經濟部智慧財產局員工消費合作社印製 488191 Λ7 _______ B7 五、發明說明（丨） [技術領域] 本發明係有關元件組裝裝置，詳言之，其係有關一種 在將電子元件組裝在印刷電路板等組裝對象物上時所使用 之元件組裝裝置。 [習知技術] 作爲組裝電子元件之場合所使用之習知的元件組裝裝 置之一例，是在XY軸機械手上安裝具有保持電子元件的 保持機構(藉由以真空吸附電子元件的吸附嘴、及機械挾持 的挾持機構等）的組裝頭，以藉由保持機構保持電子元件的 狀態使組裝頭移動，並將電子元件組裝在既定的印刷電路 板等組裝對象物的既定位置上。 作爲這種方式的元件組裝裝置，例如圖4所示的元件 組裝裝置，具有：元件供給部51，載置有元件排列整齊用 的托盤等的元件供給治具；元件組裝部52，載置有作爲電 子元件的組裝對象的基板等的組裝對象物；組裝頭54，具 有從元件供給部51對電子元件進行吸附和保持的真空吸附 嘴等的元件保持機構53 ; XY軸機械手55，安裝有組裝頭 54 ;元件攝影機構（攝影機）56，爲獲得電子元件的位置 資訊而在既定位置對保持在組裝頭54的元件保持機構53 上的電子元件進行攝影；及組裝對象物攝影機構（攝影機 )57，爲獲得組裝位置資訊而對基板等的元件組裝對象進行 攝影；並且，在藉由組裝頭54的元件保持機構53對電子 元件進行吸附和保持的狀態下，藉由使組裝頭54沿箭頭 a，b，c，d所示方向移動，將電子元件組裝在組裝對象物的既 3 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） I------------------訂—-----線 i^w. (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 488191 A7 __ B7 五、發明說明（V ) 定位置。 然而，在上述習知的元件組裝裝置中，必須使組裝頭 54移動到元件吸附位置、元件位置識別用的元件攝影機構 56的攝影位置、及元件組裝位置(例如基板上的既定位置) 共計3個位置，組裝頭54的移動距離(動線)變長，在電子 元件的組裝，組裝頭54的移動、停止所需時間和攝影所得 影像的運算處理所需時間的合計時間是必須的，從而成爲 難以縮短生產節拍時間(tact time)的主要原因。另外，也有 將用於確認元件組裝位置的組裝對象物攝影機構（攝影機) 載置於組裝頭上的元件組裝裝置，在此場合，必須包含用 於對作爲組裝對象物的基板等進行攝影的位置而在至少4 個位置使組裝頭移動，而使動線變得更長的問題點。 另外，在上述習知的元件組裝裝置中，在將元件組裝 部(基板等的組裝對象物)52組裝到XY工作台(未圖示)的場 合，產生必須使XY工作台沿與組裝頭54的移動方向相同 方向移動並進行組裝位置的微調的情況，造成不僅位置控 制困難、設備重複、及成本增大的問題。 另一方面，在元件供給部中，雖然一般是對使多數個 電子元件排列整齊配置的托盤等的元件供給治具進行設置 ’但爲進一步提局自動化的生產率，要求將元件連續地供 給元件供給部或元件供給治具，並要求與此相應的對策。 本發明係爲解決上述習知元件組裝裝置的問題點，其 目的在於提供一種能縮短組裝頭的移動距離、縮短生產節 拍時間且組裝位置精度優異的元件組裝裝置。 4 本紙張尺度適用中國國家標準（CNS)A4規格（2i0 X 297公釐） (請先閱讀背面之注意事項再填寫本頁) 訂---------線· 488191 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明說明（々） [解決課題之手段] 本發明的元件組裝裝置，其特徵係具有： 元件供給部，將元件供給治具與振動饋料器、大量饋 料器、載帶饋料器、黏著片饋料器中的一種或多種加以組 合設置，並藉由驅動機構'沿既定方向進行直線往復驅動； 元件組裝部’將組裝對象物加以設置’並藉由驅動機 構沿與上述元件供給部的移動方向平行的方向進行直線往 復驅動； 組裝頭，具有用於保持元件的元件保持機構，藉由驅 動機構沿與上述兀件供給部和兀件組裝部的移動方向正交 的方向進行直線往復驅動’且拾取設置在上述元件供給部 之元件，並將該元件組裝於元件組裝部上所設置之組裝對 象物的既定位置； 元件攝影機構，在上述組裝頭直線移動過程中，對被 上述組裝頭之元件保持機構所保持之元件進行攝影； 驅動控制裝置，分別對上述元件供給部、元件組裝部 、及組裝頭進行驅動控制；及 影像運算處理機構，對藉由上述元件攝影機構所攝影 影的影像進行運算處理。 依本發明的元件組裝裝置，由於在對元件供給部和元 件組裝部分別獨立並相互平行地往復驅動，並且對具有元 件保持機構的組裝頭沿與元件供給部和元件組裝部的移動 方向正交的方向往復驅動，並藉由藉由元件攝影機構對保 持在元件保持機構的元件進行攝影，故能在組裝頭動作過 5 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） '""""""^ --------^---------$ (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員Η消費合作社印製 488191 ______B7_ 五、發明說明（vv ) 程中，藉由藉由元件攝影機構對元件進行攝影，而可獲得 組裝位置的補正資訊。因此，藉由藉由僅使組裝頭沿既定 方向直線移動，即能從元件供給部拾取元件並高精度地組 裝到元件組裝部的組裝對象物的既定位置。其結果是與習 知的使組裝頭移動3個或4個位置的場合相比，不但能縮 短移動距離及縮短生產節拍時間，並能防止設備重複、經 濟性優異、高組裝位置精度的元件組裝裝置。 另外，在本發明中，由於元件供給部中對托盤、托板 等元件供給治具與振動饋料器、大量饋料器、載帶饋料器 、黏著片饋料器中的一種或多種加以組合設置，故能連續 供給種類和大小不同的元件，能進一步提高自動化的生產 率。 [發明之實施形態] 以下根據圖式說明本發明的實施形態。 圖1和圖2爲用於說明本發明之一實施形態的元件組 裝裝置的圖，其中，圖1爲爲表示元件組裝裝置的整體構 成的立體圖，圖2爲槪略表示元件組裝裝置的組裝動作的 俯視圖。 圖中，1爲兀件組裝裝置，該元件組裝裝置丨，係由在 呈L字形的基座構件2上載置有元件供給部3、元件組裝 部4、具有4個真空吸附嘴(元件保持機構)5的組裝頭6、 元件攝影機(元件攝影機構)7等所構成。另外，本元件組裝 裝置1，還具有：驅動控制裝置(未圖示），分別對上述元件 供給部3、元件組裝部4、吸附嘴5和組裝頭6進行驅動控 6 本紙用中國國家標準（CNS)A4規格（2{^7^7公爱） ---- (請先閱讀背面之注意事項再填寫本頁) 果---------訂---------線. 488191 A7 B7 -----—________ 五、發明說明（ς) 制；及影像運算處理機構（未圖示），對來自上述元件攝影 機7的影像進行運算處理。 上述基座構件2由振動衰減率比金屬構件高且熱膨百長 係數小的材料如混凝土、陶瓷、金屬與陶瓷的複合材料、 或者大理石等一體形成，並在基座本體2a的後端與垂直壁 2b —體形成所構成。因此，能在使各機構部動作時的振動 有效衰減，並可抑制由線性馬達等驅動機構的發熱引起的 各機構部的位置偏移，從而能保持電子元件的高組裝位置 精度。另外，由於基座構件2由上述材料一體形成，各機 構部振動時的相位相同，與各機構部分散振動時的情況相 比，能抑制由振動造成的弊害。 上述元件供給部3，從裝置正面觀之，其係配置在基 座本體2a的左端部，並由未圖示的線性馬達沿線性馬達滑 動件(驅動機構)在X軸方向（前後方向）直線往復驅動。在 該元件供給部3的上面，設置排列配置有多數電子元件的 托板(元件供給治具)3a。在該托板3a上形成有容置電子元 件的容置凹部，且該容置凹部排列成具有與上述各吸附嘴 5的排列間距對應的間距。因此能以4個吸附嘴5 —次保 持4個電子元件。 在上述元件供給部3配設振動饋料器30。該振動饋料 器30藉由藉由振動供給部32將多數電子元件依次供給至 上述托板3a的各容置凹部。 上述元件組裝部4，配置在基座本體2a的中央部，並 藉由線性馬達8沿一對線性馬達滑動件(驅動機構)8a、8b 7 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） (請先閱讀背面之注意事項再填寫本頁) ---------t---------線. 經濟部智慧財產局員Η消費合阼ii印製 經濟部智慧財產局員工消費合作社印製 488191 _ B7 五、發明說明（b ) 在與上述元件供給部3的移動方向平行的X軸方向（前後方 向）直線往復驅動。在該元件組裝部4上面，設置組裝有電 子元件的印刷電路板(組裝對象物)4a。 上述組裝頭6 ’定位於兀件供給部3和兀件組裝部4 的上方，並配設在固定於垂直壁2b的架台9。在該架台9 安裝固定有一對線性馬達滑動件1〇、10，上述組裝頭6藉 由線性馬達Π沿線性馬達滑動件10沿與X軸方向正交的 Y軸方向（左右方向)直線往復驅動。 驅動上述組裝頭6的線性馬達11，採用直接驅動方式 的線性馬達，另外，作爲線性馬達編碼器則採用玻璃尺規 、金屬尺規等，俾能進行全閉型(full dose)高精度定位。 上述各真空吸附嘴5，固定在固定元件5a上，並且該 固定元件5a被支持成沿固定於上述組裝頭6的一對線性馬 達滑動件12a、12a可在Z軸方向（上下方向)移動。另外， 上述固定元件5a，藉由使與伺服電動機13連接的凸輪板 14旋轉而沿Z軸方向往復驅動。並且，上述各吸附嘴5， 被支持成藉由未圖示的旋轉定位驅動機構，可將所吸附保 持的電子元件圍繞Z軸（圖1的<9方向)旋轉定位。 上述元件攝影機7，配置固定在元件供給部3與元件 組裝部4之間，當組裝頭6從元件供給部3向元件組裝部 4直線移動時，對吸附保持在上述吸附嘴5的電子元件進 行攝影而構成。然後求得相對於由上述攝影機7攝影的電 子元件的基準點（一般爲吸附嘴的中心點）的偏移量，並對 應於該偏移量算出X軸、Y軸及Θ的補正量。 8 本紙張尺度適用中國國家標準(CNS)A4規格（210 X 297公釐） — "~ I I------------訂---------線 (請先閱讀背面之注意事項再填寫本頁) 488191 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明說明（Q ) 另外，在上述元件供給部3與元件攝影機7之間配設 充塡有黏著劑、導電性黏著劑、焊料膏等的塗敷部16。