CN102340980A

CN102340980A - Mounting apparatus

Info

Publication number: CN102340980A
Application number: CN2011101938985A
Authority: CN
Inventors: 养老进也; 小林一裕
Original assignee: Yamaha Motor Co Ltd
Current assignee: Yamaha Motor Co Ltd
Priority date: 2010-07-15
Filing date: 2011-07-07
Publication date: 2012-02-01
Anticipated expiration: 2031-07-07
Also published as: CN102340980B

Abstract

The invention provides a mounting apparatus, comprising: a base; a chip keep bench capable of keeping chip elements; an upward pushing device provided with a mechanism pushing up the chip elements kept on the chip keep bench from the lower part; a plurality of withdrawing head parts used for adsorbing the chip elements pushed up by the upward pushing device; a head part unit provided with a plurality of installing head parts receiving the chip elements from the withdrawing head parts and installing the chip elements onto a substrate; wherein, each mounting head part of the plurality of mounting head parts simultaneously receives the chip elements respectively absorbed by the withdrawing parts. Therefore, a mounting apparatus advantaged by shorter summation time required by delivering motion of the plurality of chip elements is provided.

Description

Mounting machine

Technical Field

The present invention relates to a mounting machine, and more particularly to a mounting machine including a pickup head that sucks a wafer component pushed up by a push-up device.

Background

As a mounting machine including a pickup head which sucks and vertically inverts a wafer component pushed up by a pushing-up device, mounting machines described in, for example, japanese patent No. 4016982 (hereinafter, referred to as patent document 1) and japanese patent laid-open publication No. 2004-.

Patent document 1 discloses a mounting machine including: a holding stage (wafer holding stage) that holds a flip chip (wafer element) and is movable in the XY direction, a sheet peeling mechanism (push-up device) provided below the holding stage, a take-out head that adsorbs the flip chip, and a mounting head that receives the flip chip from the take-out head and mounts it onto a substrate. The mounting machine of patent document 1 includes one take-out head. Therefore, it is considered that the mounting machine of patent document 1 performs the taking out of one flip chip from the holding table to the delivery of the component to the mounting head, and then performs the taking out of the next flip chip from the holding table and the delivery to the mounting head.

Further, patent document 2 discloses a mounting machine including: the component mounting apparatus includes a component supply stage (wafer holding stage) that holds a wafer component and is movable in the XY direction, a component introduction portion (pickup device) having a pickup nozzle that sucks the wafer component, and a mounting portion (head unit) having a mounting nozzle that receives the wafer component from the component introduction portion and mounts the wafer component on a substrate. In the mounting machine of patent document 2, as in the mounting machine of patent document 1, since one pickup nozzle is provided, it is considered that the mounting machine performs pickup of one wafer component from the component supply table to delivery of the component to the mounting nozzle, and then performs pickup of the next wafer component from the component supply table and delivery to the mounting nozzle.

In the mounting machine of patent document 1, since the flip chip is taken out from the holding table and the flip chip is delivered to the mounting head for each flip chip, there are the following problems: the total time required for the delivery operation of a plurality of flip chips (chip elements) increases.

In addition, in patent document 2, since the operation of taking out the wafer component from the component supply table and the operation of delivering the wafer component to the mounting nozzle are performed for each wafer component, there are the following problems: the total time required for the delivery operation of the plurality of wafer elements increases.

Disclosure of Invention

The invention aims to provide a mounting machine which has shorter total time required by the delivery operation of a plurality of wafer elements compared with the conventional mounting machine.

The mounting machine of the invention comprises: a base; a wafer holding stage capable of holding a wafer element; a push-up device having a mechanism for pushing up the wafer element held on the wafer holding stage from below; a plurality of take-out heads for sucking the wafer elements pushed up by the push-up means; a head unit having a plurality of mounting heads for receiving the wafer component from the take-out head and mounting the wafer component on a substrate; wherein each of the plurality of mounting heads simultaneously receives the wafer element sucked by each of the plurality of pickup heads.

According to the present invention, it is possible to suppress an increase in the total time required for the delivery operation of a plurality of wafer components, as compared with a conventional mounting machine.

Drawings

Fig. 1 is a plan view showing the overall configuration of a mounter according to a first embodiment of the present invention (a state in which a wafer holding stage is set at a component pickup work position).

Fig. 2 is a plan view showing the overall configuration of the mounting machine according to the first embodiment of the present invention (a state in which the wafer holding stage is disposed at the wafer receiving position).

Fig. 3 is a front view showing the overall structure of the mounting machine according to the first embodiment of the present invention.

Fig. 4 is a perspective view showing main components of a mounting machine according to a first embodiment of the present invention.

Fig. 5 is a side view showing a wafer component delivery state of the mounter according to the first embodiment of the present invention.

Fig. 6 is a front view showing a wafer component delivery state of the mounter according to the first embodiment of the present invention.

Fig. 7 is a block diagram showing a control system of a mounting machine according to a first embodiment of the present invention.

Fig. 8 is a flowchart for explaining the mounting operation of the mounting machine according to the first embodiment of the present invention.

Fig. 9 is a plan view showing the overall configuration of a mounting machine according to a modification of the first embodiment of the present invention.

Fig. 10 is a plan view showing the overall configuration of a mounting machine according to a second embodiment of the present invention.

Fig. 11 is a side view showing a component delivering state of a wafer in a mounter according to a second embodiment of the present invention.

Fig. 12 is a plan view showing the overall configuration of a mounting machine according to a third embodiment of the present invention.

Fig. 13 is a side view showing a component delivering state of a wafer in a mounter according to a third embodiment of the present invention.

Fig. 14 is a side view showing another delivery state of the wafer component in the mounter according to the third embodiment of the present invention.

Detailed Description

Embodiments of the present invention will be described below with reference to the drawings.

(first embodiment)

Next, the structure of the mounter 100 according to the first embodiment of the present invention will be described with reference to fig. 1 to 7. Note that XYZ rectangular coordinate axes are shown as appropriate in the drawings in order to clarify the directional relationship. The X-axis direction is a direction parallel to the horizontal plane, the Y-axis direction is a direction orthogonal to the X-axis direction on the horizontal plane, and the Z-axis direction is a direction orthogonal to each of the X-axis and the Y-axis.

The mounter 100 is a so-called composite type mounter that can take out bare chips from a diced wafer W and mount (mount) them on a printed circuit board P, and mount packaged components and the like supplied by a component supply apparatus 160 on the printed circuit board P. The printed circuit board P is an example of the "substrate" of the present invention.

