KR20150019159A - Apparatus and method for fabricating semiconductor chip package with film attached on - Google Patents

Abstract

Disclosed are a device and a method for manufacturing a semiconductor chip package with an attached film, such as an LED package with an attached light emitting film. The device for manufacturing a semiconductor chip package includes a lead frame loading unit sequentially loading a lead frame, a resin dispensing unit injecting sealing resin into the lead frame to seal a chip accepting part of the lead frame, a film stage moved to sequentially place a fluorescent film piece on a pick-up position, a film attaching unit absorbing the fluorescent film piece to sequentially attach the piece to the sealing resin of the lead frame, and a lead frame unloading unit collecting the lead frame by unloading the lead frame passing through the film attaching unit.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to an apparatus and a method for manufacturing a semiconductor chip package with a film,

The present invention relates to a semiconductor chip package manufacturing apparatus and a manufacturing method for continuously manufacturing a film-attached semiconductor chip package, for example, an LED package having a fluorescent film attached thereto.

BACKGROUND ART An LED package used as an indicator of an electronic device, a backlight unit of an LCD panel, a lighting device, or the like, typically mounts a light emitting diode (LED), which is a kind of semiconductor chip, on a lead frame, And is sealed with a light-transmitting resin to protect the electrode connection portion. As the sealing resin, for example, silicone resin is used, and in order to improve brightness upon light emission, a phosphor powder may generally be mixed with the sealing resin.

However, in such a conventional LED package, it is difficult to control the thickness of the sealing resin layer mixed with the phosphor and precisely control the blending ratio of the phosphor, so that it is difficult to control the light emitting quality of the LED package, resulting in low yields of good products, high heating value and low luminous efficiency.

In addition, there is a problem that the sealing resin may not be used due to solidification of the sealing resin during long-term storage, resulting in an increase in cost.

Korean Patent Publication No. 10-1102237 Korean Patent Publication No. 10-2011-0074098

The present invention provides an apparatus for manufacturing a film-attached semiconductor chip package, such as an LED package with a light-emitting film attached thereto, and a method for manufacturing a semiconductor chip package.

The present invention also provides an apparatus for manufacturing a semiconductor chip package for automatically attaching a film to an upper surface of a semiconductor chip package, and a method for manufacturing a semiconductor chip package.

The present invention also provides an apparatus for manufacturing a semiconductor chip package and a method for manufacturing the semiconductor chip package, wherein the film piece is detached from the supporting tape and automatically attached to the upper surface of the semiconductor chip package.

The present invention relates to a lead frame loading unit for sequentially loading a lead frame, a sealing resin for injecting a sealing resin into the lead frame so that the chip housing portion of the lead frame is sealed, A film stage movable so that a resin dispensing unit and a phosphor film piece are sequentially positioned in a pick-up position, a piece of fluorescent film positioned at the pick-up position is adsorbed And a lead frame unloading unit (lead frame) for unloading and collecting a lead frame passing through the film attaching unit, and an unloading unit.

The apparatus for manufacturing a semiconductor chip package according to the present invention comprises: a film cassette which can be accommodated by laminating a plurality of film trays in which a plurality of the fluorescent film pieces are regularly arranged and a film tray picked up from the film cassette, The apparatus may further include a film changer mounted on the film stage or picking up a film tray mounted on the film stage and mounting the film tray on the film cassette.

Wherein the film attaching unit has a collet for adsorbing a piece of fluorescent film arranged on the film tray, and the semiconductor chip package producing apparatus of the present invention is characterized in that when the collet descends to adsorb the piece of fluorescent film, A film supporting pin for supporting the piece of fluorescent film so that the fluorescent film piece is not pushed down, and a control unit for controlling the collet and the film support pin such that the down movement of the collet and the upward movement of the film support pin are synchronized, And a control unit for controlling the control unit.

At least two kinds of fluorescent film pieces are arranged in the film tray, and the semiconductor chip package manufacturing apparatus of the present invention is characterized in that the film stage is so arranged that a piece of fluorescent film of a suitable kind is successively positioned in the pick- The controller may further include a controller for controlling the controller.

The film tray may have a plurality of film seating grooves arranged in a matrix form on an upper side thereof, and the plurality of pieces of fluorescent film may be seated in the film seating grooves.

A lead frame loaded by the lead frame loading unit is mounted with a wire-bonded LED (light emitting diode), and the fluorescent film piece may include a fluorescent material.

The present invention also relates to a lead frame loading unit for sequentially loading a lead frame, a sealing member for sealing the lead frame with a sealing resin to seal the chip housing portion of the lead frame, A resin dispensing unit, a film feeding unit for continuously conveying a supporting tape to which at least one piece of fluorescent film is adhered and supported, and separating the piece of fluorescent film from the supporting tape, A film attaching unit that adsorbs a piece of fluorescent film separated from the tape and sequentially attaches the piece of fluorescent film to the sealing resin of the lead frame; and a unloading unit that unloads the lead frame passing through the film attaching unit, And a leadframe unloading unit which is provided with a lead frame unloading unit.

Wherein the film feeding unit comprises a film separating die for separating the at least one film piece from a supporting tape to which at least one piece of film is attached and supported, A tape unwinding roller for continuously feeding the support tape and a tape rewinding roller for continuously recovering the support tape separated from the at least one film piece.

Wherein the film separating die has an acute angle protruding edge for switching the advancing direction of the support tape and the at least one film piece is supported by the support when the support tape passes the edge, Tape. ≪ / RTI >

Wherein the film feeding unit presses at least one piece of the film adhered to the support tape before the support tape passes the edge and releases the pressure when the support tape passes the edge, The apparatus may further include a film separating roller for separating the at least one film piece.

Wherein the film feeding unit further comprises at least one film supporting rod for supporting at least one piece of film separated from the supporting tape until it is absorbed by the film attaching unit, The manufacturing apparatus may further include a controller for controlling the film feeding unit to stop the progress of the support tape when at least one piece of the film is supported on the at least one film support rod.

The film feeding unit may further include a number of film sensing sensors such as the number of film support rods that sense whether the film piece is supported on the at least one film support rod.

The semiconductor chip package manufacturing apparatus of the present invention is characterized in that the resin film is provided between the sealing resin dispensing unit and the film attaching unit so that the piece of fluorescent film is adhered and fixed to the sealing resin injected into the lead frame, And a resin dispensing unit for applying an adhesive to the resin dispensing unit.

A cure unit for curing the sealing resin may be interposed between the resin dispensing unit for sealing and the resin dispensing unit for bonding.

The semiconductor chip package manufacturing apparatus of the present invention is characterized in that a resin for an adhesive is disposed on the lead frame so as to be adhered and fixed to a sealing resin of a lead frame disposed before the film attaching unit and passed through the sealing resin dispensing unit And a resin dispensing unit for applying an adhesive, wherein when the sealing resin is dispensed from the sealing resin dispensing unit and discharged to the lead frame unloading unit, the film attaching unit and the adhesive The resin dispensing unit can be configured to be inoperative.