當 以元件供給部3將所拾取的電子元件搬運到元件組裝部4 時，能藉由該塗敷部16將黏著劑和焊料膏等自動地塗敷在 該電子元件上，並能提高生產率。 在上述架台9，配設與組裝頭6獨立之多目的頭Π。 該多目的頭17,藉由線性馬達18沿線性馬達滑動件10 進行Y軸方向直線往復驅動。在多目的頭17配置基板攝 影機19。求得相對於藉由該基板攝影機19攝影的印刷電 路板4a的實際組裝位置的偏移量，並對應於該偏移量算出 X軸、Y軸的補正量。 由於將上述多目的頭17與組裝頭6獨立配置，故當組 裝頭6在元件供給部3進行電子元件拾取動作時，攝影印 刷電路板4a，能縮短生產節拍時間。另外，在多目的頭17 ，除基板攝影機19外，還可載置例如用於在印刷電路板 4a上塗敷黏著劑的黏著劑分配器等。 本實施形態的元件組裝裝置1，還具有元件搬運部20 ，將藉由前製程設備A所裝配的印刷電路板運至上述元件 組裝部4、並將藉由元件組裝部4將電子元件組裝於組裝 完成的印刷電路板4a運至後製程設備B。 該元件搬運部20，係由：並列配置在基座本體2a上 的右側端部的一對運入軌道21、21和運出軌道22、22 ; 沿該運入、運出軌道21、22在X軸方向往復移動的運入 、運出台車23、24 ;使該各台車23、24分別獨立往復驅 9 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） ,—--------^---------^ i^w— (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 488191 A7 B7 五、發明說明（X ) 動的同步皮帶25、25及旋轉驅動馬達26 ;對配置於上述 運入、運出台車23、24的上方並將設置於該台車23、24 的印刷電路板加以把持的移載元件27、27 ;及沿上下方向 (Z軸方向）和左右方向（Y軸方向）移動驅動各移載元件27 的移載驅動機構28所構成。 而且，將在前製程設備A所組裝的印刷電路板運送到 在前製程設備A的交接位置待機的運入台車23，且運入台 車23以該狀態移動到與元件組裝部4並行的位置。接著’ 移載元件27將運入台車23的印刷電路板運送到元件組裝 部4的既定位置並進行固定。 接著，一旦元件在印刷電路板上組裝結束，移載元件 27即將組裝好的.印刷電路板運送至運出台車24，且該運出 台車24移動至後製程設備B的的受讓位置。 以下說明本實施形態的作用效果。 藉由本實施形態的元件組裝裝置1將電子元件組裝在 印刷電路板時，首先，在振動饋料器30將電子元件供給至 托板3a的各容置凹部、當元件供給部3沿X軸方向移動 的同時，組裝頭6沿Y軸方向移動並在既定的拾取位置(吸 附嘴中心與容置凹部中心一致的位置)處定位。固定元件5a 在該拾取位置處下降並藉由各吸附嘴5吸附保持電子元件 ，其後吸附嘴5上升。 在該拾取步驟時，多目的頭17在設置於元件組裝部4 之印刷電路板4a的上方移動，攝影機19對印刷電路板攝 影，影像運算處理機構算出相對於目標組裝位置的X軸、 10 —--------^--------- (請先閱讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 488191 經濟部智慧財產局員工消費合作社印製 A7 _____ ___B7___ 五、發明說明（1 ) Y軸的補正量。另外，多目的頭I7在攝影後退避至不與組 裝頭4干涉的位置。 另一方面，在此期間，在元件搬運部20，運入台車 23運入由前製程設備A所組裝的印刷電路板，移載件27 則被固定在元件組裝部4。 繼上述拾取步驟，上述組裝頭6直線移動至元件組裝 部4的上方。在進行該移動時，元件攝影機7對保持在各 吸附嘴5處的電子元件攝影，影像運算處理機構算出相對 於各電子元件的吸附嘴5的X軸、Y軸及Θ方向的補正量 〇 而且，組裝頭6在元件組裝部4的印刷電路板4a的上 方移動，爲使電子元件在這種狀態下與印刷電路板4a的既 定組裝位置一致，在加上上述算出的補正量並進行元件組 裝部4的X軸方向的定位的同時，進行組裝頭6的Y軸方 向的定位，進而各吸附嘴5僅旋轉既定角度並進行0方向 的定位。 接著，使固定元件5a下降並將電子元件組裝在印刷電 路板4a的既定組裝位置。其後，固定元件5a上升並返回 至應對下一電子元件進行拾取的位置。藉由重複這種一連 串的動作，將各電子元件組裝在印刷電路板4a上。然後， 藉由移載元件27將組裝完畢的印刷電路板4a移送到運出 台車24上並運出至後製程設備B。 依本實施形態，由於使元件供給部3和元件組裝部4 分別獨立且配設成可沿前後方向（X軸方向）移動，使具有 11 冢紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） ~ ..—--------^—------^ (請先閱讀背面之注意事項再填寫本頁) 488191Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 488191 Λ7 _______ B7 V. Description of the Invention (丨) [Technical Field] The present invention relates to a component assembly device, in particular, it relates to a method of assembling electronic components on a printed circuit board. Component assembly device used when waiting for assembly. [Conventional Technology] As an example of a conventional component assembling device used when assembling electronic components, a holding mechanism having a holding electronic component is mounted on a XY-axis manipulator (a vacuum nozzle is used to suck the electronic component, And mechanical holding mechanism, etc.), the assembly head is moved by holding the electronic component by the holding mechanism, and the electronic component is assembled at a predetermined position of the assembly target such as a predetermined printed circuit board. As the component assembling device in this manner, for example, the component assembling device shown in FIG. 4 includes a component supply section 51 on which component supply jigs such as a tray for aligning components are placed, and a component assembly section 52 on which An assembly object such as a substrate that is an assembly target for electronic components; an assembly head 54 having a component holding mechanism 53 such as a vacuum suction nozzle that suctions and holds electronic components from the component supply unit 51; and an XY axis robot 55 to which Assembly head 54; component photographing mechanism (camera) 56 for photographing electronic components held on the component holding mechanism 53 of the assembly head 54 at predetermined positions in order to obtain position information of the electronic components; and assembly object photographing mechanism (camera) 57. The component assembly object such as a substrate is photographed in order to obtain assembly position information. In a state where the electronic component is adsorbed and held by the component holding mechanism 53 of the assembly head 54, the assembly head 54 is moved along the arrow. Move in the directions shown in a, b, c, and d to assemble the electronic components on the assembly object. The three paper sizes are applicable to Chinese national standards. CNS) A4 specification (210 X 297 mm) I ------------------ Order —----- line i ^ w. (Please read the precautions on the back first (Fill in this page again) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 488191 A7 __ B7 V. Description of the invention (V). However, in the conventional component assembly device, the assembly head 54 must be moved to the component suction position, the imaging position of the component imaging mechanism 56 for component position recognition, and the component assembly position (for example, a predetermined position on the substrate). In each position, the moving distance (moving line) of the assembly head 54 becomes longer. In the assembly of electronic components, the total time required for the movement and stop of the assembly head 54 and the time required for the arithmetic processing of the captured image is necessary. This is the main reason why it is difficult to shorten the production tact time. In addition, there is also a component assembly device that mounts an assembly object imaging mechanism (camera) for confirming a component assembly position on an assembly head. In this case, it is necessary to include a position for imaging a substrate or the like as an assembly object. The problem of moving the assembly head in at least 4 positions and making the moving line longer. In addition, in the conventional component assembly device, when the component assembly section (assembly target such as a substrate) 52 is assembled to an XY table (not shown), it is necessary to make the XY table edge and the assembly head 54 necessary. The movement of the same direction and the fine adjustment of the assembly position cause problems such as difficult position control, duplicate equipment, and increased costs. On the other hand, in the component supply unit, although a component supply jig such as a tray that arranges a plurality of electronic components in a regular arrangement is generally provided, it is required to continuously supply components in order to further improve the productivity of automation. Parts or components are supplied with jigs, and countermeasures are required accordingly. The present invention is to solve the problems of the conventional component assembly device described above, and an object thereof is to provide a component assembly device which can shorten the moving distance of the assembly head, shorten the production cycle time, and has excellent assembly position accuracy. 4 This paper size applies to China National Standard (CNS) A4 (2i0 X 297 mm) (Please read the precautions on the back before filling this page) Order --------- line · 488191 Intellectual Property of the Ministry of Economic Affairs Printed by the Consumer Cooperative of the Bureau A7 B7 V. Description of the invention (々) [Method for solving the problem] The component assembly device of the present invention is characterized by having a component supply unit, which supplies components to a jig, a vibration feeder, and a large number of feeders. One or more of the feeder, carrier tape feeder, and adhesive sheet feeder are combined and set, and driven linearly and reciprocally in a predetermined direction by a driving mechanism; the component assembly section 'sets an assembly object' and borrows The driving mechanism is linearly reciprocated in a direction parallel to the moving direction of the component supply unit. The assembly head has a component holding mechanism for holding the component. The driving mechanism is arranged along with the component supply unit and the component assembly unit. The linearly reciprocating driving is performed in a direction orthogonal to the moving direction, and a component provided in the component supply section is picked up, and the component is assembled in an assembly pair provided in the component assembly section. A predetermined position of the object; a component photographing mechanism that photographs the components held by the component holding mechanism of the assembly head during the linear movement of the assembly head; a drive control device that respectively performs the component supply section, the component assembly section, and The assembly head performs drive control; and an image calculation processing unit performs calculation processing on an image photographed by the component photography mechanism. According to the component assembly device of the present invention, the component supply section and the component assembly section are driven independently and reciprocally in parallel with each other, and the assembly head having the component holding mechanism is orthogonal