CN215266355U

CN215266355U - LED die bonder

Info

Publication number: CN215266355U
Application number: CN202121343729.0U
Authority: CN
Inventors: 张跃春; 罗元明; 付勇
Original assignee: ADVANCED OPTOELECTRONIC EQUIPMENT (SHENZHEN) CO LTD
Current assignee: ADVANCED OPTOELECTRONIC EQUIPMENT (SHENZHEN) CO LTD
Priority date: 2021-06-16
Filing date: 2021-06-16
Publication date: 2021-12-21
Anticipated expiration: 2031-06-16

Abstract

The utility model discloses a LED die bonder, which comprises a frame, the symmetry is equipped with two work areas in the frame, be equipped with the work box in the work area respectively, the rubber disc subassembly, the subassembly is glued to the point, die bonder subassembly, carry the material subassembly, send the ring subassembly and grab the ring subassembly, grab the ring subassembly and include the rotating clamping jaw who carries the brilliant ring between send the ring subassembly and carry the material subassembly, still be equipped with in the frame and go up the unloading subassembly, it includes the storage box and sets up first runner and the second runner of relative both sides in storage box X axial direction to go up the unloading subassembly, it still includes along the portable material claw that moves that follows Z axial direction liftable still to go up the unloading subassembly, it still includes a plurality of receipts magazine to go up the unloading subassembly. The LED die bonder can automatically complete feeding and discharging of the die ring, feeding of the LED support and automatic discharging of finished products, is high in automation degree, greatly reduces the requirement for manual operation, reduces the probability of faults caused by manual intervention, and further improves the production efficiency of LED products.

Description

LED die bonder

Technical Field

The utility model relates to a semiconductor package equipment technical field especially relates to a solid brilliant device of LED.

Background

In recent years, LED products are widely used in many fields such as lighting, display, and signal indication, and with the popularization of LED products, the market demand for LED products is increasing. The magazine needs to be changed by the manual work to go up unloading usually in current LED encapsulation equipment in process of production, ensures that LED encapsulation equipment goes up the encapsulation operation that the storage has sufficient brilliant ring or LED support in order to carry out the LED product in succession, and need halt LED encapsulation equipment's operation usually when changing the magazine, and manual change efficiency is not high, operator work load is big, is unfavorable for promoting the production efficiency of LED product.

SUMMERY OF THE UTILITY MODEL

The utility model discloses the technical problem that will solve is: the LED die bonding device with high automation degree is provided.

In order to solve the technical problem, the utility model discloses a technical scheme be: a LED die bonder comprises a rack, wherein two working areas are symmetrically arranged on the rack, a working box, a rubber disc assembly, a glue dispensing assembly, a die bonder assembly, a material loading assembly, a ring feeding assembly and a ring grabbing assembly are respectively arranged in the working areas, the glue dispensing assembly comprises a glue dispensing arm which dips glue from the inside of the rubber disc assembly and dispenses the glue on an LED support in the working box, the die bonder assembly comprises a die bonder arm which absorbs an LED wafer from the material loading assembly and pastes the LED support in the working box, the ring grabbing assembly comprises a rotating clamping jaw which carries a die ring between the ring feeding assembly and the material loading assembly, a feeding and discharging assembly is further arranged on the rack, the feeding and discharging assembly comprises a storage box and a first flow channel and a second flow channel which are arranged on two opposite sides in the X-axis direction of the storage box, and the length directions of the first flow channel and the second flow channel are Y-axis directions, one of them the work box with first flow channel intercommunication, another the work box with the second flow channel intercommunication, go up unloading subassembly still includes along X axle direction portable and along the liftable material claw that moves of Z axle direction, go up unloading subassembly still includes a plurality of receipts magazine, one of them the receipts magazine with the one end intercommunication of work box is kept away from to first flow channel, another the receipts magazine with the one end intercommunication of work box is kept away from to the second flow channel.

Furthermore, the feeding and discharging assembly further comprises a portal frame, the material moving claw is movably arranged on the portal frame, and a first driving piece for driving the material moving claw to move is arranged on the portal frame.

