CN113035745B - Chip mounting device - Google Patents
Chip mounting device Download PDFInfo
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- CN113035745B CN113035745B CN202110213677.3A CN202110213677A CN113035745B CN 113035745 B CN113035745 B CN 113035745B CN 202110213677 A CN202110213677 A CN 202110213677A CN 113035745 B CN113035745 B CN 113035745B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
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Abstract
The invention provides a chip mounting device which comprises a substrate feeding device, a chip positioning device, an alignment welding device, a positioning device and a discharging device, wherein the output end of the substrate feeding device is connected with the substrate input end of the alignment welding device through the substrate feeding device; the electric chip mounting device is characterized by further comprising an electric system, wherein the electric system is electrically connected with the substrate feeding device, the chip positioning device, the alignment welding device, the positioning device and the discharging device, and the chip and the substrate are further positioned during alignment welding by accurately controlling the movement and the position of the chip so as to improve the chip mounting precision.
Description
Technical Field
The invention relates to the technical field of manufacturing of semiconductor devices, relates to installation of semiconductor chips, and particularly relates to a chip mounting device.
Background
In the existing semiconductor chip mounting and welding technology, an open-loop or closed-loop motion control system is generally constructed by a lead screw, a guide rail, a servo motor, a camera and other components, a chip is picked up and carried to a mounting and welding position, and the chip is welded on a substrate. The positioning of the chip and the substrate is an important link for ensuring the chip mounting precision.
Document CN109616430B discloses a chip mounting and recognizing system and method, wherein the system includes a shooting device, a substrate and an adsorbing device, the shooting device is located above the substrate, the substrate is used for mounting a chip, the adsorbing device is used for adsorbing the chip and moving to the position below the shooting device, and the shooting device is used for recognizing the position of the substrate and the position of the chip by shooting; the chip surface is provided with an identification area, and the identification area is exposed when the adsorption device adsorbs the chip, so that when the chip is moved to the lower part of the shooting device, the shooting device identifies the position of the chip through the shooting identification area. Through using special adsorption equipment, can expose the surface identification region when making the chip adsorbed, accomplish discernment location to chip and base plate through a camera, system is with low costs, has eliminated because of the influence of the installation error of different cameras to the paster precision, and chip position discernment improves paster precision and paster efficiency after the chip is absorbed.
However, the above technical solutions only position the substrate and the chip, but not position the chip movement process and the chip angle, and still generate a large error, especially an angle error, when the chip is soldered and mounted.
Document CN108311765A discloses a dual-chip module pick-and-place soldering system and a dual-chip module assembling method, including a first carrying table and a second carrying table for respectively accommodating a plurality of first chips and second chips. A calibration platform is arranged between the two bearing tables, and a first chip and a second chip are respectively taken and placed on the calibration platform by utilizing the first taking and placing arm and the second taking and placing arm. A calibration and positioning vision module is used for correcting the positions and angles of the two chips. The double-chip taking and placing unit is provided with a first suction nozzle and a second suction nozzle which respectively suck the first chip and the second chip, and a preset distance is reserved between the first chip and the second chip. An assembly material placing platform holds a circuit substrate. A substrate positioning vision module corrects the position of the circuit substrate. The double-chip taking and placing unit places the first chip and the second chip on the circuit substrate together.
According to the technical scheme, the position and the angle of the chip can be positioned and corrected, the chip welding and mounting precision is improved to a certain extent, and errors are reduced. However, the above technical solutions do not position and control the chip moving process, and errors are easily generated during the movement of the chip, which affects the accuracy of chip mounting.
Disclosure of Invention
The invention provides a chip mounting device, aiming at the problems that in the prior art, chip movement is easy to generate deviation and welding precision is influenced.
In order to achieve the purpose, the technical scheme adopted by the invention is as follows: a chip mounting device is characterized by comprising a substrate feeding device, a chip positioning device, an alignment welding device, a positioning device and a discharging device, wherein the output end of the substrate feeding device is connected with the substrate input end of the alignment welding device through the substrate feeding device, the output end of the chip positioning device is connected with the chip input end of the alignment welding device through the chip feeding device, the output end of the alignment welding device is connected with the input end of the discharging device through the substrate feeding device, and the positioning device is respectively electrically connected with the chip feeding device, the chip positioning device and the alignment welding device; the electric system is electrically connected with the substrate feeding device, the chip positioning device, the alignment welding device, the positioning device and the blanking device.
When the positioning device mainly used for positioning the image sensor is used for positioning the chip and the substrate in the alignment welding device, the visual center of the image sensor is set as a mounting position, so that mounting is carried out at the visual center of the image sensor every time, and motion errors generated in intermediate processes and links such as vibration in the operation process of a machine, thermal drift phenomenon caused by heat change after the machine operates for a long time and the like are eliminated.
Preferably, the chip positioning device comprises a chip placing die bonding ring, a die bonding ring rotating shaft, a chip positioning Y-axis moving platform, a chip positioning Y-axis grating encoder, a chip positioning X-axis moving platform and a chip positioning X-axis grating encoder, the chip placing die bonding ring is annular and serves as the output end of the chip positioning device, the die bonding ring rotating shaft is in transmission connection with the chip placing die bonding ring, the chip positioning Y-axis grating encoder is fixedly connected with the chip positioning Y-axis moving platform, the chip positioning X-axis grating encoder is fixedly connected with the chip positioning X-axis motion platform, the chip placing die bonding ring can move in the Y-axis direction under the driving of the chip positioning Y-axis motion platform, the chip placing die bonding ring can move in the X-axis direction under the driving of the chip positioning X-axis motion platform.