to the moving direction of the component supply section and the component assembly section. It is driven back and forth in the direction of the camera, and the component held by the component holding mechanism is photographed by the component photography mechanism, so it can move over the assembly head. 5 paper sizes are applicable to China National Standard (CNS) A4 (210 X 297 mm) ) '&Quot; " " " " " ^ -------- ^ --------- $ (Please read the notes on the back before filling this page) Wisdom of the Ministry of Economic Affairs Printed by a member of the property bureau and a consumer cooperative 488191 ______B7_ 5. In the course of the invention description (vv), by using the component photography mechanism to photograph the components, you can obtain the correction information of the assembly position. Therefore, by simply moving the assembly head linearly in a predetermined direction, components can be picked up from the component supply section and assembled to a predetermined position of the assembly target in the component assembly section with high accuracy. As a result, compared with the conventional case where the assembly head is moved by three or four positions, not only can the moving distance be shortened and the production cycle time can be shortened, but also the equipment can be prevented from being duplicated. Device. In addition, in the present invention, one or more of component supply jigs and vibration feeders, bulk feeders, carrier tape feeders, and adhesive sheet feeders are supplied to the component supply unit for components such as trays and pallets. The combination setting can continuously supply components of different types and sizes, which can further improve the productivity of automation. [Embodiments of the invention] Embodiments of the present invention will be described below with reference to the drawings. 1 and 2 are diagrams for explaining a component assembly device according to an embodiment of the present invention, wherein FIG. 1 is a perspective view showing the overall configuration of the component assembly device, and FIG. 2 is a schematic view showing an assembly operation of the component assembly device. Top view. In the figure, 1 is a component assembly device. The component assembly device 丨 is composed of a component supply section 3, a component assembly section 4, and four vacuum suction nozzles (component holding mechanism) placed on an L-shaped base member 2. ) 5 is composed of an assembly head 6, a component camera (component imaging mechanism) 7, and the like. In addition, the component assembling device 1 further includes a drive control device (not shown) for driving and controlling the component supply section 3, the component assembling section 4, the suction nozzle 5, and the assembling head 6 respectively. CNS) A4 specifications (2 {^ 7 ^ 7 public love) ---- (Please read the precautions on the back before filling this page) Fruit --------- Order -------- -Line. 488191 A7 B7 -----— ________ 5. The invention description (ς) system; and an image calculation processing unit (not shown), which performs calculation processing on the image from the component camera 7 described above. The base member 2 is integrally formed of a material such as concrete, ceramic, a composite material of metal and ceramic, or marble, which has a higher vibration attenuation rate than a metal member and a small thermal expansion coefficient, and is formed at the rear end of the base body 2a. The vertical wall 2b is formed as a unit. Therefore, it is possible to effectively attenuate vibrations during the operation of each mechanism portion, and to suppress the positional displacement of each mechanism portion due to heat generation of a driving mechanism such as a linear motor, thereby maintaining high assembly position accuracy of electronic components. In addition, since the base member 2 is integrally formed of the above-mentioned materials, the phases of each mechanism portion when they are vibrated are the same, and the disadvantages caused by vibration can be suppressed compared with the case where each mechanism portion is oscillated. The component supply unit 3 is arranged at the left end of the base body 2a when viewed from the front of the device, and is linearly moved along the linear motor slider (drive mechanism) in the X-axis direction (front-rear direction) by a linear motor (not shown). Reciprocating drive. On the upper surface of the component supply