Furthermore, the material moving claw comprises a material moving frame, wherein a plurality of suction nozzles are arranged on the material moving frame, and the suction nozzles are arranged on the material moving frame in a matrix manner.

Further, the feeding and discharging assembly further comprises a waste material box, and the waste material box is arranged between the storage box and the first flow channel/the second flow channel.

Furthermore, go up unloading subassembly still includes the liftout device, the liftout device includes the liftout board and orders about the second driving piece that the liftout board goes up and down in the Z axle direction, the liftout board sets up in the storage box.

Furthermore, a plurality of material receiving grooves are formed in the material receiving box, the material receiving grooves are arranged at intervals along the Z-axis direction, and the openings of the material receiving grooves face the first flow channel/the second flow channel.

Furthermore, go up unloading subassembly still includes the receipts flitch and orders about the third driving piece that the receipts flitch goes up and down in the Z axle direction, the receipts magazine sets up on the receipts flitch.

Furthermore, the ring feeding assembly comprises a first ring feeding plate and a second ring feeding plate which are arranged at intervals in the Z-axis direction, a through hole for a crystal ring to pass through is formed in the first ring feeding platform, a ring separating cylinder is arranged at the edge of the through hole, and the second ring feeding plate is arranged in a lifting manner in the Z-axis direction.

Furthermore, the second ring conveying plate is provided with a position avoiding notch for avoiding the rotating clamping jaw.

Furthermore, still be equipped with thimble assembly in the working area, thimble assembly sets up carry the material subassembly under.

The beneficial effects of the utility model reside in that: the utility model provides a LED die bonder which is provided with two working areas on a frame, wherein each working area is internally provided with a working box, a glue tray component, a glue dispensing component, a die bonder component, a material loading component, a material conveying ring component and a grab ring component independently, and the two working areas can respectively carry out the chip mounting on an LED bracket, and the crystal ring can be carried between the material conveying ring component and the material loading component through the grab ring component, so that the empty crystal ring is moved into the material conveying ring component and the crystal ring filled with the chip in the material conveying ring component is moved onto the material loading component, thereby realizing the automatic feeding and discharging of the crystal ring, ensuring that enough chips can be used in the working process of the LED die bonder, and the frame is also provided with a feeding and discharging component which carries the LED bracket in the material storage box to a first flow passage or a second flow passage through a material moving claw and feeds the LED bracket into the working box through the first flow passage or the second flow passage for packaging, the LED product rethread first runner or the second runner of accomplishing of encapsulation transports to receiving in the magazine and concentrates the storage, the automatic feeding and the off-the-shelf automatic collection of LED support have been realized, and then the solid brilliant device of LED can accomplish the unloading of brilliant ring automatically in the course of the work, the material loading of LED support and off-the-shelf automatic unloading, degree of automation is high, the demand to manual operation has significantly reduced, reduce the probability that manual intervention caused the trouble, make the production efficiency of LED product further promote.

Drawings

Fig. 1 is a schematic structural view of an LED die bonder according to a first embodiment of the present invention;

fig. 2 is a schematic view of a partial structure of an LED die bonder according to a first embodiment of the present invention;

fig. 3 is a top view of a partial structure of an LED die bonder according to a first embodiment of the present invention;

fig. 4 is a schematic structural view of an upper feeding and lower discharging assembly in an LED die bonder according to a first embodiment of the present invention;

fig. 5 is a schematic structural view of a material moving part of a feeding and discharging assembly in an LED die bonder according to a first embodiment of the present invention;

fig. 6 is a schematic structural diagram of a second flow channel in the LED die bonder according to the first embodiment of the present invention;

fig. 7 is a schematic structural view of a feeding portion of a feeding and discharging assembly in an LED die bonder according to a first embodiment of the present invention;

fig. 8 is a schematic structural view of a material receiving portion of a feeding and discharging assembly in an LED die bonder according to a first embodiment of the present invention;

fig. 9 is a schematic structural diagram of a working box in an LED die bonder according to a first embodiment of the present invention;

fig. 10 is a schematic structural view of a die bonding assembly in an LED die bonding apparatus according to a first embodiment of the present invention;

