CN114566452B - Base and chip bonding device and automatic packaging production line of pressure sensor comprising same - Google Patents

Base and chip bonding device and automatic packaging production line of pressure sensor comprising same Download PDF

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Publication number
CN114566452B
CN114566452B CN202210465264.9A CN202210465264A CN114566452B CN 114566452 B CN114566452 B CN 114566452B CN 202210465264 A CN202210465264 A CN 202210465264A CN 114566452 B CN114566452 B CN 114566452B
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chip
base
station
carrier
hole
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CN114566452A (en
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王小平
曹万
熊波
梁世豪
陈列
施涛
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Wuhan Finemems Inc
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Wuhan Finemems Inc
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C13/00—Means for manipulating or holding work, e.g. for separate articles
    • B05C13/02—Means for manipulating or holding work, e.g. for separate articles for particular articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/0208—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16B—DEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS OR MACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS, CLIPS OR WEDGES; JOINTS OR JOINTING
    • F16B11/00—Connecting constructional elements or machine parts by sticking or pressing them together, e.g. cold pressure welding
    • F16B11/006—Connecting constructional elements or machine parts by sticking or pressing them together, e.g. cold pressure welding by gluing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/08—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of piezoelectric devices, i.e. electric circuits therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67271—Sorting devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8887—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges based on image processing techniques

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Signal Processing (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
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  • Computer Vision & Pattern Recognition (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The invention provides a base and chip bonding device and an automatic packaging production line of a pressure sensor comprising the same, wherein the base and chip bonding device comprises a rotating disk and a driving device for driving the rotating disk to rotate; a plurality of first stations for placing the TO bases are connected around the rotating disc; a dispensing device and a visual defect detection device are arranged above the first station; the first station is provided with a horizontal conveying device which is used for conveying the packaged TO bases; the rotary disk is provided with a second station for placing the chip carrier, the second station is provided with an intermediate chip feeding device, and a chip sucking and transferring device is arranged above the second station. The invention carries out centralized processing by utilizing the rotating disc, shortens the production line and reduces the occupied area; the rotation of the rotating disk and the visual defect identification of the visual defect detection device are combined, and the bonded and assembled assembly parts can be screened and classified.

Description

Base and chip bonding device and automatic packaging production line of pressure sensor comprising same
Technical Field
The invention relates to the technical field of pressure sensor packaging, in particular to a base and chip bonding device and an automatic packaging production line comprising the same.
Background
Because the size of the silicon chip is generally very small and the corrosion resistance of the silicon material is poor, the manufactured silicon chip cannot be directly applied, so that people are required to package a bare chip before use, and the internal silicon chip is protected from being damaged by external force. In addition, the package must provide an interface for the silicon chip to external systems. For pressure sensors, the silicon chip must typically be directly exposed to the fluid being measured during operation, which requires packaging of the pressure sensor in a manner that both protects the chip and transmits pressure.
As shown in fig. 1, in the related art, the oil pressure sensor includes a metal housing 1001, a TO base 1002, a pressure chip 1003, silicone oil 1004, a gold wire 1005, and an isolation diaphragm 1007, where the isolation diaphragm 1007 is a stainless steel sheet, and the TO base 1002 is a ceramic base. One end of the metal shell 1001 is welded and fixed with an isolation diaphragm 1007, the other end of the metal shell 1001 is welded with the TO base 1002, a sealed cavity is formed among the isolation diaphragm 1007, the metal shell 1001 and the TO base 1002, the pressure chip 1003 is located in the cavity, and the pressure chip 1003 is adhered TO the upper surface of the TO base 1002 through a glue layer 1006. The pressure chip 1003 bonding pad is connected with the TO base 1002 through a gold wire 1005. The cavity is filled with silicone oil 1004. When the sensor works, an external medium to be measured and the pressure chip 1003 are isolated from the stainless steel diaphragm by the silicone oil 1004, so that pressure can be transmitted to the pressure chip 1003 almost without loss. As shown in fig. 2, in the related art, the main processes for packaging the oil pressure sensor include: the isolation diaphragm and the metal shell are subjected to airtight welding by adopting a fusion welding process, and the fusion welding process is commonly used for laser welding, argon arc welding or electron beam welding and the like. And the silicone oil is subjected to high-temperature high-vacuum treatment and then is filled in vacuum, so that the influence of residual gas on an isolation pressure measurement system is basically eliminated. The silicon chip is formed by sealing through an electrostatic bonding process, the sealed chip is adhered TO the TO base through a glue joint process, and the chip bonding pad is connected with the lead of the TO base through a lead bonding process of gold wires.
At present, an automatic production line is designed according to the process flow of the engine oil pressure sensor packaging, and the automatic production line generally comprises an isolation diaphragm and metal shell welding device, a base and chip bonding device, a lead bonding device, a silicone oil vacuum filling device, a finished product assembling and welding device and a finished product leakage detection device. The PCL controller automatically controls the automatic operation of each device, and then automatically completes the packaging work of the whole engine oil pressure sensor. Still be equipped with conveyer, manipulator between each device, wherein conveyer is used for transporting spare part, the manipulator is used for transporting spare part.