The sealing resin dispensing unit may be configured to replace the syringe with a syringe for the resin dispensing unit for adhering and replaceable with a resin dispensing unit for adhering.

The present invention also relates to a sealing resin injection step for sealing a semiconductor chip by injecting a sealing resin into a lead frame to which a semiconductor chip is bonded and a sealing resin injection step for sealing the semiconductor chip on the upper side of the hardened sealing resin And a film adhering step of adhering a piece of fluorescent film.

The film adhering step may include a step of applying an adhesive for applying an adhesive resin to the upper side of the cured resin for sealing, a step of applying a film tray in which a plurality of fluorescent film pieces are regularly arranged in a horizontal direction A film picking-up step for picking up a piece of the fluorescent film positioned at the pick-up position, a step for picking up a piece of the fluorescent film picked up at the pickup position, And a film loading step of placing the adsorbed fluorescent film pieces on the upper surface of the sealing resin coated with the adhesive resin.

Wherein the resin injecting step and the adhesive applying step are performed by operation of a resin dispensing unit that discharges resin into the lead frame, wherein in the resin injecting step, a syringe provided in the resin dispensing unit ) Is filled with the sealing resin, and in the adhesive applying step, the syringe provided in the resin dispensing unit may be filled with the adhesive resin.

The present invention also provides a method of manufacturing a semiconductor device, comprising the steps of: injecting a sealing resin into a lead frame to which the semiconductor chip is bonded to seal the semiconductor chip; a resin curing step of curing the injected sealing resin; There is provided a method of manufacturing a semiconductor chip package including a film attaching step of attaching a piece of fluorescent film to an upper side of a resin.

The method for manufacturing a semiconductor chip package of the present invention may further comprise an adhesive applying step of applying an adhesive resin to the upper surface of the sealing resin between the resin curing step and the film adhering step.

According to the semiconductor chip package manufacturing apparatus of the present invention, it is possible to continuously and automatically produce the semiconductor chip package having the film on the upper side thereof. Therefore, product yield and productivity are improved, and the production cost can be reduced.

In addition, the LED package produced by the semiconductor chip package manufacturing apparatus according to the embodiment of the present invention has a low calorific value, thereby improving luminous efficiency and reducing the amount of phosphor powder or fluorescent ink used, thereby reducing the production cost.

1 is a cross-sectional view showing an LED package to which a fluorescent film is attached.
2 is a perspective view showing a form in which a lead frame used for manufacturing an LED package is mounted on a carrier.
3 is a plan view of the semiconductor chip package manufacturing apparatus according to the first embodiment of the present invention.
4 is a perspective view showing the lead frame loading unit of FIG. 3;
Fig. 5 is a perspective view showing the lead frame feeding unit of Fig. 3; Fig.
FIG. 6 is a perspective view showing the resin dispensing unit of FIG. 3; FIG.
Figure 7 is a perspective view showing the film cassette of Figure 3;
FIG. 8 is a perspective view showing the film stage of FIG. 3; FIG.
Fig. 9 is a perspective view showing the film moving unit of Fig. 3; Fig.
10 is a perspective view showing the film attaching unit of Fig.
Fig. 11 is a cross-sectional view showing a state in which a film piece is adsorbed and separated in the film stage of Fig. 7 using an adsorbing collet of Fig. 10;
12 is a flowchart showing a method of manufacturing a semiconductor chip package according to the first embodiment of the present invention.
13 is a plan view of a semiconductor chip package manufacturing apparatus according to a second embodiment of the present invention.
Figs. 14 and 15 are a perspective view and a plan view showing the film feeding unit of Fig. 13; Fig.
Fig. 16 is a front view showing a traveling path of the supporting tape and the film piece in the film feeding unit of Fig. 14; Fig.
17 is a perspective view showing the film attaching unit of Fig.
18 is a flowchart showing a method of manufacturing a semiconductor chip package according to an embodiment of the present invention.
19 and 20 are block diagrams showing a first example and a second example of a system for implementing the semiconductor chip package manufacturing method of the present invention.

Hereinafter, an apparatus and method for manufacturing a semiconductor chip package with a film according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings. The terminology used herein is a term used to properly express the preferred embodiment of the present invention, which may vary depending on the intention of the user or operator or the custom in the field to which the present invention belongs. Therefore, the definitions of these terms should be based on the contents throughout this specification.

First, an example of a semiconductor chip that can be manufactured using the semiconductor chip package manufacturing apparatus of the present invention will be described. FIG. 1 is a cross-sectional view showing an LED package with a fluorescent film attached thereto, and FIG. 2 is a perspective view showing a form in which a lead frame used for manufacturing an LED package is mounted on a carrier. 1, the illustrated semiconductor chip package is an LED package (light emitting diode package) 1, in which the lead frame 14 has a groove 18 (see FIG. 2) . The LED 2 is mounted on the bottom of the groove 18 and the LED 2 is connected by a terminal (not shown) of the lead frame 14 and a bonding wire 4. The grooves 18 are filled with the transparent sealing resin 6 and cured through a curing process. The sealing resin 6 may be, for example, a transparent silicone resin. On the upper side of the cured resin 6 for sealing, an adhesive resin 7 is applied, and a film piece 8 is adhered thereon. A phosphor material is included in the film piece 8 so that the brightness of light projected from the LED package 1 is improved. The adhesive resin 7 may be, for example, OCA (optical clean adhesive).

2, when the lead frame 14 is transferred from the semiconductor chip package manufacturing apparatus 20 (see FIG. 3), a plurality of lead frames 14 are carried on the carrier 11. The carrier 11 is formed with transfer conveying holes 12 spaced apart by an interval equal to the distance between adjacent pair of lead frames 14 in a line in the longitudinal direction of the carrier 11. [

FIG. 3 is a plan view of a semiconductor chip package manufacturing apparatus according to a first embodiment of the present invention, FIG. 4 is a perspective view showing a lead frame loading unit of FIG. 3, FIG. 6 is a perspective view showing a resin dispensing unit of FIG. 3. FIG. 6 is a perspective view showing a lead frame feeding unit. FIG. 3, an apparatus 20 for manufacturing a semiconductor chip package according to a first embodiment of the present invention includes an LED 2 (see FIG. 1) mounted and a wire 4 (see FIG. 1) It is an apparatus for automatically and continuously performing an operation of attaching a fluorescent film piece 8 to a lead frame 14 (see Fig. 1) sealed by injection and curing of a resin 6 (see Fig. 1) .