fig. 11 is a schematic structural view of a dispensing assembly in an LED die bonder according to a first embodiment of the present invention;

fig. 12 is a schematic structural view of a loading assembly in an LED die bonder according to a first embodiment of the present invention;

fig. 13 is a schematic structural view of a rubber disc assembly in an LED die bonder according to a first embodiment of the present invention;

fig. 14 is a schematic structural view of a ring feeding assembly in an LED die bonder according to a first embodiment of the present invention;

fig. 15 is a schematic structural view of a grab ring assembly in an LED die bonder according to a first embodiment of the present invention;

fig. 16 is a schematic structural view of a thimble assembly in an LED die bonder according to a first embodiment of the present invention.

Description of reference numerals:

1. a frame; 11. taking a crystal lens barrel; 12. fixing a lens cone; 13. a thimble assembly; 131. a thimble; 2. a working box; 21. a clamp; 22. a fourth drive; 3. a glue reel assembly; 31. a rubber plate; 32. a fifth driving member; 4. dispensing components; 41. dispensing an adhesive arm; 5. a die bonding assembly; 51. a die bonding arm; 6. a loading assembly; 61. a material loading platform; 62. a sixth driving member; 7. a feed ring assembly; 71. a first ring feeding plate; 72. a second ring feeding plate; 73. a ring-dividing cylinder; 74. avoiding gaps; 75. a ring feeding rack; 8. a grab ring assembly; 81. rotating the clamping jaw; 9. a feeding and discharging assembly; 91. a storage box; 92. a first flow passage; 93. a second flow passage; 94. a material moving claw; 941. a material moving frame; 942. a suction nozzle; 95. a material receiving box; 951. a material receiving groove; 952. a material collecting plate; 953. a third driving member; 96. a gantry; 97. a first driving member; 98. a waste material box; 99. a material ejecting device; 991. a material ejecting plate; 992. a second driving member.

Detailed Description

In order to explain the technical content, the objects and the effects of the present invention in detail, the following description is made with reference to the accompanying drawings in combination with the embodiments.

Referring to fig. 1 to 16, an LED die bonder includes a frame 1, two working areas are symmetrically disposed on the frame 1, a working box 2, a glue tray assembly 3, a glue dispensing assembly 4, a die bonding assembly 5, a carrier assembly 6, a ring feeding assembly 7 and a catch ring assembly 8 are disposed in the working areas, the glue dispensing assembly 4 includes a glue dispensing arm 41 for dipping glue from the glue tray assembly 3 and dispensing glue on an LED support in the working box 2, the die bonding assembly 5 includes a die bonding arm 51 for sucking an LED die from the carrier assembly 6 and attaching the LED die to the LED support in the working box 2, the catch ring assembly 8 includes a rotating clamping jaw 81 for transporting a die ring between the ring feeding assembly 7 and the carrier assembly 6, a feeding and discharging assembly 9 is further disposed on the frame 1, the die bonding assembly 9 includes a box 91 and a first flow channel 92 and a second flow channel 93 disposed on two opposite sides of the storage box 91 in an X-axis direction, the length directions of the first flow channel 92 and the second flow channel 93 are Y-axis directions, one of the work boxes 2 is communicated with the first flow channel 92, the other work box 2 is communicated with the second flow channel 93, the feeding and discharging assembly 9 further comprises a material moving claw 94 which can move along the X-axis direction and can lift along the Z-axis direction, the feeding and discharging assembly 9 further comprises a plurality of material receiving boxes 95, one of the material receiving boxes 95 is communicated with one end, far away from the work box 2, of the first flow channel 92, and the other material receiving box 95 is communicated with one end, far away from the work box 2, of the second flow channel 93.

From the above description, the beneficial effects of the present invention are: the utility model provides a solid brilliant device of LED can accomplish automatically that the unloading of brilliant ring goes up, the material loading of LED support and off-the-shelf automatic unloading, and degree of automation is high, has significantly reduced the demand to manual operation, reduces the probability that manual intervention caused the trouble, makes the production efficiency of LED product further promote.

Further, the feeding and discharging assembly 9 further includes a gantry 96, the material moving claw 94 is movably disposed on the gantry 96, and a first driving member 97 for driving the material moving claw 94 to move is disposed on the gantry 96.