In each of the above devices, the base and die bonding device is critical. Generally, the TO base moves TO a position below a dispensing head of the bonding apparatus, and then the dispensing structure performs dispensing on the TO base. The pressure chips are loaded in a dedicated carrier plate, which is conveyed by a conveyor belt. When the assembly is needed, the conveyor belt is paused, the special carrying disc is stopped at a preset position, and the manipulator grabs the pressure chip and bonds the pressure chip with the TO base in a bonding mode. The manipulator will then rotate to remove the empty dedicated carrier tray and place it in a carrier tray collection frame for reuse.
The technical content has defects: the production line is too long, occupies more horizontal space, and is difficult to meet the requirements under the condition of limited places.
Disclosure of Invention
The invention provides a base and chip bonding device and an automatic packaging production line of a pressure sensor comprising the same, which aim to solve the technical problems.
The technical scheme of the invention is realized as follows:
in one aspect, the invention provides a base and chip bonding device, which comprises a rotating disk and a driving device for driving the rotating disk to rotate; the periphery of the rotating disc is connected with a plurality of first stations, dispensing equipment and a visual defect detection device are arranged on the periphery of the first stations, and the first stations are provided with horizontal conveying devices which are used for placing and conveying TO bases on the horizontal conveying devices; the chip loading device is characterized in that a second station is arranged at the rotating center of the rotating disc, an intermediate chip loading device and a chip carrier removing device are arranged on the second station, and a chip sucking and transferring device is arranged above the second station.
In some embodiments, the driving device comprises a first motor, a first transmission shaft, a second transmission shaft, a worm wheel; an output shaft of the first motor is coaxially connected with the first transmission shaft, and one end of the worm is coaxially connected with the second transmission shaft; the first transmission shaft is in transmission connection with the second transmission shaft through a belt; one end of the worm wheel is coaxially connected with the rotating disc, and the worm wheel is meshed with the worm; the worm wheel is equipped with the hole along the axis direction, and the hole endotheca has fixed reference column, the fixed cover of fixed reference column periphery wall has connect support piece, support piece is close to the one end of worm wheel is equipped with the embedded groove, the worm wheel free end coaxial coupling has the one end of column spinner, the other end rotation of column spinner sets up in the embedded groove.
In some embodiments, the fixed positioning column is provided with a cavity with an opening at one end, the cavity is used for accommodating the chip carriers stacked layer by layer, and the peripheral wall of the cavity is provided with an electric heating layer; the cavity is also internally provided with the intermediate chip feeding device, and the intermediate chip feeding device is used for pushing the chip carrier to move and feed; the fixed positioning column is fixedly connected with the chip carrier removing device, and the chip carrier removing device is used for removing the loaded chip carrier in a mode of pushing the chip carrier to move along the horizontal direction.
In some embodiments, the middle chip feeding device comprises a second motor, a left-right screw rod, a mounting plate, a first upper diagonal rod, a second upper diagonal rod, a first lower diagonal rod, a second lower diagonal rod and a push plate; the output end of the second motor is coaxially connected with one end of the left and right screw rod, and the other end of the left and right screw rod is provided with a limiting block; one end of the first upper inclined rod and one end of the second upper inclined rod are hinged to the side face of the push plate, and one end of the first lower inclined rod and one end of the second lower inclined rod are hinged to the side face of the mounting plate; the left-right screw rod is in threaded connection with a first moving block and a second moving block, and the first moving block and the second moving block move relatively; the other end of the first upper inclined rod, the other end of the first lower inclined rod and the first moving block are hinged; the other end of the second upper inclined rod, the other end of the second lower inclined rod and the second moving block are hinged.
In some embodiments, the chip carrier removing device includes an air cylinder, a through hole provided on the rotating disk, and the through hole is located on a path along which the chip carrier moves horizontally for the chip carrier to drop.
In some embodiments, a carrier collecting device is arranged below the through hole, the chip carrier collecting device comprises a collecting box, an inclined plate and a pressure counting device, the collecting box is connected with the lower end face of the rotating disc, and the peripheral wall of the collecting box is provided with a feeding hole; the inclined plate is arranged close to the through hole, one end of the inclined plate is hinged with the lower end face of the rotating disc, and the other end of the inclined plate extends into the collecting box through the feeding hole; the working face of the inclined plate is provided with the pressure counting device.
In some embodiments, a carrier collecting device is placed below the through hole, and the carrier collecting device comprises a collecting box, a pressure sensor, a collecting plate, a spring and an alarm system; the collecting plate is located in the collecting box, a plurality of springs are arranged between the collecting plate and the collecting box, one end of each spring is connected with the bottom of the collecting box, the other end of each spring is connected with the collecting plate, and the pressure sensor is connected with the alarm system.