The semiconductor chip package manufacturing apparatus 20 includes a lead frame loading unit 21, a lead frame feeding unit 30, a pair of resin dispensing units 40, A cassette 50, a film tray 60, a film stage 70, a film changer 80, a film attaching unit 90, a lead frame unloading unit 103, and a controller 109 do. 2, 3, and 5, the lead frame feeding unit 30 moves the carrier 11 on which the plurality of lead frames 14 are mounted in a direction parallel to the Y axis. The carrier 11 is loaded on a conveying rail 31 extending parallel to the Y-axis and is conveyed along the conveying rail 31. A lead frame loading unit 21 is disposed on one side of the feed rail 31 and a lead frame unloading unit 103 is disposed on the other side of the feed rail 31.

The lead frame feeding unit 30 includes a reciprocating bar 33 extending in parallel with the feed rail 31 on the side of the feed rail 31 and a push rod 33 projecting toward the feed rail 31 from the reciprocating bar 33 And a transfer pin (pin) 36 which protrudes downward from the end of each of the transfer rods 35. The transfer rods 35, The reciprocating bar 33 reciprocates by a distance between a pair of adjacent lead frames 14 mounted on the carrier 11 and reciprocates in a clockwise and counterclockwise direction by a certain angle about its own longitudinal axis Alternate rotation. With this configuration, when the reciprocating bar 33 rotates counterclockwise by a predetermined angle, the feed pin 36 descends and its lower end is inserted into the feed through hole 12 of the carrier 11, 33 are moved in parallel to the positive (+) direction of the Y axis so that the carrier 11 and the plurality of lead frames 14 mounted thereon are shifted by one pitch. When the reciprocating bar 33 is rotated by a predetermined angle in the clockwise direction, the conveying pin 36 rises and the lower end of the conveying pin 33 is disengaged from the conveying through hole 12. When the reciprocating bar 33 is rotated in the Y- In parallel with the direction of the arrow. By the repetition of the above-described mechanism, the plurality of lead frames 14 and the carrier 11 are moved by a pitch along the feed rail 31. The controller 109 controls the operation of the lead frame feeding unit 30 in synchronization with the operation and timing of the other units 21, 40, 70, 90,

2 to 4 together, the lead frame loading unit 21 sequentially loads the carrier 11 on which the lead frame 14 is mounted to one side of the transfer rail 31. As shown in Fig. The lead frame loading unit 21 has a plurality of lead frame cartridges 26 on which the carriers 11 are stacked. A plurality of carriers 11 are supported in the lead frame cartridge 26 on a plurality of support tails 27 formed at regular intervals in the vertical direction so that the plurality of carriers 11 are held in the lead frame cartridge 26 Respectively. On the other hand, a plurality of lead frame cartridges 26 are arranged in the cartridge lowering guide 22 in the vertical direction, and the lowest support jaw 27 of the lead frame cartridge 26, (+) Direction sequentially from the carrier 11 supported on the conveying rail 31, and is loaded on the conveying rail 31.

When the carrier 11 of the lowest layer is discharged from the lead frame cartridge 26, the lead frame cartridge 26 is lowered by the height of one layer of the supporting jaw 27 and then the carrier 11 of the next layer is discharged again do. In this manner, when the lead frame cartridge 26 is lowered by one layer height and all of the carriers 11 stacked therein are discharged and loaded into the transfer rail 31, (22), and is moved and discharged along the X-axis direction along the cartridge sliding table (24). The controller 109 controls the operation of the lead frame loading unit 21 in synchronism with the operation and timing of the other units 30, 40, 70, 90,

2, 3, and 6, the resin dispensing unit 40 is disposed between the leadframe loading unit 21 and the film attaching unit 90. As shown in FIG. Since the time required for performing the operation of the resin dispensing unit 40 tends to be longer than the time required for performing the operation of the film attaching unit 90, the semiconductor chip package manufacturing apparatus 20 A single film attaching unit 90, and a pair of resin dispensing units 40. [

The resin dispensing unit 40 includes a syringe 42 filled with a fluid resin and a syringe driver 44 for moving the syringe 42 in the horizontal direction, Respectively. At the lower end of the syringe 42, there is formed a nozzle 43 through which a fluid resin is discharged. When the lead frame 14 mounted on the carrier 11 and transported parallel to the Y axis positive direction along the feed rail 31 is positioned below the syringe 42, the nozzle 43 and the lead frame The syringe 42 is moved in parallel by the syringe driver 44 and the resin is discharged to the lead frame 14 through the nozzle 43. [ The discharge method of the resin is, for example, a dot method in which discharge is performed with a small interval by intervals, and a write method in which the discharge is continuously performed without interruption. The syringe driver 44 can move the syringe 42 finely during the discharge of the resin to appropriately distribute the resin.

Depending on the type of work, the syringe 42 may be filled with an adhesive resin such as OCA, or may be filled with a sealing resin such as a transparent silicone resin. When the syringe 42 is filled with the adhesive resin, the lead frame 14 supplied from the lead frame loading unit 21 to the feed rail 31 is connected to the wire 4 (see Fig. 1) (See Fig. 1) is mounted, and the sealing resin 6 (see Fig. 1) is injection-cured, and the adhesive resin 7 (see Fig. 1) is cured through the resin dispensing unit 40 (6). At this time, the controller 109 controls the operation of the resin dispensing unit 40 according to the timing and timing of the operation of the other units 21, 30, 70, 90,

However, when the syringe 42 is filled with the sealing resin, the lead frame 14 supplied from the lead frame loading unit 21 to the feed rail 31 is connected to the wire 4 (see Fig. 1) The sealing resin 6 is injected into the groove 18 of the lead frame 14 through the resin dispensing unit 40 as shown in Fig. At this time, the controller 109 adjusts the timing of the operations of the lead frame loading unit 21, the lead frame feeding unit 30, and the lead frame unloading unit 103 so that the operation of the resin dispensing unit 40 Until the carrier 11 on which the lead frame 14 is mounted is discharged from the lead frame loading unit 21 and collected by the lead frame unloading unit 103, (70, 90) so as to stop the operation of the motor (90).

FIG. 7 is a perspective view showing the film cassette of FIG. 3, FIG. 8 is a perspective view of the film stage of FIG. 3, FIG. 9 is a perspective view of the film moving unit of FIG. 10 is a perspective view showing the film attaching unit of Fig. 3, and Fig. 11 is a cross-sectional view showing a state in which a film piece is adsorbed and separated in the film stage of Fig. 7 by using an adsorption collet of Fig. 3 and 7 to 9, the film cassette 50 includes a plurality of film trays 60 that accommodate a plurality of film trays 8 (see FIG. 11) with regularly arranged film trays 60 . A plurality of film trays 60 are supported on a plurality of support tails 52 formed at predetermined intervals in the vertical direction inside the film cassette 50 so that a plurality of film trays 60 are arranged in the film cassette 50 Respectively. The film cassette 50 is supported by the film cassette elevator 56 and can be stepped up or down by one layer height.