As can be seen from the above description, the loading and unloading assembly 9 further includes a gantry 96 and a first driving member 97, the first driving member 97 drives the material moving claw 94 to move on the gantry 96, so that the material moving claw 94 picks up the LED support from the storage box 91 and places the LED support into the first runner 92 or the second runner 93.

Further, the material transferring claw 94 comprises a material transferring frame 941, a plurality of suction nozzles 942 are arranged on the material transferring frame 941, and the plurality of suction nozzles 942 are arranged on the material transferring frame 941 in a matrix manner.

As can be seen from the above description, the material moving claw 94 specifically includes a material moving rack 941 and a plurality of suction nozzles 942 disposed on the material moving rack 941, so as to suck the LED support in the storage box 91 through the suction nozzles 942 and drive the LED support to move through the material moving rack 941.

Further, the loading and unloading assembly 9 further includes a waste material box 98, and the waste material box 98 is disposed between the storage box 91 and the first flow passage 92/the second flow passage 93.

As can be seen from the above description, the waste box 98 is disposed between the first flow channel 92 and the second flow channel 93 to store the unqualified LED support and other impurities in the storage box 91.

Further, go up unloading subassembly 9 and still include liftout device 99, liftout device 99 includes liftout plate 991 and orders about the second driving piece 992 that liftout plate 991 goes up and down in the Z axle direction, liftout plate 991 sets up in the storage box 91.

As can be seen from the above description, the ejecting device 99 is disposed in the storage box 91 for lifting the LED support to be picked up, so as to move the LED support in the storage box 91 to a height position convenient for the material moving claw 94 to pick up.

Further, a plurality of material receiving grooves 951 are arranged in the material receiving box 95, the material receiving grooves 951 are arranged at intervals along the Z-axis direction, and openings of the material receiving grooves 951 face the first flow channel 92/the second flow channel 93.

Further, the feeding and discharging assembly 9 further includes a material receiving plate 952 and a third driving member 953 for driving the material receiving plate 952 to move up and down in the Z-axis direction, and the material receiving box 95 is disposed on the material receiving plate 952.

As can be seen from the above description, the receiving grooves 951 are arranged in the Z-axis direction of the receiving box 95 at intervals, one LED product can be stored in each receiving groove 951, and then the receiving plate 952 is driven to ascend and descend by the third driving member 953, so that different receiving grooves 951 are aligned with the first flow channel 92/the second flow channel 93, and the LED products sequentially enter the receiving box 95.

Further, the ring feeding assembly 7 comprises a first ring feeding plate 71 and a second ring feeding plate 72 which are arranged at intervals in the Z-axis direction, a through hole for a crystal ring to pass through is formed in the first ring feeding platform, a ring separating cylinder 73 is arranged at the edge of the through hole, and the second ring feeding plate 72 is arranged in a lifting manner in the Z-axis direction.

Further, the second ring feeding plate 72 is provided with a position avoiding notch 74 for avoiding the rotating clamping jaw 81.

As can be seen from the above description, in the ring feeding assembly 7, a wafer ring is released by the ring feeding cylinder 73 to pass through the through hole of the first ring feeding plate 71 and fall onto the second ring feeding plate 72, the rotating jaws 81 rotate into the space-avoiding gaps 74 to clamp the wafer ring on the second ring feeding plate 72, and then the wafer ring is placed on the material loading assembly 6 by the rotation of the rotating jaws 81.

Further, still be equipped with thimble assembly 13 in the working area, thimble assembly 13 sets up directly under carrying material subassembly 6.

As can be seen from the above description, the ejector pin assembly 13 is disposed right below the carrier assembly 6, and the wafer attached to the blue film of the wafer ring is detached by the action of the ejector pin assembly 13, so as to facilitate the picking up of the die bonder assembly 5.

Example one

Referring to fig. 1 to fig. 16, a first embodiment of the present invention is: an LED die bonder is used for mounting LED wafers on an LED bracket in a certain order to obtain products such as an LED display screen.