section 3, a pallet (component supply jig) 3a in which a large number of electronic components are arranged is arranged. An accommodating recess for accommodating electronic components is formed on the holding plate 3a, and the accommodating recess is arranged to have a pitch corresponding to the arrangement pitch of the suction nozzles 5 described above. Therefore, 4 electronic components can be held 5 times with 4 suction nozzles. The component feeder 3 is provided with a vibration feeder 30. In the vibration feeder 30, a plurality of electronic components are sequentially supplied to each of the receiving recesses of the pallet 3a by a vibration supply portion 32. The component assembly part 4 is arranged at the center of the base body 2a, and a linear motor 8 is used along a pair of linear motor sliders (drive mechanisms) 8a, 8b. 7 This paper size applies the Chinese National Standard (CNS) A4 specification ( 210 X 297 mm) (Please read the notes on the back before filling out this page) --------- t --------- line. Member of the Intellectual Property Bureau of the Ministry of Economic Affairs, Consumer Consumption ii Printed by the Consumer Property Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs Printed 488191 _ B7 V. Description of the invention (b) Drive linearly back and forth in the X-axis direction (front-rear direction) parallel to the moving direction of the component supply unit 3 described above. A printed circuit board (object to be assembled) 4a in which electronic components are assembled is provided on the element assembly portion 4. The assembly head 6 'is positioned above the element supply unit 3 and the element assembly unit 4, and is disposed on a stand 9 fixed to the vertical wall 2b. A pair of linear motor sliders 10 and 10 are mounted and fixed on the stand 9. The assembly head 6 is driven by the linear motor Π along the linear motor slider 10 in a Y-axis direction (left-right direction) that is orthogonal to the X-axis direction. . The linear motor 11 that drives the assembly head 6 uses a linear motor of a direct drive method. In addition, as a linear motor encoder, a glass ruler, a metal ruler, etc. are used to perform full dose high-precision positioning. Each of the vacuum suction nozzles 5 is fixed to a fixing member 5a, and the fixing member 5a is supported to be movable in the Z-axis direction (up and down direction) along a pair of linear motor sliders 12a, 12a fixed to the assembly head 6. The fixed element 5a is driven to reciprocate in the Z-axis direction by rotating the cam plate 14 connected to the servo motor 13. Each of the suction nozzles 5 is supported to rotate and position the electronic component sucked and held around the Z axis (in the < 9 direction in FIG. 1) by a rotation positioning driving mechanism (not shown). The component camera 7 is disposed and fixed between the component supply section 3 and the component assembly section 4. When the assembly head 6 moves linearly from the component supply section 3 to the component assembly section 4, the electronic components sucked and held by the suction nozzle 5 are processed. Constituted by photography. Then, the offset amount from the reference point (generally the center point of the suction nozzle) of the electronic device photographed by the camera 7 is obtained, and the X-axis, Y-axis, and θ correction amounts are calculated based on the offset amount. 8 This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) — " ~ I I ------------ Order --------- Line ( Please read the precautions on the back before filling out this page) 488191 Printed by the Consumer Property Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 V. Description of the invention (Q) In addition, a charger is provided between the component supply section 3 and the component camera 7 There are application portions 16 such as an adhesive, a conductive adhesive, and a solder paste. When the picked-up electronic component is transported to the component assembly portion 4 by the component supply portion 3, the application portion 16 can automatically apply adhesives, solder paste, and the like to the electronic component, and productivity can be improved. A multi-purpose head Π independent of the assembling head 6 is provided on the gantry 9. The multi-purpose head 17 is linearly reciprocated in the Y-axis direction by the linear motor 18 along the linear motor slider 10. The multi-purpose head 17 is provided with a substrate camera 