On the upper side of the film tray 60, a plurality of film receiving grooves 62 arranged in a matrix form are formed by barrier ribs 63 formed in a checkered pattern. The film pieces 8 are seated one by one in the respective film seating grooves 62. [ Each film seating groove 62 is open to the lower side and is in the form of a through hole as shown in Fig. One kind of film pieces 8 (see Fig. 11) may be placed on all the film seating grooves 62, and a plurality of different kinds of film pieces 8 may be seated and arranged in a predetermined order. Here, the kind of the film piece 8 can be distinguished, for example, by the thickness of the film piece 8, the color of the film piece 8, or the type and amount of the fluorescent material contained in the film piece 8 . Specifically, for example, a fluorescent film piece 8 having different color coordinates is mounted on a plurality of film receiving grooves 62, and a fluorescent film piece 8 having an appropriate color coordinate according to the type of the LED 2 is attached . Accordingly, it is possible to produce various types of LED packages in small quantities. The film tray 60 is not limited to a rectangular plate shape as shown in FIG. 8, and for example, a film tray in the form of a disc is also possible.

The film stage 70 has a tray holder 71 for holding the film tray 60 on its upper surface. The film stage 70 is movable in the horizontal direction, that is, in the direction parallel to the X axis and the Y axis, by the film stage driver 74. The film stage 70 moves in the horizontal direction under the control of the controller 109 so that a plurality of film pieces 8 seated on the film tray 60 are sequentially positioned at the pick-up position . When a plurality of kinds of film pieces 8 are arranged in the film tray 60, the controller 109 controls the film stage 8 so that the film pieces 8 of a suitable kind are sequentially positioned in the pick- 70 can be controlled.

The film changer 80 picks up one film tray 60 from the film cassette 50 and inserts it into the tray holder 71 of the film stage 70 or attaches the film tray 60 to the tray holder 71 And the picked-up film tray 60 is picked up and mounted on the film cassette 50. Specifically, the film changer 80 includes a tray pick-up head 81 for holding the film tray 60, a head pick-up head 81 for holding the tray pick-up head 81 at one end, and a head driver 84 for driving the other end of the head support beam 83 so as to reciprocate in a direction parallel to the Y axis. The head driver 84 has a timing belt 88 fixed to the other end of the head support beam 83 and wound on a pair of pulleys 86 and 87 and a pair of pulleys 86 and 87 And a motor 85 that rotates one of the clockwise and counterclockwise clockwise and counterclockwise directions.

For example, when the tray pick-up head 81 is picked up by the control of the controller 109, the film tray 60 stacked on the lowermost layer among the plurality of film trays 60 stacked on the film cassette 50 and the film tray 60 can be fitted to the tray holder 71 by moving in parallel with the positive (+) direction of the Y axis. 11) are all used in the film tray 60 sandwiched by the tray holder 71, the tray pickup head 81 returns to the film tray (not shown) fitted in the tray holder 71 60 in this state and moves in parallel with the direction of the Y axis negative (-) to push the film tray 60 into the lowest layer of the film cassette 50 to which the film tray 60 was originally stacked. When the film cassette elevator 56 descends by one layer height of the film tray 60 for the proceeding of the operation with the next film tray 60 the tray pick-up head 81 is moved to the film stacked on this layer of the film cassette 50 The tray 60 is picked up and mounted on the film stage 70 again as described above.

3, 10, and 11, the film attaching unit 90 is seated on the film tray 60 (see FIG. 8) and moves horizontally of the film stage 70 to a film piece 8) to be adhered to the lead frame (14) conveyed along the conveying rail (31). Specifically, the film piece 8 is attached to the upper surface of the sealing resin 6 sealing resin 7 to which the adhesive resin 7 (see Fig. 1) is applied. The film attaching unit 90 includes a collet 92 for sucking a film piece 8 arranged on the film tray 60 by vacuum suction and a collet 92 for supporting the collet 92, That is, a collet driver 94 that moves in a direction parallel to the X axis, the Y axis, and the Z axis, respectively.

On the other hand, below the film stage 70 (see Fig. 8), a film piece 8 at the pick-up position and a film supporting pin 78 aligned on a virtual vertical line VL project upward Respectively. If the film seating groove 62 is not in the form of a through hole as shown in Fig. 11 but is opened only on the upper side, the speed at which the collet 92 descends to attract the film pieces 8 arranged on the film tray 60 The lower end of the collet 92 and the film piece 8 may collide with each other and breakage may occur. If the lowering speed of the collet 92 is set to be slow to prevent this, the work yield may be lowered. Thus, the collet 92 is moved to align on the vertical line VL of the film pick-up position and rapidly lowered, and at the same time, the film piece 8 is supported by the film support pin 78, Can be picked up.

The film support pin 78 rapidly ascends as the collet 92 descends to adsorb the film piece 8 in the lowered state (see the dashed line in FIG. 11) so as not to interfere with the film tray 60, The piece 8 is supported, and then quickly returned to its original state. The controller 109 controls the collet 92 and the film support pins 78 so that the downward movement of the collet 92 for picking up the film piece 8 and the upward movement of the film support pin 78 are synchronized. 78).

The film attaching unit 90 further includes a pickup alignment sensor 99 for sensing the adsorbed posture of the film piece 8 adsorbed on the collet 92 and the point where the film piece 8 is adsorbed. The pickup alignment detection sensor 99 may be, for example, a camera module having an image sensor (not shown). The collet 92 is set to adsorb the center point of the film piece 8, but when actually adsorbed, a point slightly off the center point can be adsorbed, and the adsorbed posture of the film piece 8 may also be slightly off the set angle have. Therefore, the collet 92 that has adsorbed the film piece 8 moves to the upper side of the pickup alignment detection sensor 99, and the pick-up alignment detection sensor 99 picks up the film piece 8 to which the film piece 8 is adsorbed. The controller 109 compares the picked up posture and the information about the picked up point with a default value to calculate an error and the collet 92 picks up the picked up alignment sensor 99 from the feed rail 31 The moving position and posture, that is, the rotation angle of the collet 92 is finely controlled in consideration of the error when the film piece 8 is placed on the lead frame 14. When the collet 92 stops the vacuum intake at the upper side of the lead frame 14, the film piece 8 falls due to gravity and is put on the upper side of the lead frame 14. [

The film adhering unit 90 is separated from the collet 92 so that the film piece 8 loaded on the lead frame 14 is brought into close contact with the adhesive resin 7 And further includes a pressing pusher 97 that presses down toward the frame 14 side. The pressure pusher 97 is provided after the collet 92 along the advancing direction on the feed rail 31 of the lead frame 14. [

The lead frame unloading unit 103 unloads the carrier 11 (see Fig. 2) on which the plurality of lead frames 14 are mounted, which has advanced to the other side of the conveying rail 31 along the conveying rail 31 (unloading). Although not shown in detail, the lead frame unloading unit 103 has a lead frame cartridge similar to the lead frame loading unit 21. When the carrier 11 is fully stacked on the lead frame cartridge, an empty lead frame cartridge is substituted for it, and the filled lead frame cartridge falls downward and is moved along the cartridge sliding table to the side of the semiconductor chip package manufacturing apparatus 20 And is discharged to the outside.