As shown in fig. 1 and 2, the mounter 100 includes: a base 1; a conveying device 2 for carrying the printed circuit board P into and out of a predetermined mounting operation position; and a chip component supply section 3 for supplying chip components. As shown in fig. 2 and 4, the mounter 100 includes: a mounting portion 4 for mounting a component (a bare chip or a chip component) on the printed circuit board P; a wafer holding table 5 for supporting the wafer W drawn out from the wafer storage 170; a take-out device 6 for taking out bare chips from the wafer W supported by the wafer holding stage 5 and delivering the bare chips to the mounting portion 4; a push-up device 7 that pushes up the bare chip from below when the bare chip is taken out by the take-out device 6; the movable camera 8 for component position recognition photographs the bare chip before the bare chip is taken out by the taking-out device 6. The bare chip is an example of the "wafer element" of the present invention.

The conveying device 2 includes: a conveying device main body extending in the X direction for conveying the printed circuit board P, and a positioning mechanism, not shown, for positioning the printed circuit board P by lifting it up. The transport device transports the printed circuit board P in the X-axis direction from the right side to the left side in fig. 1 in a substantially horizontal posture, and positions and fixes the printed circuit board P at a predetermined mounting work position. In the first embodiment, positions (positions of the printed circuit boards P in the drawing) on the conveyance path of the conveyance device 2 and spaced apart by a predetermined interval in the X-axis direction are set as mounting work positions. In the following description, the position on the upstream side in the conveying direction of the printed circuit board P among the mounting work positions is referred to as a first work position S1, and the position on the downstream side is referred to as a second work position S2.

The chip component supply sections 3 are provided at both ends of the front side of the mounter 100. The chip component supply section 3 supplies chip components such as transistors, resistors, and capacitors. In the chip component supply unit 3, for example, a component supply device 160 such as a tape feeder 161 is arranged along the conveying device 2. Each belt feeder 161 includes: a reel on which a tape holding chip elements such as transistors at a predetermined interval is wound; a holding member that holds the reel; and a component feeding mechanism for feeding out the chip components from the tape to a component supply position at the tip of the tape feeder by drawing out the tape from the reel. The tape feeder 161 is configured to perform a feeding operation of the chip components in conjunction with the mounter 100 in a state of being mounted on the chip component supply unit 3. That is, the mounting section 4 of the mounter 100 is caused to pick up a chip component at the component supply position, and to send out the next chip component to the component supply position in association with the pick-up. Instead of the tape feeder 161, a tray (not shown) on which large-sized package components such as semiconductor packages are placed may be provided in the chip component supply unit 3. In this case, the packaged components are picked up directly from the tray by the mounting portion 4.

The mounting part 4 is a part that mounts a bare chip or a chip component onto the printed circuit board P, and includes two head units (referred to as a first head unit 41 and a second head unit 42) that are movable in the horizontal direction (XY direction) respectively at positions above the carrier device 2, and driving units that drive them respectively.

The first head unit 41 is movable only in an upstream side region of the base 1 mainly including the first working position S1 as a movable region, and the second head unit 42 is movable only in a downstream side region of the base 1 mainly including the second working position S2 as a movable region. These first head unit 41 and second head unit 42 have the following structure (the structure of second head unit 42 is explained in parentheses).

As shown in fig. 3, the first head unit 41 (second head unit 42) includes two component mounting heads 41a and one camera 41b (two component mounting heads 42a and one camera 42b) arranged in the X-axis direction. The

component mounting heads

41a and 42a are an example of the "mounting head" of the present invention.

The first head unit 41 (second head unit 42) sucks the chip components supplied from the tape feeder 161 by these component mounting heads 41a (42a) and mounts them on the printed circuit board P, and sucks the bare chips taken out of the wafer W by the take-out device 6 by the component mounting heads 41a (42a) and mounts them on the printed circuit board P. Accordingly, both chip elements such as transistors and capacitors and bare chips are mounted on the printed circuit board P. Before mounting components on the printed circuit board P, the first head unit 41 (second head unit 42) captures a reference mark (not shown) attached to the printed circuit board P by the camera 41b (42 b). The image signal captured is output from the camera 41b (42b) to the control device 11 described later, and the positional deviation of the printed circuit board P is recognized based on the image, and the positional deviation correction is performed at the time of mounting.

The driving unit of the

first head units

41 and 42 includes:

support members

43 and 44 that movably support the first head unit 41 and the second head unit 42 in the X-axis direction, respectively; fixed

rails

45 and 46 provided on the top surface 100a of the mounter 100 and movably supporting the supporting

members

43 and 44 in the Y-axis direction, respectively; a moving mechanism (not shown) constituted by linear motors for moving the first head unit 41 and the second head unit 42 in the X-axis direction with respect to the

support members

43 and 44; and a moving mechanism (not shown) constituted by a linear motor for independently moving the

support members

43 and 44 in the Y-axis direction along the

fixed rails

45 and 46, respectively.

Further, component recognition fixed

cameras

9 and 10 are provided on the base 1 in the respective movable regions of the first head unit 41 and the second head unit 42. The

fixed cameras

9 and 10 are cameras provided with an imaging element such as a CCD or a CMOS, for example. The

fixed cameras

9 and 10 pick up the components sucked by the

component mounting heads

41a and 42a of the first and

second head units

41 and 42 from below, and output image signals thereof to a control device 11 described later.

As shown in fig. 1, a wafer storage section 170 in which wafers W are stored is detachably fixed to a center portion of the front side of the mounter 100. Here, the wafer storage section 170 stores a plurality of wafers W cut as shown in fig. 4. The wafer storage 170 includes a rack (rack) for storing therein substantially annular carriers Wh (see fig. 1) for holding wafers W in a plurality of stages, and a drive unit for driving the rack up and down. The wafer storage 170 is configured to set a desired wafer W at a predetermined entry/exit height position where the wafer W can enter/exit the wafer holding stage 5 by raising/lowering the rack. The wafer holding table 5 is provided with a mechanism (not shown) for taking in and out the wafer W. The in-out mechanism is movable back and forth (Y direction) relative to the wafer holding stage 5, and has an arm portion having a carrier holding mechanism at a distal end thereof. The in-out mechanism can draw out the wafer W (the carrier Wh) in the rack set at the in-out height position from the wafer storage section 170 onto the wafer holding stage 5 by the arm section in a state where the wafer holding stage 5 is set at the wafer receiving position (see fig. 2), and can store (return) the wafer W on the wafer holding stage 5 into the rack.

Each bare chip of each wafer W accommodated in the wafer accommodation portion 170 is attached to a film-like wafer sheet in a face-up (faceup) state (a state in which a circuit formation surface (a mounting surface with respect to the printed circuit board P) is upward), and is held by the tray Wh via the wafer sheet.