In some embodiments, the first station is provided with a through slot in which a horizontal conveyor is disposed; the horizontal conveying device comprises a driving wheel, a driven wheel and a conveying belt which is connected between the driving wheel and the driven wheel in a matched mode, and the upper end face of the conveying belt and the upper end face of the first station are located on the same plane; the conveyer belt surface is equipped with the TO base standing groove that is no less than one, TO base standing groove is used for placing the TO base.
In some embodiments, the chip suction and transfer device comprises a three-axis moving platform and a vacuum suction device connected with the three-axis moving platform, the vacuum suction device comprises a vacuum suction nozzle, a vacuum tube, and a vacuum suction device, one end of the vacuum tube is connected with the vacuum suction nozzle, and the other end of the vacuum tube is connected with the vacuum suction device; the vacuum suction nozzle comprises an adsorption part and a connecting part, wherein a ventilation pipeline which is communicated up and down is arranged in the connecting part, and the ventilation pipeline extends and is communicated with the adsorption part; the adsorption surface of the adsorption part is provided with a heat-resistant layer.
In another aspect, the present invention provides an automatic packaging production line for pressure sensors, including any one of the above base and die bonding apparatuses.
The beneficial effect that technical scheme that this application provided brought includes: the invention (I) utilizes the rotating disc TO carry out centralized processing on overlong production lines in the process of bonding the TO base and the pressure chip, shortens the production lines and reduces the occupied area; the invention combines the rotation of the rotating disc and the visual defect identification of the visual defect detection device, can screen and classify the bonded and assembled assembly parts, and reduces the waste of resources caused by the assembly of subsequent defective products; and thirdly, the invention is provided with an intermediate chip feeding device, and when the chips in the chip carriers are used up, the next chip carrier filled with the chips can be replaced by the intermediate chip feeding device.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a schematic diagram of a hydraulic pressure sensor in the prior art;
FIG. 2 is a flow chart of a process of an automatic packaging production line of an oil pressure sensor in the prior art;
FIG. 3 is a schematic top view of the present invention (without a chip pick-up and transfer device);
FIG. 4 is a schematic cross-sectional view of the present invention;
FIG. 5 is a schematic structural diagram of an interposer loading device according to the present invention;
FIG. 6 is a cross-sectional view of the vacuum nozzle of the present invention;
FIG. 7 is a schematic view of a first structure of a carrier collection device according to the present invention;
fig. 8 is a second structural schematic diagram of the carrier collection device of the present invention.
In the figure: 1. rotating the disc; 101. a through hole; 2. a horizontal transfer device; 201. a driving wheel; 202. a driven wheel; 203. a conveyor belt; 3. an intermediate chip loading device; 311. a second motor; 312. a left-right screw rod; 313. mounting a plate; 314. a first upper diagonal bar; 315. a second upper diagonal member; 316. a first lower diagonal bar; 317. a second lower diagonal member; 318. a limiting block; 319. pushing the plate; 302. a chip carrier removal device; 4. a chip sucking and transferring device; 401. a three-axis mobile platform; 402. a vacuum adsorption device; 411. a vacuum suction nozzle; 5. a drive device; 501. a first motor; 502. a first transmission shaft; 503. a second drive shaft; 504. a worm; 505. a worm gear; 6. fixing the positioning column; 601. a cavity; 7. a support member; 701. a groove is embedded; 8. a spin column; 9. a first station; 10. a connecting portion; 11. an adsorption part; 12. dispensing equipment; 13. a visual defect detection device; 14. a second station; 15. a carrier collection device; 16. a pressure sensor; 17. a collection plate; 18. a spring; 19. a collection box; 20. an inclined plate; 1001. a metal housing; 1002. a TO base; 1003. a pressure chip; 1004. silicone oil; 1005. gold wires; 1006. a glue layer; 1007. an isolation diaphragm.
Detailed Description
The technical solutions of the present invention will be described clearly and completely with reference to the embodiments of the present invention, and it should be apparent that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without making any creative effort based on the embodiments in the present invention, belong to the protection scope of the present invention.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein.