As shown in fig. 1 to 3, the LED die bonder includes a frame 1, two working areas are symmetrically disposed on the frame 1, and each of the working areas is disposed with a working box 2, a glue tray assembly 3, a glue dispensing assembly 4, a die bonder assembly 5, a material loading assembly 6, a thimble assembly 13, a ring feeding assembly 7 and a ring grabbing assembly 8, wherein the working box 2 is configured to fix an LED support, the glue dispensing assembly 4 sucks glue from the glue tray assembly 3 and dispenses the glue onto a surface of the LED support, the thimble assembly 13 is configured to separate a die ring disposed on the material loading assembly 6 from an LED wafer attached to a blue film of the die ring, the die bonder assembly 5 picks up a corresponding LED wafer from the material loading assembly 6 and bonds the LED wafer to a preset position on the LED support, and sequentially bonds the LED wafer on the LED support through multiple actions of the glue dispensing assembly 4 and the die bonder 5, and the grab ring component 8 is used for transporting the wafer rings between the feeding ring component 7 and the material loading component 6, so that the wafer rings with the LED wafers on the material loading table 61 taken out are replaced by the wafer rings with the LED wafers attached, or the wafer rings with different types of LED wafers attached are replaced for the die bonding component 5 to take out.

Preferably, the two working areas operate independently, and then the two LED supports can be packaged on the LED die bonder simultaneously, so that the production efficiency of LED products is further improved.

Referring to fig. 2 and 4, the frame 1 is further provided with a feeding and discharging assembly 9, the feeding and discharging assembly 9 is used for feeding the LED support into the work box 2 and accommodating an LED product mounted on an LED wafer in the work box 2, so that the work area can continuously work, the manual feeding and discharging operation is reduced, the labor intensity of an operator is reduced, adverse effects on the LED die bonder caused by human factors are avoided, the work efficiency of the LED die bonder is improved, and the LED die bonder can stably operate.

As shown in fig. 4 to 7, the loading and unloading assembly 9 includes a storage box 91 for storing LED frames, a first flow channel 92 and a second flow channel 93 are respectively arranged on two opposite sides of the material storage box 91 in the Y-axis direction, the first flow passage 92 communicates with one of the process cartridges 2, the second flow passage 93 communicates with the other of the process cartridges 2, a portal frame 96 is further arranged above the storage box 91, the first runner 92 and the second runner 93, the gantry 96 is provided with a material moving claw 94 capable of moving along the Y-axis direction and a first driving piece 97 driving the material moving claw 94 to move, the material-moving claw 94 grabs the LED support from the storage box 91 and puts the LED support into the first runner 92 or the second runner 93, and the first flow channel 92/the second flow channel 93 sends the LED support into the corresponding working box 2, so that automatic feeding of the automatic LED support can be completed.

As shown in fig. 5, the material transferring claw 94 includes a material transferring frame 941 and a plurality of suction nozzles 942 arranged on the material transferring frame 941, and the plurality of suction nozzles 942 are arranged in a matrix on the material transferring frame 941. When the material moving claw 94 grabs the LED support from the storage box 91, the material moving frame 941 extends into the storage box 91 to make the end of the suction nozzle 942 contact with the surface of the LED support, and then a vacuum is generated by a vacuum generating device and other devices connected to the suction nozzle 942 to make the suction nozzle 942 adsorb on the LED support, so that the material moving frame 941 can be driven by the first driving member 97 to move to place the LED support in the first runner 92/the second runner 93. If the LED supports in the storage box 91 are all taken out, an operator can replace the storage box 91 with the LED supports, and at the moment, the LED die bonder can continue to operate without stopping the machine.

Referring to fig. 7, in order to enable the material moving claw 94 to rapidly grab the LED bracket in the storage box 91, the feeding and discharging assembly 9 further includes a material ejecting device 99, the material ejecting device 99 includes a material ejecting plate 991 capable of ascending and descending along the Z-axis direction and a second driving member 992 for driving the material ejecting plate 991 to ascend and descend, the material ejecting plate 991 is disposed in the storage box 91, the LED brackets are stacked on the material ejecting plate 991, and the LED brackets can be lifted to a corresponding height for the material moving claw 94 to pick up by ascending the material ejecting plate 991 in the Z-axis direction.