The wafer holding table 5 has a circular opening at the center, and can hold the wafer W so that the opening of the wafer holding table 5 overlaps with the opening of the wafer holding table Wh. Accordingly, in a state where the wafer W (the tray Wh) is held on the wafer holding stage 5, the bare chips can be pushed up from below the wafer holding stage 5 by a push-up device 7 described later.

The wafer holding table 5 is movable on the base 1 in the Y direction between a component pickup operation position (position shown in fig. 1) and a wafer receiving position (position shown in fig. 2) in the vicinity of the wafer storage section 170. Specifically, the wafer holding table 5 is movably supported by a pair of fixed rails 51 extending in the Y-axis direction on the base 1, and is moved along the fixed rails 51 by the driving of a predetermined driving unit. The drive unit includes: a ball screw 52 extending parallel to the fixed rail 51 and screwed into a nut portion of the wafer holding table 5; and a drive motor 53 for rotationally driving the ball screw 52. As shown in fig. 3, the wafer holding table 5 is moved between the component pickup operation position and the wafer receiving position by a lower position of the carrier device 2.

The push-up device 7 pushes up the bare chip as an object of extraction from the lower side of the wafer W set on the wafer holding stage 5 at the component extraction work position, thereby peeling and lifting the bare chip from the wafer sheet.

As shown in fig. 3 and 4, the push-up device 7 includes a pair of small-diameter push-up rods (referred to as a first push-up rod 71a and a second push-up rod 71b) each having a push-up pin (not shown) built therein. The push-up device 7 is driven by a prescribed drive unit to move in the X direction with respect to the base 1. That is, the base 1 includes: a fixed rail 72 extending in the X-axis direction and movably supporting the push-up device 7; a ball screw, not shown, extending parallel to the fixed rail 72 and screwed into a nut portion of the push-up device 7; a drive motor (not shown) for rotationally driving the ball screw. By driving the ball screw by the driving motor, the push-up device 7 is moved along the fixed rail 72. Since the push-up device 7 is movable in the X direction, the push-up device 7 can push up an arbitrary bare chip with respect to the wafer W supported on the wafer holding stage 5 movable only in the Y direction.

The first push-up rod 71a and the second push-up rod 71b of the push-up device 7 are driven to move up and down by actuators (air cylinders, etc.), not shown, extending in the up-down direction. That is, in a state where the first push-up bar 71a or the second push-up bar 71b is disposed inside the opening of the wafer holding stage 5, the first push-up bar 71a or the second push-up bar 71b is driven to be lifted up to a position almost contacting with the lower side of the wafer sheet and thereafter positioned at a desired X-direction position of the bare chip, and thereafter, the push-up bar is driven upward by a driving motor (not shown) from the first push-up bar 71a or the second push-up bar 71b to push up the bare chip. The thickness of the push-up pin can be changed according to the size of the element to be pushed up, for example, by the first push-up rod 71a and the second push-up rod 71 b. For example, by mounting the push-up pins having diameters different from each other in the first push-up rod 71a and the second push-up rod 71b, the first push-up rod 71a or the second push-up rod 71b can be used differently depending on the size of the component or the like.

The first push-up rod 71a and the second push-up rod 71b can be driven up and down to two-step height positions. That is, the lift pin can be driven up and down between the lowermost position for avoiding interference with the wafer holding table 5 when the wafer holding table 5 is moved between the component pickup working position (see fig. 1) and the wafer receiving position (see fig. 2) in the vicinity of the wafer storage section 170, and the push-up standby position located in the vicinity of the lower surface of the wafer W inside the opening of the tray Wh in the state where the wafer holding table 5 is located at the component pickup working position (see fig. 1), and the push-up pin can be driven up and down between the position located inside the first push rod 71a or the second push rod 71b in the standby position and the component push-up position located further above the upper surface of the wafer holding table 5.

The taking-out device 6 adsorbs the bare chip pushed up by the pushing-up device 7 and delivers to the first head unit 41 and the second head unit 42.

The taking-out device 6 is moved in the horizontal direction (XY direction) at a position above the component taking-out work position by a prescribed drive unit. The driving unit has the following structure.

That is, the component pickup operation position is provided with: a pair of overhead fixed rails 61 provided at a prescribed interval in the X-axis direction and extending parallel to each other in the Y-axis direction; a frame member 62 having both ends movably supported on the fixed rail 61 and extending in the X-axis direction, respectively; a pair of ball screws 63 provided at positions close to the fixed rail 61, extending in the Y-axis direction, and screwed into nut members (not shown) respectively inserted at both ends of the frame member 62; a pair of frame driving motors 64 that rotationally drive the ball screws 63.

The frame member 62 is provided with a first guide rail (not shown) fixed to the front side thereof and extending in the X-axis direction, and a second guide rail (not shown) fixed to the rear side thereof and extending in the X-axis direction. The taking-out device 6 is movably supported on the first guide rail, and the camera 8 is movably supported on the second guide rail. Further, the frame member 62 includes: a ball screw (not shown) extending in the X-axis direction and screwed into a nut member (not shown) of the taking-out device 6; a drive motor 65 for rotationally driving the ball screw; a ball screw (not shown) extending in the X-axis direction and screwed into a nut member (not shown) of the camera 8; a drive motor 66 for rotationally driving the ball screw. That is, the frame member 62 is moved along the fixed rail 61 by the operation of each frame driving motor 64, and the pickup device 6 and the camera 8 are integrally moved in the Y-axis direction in accordance with the movement of the frame member 62.

Further, the taking-out device 6 is moved in the X-axis direction at the Y-direction front position of the frame member 62 by the operation of the drive motor 65, and the camera 8 is moved in the X-axis direction at the Y-direction rear position of the frame member 62 by the operation of the drive motor 66. The pickup device 6 and the camera 8 can be moved independently in the horizontal direction (XY direction) at positions above the component pickup operation position.

The movable region of the taking-out device 6 in the XY direction partially coincides with the movable regions of the first head unit 41 and the second head unit 42 in the XY direction. Accordingly, as will be described later, the bare chip can be delivered from the take-out device 6 to the first head unit 41 and the second head unit 42. Further, as shown in fig. 3, the taking-out device 6, the camera 8, and their driving units described above are located further below the first head unit 41 and the second head unit 42, and their driving units. Therefore, although the movable region of the extraction device 6 and the like partially overlap with the respective movable regions of the first head unit 41 and the second head unit 42 as described above, the extraction device 6 does not interfere with the first head unit 41 and the second head unit 42.

The taking-out device 6 includes a pair of wafer heads (referred to as a first wafer head 6a and a second wafer head 6 b). The first wafer head 6a and the second wafer head 6b are examples of the "take-out head" of the present invention.