Referring to fig. 3, 4, 5, 6, 7 and 8, the present embodiment provides a base and chip bonding apparatus, which includes a rotating plate 1 and a driving device 5 for driving the rotating plate 1 to rotate. Around the rotating disk 1 are attached a number of first stations 9 for placing TO bases 1002. The TO base 1002 placed on the first station 9 can be moved from the first position TO the second position by the rotation of the rotating disk 1. In some embodiments, an angle sensor is disposed at a rotation center of the rotating disk 1, and through the angle sensor and the driving device 5, a worker can precisely control a rotation angle of the rotating disk 1. In this embodiment, the plurality of first stations 9 are symmetrically arranged around the rotating disc 1. A dispensing device 12 and a visual defect detecting device 13 are arranged above the first station 9. The dispensing device 12 can apply the glue solution on the surface of the TO base 1002 TO prepare for the subsequent adhesion of the pressure chip 1003 and the TO base 1002. The dispensing device 12 of this embodiment can implement three-dimensional path dispensing, and three-dimensional path dispensing technology is common in the market, and is not described herein. The visual defect inspection apparatus 13 of the present embodiment is used TO inspect whether the pressure chip 1003 is fixed at a predetermined position of the TO base 1002. The visual defect inspection device 13 of the present embodiment includes a CCD camera, and performs determination by using a visual inspection technique. The first station 9 is provided with a horizontal conveyor 2, which horizontal conveyor 2 is used to convey the articles located above it, leaving the articles out of the first station 9. In some embodiments, the surface of the conveyor belt 203 is provided with at least one TO base placing groove, the TO base placing groove is used for placing a TO base, and the shape of the TO base placing groove is matched with the shape of the TO base. The TO base standing groove can fix the TO base, and when the rotary disk 1 rotates or pauses, the TO base moves under the action of inertia.
The rotating disc 1 is provided with a second station 14 for placing a chip carrier, the second station 14 is provided with an intermediate chip feeding device 3, and a chip sucking and transferring device 4 is arranged above the second station 14. Chip suction transfer device 4 is similar to the manipulator among the prior art, but is different from the mode that the manipulator centre gripping snatched, and the chip suction transfer device 4 of this embodiment can adsorb the transfer through the adsorption mode to pressure chip, can not cause the damage to pressure chip.
The periphery of the rotating disc 1 of the invention is provided with a plurality of first stations 9, and each first station 9 is provided with a horizontal conveying device 2. The TO base 1002 is placed on the horizontal transfer device 2. The periphery of the rotating disc 1 is provided with a dispensing device 12 and a visual defect detection device 13, and when the rotating disc 1 rotates, the first station 9 stops below the dispensing device and below the visual defect detection device 13.
The working process is as follows:
as shown in fig. 3, 4, 5, 7 and 8, one TO base 1002 is placed in the TO base placement slot above the horizontal conveyor 2, and then the driving device 5 is controlled TO drive the rotating disk 1 TO rotate, the rotating disk 1 drives the TO base 1002 TO rotate until the driving device 5 controls the TO base 1002 TO stop below the dispensing device 12, and the dispensing device 12 performs dispensing processing on the TO base 1002.
The chip suction transfer device 4 sucks the pressure chip placed in the chip carrier and transfers the pressure chip TO the position above the TO base 1002 after dispensing, so that the pressure chip and the TO base 1002 are bonded and assembled. In this process, the rotating disk 1 is in a suspended rotating state.
After the bonding assembly is completed, the driving device 5 drives the rotating disk 1 TO rotate again, the bonded and assembled TO base 1002 passes through the visual defect detection device 13 under the driving of the rotating disk 1, and the visual defect detection device 13 can detect whether the bonding assembly position between the pressure chip 1003 and the TO base 1002 is correct or not. If the bonding assembly position between the pressure chip 1003 and the TO base 1002 is correct, the product is a high-quality product; if the position of the adhesive assembly between the pressure chip 1003 and the TO base 1002 is wrong, it is a defective product.
If the bonding assembly position of the pressure chip and the TO base is correct, the rotary plate 1 is rotated again, and the quality product with correct bonding assembly can reach the next position. After the high-quality product with correct bonding and assembling reaches the next position, the driving device 5 controls the rotating disc 1 TO stop rotating, and then the horizontal conveying device 2 automatically operates TO enable the high-quality product with correct bonding and assembling TO move towards the direction far away from the circle center of the rotating disc 1 until the high-quality product is separated from the TO base placing groove under the action of gravity, and further separated from the first station 9. At this time, the high quality products with correct bonding assembly are screened out.
If the bonding assembly position of the pressure chip and the TO base 1002 is incorrect, the rotating disc 1 continues TO keep the pause state, and then the horizontal conveying device 2 starts TO operate, so that the defective products move towards the direction away from the center of the rotating disc 1 until the defective products are separated from the TO base placing groove under the action of gravity, and further separated from the first station 9. At this time, defective products of the bonding assembly errors are screened out. In some embodiments, a defective item collecting box is provided near the visual defect detecting apparatus 13, and a defective item, which is adhesively assembled with a mistake, may drop into the defective item collecting box after leaving the first station 9.
By the method, the good products and the defective products can be automatically classified in the packaging process, and the subsequent defective products are prevented from being assembled next step, so that resource waste is avoided. A plurality of first stations 9 are arranged around the rotary disc 1, at least one TO base placing groove is formed in the surface of the conveyor belt 203, so that a plurality of TO bases 1002 can be placed at one time, and the bonding assembly process is sequentially completed according TO the rotation sequence of the rotary disc 1.
The number of the pressure chips stored in the chip carrier is limited, and after no pressure chip exists in the chip carrier, the chip can be replaced through the middle chip loading device 3, and the chip carrier which is completely loaded can be removed through the chip carrier removing device.