Preferably, the alignment welding device comprises an alignment welding Y-axis motion platform, an alignment welding Y-axis grating encoder, an alignment welding X-axis motion platform, an alignment welding X-axis grating encoder, a rotary alignment table and a chip welding platform, wherein the rotary alignment table is used as a chip input end of the alignment welding device, one end of the chip welding platform is used as a substrate input end of the alignment welding device, the other end of the chip welding platform is used as an output end of the alignment welding device, the alignment welding Y-axis grating encoder is fixedly connected to the alignment welding Y-axis motion platform, the alignment welding X-axis grating encoder is fixedly connected to the alignment welding X-axis motion platform, and the rotary alignment table and the chip welding platform can move in the Y-axis direction under the driving of the alignment welding Y-axis motion platform, the rotary alignment table and the chip welding platform can move in the X-axis direction under the driving of the alignment welding X-axis motion platform.
Preferably, the substrate feeding device comprises a material box, a material box Z-axis driving device, a material box X-axis pushing device, a material box Y-axis pushing device and an empty material box trough, wherein the material box is used for storing the substrate, the material box Z-axis driving device drives the material box to move in the Z-axis direction, the material box X-axis pushing device pushes the substrate in the material box into the substrate feeding device, and the material box Y-axis pushing device pushes the material box in the empty material box trough to move in the Y-axis direction.
Preferably, base plate material feeding unit includes that the X axle pushes away material feeding unit, feed chute, blown down tank, the feed chute with base plate material loading device's output is connected, the blown down tank with unloader connects, the feed chute with be provided with the clearance between the blown down tank, hold in the clearance counterpoint welding set, keeping away from of feed chute base plate material loading device's output one side with counterpoint welding set's base plate input is connected, keeping away from of blown down tank unloader one side with counterpoint welding set's output is connected, the X axle pushes away material feeding unit set up in the feed chute with the blown down tank upside, the X axle pushes away material feeding unit promotes base plate on the feed chute is at X axle rebound and is passed through in proper order the feed chute counterpoint welding set the blown down tank.
Preferably, chip material feeding unit includes chip pay-off X axle transport groove, Z axle pick up welding set, pick up welding nation head, chip pay-off X axle grating encoder, pick up welding nation head fixed connection in welding set is picked up to the Z axle, chip pay-off X axle grating encoder fixed connection in welding set is picked up to the Z axle, welding set is picked up to the Z axle chip along X axle rebound on the chip pay-off X axle transport groove, welding set drive is picked up to the Z axle pick up welding nation head at Z axle rebound.
Preferably, positioner is including installation frame, chip location visual system, upward vision system, chip welding visual system, chip location visual system, chip welding visual system fixed connection in the installation frame, chip location visual system set up in the chip positioner upside, upward vision system set up in chip material feeding unit downside, chip welding visual system set up in counterpoint welding set upside.
The chip positioning vision system, the upward vision system and the chip welding vision system use a CCD camera as a vision image acquisition sensor to acquire a vision image and apply the vision image to positioning of a chip and a substrate.
Preferably, still include the thimble device, the thimble device with the electrical system electricity is connected, the thimble device includes Y axial fine setting platform, X axial fine setting platform, cam thimble actuating system, thimble, cylinder jacking system, cam thimble actuating system set up in thimble downside and drive the thimble moves along the Z axial, the thimble set up in chip positioner downside, cylinder jacking system drive cam thimble actuating system reaches the thimble moves along the Z axial, Y axial fine setting platform drive cam thimble actuating system, thimble, cylinder jacking system move along the Y axial, X axial fine setting platform drive cam thimble actuating system, thimble, cylinder jacking system move along the X axial.
Preferably, still including a little gluing and glue dipping device, a little gluing and glue dipping device with the electrical system electricity is connected, a little gluing and glue dipping device is including a little gluing mounting base, a little gluing Z axle module, a little gluing first horizontal adjustment structure, a point gluing head, storage rubber tyer, a little gluing Z axle module, a little gluing first horizontal adjustment structure fixed connection in a little gluing mounting base, a little gluing head set up in a little gluing first horizontal adjustment is structural, it is close to store up the rubber tyer base plate material feeding unit with counterpoint welding set, the point is glued the head and is close to counterpoint welding set.
Preferably, the blanking device comprises a blanking box, a blanking box Z-axis driving device, a blanking box Y-axis pushing device and a blanking box trough, the blanking box is used for storing welding finished products, the blanking box Z-axis driving device drives the blanking box to move in the Z-axis direction, and the blanking box Y-axis pushing device pushes the blanking box to move in the blanking box trough along the Y-axis direction.