The first wafer head 6a and the second wafer head 6b are drum-shaped heads each including a pair of suction nozzles 6e extending vertically. Specifically, as shown in fig. 4, two holder members 6d which are arranged at a predetermined interval in the X direction and are respectively movable up and down with respect to the frame member 6c by driving of a driving motor not shown are provided on the frame member 6c of the takeout apparatus 6, the first wafer head portion 6a and the second wafer head portion 6b are provided inside the holder members 6d, and the first wafer head portion 6a and the second wafer head portion 6b are supported by the holder members 6d in a state of being respectively rotatable about axes parallel to the X axis.

The pair of suction nozzles 6e of the first wafer head 6a and the second wafer head 6b are arranged at positions which are diametrically opposite in the vertical direction, and one of the suction nozzles 6e faces directly below while the other suction nozzle 6e faces directly above. The first wafer head 6a and the second wafer head 6b are rotationally driven (i.e., upside-down driven) by drive motors 6f provided respectively outside the two holder members 6d, whereby the positions of the pair of suction nozzles 6e alternate with each other. That is, in the taking-out apparatus 6, the first wafer head section 6a and the second wafer head section 6b are provided adjacent to each other, and the drive motor 6f is provided outside the pair of

wafer head sections

6a and 6 b. The drive motor 6f is an example of the "drive device" of the present invention.

As shown in fig. 6, the distance D1 (the arrangement distance in the X-axis direction) between the nozzles 6e of the first and second wafer heads 6a and 6b is the same as the distance D2 between the component mounting heads 41a mounted on the first head unit 41 and the distance D2 between the component mounting heads 42a mounted on the second head unit 42. Accordingly, two bare chips can be delivered simultaneously from two wafer heads (the first wafer head 6a and the second wafer head 6b) to two component mounting heads 41a of the first head unit 41 or two component mounting heads 42a of the second head unit 42.

The camera 8 is a camera including an imaging element such as a CCD or a CMOS. The camera 8 captures an image of a bare chip to be taken out before taking out the bare chip from the wafer W, and outputs an image signal thereof to the control device 11. When the takeout apparatus 6 delivers the component to the head unit, the takeout apparatus 6 moves to a position (component delivery position Y1) closest to the conveying apparatus 2. At this time, as shown in fig. 5, the Y-direction position of the push-up device 7 is determined so that the Y-direction position Y2 of the camera 8 coincides with the Y-direction position of the push-up device 7. Accordingly, when the next component is taken out after the next component is picked up in parallel with the component feeding operation, the moving amount of the take-out device 6 from the component feeding to the head unit to the next component taking out can be minimized (from the position Y1 to the position Y2).

Fig. 7 shows a block diagram of a control system of the mounter 100. As shown in fig. 7, the mounter 100 includes a control device 11 including a CPU, various memories, an HDD, and the like. The above-described drive motors (including the drive motor 53, the frame drive motor 64, the drive motor 65, the drive motor 66, the drive motor 6f, another drive motor, and control valve drive solenoids in the air flow paths of the lift cylinders of the push-up

rods

71a and 71b), the video camera 8, the fixed

video cameras

9 and 10, and the like are electrically connected to the control device 11, and the operations of the respective parts are controlled integrally by the control device 11. Further, an unillustrated input device is electrically connected to the control device 11, and an operator inputs various information based on the operation of the input device and also inputs an output signal from position detection means such as an unillustrated encoder incorporated in each drive motor.

The control device 11 includes, as functional elements: a shaft control unit 11a for controlling the driving of the driving motors or the driving solenoids of the control valves; an image processing unit 11b that performs predetermined processing on image signals from the cameras (the fixed

cameras

9 and 10, the

cameras

41b and 42b, and the like); an I/O processing unit 11c that controls input of signals from sensors other than those shown in the drawings, output of various control signals, and the like; a communication control unit 11d that controls communication with an external device; a storage unit 11e for storing various programs such as an installation program and various data; the main arithmetic unit 11f performs various arithmetic processes by comprehensively controlling the above-described units.

The control device 11 controls the respective driving motors and the like according to a predetermined program, thereby controlling the conveying device 2, the wafer holding stage 5, the taking-out device 6, the pushing-up device 7, the first head unit 41, the second head unit 42, and the like. Accordingly, a series of operations (element mounting operation) such as loading and unloading the wafer W into and from the wafer storage section 170, taking out bare chips from the wafer W, and mounting elements by the first head unit 41 and the second head unit 42 are performed.

Next, control of the component mounting operation by the control device 11 will be described with reference to fig. 8.

First, in step S1, the controller 11 controls the conveyor 2 to carry the printed circuit board P into the mounting machine 100. Then, in step S2, the control device 11 controls the conveyance device 2 to set the printed circuit board P at the first working position S1 and the second working position S2, and fixes the printed circuit board P in this state.

Thereafter, in step S3, the controller 11 controls the wafer holding stage 5 to pull out the wafer W from the wafer storage 170. Specifically, the wafer holding table 5 is moved to the wafer receiving position by driving the driving motor 53 (see fig. 2). Then, the wafer W (carrier Wh) is pulled out from the wafer storage section 170 onto the wafer holding stage 5 by an unillustrated loading/unloading mechanism. Then, in step S4, the pulled-out wafer W is fixed to the wafer holding table 5. Thereafter, the wafer holding table 5 is controlled to be set at the component pickup operation position (see fig. 1).

At this time, the controller 11 moves the wafer holding stage 5 so that the Y-direction position of the bare chip to be taken out of the bare chips in the wafer W coincides with the Y-direction positions of the push-up pin at the center of the first push-up rod 71a and the push-up pin at the center of the second push-up rod 71b of the push-up device 7.

After the wafer W is set at the component pickup work position, the controller 11 controls the camera 8 to take an image of the bare chip to be picked up in step S5. Specifically, the frame member 62 is moved in the Y-axis direction by driving the frame driving motor 64, and the camera 8 is moved in the X-axis direction by driving the driving motor 66. The camera 8 is thus disposed at a position above the bare chip as the object of extraction (object of suction). Then, the bare chip is photographed by the camera 8. The control device 11 obtains the position (positional deviation) of the bare chip from the captured image data. In this case, the control device 11 causes the camera 8 to photograph a plurality of bare chips at a time or continuously as necessary.