19. The offset amount from the actual assembly position of the printed circuit board 4a photographed by the substrate camera 19 is obtained, and the X-axis and Y-axis correction amounts are calculated corresponding to the offset amount. Since the multi-purpose head 17 and the assembling head 6 are arranged independently, when the assembling head 6 performs an electronic component pickup operation in the component supply section 3, the printed circuit board 4a can be photographed, and the production cycle time can be shortened. In addition to the multi-purpose head 17, in addition to the substrate camera 19, for example, an adhesive dispenser for applying an adhesive to the printed circuit board 4a can be mounted. The component assembling device 1 of this embodiment further includes a component conveying section 20, which transports the printed circuit board assembled by the pre-process equipment A to the component assembling section 4, and electronic components are assembled on the component assembling section 4. The assembled printed circuit board 4a is transported to the post-processing equipment B. The component carrying section 20 is composed of a pair of carrying-in rails 21, 21 and carrying-out rails 22, 22 arranged side by side on the right end of the base body 2a; along the carrying-in and carrying-out rails 21, 22, The carriages 23 and 24 that are reciprocated in the X-axis direction; each of the carriages 23 and 24 is driven independently and reciprocally. This paper size is applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 mm), --- ------- ^ --------- ^ i ^ w— (Please read the notes on the back before filling this page) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 488191 A7 B7 V. Description of the invention (X) moving timing belts 25, 25 and rotary drive motors 26; the printed circuit boards disposed above the loading and unloading trolleys 23, 24 and held by the trolleys 23, 24 are moved The load-carrying elements 27, 27; and a transfer drive mechanism 28 configured to move and drive each transfer element 27 in the up-down direction (Z-axis direction) and left-right direction (Y-axis direction). Then, the printed circuit board assembled in the pre-process equipment A is transported to the carry-in trolley 23 which is waiting at the transfer position of the pre-process equipment A, and the carry-in trolley 23 is moved to a position parallel to the component assembly unit 4 in this state. Next, the transfer component 27 transports the printed circuit board carried in the carriage 23 to a predetermined position of the component assembly section 4 and fixes it. Then, once the assembly of the components on the printed circuit board is completed, the transfer component 27 is ready to be assembled. The printed circuit board is transported to the delivery cart 24, and the delivery cart 24 is moved to the receiving position of the post-processing equipment B. The effects of this embodiment will be described below. When assembling an electronic component to a printed circuit board by the component assembling device 1 of this embodiment, first, the electronic component is supplied to each of the accommodating recesses of the pallet 3a by the vibration feeder 30, and when the component supplying portion 3 is along the X-axis direction While moving, the assembly head 6 moves in the Y-axis direction and is positioned at a predetermined pickup position (a position where the center of the suction nozzle coincides with the center of the receiving recess). The fixed component 5a is lowered at the pick-up position, and the electronic component is sucked and held by each suction nozzle 5, and then the suction nozzle 5 is raised. During this picking step, the multi-purpose head 17 moves above the printed circuit board 4a provided in the component assembly section 4, the camera 19 photographs the printed circuit board, and the image processing unit calculates the X-axis, 10 with respect to the target assembly position. ------- ^ --------- (Please read the notes on the back before filling out this page) This paper size is applicable to China National Standard (CNS) A4 (210 X 297 mm) 488191 Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 _____ ___B7___ V. Description of the invention (1) The amount of correction on the Y axis. In addition, the multi-purpose head I7 is retracted to a position where it does not interfere with the assembly head 4 after photographing. On the other hand, during this