Preferably, the electric power distribution system further comprises a rack and a moving support platform, wherein the rack comprises a shell and a reinforced welding rack, the shell is fixedly connected to the outer side of the reinforced welding rack, and the inner side of the reinforced welding rack is fixedly connected with the electric system; the motion supporting platform comprises a marble bottom plate and a metal plate, the metal plate is fixedly connected with the marble bottom plate, the marble bottom plate is fixedly connected with the reinforced welding rack, the substrate feeding device, the chip feeding device and the positioning device are fixedly connected with the metal plate, and the substrate feeding device, the chip positioning device, the alignment welding device and the blanking device are fixedly connected with the bottom plate.
The invention has the following beneficial effects: the positioning device is electrically connected with the chip feeding device, the chip positioning device and the alignment welding device, and the moving stroke and position are controlled in the chip feeding and moving processes, so that the chip mounting precision is increased; the linear motor system for driving the chip and the substrate to move in the X-axis direction, the Y-axis direction and the Z-axis direction is connected with the grating encoder and is subjected to closed-loop control, the positioning device is combined, the motion stroke is dynamically compensated, the offset and the error generated in the chip moving process are reduced, the position correction is carried out in the alignment welding stage, the precision problem caused by the motion error is eliminated to the maximum extent, and the requirement of ultra-high precision chip mounting welding is met.
Drawings
Fig. 1 is a schematic view of an overall structure of a chip mounting apparatus.
Fig. 2 is a schematic diagram of a frame structure of a chip mounting device.
Fig. 3 is a schematic structural diagram of a substrate loading device of a chip mounting device.
Fig. 4 is a schematic structural view of a moving support platform of a chip placement device.
Fig. 5 is a schematic structural view of a substrate feeding device of a chip mounting device.
Fig. 6 is a schematic structural view of a chip feeding device of the chip mounting device.
Fig. 7 is a schematic structural diagram of a positioning device of a chip mounting device.
Fig. 8 is a schematic structural diagram of a chip positioning device of a chip mounting device.
Fig. 9 is a schematic structural view of an ejector pin device of a chip mounting device.
Fig. 10 is a schematic structural diagram of an alignment soldering apparatus of a chip mounting apparatus.
Fig. 11 is a schematic structural view of a dispensing and glue dipping device of a chip mounting device.
Fig. 12 is a schematic structural view of a blanking device of a chip mounting device.
In the figure: 1 is a frame, 1-1 is a shell, 1-2 is a reinforced welding frame, 1-3 is an electrical system, 2 is a substrate feeding device, 2-1 is a material box, 2-2 is a material box Z-axis driving device, 2-3 is a material box X-axis pushing device, 2-4 is a material box Y-axis pushing device, 2-5 is an empty material box trough, 3 is a motion supporting platform, 3-1 is a marble bottom plate, 3-2 is a metal plate, 4 is a substrate feeding device, 4-1 is a Y-axis pushing and feeding device, 4-2 is a feeding trough, 4-3 is a discharging trough, 5 is a chip feeding device, 5-1 is a chip feeding X-axis conveying trough, 5-2 is a Z-axis pick-up welding device, 5-3 is a pick-up welding head, 5-4 is a chip feeding X-axis grating encoder, 6 is a positioning device, 6-1 is an installation frame, 6-2 is a chip positioning visual system, 6-3 is an upper visual system, 6-4 is a chip welding visual system, 7 is a chip positioning device, 7-1 is a chip placing die bonding ring, 7-2 is a die bonding ring rotating shaft, 7-3 is a chip positioning Y-axis moving platform, 7-4 is a chip positioning Y-axis grating encoder, 7-5 is a chip positioning X-axis moving platform, 7-6 is a chip positioning X-axis grating encoder, 8 is a thimble device, 8-1 is a Y-axis fine adjusting platform, 8-2 is an X-axis fine adjusting platform, 8-3 is a cam thimble driving system, 8-4 is a thimble, 8-5 is a cylinder jacking system, 9 is an alignment welding device, 9-1 is an alignment welding Y-axis moving platform, 9-2 is an alignment welding Y-axis grating encoder, 9-3 is an alignment welding X-axis moving platform, 9-4 is an alignment welding X-axis grating encoder, 9-5 is a rotary alignment platform, 9-6 is a chip welding platform, 10 is a glue dispensing and dipping device, 10-1 is a glue dispensing mounting base, 10-2 is a glue dispensing Z-axis module, 10-3 is a glue dispensing head horizontal adjusting structure, 10-4 is a glue dispensing head, 10-5 is a glue storage disc, 11 is a blanking device, 11-1 is a blanking box, 11-2 is a blanking box Z-axis driving device, 11-3 is a blanking box Y-axis pushing device, and 11-4 is a blanking box trough.
Detailed Description
The invention will be further described with reference to the following detailed description of the drawings.
It should be noted that "electrically connected" includes both circuit connections and wireless communication connections; "fixedly attached" includes both removable and non-removable attachments; any combination of the embodiments or technical features described below can be used to form new embodiments without conflict.