Preferably, because isolation materials are generally placed between the LED supports in the storage box 91 to separate the LED supports, so as to prevent the LED supports from being damaged due to mutual rubbing, or individuals with poor quality exist in the LED supports, a waste box 98 is further disposed between the first flow channel 92 and the second flow channel 93, the waste box 98 and the storage box 91 are disposed in parallel, and after the material-moving claw 94 takes out the isolation materials or the LED supports with poor quality from the waste box 98, the material-moving claw 94 can put the isolation materials or the LED supports into the waste box 98, so as to perform subsequent centralized treatment.

Referring to fig. 4 and 8, the feeding and discharging assembly further includes a plurality of material receiving boxes 95, one of the material receiving boxes 95 is communicated with one end of the first flow channel 92 away from the work box 2, the other material receiving box 95 is communicated with one end of the second flow channel 93 away from the work box 2, and the LED product packaged in the work box 2 enters the material receiving box 95 under the driving of the first flow channel 92/the second flow channel 93, so as to complete the collection of the LED product.

Specifically, go up unloading subassembly 9 still includes material receiving plate 952 and orders about the third driving piece 953 that material receiving plate 952 goes up and down in the Z axle direction, material receiving box 95 sets up on material receiving plate 952 and be equipped with a plurality of material receiving groove 951 along Z axle direction interval in the material receiving box 95, every can hold an LED product in the material receiving groove 951, and then pass through material receiving plate 952 drives material receiving box 95 rises the price in the Z axle direction and makes anyone material receiving groove 951 aim at first runner 92 second runner 93 can make a plurality of LED products get into in proper order in the material receiving box 95. Preferably, the first flow channel 92 and the second flow channel 93 respectively include two feeding channels, one end of each feeding channel, which is far away from the work box 2, is provided with one material receiving box 95, so that the LED supports are respectively fed into the work box 2 or the packaged LED products are respectively fed into the material receiving box 95 through the two feeding channels, and the material moving claws 94 respectively feed the LED supports into the feeding channels, so as to reduce the waiting time of the material moving claws 94, and further improve the working efficiency of the LED die bonder.

As shown in fig. 9, the work box 2 includes a clamp 21 and a fourth driving member 22 for driving the clamp 21 to move, and the clamp 21 can be driven by the fourth driving member 22 to move along the X-axis direction or the Y-axis direction, so that the clamp 21 is abutted with one of the feeding channels to enable the LED bracket to enter the clamp 21 from the feeding channel or enable the LED product to enter the feeding channel from the clamp 21.

Referring to fig. 2, 10 and 11, the dispensing assembly 4 includes a rotatable dispensing arm 41, and the dispensing arm 41 swings to the upper side of the work box 2 after dipping glue from the glue tray assembly 3, and then dispenses the glue onto the LED support in the work box 2. The die bonding assembly 5 comprises a rotatable die bonding arm 51, the die bonding arm 51 swings to the position above the material loading assembly 6, then picks up a target wafer from the wafer ring, swings to the position above the work box 2, and mounts the wafer to the position, where the glue is dispensed, on the LED support, and then mounting of a wafer can be completed.

Preferably, a crystal taking lens barrel 11 and a crystal fixing lens barrel 12 are further arranged in the working area. The crystal taking lens barrel 11 is arranged right above the material loading assembly 6, the shooting direction of the crystal taking lens barrel 11 faces to the Z-axis negative direction so as to shoot images of a crystal ring on the material loading assembly 6, and then the position of a wafer to be picked on the crystal ring is positioned through the crystal taking lens barrel 11, so that the correct wafer is picked up by the crystal fixing assembly 5. The die bonding lens barrel 12 is arranged right above the working box 2, the shooting direction of the die bonding lens barrel 12 faces the Z-axis negative direction so as to shoot an image of the LED support in the working box 2, and then the position of a wafer to be mounted on the LED support is positioned through the die bonding lens barrel 12, so that the dispensing component 4 can accurately dispense glue to a preset position, and the die bonding component 5 can mount the wafer to the position.