Next, in step S6, the control device 11 controls the push-up device 7, the take-out device 6, and the wafer holding stage 5 based on the imaging result of the camera 8, and moves the push-up pins of the push-up device 7, the suction nozzles 6e of the take-out device 6, and the bare chips to be taken out to the same position on the XY plane. Specifically, the push-up device 7 is moved in the X-axis direction, and the wafer holding stage 5 is moved in the Y-axis direction by driving the driving motor 53. Accordingly, the first push-up bar 71a or the second push-up bar 71b of the push-up device 7 is moved so that the center push-up pin is positioned below the bare chip to be taken out. In addition, the frame member 62 is moved in the Y-axis direction by driving the frame driving motor 64, and the take-out apparatus 6 is moved in the X-axis direction by driving the driving motor 65. Accordingly, the first wafer head 6a or the second wafer head 6b is moved to a position above the bare chip.

Further, the control device 11 raises (is driven) the push-up pins from the first push-up rod 71a or the second push-up rod 71b in accordance with the size of the component or the like, thereby pushing up the corresponding bare chip from the lower side thereof. At this time, the distal end surface of the push-up

rod

71a or 71b is pressed up from the central portion of the distal end surface of the push-up

rod

71a or 71b while generating negative pressure and sucking and holding the wafer sheet to which the bare chip is attached. On the other hand, the first wafer head 6a or the second wafer head 6b is lowered, and the bare chips peeled off from the wafer sheet by being pushed up are sucked by the negative pressure at the tip of the suction nozzle 6 e. Accordingly, the bare chips are taken out of the wafer W. The above-described operation of taking out the bare chips from the wafer W is sequentially performed for the first wafer head 6a and the second wafer head 6b, and the bare chips are respectively sucked and held by the suction nozzles 6 e.

Next, in step S7, the control device 11 executes control for delivering the bare chip from the take-out device 6 to the head unit. Specifically, the control device 11 controls the take-out device 6 to move the take-out device 6 to a specified component delivery position (a position closest to the conveying device 2), and controls the mounting portion 4 to move the first head unit 41 (or the second head unit 42) to the component delivery position. Accordingly, the take-out device 6 and the first head unit 41 (or the second head unit 42) are disposed one above the other at the component delivery position.

The control device 11 controls the two drive motors 6f to rotate the first wafer head 6a and the second wafer head 6b during the movement until the take-out device 6 and the first head unit 41 (or the second head unit 42) are set at the component delivery position. The bare chip sucked by each suction nozzle 6e is thereby turned upside down (turned to a face-down state), and the bare chip is sucked by the two component mounting heads 41a of the first head unit 41 (or the two component mounting heads 42a of the second head unit 42) by lowering the component mounting heads 41a of the first head unit 41 (or the component mounting heads 42a of the second head unit 42). Accordingly, the two bare chips can be transferred from the taking-out apparatus 6 to the first head unit 41 (or the second head unit 42) at the same time.

Next, in step S8, the control device 11 moves the first head unit 41 above the fixed camera 9 (the fixed camera 10 in the case of the second head unit 42), causes the fixed camera to capture an image of the bare chip held on each component mounting head, and calculates a holding deviation of the bare chip with respect to each component mounting head based on the captured image data.

Next, in step S9, the control device 11 recognizes the reference mark (not shown) attached to the printed circuit board P fixed to the conveying device 2 by the camera 41b (42b) of the first head unit 41 (second head unit 42). Accordingly, the control device 11 recognizes the positional deviation of the printed circuit board P with respect to the conveying device 2.

Then, in step S10, the control device 11 moves the first head unit 41 (second head unit 42) to the corrected position above the printed circuit board P based on the suction deviation of the bare chip and the positional deviation of the printed circuit board P. Then, the component mounting head is lowered at the designated mounting position, and the bare chip is mounted on the printed circuit board P.

After that, in step S11, the control device 11 determines whether or not the mounting of all the bare chips is completed. If the bare chip to be mounted remains, the process returns to step S5 to continue the mounting operation.

When the mounting of all the bare chips is completed, the controller 11 controls the carrier device 2 to release the fixation of the printed circuit board P in step S12. Then, in step S13, the controller 11 controls the conveyor 2 to carry the printed circuit board P out of the mounting machine 100.

The control of the component mounting operation by the controller 11 has been described above, but the control shown in the flow is an example of the most basic component mounting operation when only the bare chip is mounted. That is, in order to produce the substrate P more efficiently in actual production of the printed wiring board P, the control device 11 performs a part of a plurality of operations such as the movement of taking in and out the wafer W by the wafer holding stage 5, the movement of taking out the bare chip by the take-out device 6 and the push-up device 7, and the mounting operation of the head unit in parallel. For example, in the first embodiment, when the bare chip is delivered from the take-out device 6 to the head unit or when the bare chip is mounted on the printed circuit board P by the head unit, the next component to be mounted is shot by the camera 8 in parallel. When the bare chips are mounted on the plurality of printed circuit boards P in sequence, the flow returns from step S13 to step S1, and the next printed circuit board P is loaded and step S2 is performed, but when there are bare chips remaining in the wafer W on the wafer holding stage 5, steps S3 and S4 are skipped.

In the first embodiment, as described above, the two component mounting heads 41a of the first head unit 41 or the two component mounting heads 42a of the second head unit 42 can simultaneously receive the wafer components respectively adsorbed on the first wafer head 6a and the second wafer head 6b, and thus the delivery of the two wafer components can be performed at once. Accordingly, it is possible to suppress an increase in the total time required for the delivering operation of the plurality of wafer components, as compared with the case where the delivering operation of the wafer components to the

component mounting head

41a or 42a is performed for each wafer component.

In the first embodiment, as described above, the distance D1 (hereinafter, simply referred to as the distance D1) between the centers of the first wafer head 6a and the second wafer head 6b is set to be equal to the distance D2 (hereinafter, simply referred to as the distance D2) between the centers of the two element mounting heads 41a of the first head unit 41 or the distance D2 (hereinafter, simply referred to as the distance D2) between the centers of the two element mounting heads 42a of the second head unit 42. With this configuration, it is possible to easily deliver the wafer components from the two

wafer heads

6a and 6b to the two component mounting heads 41a or the two component mounting heads 42a at the same time.

In the first embodiment, the takeout apparatus 6 is provided with the

wafer head sections

6a and 6b adjacent to each other, and the two drive motors 6f are provided outside the takeout apparatus with the

wafer head sections

6a and 6b interposed therebetween. Therefore, since there is no driving motor between the wafer heads 6a and 6b, the distance between the wafer heads 6a and 6b can be reduced accordingly, and therefore the distance between the wafer heads 6a and 6b can be easily made equal to the distance between the head units of the head unit.

In the first embodiment, as described above, by providing the wafer holding table 5 movable in the Y direction with respect to the base 1, the pushing-up device 7 movable in the X direction with respect to the base 1, and the taking-out device 6 movable in the X direction with respect to the base 1, it is possible to perform the alignment of the bare chip to be taken out with the pushing-up device 7 and the taking-out device 6 without moving the wafer holding table 5 in the X direction. That is, since it is not necessary to move the wafer holding table 5 having a relatively large area with respect to the pushing-up device 7 and the taking-out device 6 in the X direction, the mounting machine can be suppressed from being enlarged in the X direction.