As shown in fig. 1 and 2, a chip mounting apparatus is characterized in that: the automatic alignment welding device comprises a substrate feeding device 2, a substrate feeding device 4, a chip feeding device 5, a chip positioning device 7, an alignment welding device 9, a positioning device 6 and a blanking device 11, wherein the output end of the substrate feeding device 2 is connected with the substrate input end of the alignment welding device 9 through the substrate feeding device 4, the output end of the chip positioning device 7 is connected with the chip input end of the alignment welding device 9 through the chip feeding device 5, the output end of the alignment welding device 9 is connected with the input end of the blanking device 11 through the substrate feeding device 4, and the positioning device 6 is respectively electrically connected with the chip feeding device 5, the chip positioning device 7 and the alignment welding device 9; the device also comprises an electrical system 1-3, wherein the electrical system 1-3 is electrically connected with the substrate feeding device 2, the substrate feeding device 4, the chip feeding device 5, the chip positioning device 7, the alignment welding device 9, the positioning device 6 and the blanking device 11.
When in use, the substrate is stored in the substrate feeding device 2, and the substrate feeding device 4 is controlled by the electrical system 1-3 to feed the substrate into the substrate input end of the alignment welding device 9; the chip is stored in a chip positioning device 7, the chip in the chip positioning device 7 is positioned by a positioning device 6 driven by an electrical system 1-3, and the chip positioning device 7 are driven by the electrical system 1-3 to adjust the position of the chip in the X axial direction, the Y axial direction, the Z axial direction and the angle; the electric system 1-3 drives the positioning device 6 to determine the position of the chip on the chip positioning device 7, the electric system 1-3 drives the chip feeding device 5 to pick up the chip on the chip positioning device 7 according to the chip position information obtained by the positioning device 6, and the electric system 1-3 controls the movement of the chip feeding device 5 to send the chip to the chip input end of the alignment welding device 9; the electric system 1-3 drives the positioning device 6 to position the substrate and the chip on the alignment welding device 9, the electric system 1-3 drives the alignment welding device 9 to adjust the relative position and angle of the chip and the substrate on the alignment welding device according to the position information obtained by the positioning device 6, and then the chip and the substrate are welded on the alignment welding device 9 under the drive of the electric system 1-3; after welding, the electric system 1-3 drives the substrate feeding device 4 to move the welded substrate from the alignment welding device 9 to the blanking device 11; and then, the electrical system 1-3 drives the blanking device to output the welded chip to the chip mounting device.
The positioning device 6 is electrically connected with the chip feeding device 5, the chip positioning device 7 and the alignment welding device 9, so that the chip is positioned and the position of the chip is adjusted in the chip feeding stage, and the chip is further positioned in the alignment welding stage, and the chip mounting precision is improved.
As shown in FIG. 8, the chip positioning device 7 comprises a chip placement die bonding ring 7-1, a die bonding ring rotating shaft 7-2, a chip positioning Y-axis moving platform 7-3, a chip positioning Y-axis grating encoder 7-4, a chip positioning X-axis moving platform 7-5 and a chip positioning X-axis grating encoder 7-6, wherein the chip placement die bonding ring 7-1 is annular, the chip placement die bonding ring 7-1 is used as the output end of the chip positioning device 7, the die bonding ring rotating shaft 7-2 is in transmission connection with the chip placement die bonding ring 7-1, the chip positioning Y-axis grating encoder 7-4 is fixedly connected with the chip positioning Y-axis moving platform 7-3, the chip positioning X-axis grating encoder 7-6 is fixedly connected with the chip positioning X-axis moving platform 7-5, and the chip placement die bonding ring 7-1 can be driven by the chip positioning Y-axis moving platform 7-3 under the drive of the chip positioning Y-axis moving platform 7-3 The chip placing die bonding ring 7-1 can move in the X-axis direction under the drive of the chip positioning X-axis motion platform 7-5. The chip positioning device 7 is controlled through the electrical system 1-3, the chip is placed on the chip positioning device 7, the chip positioning Y-axis motion platform 7-3 and the chip positioning X-axis motion platform 7-5 move on the X axis and the Y axis of the chip, the position of the chip is determined through the positioning device 6, the chip positioning Y-axis grating encoder 7-4 and the chip positioning X-axis grating encoder 7-6 are used for accurately monitoring the displacement of the chip, and therefore the displacement and the position of the chip are accurately controlled through the electrical system 1-3; the angle of the chip is determined by the positioning device 6, the chip placing die ring 7-1 is driven to rotate by the die placing die ring rotating shaft 7-2, and the chip is rotated by the rotation of the chip placing die ring 7-1, so that the angle of the chip is accurately controlled, the position of the chip is positioned in the X axial direction, the Y axial direction and the rotating direction, the position of the chip is accurately controlled in the picking and conveying process of the chip, the position deviation of the chip during welding is reduced, and the accuracy of chip mounting is improved.