12 is a flowchart showing a method of manufacturing a semiconductor chip package according to an embodiment of the present invention. Hereinafter, a method of manufacturing a semiconductor chip package according to an embodiment of the present invention will be described in detail with reference to FIGS. 1 to 3 and FIG. A method of manufacturing a semiconductor chip package according to an embodiment of the present invention is a method of manufacturing an LED package 1 including a semiconductor chip mounting step S10, a resin injection step S20, a resin curing step S30, Step S40. The above process is sequentially performed while a plurality of lead frames 14 are mounted on the carrier 11. [ In the semiconductor chip mounting step S10, the semiconductor chip 2, that is, the LED is mounted on the groove 18 of the lead frame 14 and the terminal of the lead frame 14 and the terminal of the semiconductor chip 2 are connected to the wire 4 ) Bonding.

The resin injection step S20 is a step of sealing the semiconductor chip 2 by injecting the sealing resin 6 into the groove 18 of the lead frame 14 on which the semiconductor chip 2 is mounted, The syringe 42 of the semiconductor chip 40 is filled with the sealing resin 6 and the carrier 11 on which the lead frame 14 is mounted is filled in the lead frame cartridge 26 The device 20 can be operated. The film cassette 50, the film stage 70, the film changer 80, and the film attaching unit 90 do not operate at this time. However, it is not necessary to use the semiconductor chip package manufacturing apparatus 20 to implement the resin injection step S20. For example, when the operator holds the syringe filled with the sealing resin 6 and presses the sealing resin 6 ) May be injected. .

The resin curing step S30 is a step of curing the sealing resin 6 injected into the groove 18, which is also referred to as a curing step. Heat is applied to the lead frame 14 discharged to the outside of the semiconductor chip package manufacturing apparatus 20 after the sealing resin 6 is injected or heat is applied depending on the type of the sealing resin 6, It is possible to cure the sealing resin 6 by irradiation.

The film adhering step S40 includes an adhesive applying step S41, a film moving step S42, a film pick-up step S43, a film loading step S44, a film pressing step S45, The syringe 42 of the resin dispensing unit 40 is filled with the adhesive resin 7 and the lead frame 14 (see Fig. 4) is subjected to the resin curing step S30 ) And the semiconductor chip package manufacturing apparatus 20 can be operated.

The adhesive applying step (S41) is implemented by the operation of the resin dispensing unit (40) as a step of applying the adhesive resin (7) to the upper side of the hardened sealing resin (6). The film moving step S42 is a step in which a film tray 60 (see Fig. 8) in which a plurality of film pieces 8 are regularly arranged is mounted on the film stage 70 and moved in the horizontal direction to form a plurality of film pieces 8 To a pick-up position. The picked-up film 8 is then moved to a pick-up position. The process of moving and mounting the film tray 60 from the film cassette 50 to the film stage 70 is preceded by the operation of the film changer 80 before the film moving step S42.

The film pickup step S43 is a step of adsorbing the film piece 8 located at the pickup position and is implemented by the operation of the collet 92 (see Fig. 10) and the film support pin 78 of the film attaching unit 90 . The film loading step S44 is a step of placing the film pieces 8 adsorbed on the collet 92 on the upper side of the sealing resin 6 sealing resin 7 to which the adhesive resin 7 is applied. The film pressing step S45 is a step of pressing the film piece 8 placed on the upper side of the sealing resin 6 so as to be adhered and fixed to the sealing resin 6. The pressing pusher 97 (see Fig. 10) Lt; / RTI > The concrete implementation of the film pick-up step S43, the film loading step S44, and the film pressing step S45 has been described in detail with reference to FIGS. 10 and 11, so duplicated description will be omitted.

After the film pressing step S45, the lead frame 14 discharged outside the semiconductor chip package manufacturing apparatus 20 can be completed with the LED package 1 through an additional curing process.

FIG. 13 is a plan view of a semiconductor chip package manufacturing apparatus according to a second embodiment of the present invention. Referring to FIG. 13, the semiconductor chip package manufacturing apparatus 200 according to the second embodiment of the present invention includes LEDs 2 Is connected to the lead frame 14 (see Fig. 1), which is sealed by the injection and curing of the sealing resin 6 (see Fig. 1) Thereby automatically and continuously performing the operation of attaching the piece 8 to the workpiece.

The semiconductor chip package manufacturing apparatus 200 includes a lead frame loading unit 21, a lead frame feeding unit 30, a pair of resin dispensing units 40, A feeding unit 500, a film attaching unit 900, a lead frame unloading unit 103, and a controller 209. The lead frame feeding unit 30, the lead frame loading unit 21, the resin dispensing unit 40 and the lead frame unloading unit 103 are the same as the semiconductor chip package manufacturing apparatus according to the first embodiment of the present invention 20) (see FIG. 3) are the same as those of the units of the same name, so that redundant description will be omitted.

FIGS. 14 and 15 are a perspective view and a plan view showing a film feeding unit of FIG. 13, FIG. 16 is a front view showing a traveling path of a support tape and a film piece in the film feeding unit of FIG. 14, And 17 is a perspective view showing the film attaching unit of Fig. 13 and 16, the film feeding unit 500 is a unit for separating and feeding a film piece 8 attached to and supported by the support tape 10 from the support tape 10, A film separating die 620 for separating the plurality of film pieces 8 from the supporting tape 10 to which the film pieces 8 are attached and supported and a plurality of film pieces 8 attached to the film separating die 620 A tape unwinding roller 520 for continuously feeding the supported support tape 10 and a tape unwinding roller 520 for continuously recovering the support tape 10 from which a plurality of film pieces 8 are separated, and a tape rewinding roller 540.

The tape rewinding roller 540 is disposed below the tape unwinding roller 520. The support tape 10 discharged from the tape unwinding roller 520 is guided to the film separating die 620 by the first and second guide rollers 560 and 570 and the tape rewinding The path of the support tape 10 from which the film pieces 8 are removed to the roller 540 is guided by the third to fifth guide rollers 580, 590, 600.

The film separating die 620 is a member having a wedge-shaped cross section and extends to a length slightly larger than the width of the supporting tape 10. [ The film separating die 620 includes an upper surface 660 slidably moved with the support tape 10 to which the film piece 8 is attached and supported and an acute angle AA formed between the upper surface 660 and the upper surface 660 As shown in FIG. The separated support tape 10 slides along the inclined surface 670 and moves toward the tape rewinding roller 540. [

An edge 640 protruding at an acute angle AA is provided at one side end where the upper surface 660 and the inclined surface 670 meet. A plurality of pieces of film 8 attached to the supporting tape 10 are supported by the edge 640 when the supporting tape 10 passes the edge 640, And is separated from the tape 10.