In the first embodiment, as described above, since the taking-out device 6 is movable in the XY direction relative to the pushing-up device 7, the positions of the pushing-up device 7 and the taking-out device 6 can be finely adjusted, unlike the case where the pushing-up device 7 and the taking-out device 6 are fixed. Therefore, according to the first embodiment, the positional deviation between the push-up device 7 and the take-out device 6 at the time of component take-out can be suppressed, and the occurrence of the adsorption failure of the component can be suppressed.

In addition, in the first embodiment, the wafer holding stage 5 is movable in the Y direction, and the camera 8 is also movable in the Y direction. Accordingly, when the bare chip to be taken out is aligned with the camera 8 to take an image of the bare chip, the wafer holding stage 5 and the camera 8 can be moved to be aligned so as to be close to each other. Therefore, according to the first embodiment, the alignment can be performed in a shorter time than when the wafer imaging camera is fixed in the Y direction and only the wafer holding stage 5 is moved to perform the alignment of the camera 8 with the bare chip.

In addition, in the first embodiment, as described above, the taking-out device 6 is movable in the Y direction, and the pushing-up device 7 is fixedly provided in the Y direction. Therefore, according to the first embodiment, the Y-direction positioning of the ejector 7 for picking up the bare chip and the ejector 6 can be performed with an inexpensive configuration, compared to a configuration in which both the ejector 6 and the ejector 7 are movable in the Y direction.

In the first embodiment, as described above, the operation of imaging the next mounted bare chip held on the wafer holding stage 5 by the camera 8 can be performed in parallel with the operation of delivering the bare chip from the take-out device 6 to the

head units

41 and 42 or in parallel with the operation of mounting the bare chip on the printed circuit board P by the

head units

41 and 42, whereby the total time taken for imaging the next wafer component and mounting the previous component or delivering the wafer component can be reduced.

(modification of the first embodiment)

In the first embodiment described above, the example in which the first head unit 41 and the second head unit 42 are provided one for each corresponding to the first work position S1 and the second work position S2 has been described, but as shown in the mounting machine 200 of the modification of the first embodiment shown in fig. 9, it is also possible to perform mounting work on the printed circuit boards P in the first work position S1 and the second work position S2 by using one head unit 202 that is movably supported by the frame member 201 extending in the X direction. Further, the head unit 202 has the same structure as the head unit 41 (or 42).

In addition, in the first embodiment described above, the taking-out device 6 is provided movably in the Y direction and the push-up device 7 is provided fixedly in the Y direction, but the taking-out device 6 may be provided fixedly in the Y direction and the push-up device 7 may be provided movably in the Y direction. Accordingly, the positioning of the taking-out device 6 and the pushing-up device 7 for performing the taking-out operation can be performed by moving the pushing-up device 7 in the Y direction, and the device (mounting machine) can be made cheaper than a configuration in which both the taking-out device 6 and the pushing-up device 7 are movable in the Y direction by fixedly providing the taking-out device 6 in the Y direction. Further, both the taking-out device 6 and the pushing-up device 7 may be configured to be movable in the Y direction. According to this configuration, in relation to the Y-direction movement of the wafer holding stage 5, the taking-out device 6 and the pushing-up device 7 can adopt various movement methods, and as a result, the efficiency of taking out bare chips can be improved.

(second embodiment)

Next, a mounting machine 300 according to a second embodiment of the present invention will be described with reference to fig. 10 and 11. In the second embodiment, an example in which two take-out apparatuses are provided, which is different from the first embodiment, will be described.

In the second embodiment, as shown in fig. 10, two taking out devices (a first taking out device 301 and a second taking out device 302) are provided. The first extraction device 301 and the second extraction device 302 have the same configuration as the extraction device 6 of the first embodiment. The first taking-out device 301 and the second taking-out device 302 are fixed together to the front side of the frame member 62, are supported movably by an unillustrated fixed rail extending in the X-axis direction, and move respectively along the fixed rail. The driving means of the first extraction device 301 and the second extraction device 302 have the following configurations.

A ball screw (not shown) extending in the X-axis direction is provided on the frame member 62. The ball screw is fixed to the frame member 62. On the other hand, the first extraction device 301 is provided with: a first nut member (not shown) into which the ball screw is screwed and a first hollow motor (not shown) connected to the first nut member with the ball screw inserted therethrough are provided in the second extraction device 302: a second nut member (not shown) into which the ball screw is screwed, and a second hollow motor (not shown) connected to the second nut member with the ball screw inserted therein. That is, the first nut member is rotationally driven by the first hollow motor to move the first taking-out device 301 in the X-axis direction at the position on the front side of the frame member 62, and the second nut member is rotationally driven by the second hollow motor to move the second taking-out device 302 in the X-axis direction at the position on the front side of the frame member 62. Accordingly, the first taking-out device 301 and the second taking-out device 302 are movable in the horizontal direction (XY direction) at positions above the component taking-out work position.

In addition, in the second embodiment, one head unit 304 movable in the X direction is supported on a frame member 303 extending in the X direction. The frame member 303 is movable in the Y direction. The mounting is performed at the first working position S1 and the second working position S2 by one head unit 304.

As shown in fig. 11, the head unit 304 has four component mounting heads 304a and a camera 304 b. The distance D3 (hereinafter, simply referred to as the distance D3) between the centers of the adjacent element mounting heads 304a of the head unit 304 is equal to the distance D1 between the wafer heads of the first extraction device 301 and the distance D1 between the wafer heads of the second extraction device 302. The component mounting head 304a is an example of the "mounting head" of the present invention.

As the wafer component delivering operation according to the second embodiment, for example, after the first takeout apparatus 301 simultaneously delivers two wafer components to the two component mounting heads 304a of the head unit 304, the second takeout apparatus 302 simultaneously delivers two wafer components to the remaining two component mounting heads 304a of the head unit 304. The other configurations of the first and

second takeout apparatuses

301 and 302 are the same as the takeout apparatus 6 according to the first embodiment, and the other configurations of the mounting machine 300 according to the second embodiment are the same as those of the first embodiment.

The second embodiment has the same effects as the first embodiment.

(modification of the second embodiment)

In the second embodiment, an example in which one head unit 304 is provided and the first and

second takeout apparatuses

301 and 302 sequentially perform the operation of delivering the wafer elements to the one head unit 304 has been described. Here, when two head units (the first head unit 41 and the second head unit 42) are provided as in the first embodiment, four wafer elements can be simultaneously delivered at a time by performing the delivering operation of the first head unit 41 and the second head unit 42 from the first taking-out device 301 and the second taking-out device 302, respectively.