As shown in fig. 10, the alignment welding device 9 comprises an alignment welding Y-axis motion platform 9-1, an alignment welding Y-axis grating encoder 9-2, an alignment welding X-axis motion platform 9-3, an alignment welding X-axis grating encoder 9-4, a rotary alignment table 9-5, and a chip welding platform 9-6, wherein the rotary alignment table 9-5 is used as a chip input end of the alignment welding device 9, one end of the chip welding platform 9-6 is used as a substrate input end of the alignment welding device 9, the other end of the chip welding platform 9-6 is used as an output end of the alignment welding device 9, the alignment welding Y-axis grating encoder 9-2 is fixedly connected to the alignment welding Y-axis motion platform 9-1, the alignment welding X-axis grating encoder 9-4 is fixedly connected to the alignment welding X-axis motion platform 9-3, the rotary alignment table 9-5 and the chip welding platform 9-6 can move in the Y-axis direction under the drive of the alignment welding Y-axis motion platform 9-1, and the rotary alignment table 9-5 and the chip welding platform 9-6 can move in the X-axis direction under the drive of the alignment welding X-axis motion platform 9-3. Welding the chip and the substrate on a chip welding platform 9-6, wherein in the embodiment, a welding bonding head 5-3 is used for welding the chip and the substrate; monitoring the position and the angle of the chip in the alignment welding device 9 and the position of the substrate through the positioning device 6; the movement of the chip and the substrate is accurately measured by the alignment welding Y-axis grating encoder 9-2 and the alignment welding X-axis grating encoder 9-4; the alignment welding device 9 is controlled by combining the electrical system 1-3, and the relative position between the chip and the substrate is moved by the alignment welding Y-axis motion platform 9-1, the alignment welding X-axis motion platform 9-3 and the rotary alignment platform 9-5, so that the relative position between the chip and the substrate is accurately controlled, the offset of the chip and the substrate relative to the set position is reduced, and the chip welding precision is further improved.
When the positioning device mainly used for positioning the image sensor is used for positioning the chip and the substrate in the positioning welding device, if a CCD camera is used for positioning, the visual center of the image sensor is set as a mounting position, so that mounting is carried out at the visual center of the image sensor every time, and the motion errors generated in the middle processes and links, such as vibration in the operation process of a machine, thermal drift phenomenon caused by heat change after the machine operates for a long time, and the like are eliminated.
As shown in fig. 2 and 4, the welding machine further comprises a frame 1 and a moving support platform 3, wherein the frame 1 comprises a shell 1-1 and a reinforced welding frame 1-2, the shell 1-1 is fixedly connected to the outer side of the reinforced welding frame 1-2, and the inner side of the reinforced welding frame 1-2 is fixedly connected with an electrical system 1-3; the movement supporting platform 3 comprises a marble bottom plate 3-1 and a metal plate 3-2, the metal plate 3-2 is fixedly connected to the marble bottom plate 3-1, the marble bottom plate 3-1 is fixedly connected to the reinforced welding rack 1-2, a substrate feeding device 4, a chip feeding device 5 and a positioning device 6 are fixedly connected to the metal plate 3-2, and the substrate feeding device 2, the chip positioning device 7, an alignment welding device 9 and a discharging device 11 are fixedly connected to the bottom plate 3-1.
As shown in figure 3, the substrate feeding device 2 comprises a material box 2-1, a material box Z-axis driving device 2-2, a material box X-axis pushing device 2-3, a material box Y-axis pushing device 2-4 and an empty material box trough 2-5, wherein the material box 2-1 is used for storing substrates, the material box Z-axis driving device 2-2 drives the material box 2-1 to move in the Z-axis direction, the material box X-axis pushing device 2-3 pushes the substrates in the material box 2-1 into the substrate feeding device 4, and the material box Y-axis pushing device 2-4 pushes the material box 2-1 in the empty material box trough 2-5 to move in the Y-axis direction. The substrate feeding device 2 is controlled by the electrical system 1-3, and the substrates in the material box 2-1 are pushed into the substrate feeding device 4 by the material box Z-axis driving device 2-2, the material box X-axis pushing device 2-3 and the material box Y-axis pushing device 2-4, so that the substrates are automatically fed.
As shown in figure 5, the substrate feeding device 4 comprises an X-axis pushing feeding device 4-1, a feeding chute 4-2 and a discharging chute 4-3, wherein the feeding chute 4-2 is connected with the output end of the substrate feeding device 2, the discharging chute 4-3 is connected with a discharging device 11, a gap is arranged between the feeding chute 4-2 and the discharging chute 4-3, an alignment welding device 9 is accommodated in the gap, one side of the feeding chute 4-2, which is far away from the output end of the substrate feeding device 2, is connected with the substrate input end of the alignment welding device 9, one side of the discharging chute 4-3, which is far away from the discharging device 11, is connected with the output end of the alignment welding device 9, the X-axis pushing feeding device 4-1 is arranged at the upper sides of the feeding chute 4-2 and the discharging chute 4-3, and the X-axis pushing feeding device 4-1 pushes the substrate on the feeding chute 4-2 to move in the X-axis direction and sequentially pass through the feeding chute 4-2, A contraposition welding device 9 and a discharge chute 4-3. The electric system 1-3 is used for controlling the substrate feeding device 4, the X-axis pushing feeding device 4-1 is used for pushing the substrate to move on the substrate feeding device 4 and sending the substrate into the alignment welding device 9 for welding, and the substrate welded in the alignment welding device 9 is sent into the blanking device 11 through the discharge chute 4-3, so that the automatic feeding and conveying of the substrate are realized.