A film separating roller 690 formed of an elastic material and extending in the width direction of the supporting tape 10 is provided on the upper side 660 adjacent to the edge 640. The film separating roller 690 presses the plurality of film pieces 8 attached to the support tape 10 against the upper side surface 660 before the support tape 10 passes the edge 640. However, when the support tape 10 passes the edge 640, the pressing by the film separating roller 690 is released. As a result, the end of the film piece 80 out of the film separating roller 690 is finely lifted in a direction away from the surface of the support tape 10, and when the support tape 10 passes through the edge 640, And is easily separated from the tape 10.

The film feeding unit 500 includes a plurality of film support rods 710 that pass through the edge 640 and support a plurality of film pieces 8 separated from the support tape 10 so as not to fall to the floor do. In the embodiment shown in Fig. 15, ten film pieces 8 can be arranged in the width direction of the support tape 10, so that ten film support rods 710 are arranged in a line. The controller 209 controls the operation of the film attaching unit 900 such that when all of the film pieces 8 supported by the plurality of film supporting rods 710 are adsorbed by the collet 920 of the film attaching unit 900 The film feeding unit 500 is controlled so that the support tape 10 advances by a distance between the pair of film pieces 8 and the newly separated film piece 8 is put onto the film support rod 710. [ The controller 209 also controls the film feeding unit 500 to stop the support tape 10 if any piece of film 8 is supported on the plurality of film support rods 710.

The film feeding unit 500 further includes a number of film detection sensors 730 such as the number of film support rods 710 that sense whether the film pieces 8 are supported on the plurality of film support rods 710 . Specifically, for example, the film sensing sensor 730 may include a reflective photo sensor that senses the presence of an object in a non-contact manner, and may be proximate to a plurality of film support rods 710, Like the film support rod 710. The film piece 8 may be formed with a protruding portion 9 projecting radially on one side such that when the film piece 8 is normally supported by the film support rod 710, 730, the presence of the film piece 8 is detected by the film detection sensor 730. The film detection signal of the film detection sensor 730 is transmitted to the controller 209 and the controller 209 detects the presence of the film piece 8 in the specific film support rod 710 through the signal of the film detection sensor 730 It is determined that the empty film support rods 710 are not crossed when the collet 920 (see FIG. 17) picks up the film pieces 8 supported by the film support rod 710 one by one And controls the film attaching unit 900 so as to run.

13 and 17, the film attaching unit 900 is provided with a plurality of film supporting rods 710 (see FIG. 16), which are conveyed along the conveying rail 31 by picking up one piece of the film pieces 8 supported by the plurality of film supporting rods 710 And is attached to the lead frame 14. The collet 920 moves from the film support rod 710 on one side to the film support rod 710 on the other side among a plurality of film support rods 710 arranged in a line and sequentially adsorbs the film piece 8 . The film piece 8 is attached to the upper side of the sealing resin 6 sealing to which the adhesive resin 7 (see Fig. 1) is applied. The film attaching unit 900 includes a collet 920 for sucking the film piece 8 supported by the film support rod 710 by vacuum suction and a collet 920 for supporting the collet 920, , That is, a collet driver 940 that moves in a direction parallel to the X axis, the Y axis, and the Z axis, respectively. The collet 920 moves and descends to align on the extension line VL of the film support rod 710 to pick up and pick up the film piece 8 supported by the film support rod 710.

The film attaching unit 900 further includes a pickup alignment sensor 990 (see Fig. 14) for sensing the adsorbed posture of the film piece 8 adsorbed on the collet 920 and the point where the film piece 8 is adsorbed. The pickup alignment detection sensor 990 may be, for example, a camera module having an image sensor (not shown). The collet 920 is set to adsorb the center point of the film piece 8, but when actually adsorbed, a point slightly off the center point can be adsorbed, and the adsorbed posture of the film piece 8 may also slightly deviate from the set angle have. Thus, the collet 920 that has adsorbed the film piece 8 moves to the upper side of the pickup alignment detection sensor 990, and the pick-up alignment detection sensor 990 picks up the film piece 8 to which the film is sucked. The controller 209 compares the picked up posture and information about the picked up point with a default value to calculate an error and the collet 920 picks up the picked up alignment sensor 990 from the transfer rail 31 The movement position and the posture, that is, the rotation angle of the collet 920 are finely controlled in consideration of the error when the film piece 8 is placed on the lead frame 14. When the collet 920 stops the vacuum suction at the upper side of the lead frame 14, the film piece 8 falls due to gravity and is put on the upper side of the lead frame 14. [

The film attaching unit 900 is separated from the collet 920 so that the piece of film 8 loaded on the lead frame 14 is brought into contact with the resin 7 for adhesive agent And further comprises a pressing pusher 970 which presses down toward the frame 14 side. The pressurizing pusher 970 is provided after the collet 920 along the traveling direction on the feed rail 31 of the lead frame 14. [

The lead frame unloading unit 103 unloads the carrier 11 (see Fig. 2) on which the plurality of lead frames 14 are mounted, which has advanced to the other side of the conveying rail 31 along the conveying rail 31 (unloading).

18 is a flowchart showing a method of manufacturing a semiconductor chip package according to a second embodiment of the present invention. Hereinafter, a method of manufacturing a semiconductor chip package according to a second embodiment of the present invention will be described in detail with reference to FIGS. 1, 2, 13, and 18. FIG. A method of manufacturing a semiconductor chip package according to a second embodiment of the present invention is a method of manufacturing an LED package 1 including a semiconductor chip mounting step S100, a resin injecting step S200, a resin curing step S300, And attaching a film (S400). The above process is sequentially performed while a plurality of lead frames 14 are mounted on the carrier 11. [ The semiconductor chip mounting step S100 includes mounting the semiconductor chip 2, that is, the LED, in the groove 18 of the lead frame 14 and connecting the terminals of the lead frame 14 and the terminals of the semiconductor chip 2 to the wires 4 ) Bonding.

The resin injection step S200 is a step of sealing the semiconductor chip 2 by injecting the sealing resin 6 into the groove 18 of the lead frame 14 on which the semiconductor chip 2 is mounted, The syringe 42 of the semiconductor chip 40 is filled with the sealing resin 6 and the carrier 11 on which the lead frame 14 is mounted is filled in the lead frame cartridge 26 And the device 200 can be operated. As described above, the film feeding unit 500 and the film attaching unit 900 do not operate at this time. However, it is not necessary to use the semiconductor chip package manufacturing apparatus 200 to implement the resin injection step (S200). For example, when the operator holds the syringe filled with the sealing resin 6 and presses the sealing resin 6 ) May be injected. .