The second station 14 is arranged at the rotating center of the rotating disc 1, the middle chip feeding device 3 is arranged at the second station 14, and by means of the mode, the moving range of the chip carrier can not be large when the rotating disc 1 rotates, the moving range of the chip sucking and transferring device 4 can not be too large, the occurrence of errors is reduced, and the chip sucking and transferring device 4 is guaranteed to be accurately clamped. In addition, through the mode of middle chip material loading, can also avoid setting up the overlength conveyer belt, practiced thrift horizontal space.
The invention utilizes the rotating disc 1 TO carry out centralized treatment on overlong production lines in the process of bonding the TO base and the pressure chip, shortens the production lines and reduces the occupied area. In addition, the present invention combines the rotation of the rotating disc and the visual defect recognition of the visual defect detecting device 13, and can screen and classify the assembly parts which are bonded and assembled, thereby reducing the waste of resources caused by the assembly of the following defective products. The invention is provided with an intermediate chip loading device 3 and a chip carrier removing device, when the chip in the chip carrier is used up, the next chip carrier filled with the chip can be replaced by the intermediate chip loading device 3, and the chip carrier which is loaded with the chip can be removed by the chip carrier removing device.
As shown in fig. 4, in some embodiments, the driving device 5 includes a first motor 501, a first transmission shaft 502, a second transmission shaft 503, a worm 504, and a worm wheel 505; an output shaft of the first motor 501 is coaxially connected with a first transmission shaft 502, and one end of a worm 504 is coaxially connected with a second transmission shaft 503; the first transmission shaft 502 is in transmission connection with the second transmission shaft 503 through a belt; one end of a worm wheel 505 is coaxially connected with the rotating disk 1, and the worm wheel 505 is engaged with the worm 504. The first motor 501 can drive the first transmission shaft 502 to rotate, and the second transmission shaft 503 rotates under the action of the belt transmission connection. The second transmission shaft 503 is coaxially connected to the worm 504, and when the second transmission shaft 503 rotates, the worm 504 rotates, thereby rotating the worm wheel 505. The worm wheel 505 is connected with the rotating disc 1, and when the worm wheel 505 rotates, the rotating disc 1 also rotates. The rotating disc 1 is driven to rotate in a worm and gear transmission mode, and the rotating angle of the rotating disc 1 can be accurately controlled.
In some embodiments, the worm wheel 505 has an inner hole along the central axis direction, the inner hole is sleeved with the fixed positioning pillar 6, the fixed positioning pillar 6 has a cavity 601 with an opening at one end, and the middle chip feeding device 3 is disposed in the cavity 601. The fixed locating column 6 periphery wall is fixed to be cup jointed support piece 7, and support piece 7 is equipped with embedded groove 701 near the one end of worm wheel 505, and the worm wheel 505 free end coaxial coupling has the one end of column spinner 8, and the other end of column spinner 8 rotates the setting in embedded groove 701. The support 7 can support the rotary column 8, and further support the rotary disk 1, and can ensure that the rotary disk 1 can rotate, and further can ensure that the rotary disk 1 can rotate. The fixed positioning column 6 is fixedly connected with the installation foundation, and when the rotating disk 1 rotates, the fixed positioning column 6 is fixedly arranged at a fixed position.
In some embodiments, a lubricating layer is provided between the embedded groove 701 and the rotary column 8. The lubricating layer can reduce the frictional force between the embedded groove 701 and the rotary column 8, and the rotary column 8 is convenient to rotate. Preferably, the embedded groove 701 inside wall is equipped with the recess, is equipped with the ball in the recess, and the ball setting is between embedded groove 701 and column spinner 8, and still is equipped with lubricating oil between embedded groove 701 and the column spinner 8. By the double lubrication type, smooth rotation of the rotating disk 1 can be ensured.
In some embodiments, as shown in fig. 4, the cavity 601 is used for accommodating chip carriers stacked layer by layer, an end of the intermediate chip feeding device 3 is connected to an end surface of the cavity 601 away from the opening, and another end of the intermediate chip feeding device 3 is used for pushing the chip carriers to move along the lifting direction of the intermediate chip feeding device 3. The bottom surface of the chip carrier positioned on the uppermost layer is higher than the upper end surface of the fixed positioning column 6. The upper end face of the fixed positioning column 6 is higher than the upper end face of the rotating disc 1, or the upper end face of the fixed positioning column 6 is flush with the upper end face of the rotating disc 1. The chip adsorption and transfer device can adsorb and transfer the chips in the chip carrier on the uppermost layer, and after the chips of the chip carrier on the uppermost layer are adsorbed, the chip carrier which is completely loaded can be horizontally pushed through the chip carrier removing device 302, so that the chips in the chip carrier on the next layer are exposed, and the chip adsorption and transfer device can adsorb and grab the chips. Pushing the chip carrier requires using the chip carrier removing device 302, the chip carrier removing device 302 is fixedly connected with the fixed positioning column 6, and the chip carrier removing device 302 is used for pushing the chip carrier to move along the horizontal direction. In this embodiment, the chip carrier removing device 302, the cylinder block, and the through hole 101, the cylinder block is fixedly connected to the fixed positioning column 6, and the cylinder is fixed to the cylinder block by a bolt. Through the telescopic link of cylinder, can promote the chip carrier. The through hole 101 is disposed on the rotating disk 1, and the through hole 101 is located on a path along which the chip carrier moves horizontally for the chip carrier to drop. Therefore, the chip carrier can fall along the through hole 101 in the horizontal pushing process, and the vacant chip carrier is separated from the rotating disk 1. Through-hole 101 and chip carrier looks adaptation for the chip carrier can pass through-hole 101.