As shown in fig. 6, the chip feeding device 5 includes a chip feeding X-axis carrying groove 5-1, a Z-axis pick-up welding device 5-2, a pick-up welding bonding head 5-3, and a chip feeding X-axis grating encoder 5-4, the pick-up welding bonding head 5-3 is fixedly connected to the Z-axis pick-up welding device 5-2, the chip feeding X-axis grating encoder 5-4 is fixedly connected to the Z-axis pick-up welding device 5-2, the Z-axis pick-up welding device 5-2 moves upward along the X-axis on the chip feeding X-axis carrying groove 5-1, and the Z-axis pick-up welding device 5-2 drives the pick-up welding bonding head 5-3 to move upward along the Z-axis. Controlling a chip feeding device 5 through an electrical system 1-3, picking up a chip on a chip positioning device 7 through a picking up welding bonding head 5-3, moving the chip in the X-axis direction through a chip feeding X-axis carrying groove 5-1, moving the chip in the Z-axis direction through a Z-axis picking up welding device 5-2, and conveying the chip to a chip inlet of an alignment welding device 9; meanwhile, the positioning device 6 is used for monitoring the position of the chip and positioning the chip feeding starting position and the chip feeding ending position of the chip feeding device 5; the movement and the position of the chip in the X-axis direction are accurately controlled through the electric system 1-3 by combining displacement information fed back by the chip feeding X-axis grating encoder 5-4, so that the position of the chip is accurately controlled in the moving process of the chip, chip offset during welding is reduced from the aspect of accurately controlling the position of the chip input, and the chip mounting precision is improved.
As shown in fig. 7, the positioning device 6 includes an installation frame 6-1, a chip positioning vision system 6-2, an upward vision system 6-3, and a chip welding vision system 6-4, the chip positioning vision system 6-2 and the chip welding vision system 6-4 are fixedly connected to the installation frame 6-1, the chip positioning vision system 6-2 is disposed on the upper side of the chip positioning device 7, the upward vision system 6-3 is disposed on the lower side of the chip feeding device (5), and the chip welding vision system 6-4 is disposed on the upper side of the alignment welding device 9. In this embodiment, the upward vision system 6-3 is disposed on the marble slab 3-1 and is located at the lower side of the chip feeding device (5). The positions of the chips in the chip positioning device 7, the chip feeding device 5 and the alignment welding device 9 are respectively monitored through the chip positioning visual system 6-2, the top vision visual system 6-3 and the chip welding visual system 6-4, and the positions of the chips in the chip positioning device 7, the chip feeding device 5 and the alignment welding device 9 are controlled through the electrical system 1-3 based on the chip positions obtained through monitoring, so that the deviation of the chips from the set positions on each position in the chip mounting device is reduced, the deviation of the chips and the substrate relative to the set positions is reduced, and the accuracy of chip mounting is improved.
The chip positioning vision system 6-2, the upward vision system 6-3 and the chip welding vision system 6-4 can use a CCD camera as a vision image acquisition sensor to acquire a vision image and apply the vision image to the positioning of the chip and the substrate.
As shown in fig. 9, the device further comprises a thimble device 8, the thimble device 8 is electrically connected to an electrical system 1-3, the thimble device 8 comprises a Y-axis fine adjustment platform 8-1, an X-axis fine adjustment platform 8-2, a cam thimble driving system 8-3, a thimble 8-4, and a cylinder jacking system 8-5, the cam thimble driving system 8-3 is disposed at the lower side of the thimble 8-4 and drives the thimble 8-4 to move along the Z-axis direction, the thimble 8-4 is disposed at the lower side of the chip positioning device 7, the cylinder jacking system 8-5 drives the cam thimble driving system 8-3 and the thimble 8-4 to move along the Z-axis direction, the Y-axis fine adjustment platform 8-1 drives the cam thimble driving system 8-3, the thimble 8-4, and the cylinder jacking system 8-5 to move along the Y-axis direction, the X-axis fine adjustment platform 8-2 drives the cam thimble driving system 8-3, the thimble 8-4 and the cylinder jacking system 8-5 to move along the X axis. When the chip is attached to the blue film with the adhesive property, the chip is ejected from the blue film through the ejector pin device 8, so that the chip can be moved to a set position by the chip feeding device 5.
As shown in fig. 11, the device further includes a dispensing and glue-dipping device 10, the dispensing and glue-dipping device 10 is electrically connected to the electrical system 1-3, the dispensing and glue-dipping device 10 includes a dispensing mounting base 10-1, a dispensing Z-axis module 10-2, a dispensing head horizontal adjustment structure 10-3, a dispensing head 10-4, and a glue storage tray 10-5, the dispensing Z-axis module 10-2 and the dispensing head horizontal adjustment structure 10-3 are fixedly connected to the dispensing mounting base 10-1, the dispensing head 10-4 is disposed on the dispensing head horizontal adjustment structure 10-3, the glue storage tray 10-5 is close to the substrate feeding device (4) and the alignment welding device (9), and the dispensing head 10-4 is close to the alignment welding device 9. In this embodiment, the glue storage tray 10-5 is fixedly connected to the right side of the positioning device mounting frame 6-1. Dispensing is carried out on the substrate to be welded by the dispensing and glue dipping device 10 so as to facilitate welding.
As shown in fig. 12, the discharging device 11 includes a discharging box 11-1, a discharging box Z-axis driving device 11-2, a discharging box Y-axis pushing device 11-3 and a discharging box trough 11-4, the discharging box 11-1 is used for storing a welding finished product, the discharging box Z-axis driving device 11-2 drives the discharging box 11-1 to move in the Z-axis direction, and the discharging box Y-axis pushing device 11-3 pushes the discharging box 11-1 to move in the discharging box trough 11-4 in the Y-axis direction.