period, in the component transfer section 20, the loading trolley 23 loads the printed circuit board assembled by the pre-processing equipment A, and the transfer member 27 is fixed to the component assembly section 4. Following the pick-up step, the assembly head 6 is linearly moved above the component assembly portion 4. During this movement, the component camera 7 photographs the electronic components held at the suction nozzles 5, and the image calculation processing means calculates the correction amounts in the X-axis, Y-axis, and Θ directions with respect to the suction nozzles 5 of each electronic component. The assembly head 6 moves above the printed circuit board 4a of the component assembly section 4. In order to make the electronic components in this state coincide with the predetermined assembly position of the printed circuit board 4a, the calculated amount of correction is added and the components are assembled. The positioning of the part 4 in the X-axis direction is performed while the positioning of the assembly head 6 in the Y-axis direction is performed. Further, each suction nozzle 5 is rotated by a predetermined angle and positioned in the 0 direction. Next, the fixed component 5a is lowered and the electronic component is assembled at a predetermined assembly position of the printed circuit board 4a. Thereafter, the fixed element 5a is raised and returned to a position where the next electronic component should be picked up. By repeating this series of operations, each electronic component is assembled on the printed circuit board 4a. Then, the assembled printed circuit board 4a is transferred to the delivery trolley 24 by the transfer element 27 and carried out to the post-processing equipment B. According to this embodiment, since the component supply section 3 and the component assembly section 4 are independent and arranged to move in the front-rear direction (X-axis direction), the paper with a standard of 11 mounds is applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 mm) ~ .. —-------- ^ —------ ^ (Please read the notes on the back before filling this page) 488191
五、發明說明（iC ) 經濟部智慧財產局員Η消費合作社印制衣 可沿上下方向（Z軸方向）移動的吸附嘴5的組裝頭6配設成 可沿左右方向(Y軸方向）直線移動，且在上述組裝頭6移 動時藉由元件攝影機7對由吸附嘴5吸附保持的電子元件 進行攝影，故能在組裝頭6移動過程中藉由元件攝影機7 對電子元件進行攝影而獲得組裝位置的補正資訊。因此， 只需使組裝頭6沿Y軸方向直線移動，即能由元件供給部 3拾取電子元件並將其高精度地組裝在元件組裝部4的印 刷電路板4a的既定組裝位置上。其結果，與習知的使組裝 頭移動到3個位置或4個位置的場合相比，能提供縮短移 動距離和縮短生產節拍時間，並且防止設備重復、經濟性 優異、高組裝位置精度的元件組裝裝置1。 另外，在本實施形態中，由於在元件供給部3，組合 設置托板3a和將電子元件供給該托板3a的振動饋料器30 ’故能連續供給種類和大小不同的電子元件，能進行連續 運轉，進一步提高生產率。 在本實施形態，由於設有將電子元件組裝在印刷電路 板上的元件供給部3、元件組裝部4，並設有將在前製程設 備A中組裝的印刷電路板運入元件組裝部4、並將組裝完 畢的印刷電路板運出至後製程設備B的元件運送部20，故 可進行無人化及連續生產，能大幅度提高生產率。 另外，在上述實施形態中，雖然對將振動饋料器30與 元件供給部3組合俾連續供給電子元件的場合作了說明， 但本發明並不限於此，例如，如圖3所示，也可將載帶饋 料器35與元件供給部3組合。該載帶饋料器35，係在固 12 I ! ! -------訂---------^ C請先閱讀背面之注意事項再填寫本頁} 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 488191 A7 B7 五、發明說明（) 定於元件供給部3的固定台36上組裝元件帶37(將多數電 子元件放在載帶上而成），並藉由驅動滾輪38運送該元件 帶37而構成。在這種場合，也能將電子元件依次供給托板 3a並獲得上述同樣的效果。 另外，在上述實施形態，雖然對將電子元件組裝在印 刷電路板上的場合作了說明，但本發明的元件組裝裝置並 不限於此，例如也可適用於精密機械元件的裝配。 進而，在上述元件供給部，並不限於組合上述振動饋 料器、載帶饋料器，也可將大量饋料器、黏著片饋料器等 其他連續供給機構加以組合。 [圖式之簡單說明] 圖1爲用於說明本發明之一實施形態的元件組裝裝置 的整體構成圖。 圖2爲槪略表示上述元件組裝裝置的組裝動作的俯視 圖。 圖3爲表示另一實施形態的元件供給方式的槪略圖。 圖4爲表示習知一般的元件組裝動作的槪略圖。 (請先閱讀背面之注意事項再填寫本頁) 裝----- 訂---------線· 經濟部智慧財產局員工消費合作社印製 [符號說明] 1 元件組裝裝置 3 元件供給部 4 元件組裝部 4a 印刷電路板(組裝對象物） 5 真空吸附嘴(元件保持機構) 6 組裝頭 13 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 488191 A7 Β7 五、發明說明（Γ/) 7 元件攝影機(元件攝影機構） 8、11 線性馬達(驅動機構） 30 振動饋料器 35 載帶饋料器 X 元件供給部、元件組裝部之移動方向 Υ 組裝頭之移動方向 1 ζ 吸附嘴之移動方向 衣--------訂---------線· (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 Μ 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐）V. Description of the Invention (iC) The assembly head 6 of the suction nozzle 5 which can move the clothes in the up and down direction (Z axis direction) of the consumer cooperatives printed by the Intellectual Property Bureau of the Ministry of Economic Affairs is arranged to move linearly in the left and right direction (Y axis direction) And when the assembly head 6 is moved, the component camera 7 is used to photograph the electronic components sucked and held by the suction nozzle 5. Therefore, the assembly camera 6 can be used to photograph the electronic components to obtain the assembly position when the assembly head 6 is moved. Correction information. Therefore, by simply moving the assembly head 6 linearly in the Y-axis direction, the electronic component can be picked up by the component