Preferably, the carrier collecting device 15 can be placed below the through hole 101. As shown in fig. 7, the carrier collection device 15 includes a collection box 19, a pressure sensor 16, a collection plate 17, and a spring 18. The collecting plate 17 is positioned in the collecting box 19, a plurality of springs 18 are arranged between the collecting plate 17 and the collecting box 19, one end of each spring 18 is connected with the bottom of the collecting box 19, and the other end of each spring 18 is connected with the collecting plate 17. The pressure sensor 16 is mounted at the bottom of the collection tank 19. When the carrier collection device 15 is in an idle state, the collection plate 17 is disposed near the opening of the collection box 19. As more and more chip carriers drop into the carrier collecting device 15 along the through hole 101, the collecting plate 17 gradually overcomes the elastic force of the spring 18, and the collecting plate 17 moves toward the chip approaching the pressure sensor 16 until the collecting plate 17 presses the pressure sensor 16. The pressure sensor 16 is connected to an alarm system. When the pressure sensor 16 senses the pressure or the pressure born by the pressure sensor 16 exceeds a certain threshold, the alarm system gives an alarm to remind the operator to recycle the carrier collecting device 15 in the collecting box 19. In addition, the chip carrier drops into the carrier collection device 15, which may damage itself due to gravity. Through the arrangement of the spring 18 and the collecting plate 17, the falling height of the chip carrier can be reduced, and the possibility of damage to the chip carrier is reduced.
As shown in fig. 8, a carrier collecting device 15 is arranged below the through hole 101, the chip carrier collecting device comprises a collecting box 19, an inclined plate 20 and a pressure counting device, the collecting box 19 is connected with the lower end surface of the rotating disc 1, and the peripheral wall of the collecting box 19 is provided with a feeding hole; the inclined plate 20 is arranged close to the through hole 101, one end of the inclined plate 20 is hinged with the lower end face of the rotating disc 1, and the other end of the inclined plate 20 extends into the collecting box 19 through the feeding hole; the working face of the inclined plate 20 is provided with a pressure counting device. The loaded chip carriers drop down along the through holes 101 to the inclined plate 20, and then the chip carriers enter the collection box 19 along the inclined plate 20. The pressure counting device can count the chip carriers passing through the pressure counting device. When the number recorded by the pressure-technical device exceeds a set threshold value, the operator can be alerted by an alarm device to replace the collecting tank 19. The collecting box 19 is detachably mounted below the rotating disc 1 in a bolt connection mode or a magnetic absorption fixing mode and the like.
In some embodiments, the fixed positioning column 6 is provided with an electric heating layer, and the fixed positioning column 6 can be heated by the heating effect of the electric heating layer, so that the chip in the chip carrier is preheated. Facilitating subsequent adhesive assembly of the chip TO the TO base 1002.
In some embodiments, the middle chip feeding device 3 includes a second motor 311, a left-right screw 312, a mounting plate 313, a first upper diagonal rod 314, a second upper diagonal rod 315, a first lower diagonal rod 316, a second lower diagonal rod 317, and a push plate 319; the output end of the second motor 311 is coaxially connected with one end of the left-right spinning rod 312, and the other end of the left-right spinning rod 312 is provided with a limiting block 318; one end of a first upper inclined rod 314 and one end of a second upper inclined rod 315 are hinged to the side surface of the push plate 319, and one end of a first lower inclined rod 316 and one end of a second lower inclined rod 317 are hinged to the side surface of the mounting plate 313; the left-right rotating screw rod 312 is in threaded connection with a first moving block and a second moving block, and the first moving block and the second moving block move relatively; the other end of the first upper inclined rod 314, the other end of the first lower inclined rod 316 and the first moving block are hinged; the other end of the second upper diagonal bar 315, the other end of the second lower diagonal bar 317 and the second moving block are hinged. The rotation of the second motor 311 can drive the left and right screws 312 to rotate, so as to drive the first moving block and the second moving block to move relatively. The first upper diagonal bar 314, the second upper diagonal bar 315, the first lower diagonal bar 316, and the second lower diagonal bar 317 are also moved, so that the intermediate chip feeding device 3 is lifted.