(third embodiment)

Next, a mounting machine 400 according to a third embodiment of the present invention will be described with reference to fig. 12, 13, and 14. In the third embodiment, an example in which two take-out apparatuses having one wafer head are provided, which is different from the first embodiment described above in which one take-out apparatus 6 having two wafer heads is provided, will be described.

In the third embodiment, as shown in fig. 12 and 13, two taking out devices (a first taking out device 401 and a second taking out device 402) are provided. The first taking out device 401 and the second taking out device 402 are supported together movably on a fixed rail extending in the X-axis direction on the front side of the frame member 62. The first taking out device 401 and the second taking out device 402 can move independently of each other in the X-axis direction on the fixed rail of the frame member 62 by using the mechanism of the hollow motor similar to that of the second embodiment.

In addition, the first and second taking out

devices

401 and 402 have one

wafer head

401a and 402a, respectively.

In detail, the wafer head 401a is a drum-shaped head including a pair of suction nozzles 401d extending vertically. A frame member 401b of the first takeout apparatus 401 is provided with a holder member 401c which can be moved up and down with respect to the frame member 401b, and the wafer head portion 401a is supported by the holder member 401c so as to be rotatable about an axis parallel to the X axis. The wafer head 401a is provided on the second pickup device 402 side of the holder member 401c, and the wafer head 401a is rotated by driving of the driving motor 401e provided on the holder member 401c on the opposite side of the second pickup device 402 side, so that the positions of the pair of suction nozzles 401d alternate with each other.

The wafer head 402a is also a drum-shaped head including a pair of vertically extending suction nozzles 402d, as in the wafer head 401a, and is supported by a holder member 402c provided on a frame member 402b of the second taking-out device 402 so as to be able to move up and down while being rotatable about an axis parallel to the X axis. The wafer head 402a is provided on the first pickup device 401 side of the holder member 402c, and the wafer head 402a is rotated by driving of the driving motor 402e provided on the holder member 402c on the opposite side of the first pickup device 401 side, so that the positions of the pair of suction nozzles 402d alternate with each other. That is, the wafer head 402a of the second taking-out device 402 and the wafer head 401a of the first taking-out device 401 are disposed to face each other, and the driving motor 401e of the first taking-out device 401 and the driving motor 402e of the second taking-out device 402 are disposed on the outer side across the wafer heads 402a and 401 a. The other configurations of the mounter 400 of the third embodiment are the same as those of the first embodiment described above. The wafer head 401a and the wafer head 402a are examples of the "take-out head" of the present invention.

The third embodiment includes two head units, a first head unit 420 and a second head unit 421, as in the first embodiment. The first head unit 420 and the second head unit 421 have the same configuration as the head unit 304 of the second embodiment, and each of the

head units

420 and 421 includes four

element mounting heads

420a and 421a and

cameras

421b and 421b, respectively. In this example, the intervals D5 (hereinafter, simply referred to as intervals D5) of the centers of the element mounting heads 420a adjacent to each other of the first head unit 420 are equal. The same applies to the second head unit 421.

As the taking-out operation and the delivering operation in the third embodiment, first, the wafer head 401a of the first taking-out apparatus 401 and the wafer head 402a of the second taking-out apparatus 402 take out the wafer elements (bare chips), respectively. Then, at least one of the first takeout apparatus 401 and the second takeout apparatus 402 is moved, whereby the first takeout apparatus 401 and the second takeout apparatus 402 are moved to the designated delivery position. Here, in the third embodiment, as shown in fig. 13, the control device (not shown) controls the first taking out device 401 and the second taking out device 402 so that the distance between the centers of the wafer head 401a of the first taking out device 401 and the wafer head 402a of the second taking out device 402 (the distance D4 between the centers of the nozzle 401D and the nozzle 402D, hereinafter simply referred to as the distance D4) is equal to the distance D5 of the component mounting head 420a of the first head unit 420 or the distance D5 of the component mounting head 421a of the second head unit 421 at the transfer position.

Then, as in the first embodiment, the wafer elements are delivered simultaneously from the wafer head 401a of the first taking-out apparatus 401 and the wafer head 402a of the second taking-out apparatus 402 to the two element mounting heads 420a of the first head unit 420 or the two element mounting heads 421a of the second head unit 421.

In the third embodiment, as described above, when wafer elements are delivered from the first and

second takeout apparatuses

401 and 402 to the first head unit 420 or the second head unit 421, at least one of the first and

second takeout apparatuses

401 and 402 is moved so that the distance between the wafer head 401a of the first takeout apparatus 401 and the wafer head 402a of the second takeout apparatus 402 is equal to the distance D5 between the two element mounting heads 420a of the first head unit 420 or the distance D5 between the two element mounting heads 421a of the second head unit 421. According to this configuration, the wafer head 401a of the first taking-out device 401 and the wafer head 402a of the second taking-out device 402, which are movable independently of each other, can simultaneously deliver the wafer elements of the respective wafer heads to any adjacent two of the four element mounting heads of the head unit.

As shown in fig. 14, in the third embodiment, when delivering wafer elements from the first and

second takeout apparatuses

401 and 402 may be moved as necessary so that the distance D4 between the wafer head 401a of the first takeout apparatus 401 and the wafer head 402a of the second takeout apparatus 402 is twice or three times (integral multiple) the distance D5 between the two element mounting heads 420a of the first head unit 420 or the distance D5 between the two element mounting heads 421a of the second head unit 421. Accordingly, by the wafer head portion 401a of the first taking-out apparatus 401 and the wafer head portion 402a of the second taking-out apparatus 402 being movable independently of each other, the wafer elements held by the

wafer head portions

401a and 402a can be simultaneously delivered to any two of the four element mounting head portions 420a of the first head unit 420 or any two of the four element mounting head portions 421a of the second head unit 421. Other effects of the third embodiment are similar to those of the first embodiment.

Moreover, it is intended that all matter contained in the above disclosed embodiments be interpreted as illustrative and not in a limiting sense. The scope of the present invention is defined by the scope of claims equivalent to the summary of the invention, rather than the description of the above embodiments, and includes meanings equivalent to the scope of the claims and all modifications within the scope.

For example, in the first to third embodiments described above, an example in which two or four component mounting heads are provided is shown as the head unit of the mounting portion 4, but the present invention is not limited thereto, and the head unit may include three or more component mounting heads. The extraction device may include three or more extraction heads.