The resin curing step S300 is a step of curing the sealing resin 6 injected into the groove 18, which is also referred to as a curing step. Heat is applied to the lead frame 14 discharged to the outside of the semiconductor chip package manufacturing apparatus 200 after the sealing resin 6 is injected or heat is applied depending on the type of the sealing resin 6 or ultraviolet It is possible to cure the sealing resin 6 by irradiation.

The film adhering step S400 may include an adhesive applying step S410, a tape supplying step S420, a film separating step S430, a film pick-up step S440, a film loading step S450, A film pressing step S460, and a tape recovery step S470. The film attaching step S400 is a step of filling the syringe 42 of the resin dispensing unit 40 with the resin 7 for adhesive agent and attaching the lead frame cartridge 26 (see Fig. 4) The semiconductor chip package manufacturing apparatus 200 can be implemented by filling the carrier 11 on which the frame 14 is mounted.

The adhesive applying step S410 is implemented by the operation of the resin dispensing unit 40 as a step of applying the adhesive resin 7 to the upper side of the hardened sealing resin 6. The tape supplying step S420 is a step of supplying the supporting tape 10 (see Fig. 16) to which the plurality of fluorescent film pieces 8 are attached and supported to the film separating die 620 (see Fig. 16) S420), the support tape 10 to which the fluorescent film piece 8 is attached and supported is led out in a line from the tape unwinding roller 520 (see Fig. 16).

The film separating step S430 is a step of separating the piece of fluorescent film 8 from the supporting tape 10 at the edge 640 of the film separating die 620 (see Fig. 16). The film pickup step S440 is a step of picking up a piece of film separated from the support tape 10 and supported by the film support rod 710 (see Fig. 16) by a collet 920 (see Fig. 17). In the film loading step S450, the film pieces 8 adsorbed on the collet 920 are placed on the upper surface of the sealing resin 6 coated with the adhesive resin 7. The film pressing step S460 is a step of pressing the film piece 8 placed on the upper side of the sealing resin 6 so as to be adhered and fixed to the sealing resin 6 and the pressing pusher 970 Lt; / RTI >

The tape recovery step S470 is a step of withdrawing the separated support tape 10 from the film separation die 620 with the film piece 8. In this step S470, the support tape 10 from which the film pieces 8 are separated is wound in a line on the tape rewinding roller 540 (see Fig. 16) and recovered. Specific implementations of the tape supply step S420, the film separation step S430, the film pickup step S440, the film loading step S450, the film pressing step S460, and the tape recovery step S470, 17, the duplicated description will be omitted.

After the film attaching step S400, the lead frame 14 discharged to the outside of the semiconductor chip package manufacturing apparatus 200 can be completed with the LED package 1 through an additional curing process.

19 and 20 are block diagrams showing a first example and a second example of a system for implementing the semiconductor chip package manufacturing method of the present invention. Referring to Figures 1 and 19 together, the system of the first embodiment for implementing the method of manufacturing a semiconductor chip package comprises a semiconductor chip

And includes a mounting apparatus 115 and a semiconductor chip package manufacturing apparatus 120A. The semiconductor chip mounting apparatus 115 is a device that mounts the semiconductor chip 2 on the lead frame 14 and connects the lead frame 14 and the semiconductor chip 2 with the bonding wire 4. The semiconductor chip package manufacturing apparatus 120A includes a lead frame loading unit 130 for loading the lead frame 14 on which the semiconductor chip 2 is mounted into the apparatus 120A, A curing unit 150 for curing the injected sealing resin 6 to inject the resin 6 for sealing, a curing unit 150 for curing the injected sealing resin 6, 6) an adhesive resin dispensing unit 160 for applying an adhesive resin 7 to the upper side, a film attaching unit 170 for attaching the fluorescent film piece 8 on the applied adhesive resin 7, and And a lead frame unloading unit 180 for discharging the lead frame 14 to which the fluorescent film piece 8 is attached from the apparatus.

Referring to FIGS. 1 and 20 together, the system of the second embodiment for implementing the semiconductor chip package manufacturing method includes a semiconductor chip mounting apparatus 115, a semiconductor chip package manufacturing apparatus 120B, a curing apparatus 190 Respectively. That is, the semiconductor chip package manufacturing apparatus 120B in this embodiment does not include a curing unit, and a separate curing apparatus is provided.

The semiconductor chip mounting apparatus 115 is a device that mounts the semiconductor chip 2 on the lead frame 14 and connects the lead frame 14 and the semiconductor chip 2 with the bonding wire 4. The semiconductor chip package manufacturing apparatus 120B includes a lead frame loading unit 130 for loading the lead frame 14 on which the semiconductor chip 2 is mounted into the apparatus 120A, A resin dispenser unit 160 for sealing resin for dispensing a resin 6 for adhesion, a resin dispenser unit 160 for applying an adhesive resin 7 to the upper side of the cured resin 6 for sealing, A film attaching unit 170 for attaching the fluorescent film pieces 8 on the adhesive resin 7 and a lead frame unloading unit for discharging the lead frame 14 to which the fluorescent film pieces 8 are attached from the apparatus 180).

The curing apparatus 190 is a device for curing and curing the sealing resin 6 injected into the lead frame 14 by the resin dispensing unit 140 for sealing.

The resin dispensing unit 140 for sealing may be substantially the same in structure as the resin dispensing unit 160 for adhering, and the sealing resin may be filled in the syringe instead of the adhesive resin and the unit may be operated (see FIG. 6). The resin dispensing unit 140 for sealing may be substantially the same in structure as the resin dispensing unit 160 for adhering, and the sealing resin may be filled in the syringe instead of the adhesive resin and the unit may be operated (see FIG. 6). Alternatively, the resin dispensing unit 140 for sealing and the resin dispensing unit 160 for bonding may be disposed adjacent to each other, and a film attaching unit 170 may be disposed after the dispensing units. In the step of applying the sealing resin, the sealing dispensing unit 160 and the film attaching unit 170 do not operate.

Thereafter, the lead frame 14 is discharged from the semiconductor chip package manufacturing apparatus 120B after the operation is performed in the sealing resin dispensing unit 140, and the curing operation is performed through the curing apparatus 190. [

Thereafter, the lead frame having completed the curing operation is supplied again to the semiconductor chip package manufacturing apparatus 120B, and is discharged again after the operations are sequentially performed in the resin dispensing unit 160 for adhering and the film attaching unit 170 have. In this operation, the sealing resin dispensing unit 140 does not operate.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the scope of the present invention. Therefore, the true scope of protection of the present invention should be defined only by the appended claims.