In some embodiments, the first station 9 is provided with a through slot in which the horizontal transfer device 2 is arranged; the horizontal conveying device 2 comprises a driving wheel 201, a driven wheel 202 and a conveying belt 203 connected between the driving wheel 201 and the driven wheel 202 in a matching mode, and the upper end face of the conveying belt 203 and the upper end face of the first station 9 are located on the same plane. The articles located above the conveyor belt 203 are caused to exit the first station 9 by the conveying action of the conveyor belt 203.
In some embodiments, the chip sucking and transferring device 4 includes a three-axis moving platform 401 and a vacuum sucking device 402 connected to the three-axis moving platform 401, the vacuum sucking device 402 includes a vacuum nozzle 411, a vacuum tube, and a vacuum sucking device, one end of the vacuum tube is connected to the vacuum nozzle 411, and the other end of the vacuum tube is connected to the vacuum sucking device; the vacuum suction nozzle 411 comprises an adsorption part 11 and a connecting part 10, wherein a ventilation pipeline which is communicated up and down is arranged in the connecting part 10, and the ventilation pipeline extends and is communicated with the adsorption part 11; the adsorption surface of the adsorption part 11 is provided with a heat-resistant layer, and the heat-resistant layer is a fluoride layer. The absorption portion 11 is usually made of rubber, and by providing the heat-resistant layer, the heat on the surface of the chip can be prevented from affecting the absorption portion 11, so that the absorption portion 11 is deformed and damaged.
In the description of the present application, it should be noted that the terms "upper", "lower", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, which are only for convenience in describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and operate, and thus, should not be construed as limiting the present application. Unless expressly stated or limited otherwise, the terms "mounted," "connected," and "connected" are intended to be inclusive and mean, for example, that they may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as the case may be.
It is noted that, in this application, relational terms such as "first" and "second," and the like, are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
The above description is merely exemplary of the present application and is presented to enable those skilled in the art to understand and practice the present application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the application. Thus, the present application is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims (10)

1. The base and chip bonding device is characterized by comprising a rotating disk (1) and a driving device (5) for driving the rotating disk (1) to rotate; a plurality of first stations (9) are connected around the rotating disc (1), dispensing equipment (12) and a visual defect detection device (13) are arranged around the first stations (9), a horizontal conveying device (2) is arranged on the first stations (9), and the horizontal conveying device (2) is used for placing and conveying the TO bases on the horizontal conveying device; the chip picking and transferring device is characterized in that a second station (14) is arranged at the rotating center of the rotating disc (1), the second station (14) is provided with an intermediate chip feeding device (3) and a chip carrier removing device (302), and a chip sucking and transferring device (4) is arranged above the second station (14).
2. The susceptor and chip bonding apparatus according to claim 1, wherein the driving means (5) comprises a first motor (501), a first transmission shaft (502), a second transmission shaft (503), a worm (504), a worm wheel (505); the output shaft of the first motor (501) is coaxially connected with the first transmission shaft (502), and one end of the worm (504) is coaxially connected with the second transmission shaft (503); the first transmission shaft (502) is in transmission connection with the second transmission shaft (503) through a belt; one end of the worm wheel (505) is coaxially connected with the rotating disc (1), and the worm wheel (505) is meshed with the worm (504); worm wheel (505) are equipped with the hole along the axis direction, and the hole endotheca has fixed reference column (6), the fixed cover of fixed reference column (6) periphery wall has cup jointed support piece (7), support piece (7) are close to the one end of worm wheel (505) is equipped with embedded groove (701), worm wheel (505) free end coaxial coupling has the one end of column spinner (8), the other end of column spinner (8) rotates the setting and is in embedded groove (701).
3. The base and chip bonding apparatus according to claim 2, wherein the fixed positioning column (6) is provided with a cavity (601) with one open end, the cavity (601) is used for accommodating chip carriers stacked layer by layer, and the peripheral wall of the cavity (601) is provided with an electric heating layer; the cavity (601) is also internally provided with the intermediate chip feeding device (3), and the intermediate chip feeding device (3) is used for pushing the chip carrier to move and feed; the fixed positioning column (6) is fixedly connected with the chip carrier removing device (302), and the chip carrier removing device (302) is used for removing the chip carrier which is completely loaded in a mode of pushing the chip carrier to move along the horizontal direction.
4. The die bonding apparatus according to claim 3, wherein the middle die feeding means (3) comprises a second motor (311), a left-right screw (312), a mounting plate (313), a first upper slanting rod (314), a second upper slanting rod (315), a first lower slanting rod (316), a second lower slanting rod (317), a pushing plate (319); the output end of the second motor (311) is coaxially connected with one end of the left and right screw rods (312), and the other end of the left and right screw rods (312) is provided with a limiting block (318); one end of the first upper inclined rod (314) and one end of the second upper inclined rod (315) are hinged to the side surface of the push plate (319), and one end of the first lower inclined rod (316) and one end of the second lower inclined rod (317) are hinged to the side surface of the mounting plate (313); the left-right screw rod (312) is in threaded connection with a first moving block and a second moving block, and the first moving block and the second moving block move relatively; the other end of the first upper inclined rod (314), the other end of the first lower inclined rod (316) and the first moving block are hinged; the other end of the second upper inclined rod (315), the other end of the second lower inclined rod (317) and the second moving block are hinged.