As shown in fig. 12 and 16, the loading assembly 6 includes a loading platform 61 and a sixth driving element 62 for driving the loading platform 61 to move along the X-axis direction or the Y-axis direction on the frame 1, a wafer ring is placed on the loading platform 61, and the loading platform 61 is rotatably disposed, so that the wafer fixing arm 51 can pick up a wafer from any position of the wafer ring. A thimble assembly 13 is further arranged under the material loading table 61, the thimble assembly 13 includes a thimble 131 capable of lifting in the Z-axis direction, the thimble 131 can extend into the material loading table 61 from bottom to top and abut against the bottom surface of the blue film of the wafer ring, so that the wafer attached to the top surface of the blue film is jacked up, and further the wafer is separated from the blue film, so that the wafer is picked up from the wafer ring by the wafer fixing arm 51.

As shown in fig. 13, the glue reel assembly 3 is disposed close to the glue dispensing assembly 4, and the glue reel assembly 3 includes a glue tray 31 and a fifth driving member 32 for driving the glue tray 31 to rotate, the glue tray 31 contains glue, and the glue tray 31 keeps rotating under the driving of the fifth driving member 32, so as to prevent the glue in the glue tray 31 from solidifying.

As shown in fig. 14 to 15, the ring feeding assembly 7 includes a ring feeding frame 75, a first ring feeding plate and a second ring feeding plate 72 are disposed on the ring feeding frame 75 at intervals along the Z-axis direction, the first ring feeding plate 71 is fixed on the ring feeding frame 75, a plurality of rings are stacked on the first ring feeding plate 71, a through hole for a ring to pass through is disposed on the first ring feeding plate 71, a ring separating cylinder 73 is disposed at an edge of the through hole, the second ring feeding plate 72 is located right below the first ring feeding plate 71, the second ring feeding plate 72 is capable of being lifted along the Z-axis direction, the ring separating cylinder 73 can clamp a ring so that the ring cannot pass through the through hole or release the ring so that the ring passes through the through hole and falls onto the second ring feeding plate 72 below, and only one ring falls onto the second ring feeding plate 72 per one operation of the ring separating cylinder 73. When the ring feeding assembly 7 feeds the ring, the second ring feeding plate 72 rises and is attached to the bottom surface of the first ring feeding plate 71, the ring separating cylinder 73 acts to enable a crystal ring to fall onto the second ring feeding plate 72, and then the second ring feeding plate 72 descends to a preset height so that the grasping ring assembly 8 can grasp the crystal ring.

Specifically, the grab ring assembly 8 includes a rotating clamping jaw 81, the second ring feeding plate 72 is provided with a position avoiding gap 74 for avoiding the rotating clamping jaw 81, after the second ring feeding plate 72 conveys the wafer ring to a preset height, the rotating clamping jaw 81 rotates and extends into the position avoiding gap 74, and simultaneously, the wafer ring part enters into an open interval of the rotating clamping jaw 81, at this time, the rotating clamping jaw 81 is closed to clamp the wafer ring and move the wafer ring onto the material loading table 61 through the rotation of the rotating clamping jaw 81, and the material loading table 61 is also provided with a gap for avoiding the rotating clamping jaw 81, so that the rotating clamping jaw 81 can place the wafer ring onto the material loading table 61 or grab the wafer ring from the material loading table 61 and place the wafer ring back into the ring feeding assembly 7, so as to realize the automatic wafer ring loading and unloading on the material loading table 61, and further improve the automation degree of the LED wafer fixing device, the production efficiency of the LED die bonder is improved.

To sum up, the utility model provides a LED die bonder adopts the material loading subassembly to send the LED support into the work box automatically and encapsulate, and accommodate the LED product that accomplishes the encapsulation in the material receiving box, has still adopted the cooperation of send ring subassembly and grab ring subassembly to accomplish and move on carrying the material subassembly upper and lower brilliant ring, makes LED die bonder accomplish the material loading and unloading action automatically, has avoided manual operation and has reduced the influence of human factor to the operation of LED die bonder, has improved the degree of automation of LED die bonder when lightening operator intensity of labour; the LED die bonder is characterized in that two working areas are symmetrically arranged on the rack, a working box, a rubber disc assembly, a glue dispensing assembly, a die bonder assembly, a material carrying assembly, a thimble assembly, a ring feeding assembly and a ring grabbing assembly are respectively arranged in each working area, and the two working areas independently operate to simultaneously package two LED supports on the LED die bonder, so that the production efficiency of LED products is improved in multiples.