1: LED package 8: film piece
20: semiconductor chip package manufacturing apparatus 21: lead frame loading unit
30: Lead frame feeding unit 31: Feed rail
40: resin dispensing unit 50: film cassette
60: film tray 70: film stage
90: Film attaching unit 103: Lead frame unloading unit

Claims (21)

A lead frame loading unit for sequentially loading lead frames;
A resin dispensing unit for sealing to inject the sealing resin into the lead frame so that the chip housing of the lead frame is sealed;
A film stage movable so that a phosphor film piece is sequentially positioned in a pick-up position;
A film attaching unit for sucking a piece of the fluorescent film positioned at the pick-up position and sequentially attaching the piece of fluorescent film to the sealing resin of the lead frame; And
And a lead frame unloading unit for unloading and collecting the lead frame passing through the film attaching unit. The method according to claim 1,
A film cassette accommodating a plurality of film trays in which a plurality of the fluorescent film pieces are regularly arranged and stacked; And
A film changer for picking up one film tray from the film cassette and mounting the film tray on the film stage or picking up a film tray mounted on the film stage and mounting the film tray on the film cassette; And the semiconductor chip is mounted on the semiconductor chip. The method according to claim 1,
Wherein the film attaching unit has a collet for adsorbing a piece of fluorescent film arranged on the film tray,
The semiconductor chip package manufacturing apparatus includes: a film supporting pin which rises when the collet descends to adsorb the fluorescent film piece to support the fluorescent film piece so that the fluorescent film piece is not pushed down; And
Further comprising a controller for controlling the collet and the film support pin such that the down movement of the collet and the up movement of the film support pin are synchronized. The method according to claim 1,
At least two kinds of fluorescent film pieces are arranged in the film tray,
Wherein the semiconductor chip package manufacturing apparatus further comprises a controller for controlling the film stage so that a piece of fluorescent film of a suitable kind is sequentially positioned at the pickup position according to a predetermined operation sequence. The method according to claim 1,
Wherein the film tray has a plurality of film seating grooves arranged in a matrix on an upper side thereof and the plurality of pieces of fluorescent film are seated in the film seating grooves. The method according to claim 1,
Wherein a lead frame loaded by the lead frame loading unit is mounted with a wire-bonded LED (light emitting diode), and the fluorescent film piece includes a fluorescent material. A lead frame loading unit for sequentially loading lead frames;
A resin dispensing unit for sealing to inject the sealing resin into the lead frame so that the chip housing of the lead frame is sealed;
A film feeding unit for continuously conveying a supporting tape on which at least one piece of fluorescent film is adhered and supported and separating the piece of fluorescent film from the supporting tape;
A film attaching unit for sucking a piece of fluorescent film separated from the supporting tape and sequentially attaching the piece of fluorescent film to the sealing resin of the lead frame; And
And a lead frame unloading unit for unloading and collecting the lead frame passing through the film attaching unit. 8. The method of claim 7,
Said film feeding unit comprising:
A film separating die for separating said at least one film piece from a supporting tape onto which at least one piece of film is attached and supported;
A tape unwinding roller for continuously supplying a supporting tape to which the at least one film piece is attached and supported by the film separating die;
And a tape rewinding roller for continuously recovering the separated support tapes of the at least one film piece. 9. The method of claim 8,
Wherein the film separating die has an acute angle protruding edge for switching the advancing direction of the support tape and the at least one film piece is supported by the support when the support tape passes the edge, And is separated from the tape. 10. The method of claim 9,
Wherein the film feeding unit presses at least one film piece attached to the support tape before the support tape passes the edge and releases the pressure when the support tape passes the edge, Further comprising a film separating roller to help separate at least one piece of film. 9. The method of claim 8,
Wherein the film feeding unit further comprises at least one film support rod that supports at least one film piece separated from the support tape until it is adsorbed by the film attaching unit,
Wherein the semiconductor chip package manufacturing apparatus further comprises a controller for controlling the film feeding unit to stop the progress of the support tape if at least one piece of the film is supported on the at least one film support rod Chip package manufacturing apparatus. 12. The method of claim 11,
Wherein the film feeding unit further comprises a number of film detection sensors equal in number to the number of film support rods that sense whether the piece of film is supported on the at least one film support rod. 8. The method of claim 1 or 7,
A resin dispenser unit for bonding, which is disposed between the sealing resin dispensing unit and the film attaching unit, for applying adhesive resin to the lead frame so that the piece of fluorescent film is adhered and fixed to the sealing resin injected into the lead frame and a resin dispensing unit for transferring the semiconductor chip package. 14. The method of claim 13,
Wherein a cure unit for curing the sealing resin is interposed between the resin dispensing unit for sealing and the resin dispensing unit for bonding. 8. The method of claim 1 or 7,
And an adhesive resin dispensing unit disposed in front of the film attaching unit for applying an adhesive resin to the lead frame so as to fix the piece of fluorescent film to the sealing resin of the lead frame passing through the sealing resin dispensing unit resin dispensing unit,
Characterized in that the film attaching unit and the resin dispensing unit for bonding are not operated when the sealing resin is dispensed from the sealing resin dispensing unit and discharged to the lead frame unloading unit . 16. The method of claim 15,
Wherein the sealing resin dispensing unit is replaceable with a resin dispensing unit for adhering by replacing the syringe with a syringe for the resin dispensing unit for adhering. A sealing resin injecting step of injecting a sealing resin into a lead frame to which the semiconductor chip is bonded to seal the semiconductor chip; And
And a film attaching step of attaching a piece of fluorescent film to the upper side of the cured resin for sealing which is cured after the step of importing for sealing. 18. The method of claim 17,
The film-
An adhesive applying step of applying an adhesive resin to an upper surface of the cured resin for sealing;
A film tray in which a plurality of fluorescent film pieces are regularly arranged is moved in the horizontal direction so that a predetermined piece of fluorescent film among the plurality of fluorescent film pieces is picked up at a pick- A moving film moving step;
A film pick-up step of picking up a piece of fluorescent film positioned at the pick-up position; And
And a film loading step of placing a piece of the adsorbed fluorescent film on an upper surface of the sealing resin coated with the adhesive resin. 18. The method of claim 17,
The resin injecting step and the adhesive applying step are performed by operation of a resin dispensing unit for discharging resin into the lead frame,
In the resin injecting step, the sealing resin is filled in a syringe provided in the resin dispensing unit,
Wherein in the step of applying the adhesive, the syringe provided in the resin dispensing unit is filled with the adhesive resin. 13. A semiconductor chip package manufacturing method performed in an apparatus for manufacturing a semiconductor chip package having the structure of any one of claims 7 to 12,
A sealing resin injecting step of injecting a sealing resin into a lead frame to which the semiconductor chip is bonded to seal the semiconductor chip;
A resin curing step of curing the injected sealing resin; And
And attaching a piece of the fluorescent film to the upper side of the cured resin for sealing. 21. The method of claim 20,
Further comprising an adhesive applying step of applying an adhesive resin to the upper surface of the sealing resin between the resin curing step and the film attaching step.

Images