The chip and substrate positioning characteristic coordinates are identified through a positioning device 6 consisting of a CCD camera to position, a welding point coordinate is arranged at the visual center of the CCD camera, a linear motor system for driving the chip and the substrate to move in the X-axis direction, the Y-axis direction and the Z-axis direction is connected with a grating encoder and is subjected to closed-loop control, the movement stroke is dynamically compensated by combining the positioning device 6, the offset and the error generated in the chip moving process are reduced, the ultrahigh-precision chip mounting and welding requirements are met, and in an ideal state, the precision of the chip mounting device provided by the invention can reach +/-0.5 micrometer.
The above technical features constitute the best embodiment of the present invention, which has strong adaptability and best implementation effect, and unnecessary technical features can be added or subtracted according to actual needs to meet the needs of different situations.
Finally, it should be noted that the above-mentioned contents are only used for illustrating the technical solutions of the present invention, and not for limiting the protection scope of the present invention, and that the simple modifications or equivalent substitutions of the technical solutions of the present invention by those of ordinary skill in the art can be made without departing from the spirit and scope of the technical solutions of the present invention.
Claims (6)
1. A chip mounting device is characterized in that: comprises a substrate feeding device (2), a substrate feeding device (4), a chip feeding device (5), a chip positioning device (7), an alignment welding device (9), a positioning device (6) and a blanking device (11), the output end of the substrate feeding device (2) is connected with the substrate input end of the alignment welding device (9) through the substrate feeding device (4), the output end of the chip positioning device (7) is connected with the chip input end of the alignment welding device (9) through the chip feeding device (5), the output end of the alignment welding device (9) is connected with the input end of the blanking device (11) through the substrate feeding device (4), the positioning device (6) is electrically connected with the chip feeding device (5), the chip positioning device (7) and the alignment welding device (9) respectively; the device is characterized by further comprising an electrical system (1-3), wherein the electrical system (1-3) is electrically connected with the substrate feeding device (2), the substrate feeding device (4), the chip feeding device (5), the chip positioning device (7), the alignment welding device (9), the positioning device (6) and the blanking device (11);
the chip positioning device (7) comprises a chip placing die bonding ring (7-1), a die bonding ring rotating shaft (7-2), a chip positioning Y-axis motion platform (7-3), a chip positioning Y-axis grating encoder (7-4), a chip positioning X-axis motion platform (7-5) and a chip positioning X-axis grating encoder (7-6), wherein the chip placing die bonding ring (7-1) is in a ring shape, the chip placing die bonding ring (7-1) serves as the output end of the chip positioning device (7), the die bonding ring rotating shaft (7-2) is in transmission connection with the chip placing die bonding ring (7-1), the chip positioning Y-axis grating encoder (7-4) is fixedly connected to the chip positioning Y-axis motion platform (7-3), and the chip positioning X-axis grating encoder (7-6) is fixedly connected to the chip positioning X-axis motion flat-axis grating encoder (7-6) The chip placing die bonding ring (7-1) can move in the Y-axis direction under the driving of the chip positioning Y-axis motion platform (7-3), and the chip placing die bonding ring (7-1) can move in the X-axis direction under the driving of the chip positioning X-axis motion platform (7-5);
the chip feeding device (5) comprises a chip feeding X-axis carrying groove (5-1), a Z-axis picking and welding device (5-2), a picking and welding bonding head (5-3) and a chip feeding X-axis grating encoder (5-4), wherein the picking and welding bonding head (5-3) is fixedly connected to the Z-axis picking and welding device (5-2), the chip feeding X-axis grating encoder (5-4) is fixedly connected to the Z-axis picking and welding device (5-2), the Z-axis picking and welding device (5-2) moves upwards along the X axis on the chip feeding X-axis carrying groove (5-1), and the Z-axis picking and welding device (5-2) drives the picking and welding bonding head (5-3) to move upwards along the Z axis;
the alignment welding device (9) comprises an alignment welding Y-axis motion platform (9-1), an alignment welding Y-axis grating encoder (9-2), an alignment welding X-axis motion platform (9-3), an alignment welding X-axis grating encoder (9-4), a rotary alignment platform (9-5) and a chip welding platform (9-6), wherein the rotary alignment platform (9-5) is used as a chip input end of the alignment welding device (9), one end of the chip welding platform (9-6) is used as a substrate input end of the alignment welding device (9), the other end of the chip welding platform (9-6) is used as an output end of the alignment welding device (9), the alignment welding Y-axis grating encoder (9-2) is fixedly connected to the alignment welding Y-axis motion platform (9-1), the alignment welding X-axis grating encoder (9-4) is fixedly connected to the alignment welding X-axis motion platform (9-3), the rotary alignment table (9-5) and the chip welding platform (9-6) can move in the Y-axis direction under the driving of the alignment welding Y-axis motion platform (9-1), and the rotary alignment table (9-5) and the chip welding platform (9-6) can move in the X-axis direction under the driving of the alignment welding X-axis motion platform (9-3);
the positioning device (6) comprises an installation rack (6-1), a chip positioning visual system (6-2), an upward vision visual system (6-3) and a chip welding visual system (6-4), the chip positioning visual system (6-2) and the chip welding visual system (6-4) are fixedly connected to the installation rack (6-1), the chip positioning visual system (6-2) is arranged on the upper side of the chip positioning device (7), the upward vision visual system (6-3) is arranged on the lower side of the chip feeding device (5), and the chip welding visual system (6-4) is arranged on the upper side of the alignment welding device (9);
the electric system (1-3) drives the positioning device (6) to position the substrate and the chip on the alignment welding device (9), and the electric system (1-3) drives the alignment welding device (9) to adjust the relative position and angle of the chip and the substrate on the alignment welding device according to the position information obtained by the positioning device (6).