The above mentioned is only the embodiment of the present invention, and not the limitation of the patent scope of the present invention, all the equivalent transformations made by the contents of the specification and the drawings, or the direct or indirect application in the related technical field, are included in the patent protection scope of the present invention.

Claims

1. The utility model provides a solid brilliant device of LED, includes the frame, its characterized in that: the automatic die-casting machine is characterized in that two working areas are symmetrically arranged on the machine frame, a working box, a glue disc assembly, a glue dispensing assembly, a die-fixing assembly, a material loading assembly, a material conveying assembly and a grab ring assembly are respectively arranged in the working areas, the glue dispensing assembly comprises a glue dispensing arm which dips glue from the glue disc assembly and dispenses on an LED support in the working box, the die-fixing assembly comprises a die-fixing arm which sucks an LED wafer from the material loading assembly and mounts the LED wafer onto the LED support in the working box, the grab ring assembly comprises a rotating clamping jaw which carries a die ring between the material conveying assembly and the material loading assembly, the machine frame is further provided with a feeding and discharging assembly, the feeding and discharging assembly comprises a storage box and a first flow channel and a second flow channel which are arranged on two opposite sides of the storage box in the X-axis direction, and the length directions of the first flow channel and the second flow channel are Y-axis directions, one of them the work box with first flow channel intercommunication, another the work box with the second flow channel intercommunication, go up unloading subassembly still includes along X axle direction portable and along the liftable material claw that moves of Z axle direction, go up unloading subassembly still includes a plurality of receipts magazine, one of them the receipts magazine with the one end intercommunication of work box is kept away from to first flow channel, another the receipts magazine with the one end intercommunication of work box is kept away from to the second flow channel.

2. The LED die bonding device according to claim 1, wherein: the feeding and discharging assembly further comprises a portal frame, the material moving claw is movably arranged on the portal frame, and a first driving piece for driving the material moving claw to move is arranged on the portal frame.

3. The LED die bonding device according to claim 1, wherein: the material moving claw comprises a material moving frame, wherein a plurality of suction nozzles are arranged on the material moving frame, and the suction nozzles are arranged on the material moving frame in a matrix manner.

4. The LED die bonding device according to claim 1, wherein: the feeding and discharging assembly further comprises a waste material box, and the waste material box is arranged between the storage box and the first flow channel/the second flow channel.

5. The LED die bonding device according to claim 1, wherein: the feeding and discharging assembly further comprises a material ejecting device, the material ejecting device comprises a material ejecting plate and a second driving piece for driving the material ejecting plate to lift in the Z-axis direction, and the material ejecting plate is arranged in the material storage box.

6. The LED die bonding device according to claim 1, wherein: the material receiving box is internally provided with a plurality of material receiving grooves which are arranged at intervals along the Z-axis direction, and the openings of the material receiving grooves face the first flow channel/the second flow channel.

7. The LED die bonding device according to claim 6, wherein: the feeding and discharging assembly further comprises a material receiving plate and a third driving piece for driving the material receiving plate to lift in the Z-axis direction, and the material receiving box is arranged on the material receiving plate.

8. The LED die bonding device according to claim 1, wherein: the ring feeding assembly comprises a first ring feeding plate and a second ring feeding plate which are arranged in the Z-axis direction at intervals, a through hole for a crystal ring to pass through is formed in the first ring feeding platform, a ring separating cylinder is arranged at the edge of the through hole, and the second ring feeding plate can be arranged in the Z-axis direction in a lifting mode.

9. The LED die bonding device according to claim 8, wherein: and the second ring conveying plate is provided with a position avoiding notch for avoiding the rotating clamping jaw.

10. The LED die bonding device according to claim 1, wherein: still be equipped with thimble assembly in the working area, thimble assembly sets up carry the material subassembly under.