supply section 3 and assembled at a predetermined assembly position of the printed circuit board 4a of the component assembly section 4 with high accuracy. As a result, compared with the conventional case where the assembly head is moved to three or four positions, it is possible to provide a component that shortens the moving distance and shortens the production cycle time, prevents equipment duplication, is excellent in economy, and has high assembly position accuracy. Assembling device 1. In addition, in the present embodiment, since the support plate 3a and the vibration feeder 30 'for supplying electronic components to the support plate 3a are provided in combination in the component supply unit 3, it is possible to continuously supply electronic components of different types and sizes, enabling Continuous operation to further increase productivity. In this embodiment, a component supply section 3 and a component assembly section 4 for assembling electronic components on a printed circuit board are provided, and a printed circuit board assembled in the pre-process equipment A is provided into the component assembly section 4, Since the assembled printed circuit board is shipped out to the component transfer section 20 of the post-processing equipment B, unmanned and continuous production can be performed, and productivity can be greatly improved. In addition, in the embodiment described above, the field in which the vibration feeder 30 is combined with the component supply unit 3 to continuously supply electronic components has been described, but the present invention is not limited to this. For example, as shown in FIG. 3, The carrier tape feeder 35 may be combined with the component supply section 3. The carrier tape feeder 35 is attached to the solid 12 I!! ------- Order --------- ^ C Please read the notes on the back before filling this page} This paper size applies China National Standard (CNS) A4 specification (210 X 297 mm) 488191 A7 B7 V. Description of the invention () The component tape 37 is assembled on the fixing table 36 of the component supply section 3 (most electronic components are placed on the carrier tape and Is completed), and the component tape 37 is transported by the driving roller 38. In this case, the same effects as described above can be obtained by sequentially supplying the electronic components to the pallet 3a. In addition, in the above-mentioned embodiment, the field of assembling electronic components on a printed circuit board has been described, but the component assembling device of the present invention is not limited to this. For example, it can also be applied to the assembly of precision mechanical components. Furthermore, the component supply section is not limited to the combination of the above-mentioned vibration feeder and carrier tape feeder, and other continuous supply mechanisms such as a large number of feeders and adhesive sheet feeders may be combined. [Brief description of the drawings] Fig. 1 is an overall configuration diagram for explaining a component assembling apparatus according to an embodiment of the present invention. Fig. 2 is a plan view schematically showing an assembling operation of the component assembling device. FIG. 3 is a schematic diagram showing a component supply method according to another embodiment. FIG. 4 is a schematic diagram showing a conventional general component assembling operation. (Please read the precautions on the back before filling out this page) Packing ----- Order --------- Line · Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs [Symbol Explanation] 1 Component Assembly Device 3 Component supply part 4 Component assembly part 4a Printed circuit board (assembly object) 5 Vacuum suction nozzle (component holding mechanism) 6 Assembly head 13 This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) 488191 A7 Β7 V. Description of the invention (Γ /) 7 Component camera (component photography mechanism) 8, 11 Linear motor (drive mechanism) 30 Vibration feeder 35 Carrier feeder X Component supply section, component assembly section movement direction Υ Assembly Head movement direction 1 ζ Suction nozzle movement direction clothes -------- Order --------- Line · (Please read the precautions on the back before filling this page) Intellectual Property Bureau of the Ministry of Economic Affairs Printed by employee consumer cooperatives M This paper is sized for China National Standard (CNS) A4 (210 X 297 mm)