2. A chip mounting apparatus according to claim 1, wherein: the substrate feeding device (2) comprises a material box (2-1), a material box Z-axis driving device (2-2), a material box X-axis pushing device (2-3), a material box Y-axis pushing device (2-4) and an empty material box trough (2-5), wherein the material box (2-1) is used for storing substrates, the material box Z-axis driving device (2-2) drives the material box (2-1) to move in the Z-axis direction, the material box X-axis pushing device (2-3) pushes the substrates in the material box (2-1) into the substrate feeding device (4), and the material box Y-axis pushing device (2-4) pushes the material box (2-1) in the empty material box trough (2-5) to move in the Y-axis direction.
3. A chip mounting apparatus according to claim 1, wherein: the base plate feeding device (4) comprises an X-axis pushing feeding device (4-1), a feeding groove (4-2) and a discharging groove (4-3), the feeding groove (4-2) is connected with the output end of the base plate feeding device (2), the discharging groove (4-3) is connected with the blanking device (11), a gap is formed between the feeding groove (4-2) and the discharging groove (4-3), the alignment welding device (9) is accommodated in the gap, one side of the feeding groove (4-2) far away from the output end of the base plate feeding device (2) is connected with the base plate input end of the alignment welding device (9), one side of the discharging groove (4-3) far away from the blanking device (11) is connected with the output end of the alignment welding device (9), the X-axis pushing and feeding device (4-1) is arranged on the upper side of the feeding groove (4-2) and the discharging groove (4-3), and the X-axis pushing and feeding device (4-1) pushes a substrate on the feeding groove (4-2) to move in the X-axis direction and sequentially pass through the feeding groove (4-2), the alignment welding device (9) and the discharging groove (4-3).
4. A chip mounting apparatus according to claim 1, wherein: the thimble device is characterized by further comprising a thimble device (8), the thimble device (8) is electrically connected with the electrical system (1-3), the thimble device (8) comprises a Y-axis fine adjustment platform (8-1), an X-axis fine adjustment platform (8-2), a cam thimble driving system (8-3), a thimble (8-4) and a cylinder jacking system (8-5), the cam thimble driving system (8-3) is arranged on the lower side of the thimble (8-4) and drives the thimble (8-4) to move along the Z axis, the thimble (8-4) is arranged on the lower side of the chip positioning device (7), the cylinder jacking system (8-5) drives the cam thimble driving system (8-3) and the thimble (8-4) to move along the Z axis, and the Y-axis fine adjustment platform (8-1) drives the cam thimble driving system (8-3) The ejector pins (8-4) and the cylinder jacking system (8-5) move along the Y axial direction, and the X axial fine adjustment platform (8-2) drives the cam ejector pin driving system (8-3), the ejector pins (8-4) and the cylinder jacking system (8-5) to move along the X axial direction.
5. A chip mounting apparatus according to claim 1, wherein: also comprises a glue dispensing and dipping device (10), the glue dispensing and dipping device (10) is electrically connected with the electrical system (1-3), the glue dispensing and dipping device (10) comprises a glue dispensing mounting base (10-1), a glue dispensing Z-axis module (10-2), a glue dispensing head horizontal adjusting structure (10-3), a glue dispensing head (10-4) and a glue storage disc (10-5), the dispensing Z-axis module (10-2) and the dispensing head horizontal adjusting structure (10-3) are fixedly connected with the dispensing mounting base (10-1), the dispensing head (10-4) is arranged on the dispensing head horizontal adjusting structure (10-3), the glue storage disc (10-5) is close to the substrate feeding device (4) and the alignment welding device (9), and the glue dispensing head (10-4) is close to the alignment welding device (9).
6. A chip mounting apparatus according to claim 1, wherein: the blanking device (11) comprises a blanking box (11-1), a blanking box Z-axis driving device (11-2), a blanking box Y-axis pushing device (11-3) and a blanking box trough (11-4), the blanking box (11-1) is used for storing welding finished products, the blanking box Z-axis driving device (11-2) drives the blanking box (11-1) to move in the Z-axis direction, and the blanking box Y-axis pushing device (11-3) pushes the blanking box (11-1) to move in the blanking box trough (11-4) in the Y-axis direction.
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| CN114566452B (en) * | 2022-04-29 | 2022-07-15 | 武汉飞恩微电子有限公司 | Base and chip bonding device and automatic packaging production line of pressure sensor comprising same |
| CN116329110A (en) * | 2023-05-30 | 2023-06-27 | 武汉普赛斯电子股份有限公司 | Chip test arrangement device |
| CN116759334B (en) * | 2023-06-01 | 2024-02-20 | 伊瑟半导体科技(江苏)股份有限公司 | Chip mounting equipment |
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