5. The base and chip bonding apparatus according to claim 3, wherein the chip carrier removing means comprises an air cylinder, a through hole (101), the through hole (101) is provided on the rotating disk (1), and the through hole (101) is located on a path of the chip carrier moving horizontally for the chip carrier to pass through.
6. The base and chip bonding apparatus according to claim 5, wherein a carrier collecting device (15) is disposed below the through hole (101), the chip carrier collecting device comprises a collecting box (19), an inclined plate (20) and a pressure counting device, the collecting box (19) is connected with the lower end surface of the rotating disc (1), and the peripheral wall of the collecting box (19) is provided with a feeding hole; the inclined plate (20) is arranged close to the through hole (101), one end of the inclined plate (20) is hinged with the lower end face of the rotating disc (1), and the other end of the inclined plate (20) extends into the collecting box (19) through the feeding hole; the working surface of the inclined plate (20) is provided with the pressure counting device.
7. The base and chip bonding apparatus according to claim 5, wherein a carrier collecting device (15) is placed under the through hole (101), and the carrier collecting device (15) comprises a collecting box (19), a pressure sensor (16), a collecting plate (17), a spring (18) and an alarm system; the collecting plate (17) is located in the collecting box (19), a plurality of springs (18) are arranged between the collecting plate (17) and the collecting box (19), one end of each spring (18) is connected with the bottom of the collecting box (19), the other end of each spring (18) is connected with the collecting plate (17), and the pressure sensor (16) is connected with the alarm system.
8. The susceptor and chip bonding apparatus according to claim 1, wherein the first station (9) is provided with a through slot in which the horizontal transfer device (2) is disposed; the horizontal conveying device (2) comprises a driving wheel (201), a driven wheel (202) and a conveying belt (203) connected between the driving wheel (201) and the driven wheel (202) in a matched mode, and the upper end face of the conveying belt (203) and the upper end face of the first station (9) are located on the same plane; the surface of the conveyor belt (203) is provided with at least one TO base placing groove used for placing a TO base.
9. The susceptor and chip bonding apparatus according to claim 1, wherein the chip suction transferring apparatus (4) comprises a three-axis moving platform (401) and a vacuum suction apparatus (402) connected to the three-axis moving platform (401), the vacuum suction apparatus (402) comprises a vacuum nozzle (411), a vacuum tube, and a vacuum suction apparatus, one end of the vacuum tube is connected to the vacuum nozzle (411), and the other end of the vacuum tube is connected to the vacuum suction apparatus; the vacuum suction nozzle (411) comprises an adsorption part (11) and a connecting part (10), wherein a ventilation pipeline which is communicated up and down is arranged in the connecting part (10), and the ventilation pipeline extends and is communicated with the adsorption part (11); the adsorption surface of the adsorption part (11) is provided with a heat-resistant layer.
10. An automatic packaging production line for pressure sensors, characterized by comprising the base and chip bonding device according to any one of claims 1 to 9.
CN202210465264.9A 2022-04-29 2022-04-29 Base and chip bonding device and automatic packaging production line of pressure sensor comprising same Active CN114566452B (en)

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US20020187589A1 (en) * 2001-06-07 2002-12-12 Lintec Corporation Die bonding sheet sticking apparatus and method of sticking die bonding sheet
CN103487175A (en) * 2013-09-02 2014-01-01 无锡慧思顿科技有限公司 Method for manufacturing pressure sensor packaged by plastic
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WO2020069294A1 (en) * 2018-09-28 2020-04-02 Boston Process Technologies, Inc. Multiple module chip manufacturing arrangement
CN113035745A (en) * 2021-02-25 2021-06-25 东莞普莱信智能技术有限公司 Chip mounting device
CN114093794A (en) * 2022-01-20 2022-02-25 武汉飞恩微电子有限公司 Multi-station rotating disc type chip packaging production line

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020187589A1 (en) * 2001-06-07 2002-12-12 Lintec Corporation Die bonding sheet sticking apparatus and method of sticking die bonding sheet
CN103487175A (en) * 2013-09-02 2014-01-01 无锡慧思顿科技有限公司 Method for manufacturing pressure sensor packaged by plastic
US20190143374A1 (en) * 2016-07-12 2019-05-16 Tyco Electronics (Shanghai) Co. Ltd. Chip Sorting and Packaging Platform
WO2020069294A1 (en) * 2018-09-28 2020-04-02 Boston Process Technologies, Inc. Multiple module chip manufacturing arrangement
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CN114093794A (en) * 2022-01-20 2022-02-25 武汉飞恩微电子有限公司 Multi-station rotating disc type chip packaging production line

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