In this case, in the first embodiment, for example, three or more component mounting heads 41a (42a) may be provided at equal intervals D2 on the first head unit 41 (or the second head unit 42), and the first wafer head 6a and the second wafer head 6b of the takeout apparatus 6 may be provided such that the interval D1 between the first wafer head 6a and the second wafer head 6b of the takeout apparatus 6 is an integral multiple of the interval D2 between the component mounting heads 41a (42 a). Accordingly, the wafer component can be delivered simultaneously to two component mounting heads 41a (42a) adjacent to each other or two component mounting heads 41a (42a) spaced apart from each other with one or more component mounting heads 41a (42a) interposed therebetween. This point is the same as in the case where three or more element mounting heads are provided in the

head units

202 and 304 in the second embodiment.

In addition, in the first embodiment, the example in which the bare chips are sucked onto the

head units

41 and 42 via the take-out device 6 is shown, but in the present invention, the

suction nozzles

41a and 42a of the

head units

41 and 42 may be allowed to reach the wafer W on the wafer holding stage 5, and the

head units

41 and 42 may directly suck the bare chips without the take-out device 6. That is, depending on the type of the bare chip, the

head units

41 and 42 may selectively perform the operation of attaching the bare chip to the printed circuit board P by suction-holding the bare chip in a face-down state via the take-out device 6, or the operation of directly attaching the bare chip to the printed circuit board P by suction-holding the bare chip in a face-up state without via the take-out device 6. The same applies to the second and third embodiments.

In this case, when the movable range of the head unit in the Y direction is provided in the vicinity of the conveying device 2 as in the first to third embodiments, it is necessary to provide the pushing-up device in the vicinity of the conveying device 2, or to configure the pushing-up device so as to be movable in the Y direction so that the pushing-up device can be moved in the vicinity of the conveying device 2. Further, even when the push-up device is fixed in the Y direction at the component pickup operation position as in the first embodiment and the like, the head unit can directly suck the bare chip without passing through the pickup device by extending the movable range of the head unit in the Y direction to the component pickup operation position.

In the first embodiment, as shown in fig. 5, the push-up device 7 is provided (fixed in the Y direction) so that the Y direction position Y2 of the camera 8 coincides with the Y direction position of the push-up device 7 when the component is delivered to the

head units

41 and 42 by the take-out device 6, but the present invention is not limited to this. That is, the push-up device 7 may be provided (fixed in the Y direction) between the Y direction position Y1 of the take-out device 6 at the time of component delivery and the Y direction position Y2 of the camera 8 at this time. In this case, after the next component is imaged in parallel with the component delivery operation, when the next component pickup operation is performed, the pickup device 6 and the wafer holding stage 5 (component to be picked up) can be moved in the Y direction so as to be close to each other and positioned above the push-up device 7. This can further shorten the time from the delivery of the component to the

head units

41 and 42 to the removal of the next component. When the Y-direction moving speed of the take-out device 6 is equal to the moving speed of the wafer holding stage 5, the push-up device 7 is provided (fixed in the Y-direction) at a position intermediate between the position Y1 and the position Y2. When the moving speed of the take-out device 6 in the Y direction is lower than the moving speed of the wafer holding stage 5, the push-up device 7 is set at a position Y1 which is closer to the middle of the position Y1, based on the speed difference.

In the first embodiment, the example in which the wafer holding stage 5, the taking-out device 6, the pushing-up device 7, the component position recognition camera 8, and the like are driven by using the ball screw has been described, but the present invention is not limited thereto, and other driving mechanisms such as a linear motor may be used. Further, although the

head units

41 and 42 are driven by using linear motors, the present invention is not limited to this, and may be driven by using ball screws. The same applies to the second and third embodiments.

In the first embodiment, the two

wafer heads

6a and 6b and the two drive motors 6f corresponding to the two wafer heads are provided in one take-out apparatus 6. That is, the two (or more) wafer heads 6a and 6b may be driven by one drive motor to be turned upside down. In this case, it is preferable that the drive motor is also provided outside the two

wafer heads

6a and 6 b. The same applies to the second embodiment.

In the first embodiment, the example in which the wafer holding stage 5 is movable only in the Y direction and the take-out device 6 and the push-up device 7 are movable in the X direction has been described, but the present invention is not limited thereto and the wafer holding stage 5 may be movable in the XY direction. In this case, for example, when the push-up device 7 is fixed in the XY direction (when the take-out device 6 is fixed), the wafer holding stage 5 is moved in the X direction and the Y direction, whereby the wafer element to be taken out can be moved to the take-out position sandwiched between the wafer heads 6a and 6b of the take-out device 6 and the push-up device 7 to perform the take-out operation. The same applies to the second and third embodiments.

In the third embodiment, the example in which the first takeout apparatus 401 and the second takeout apparatus 402 are provided with one wafer head portion 401a (401b) is shown, but the present invention is not limited thereto, and a plurality of wafer head portions may be provided in the first takeout apparatus 401 and the second takeout apparatus 402.

The invention described above is summarized as follows.

The mounting machine of the invention comprises: a base; a wafer holding stage capable of holding a wafer element; a push-up device having a mechanism for pushing up the wafer element held on the wafer holding stage from below; a plurality of take-out heads for adsorbing the wafer elements pushed up by the push-up means; a head unit having a plurality of mounting heads for receiving the wafer component from the take-out head and mounting the wafer component on a substrate; wherein each of the plurality of mounting heads simultaneously receives the wafer element sucked by each of the plurality of pickup heads.

In this mounter, as described above, since the plurality of mounting heads can simultaneously receive the wafer components respectively adsorbed by the plurality of pickup heads, the plurality of wafer components can be delivered at one time. Therefore, as compared with the case where the wafer component is delivered to the mounting head portion for each wafer component, an increase in the total time required for the delivery operation of the plurality of wafer components can be suppressed.

In the mounting machine according to the present invention, it is preferable that the arrangement interval between the plurality of pickup heads is the same as the arrangement interval between the plurality of mounting heads of the head unit at least when the wafer component is delivered from the pickup head to the head unit. According to this configuration, it is possible to easily deliver the wafer element from the plurality of taking-out heads to the plurality of mounting heads simultaneously.

In this case, it is preferable that the liquid container further include: a take-out device having the plurality of take-out heads; wherein an arrangement interval between the plurality of taking-out heads of the taking-out device is the same as an arrangement interval between the plurality of mounting heads of the head unit. With this configuration, it is possible to easily deliver the wafer elements from the plurality of taking-out heads to the plurality of mounting heads of the taking-out apparatus at the same time.

Further, in the case where the pickup head has a suction nozzle for sucking the wafer component, the pickup head inverting the wafer component sucked by the suction nozzle upward by inverting it upward, and the mounting head receives the wafer component from the pickup head by sucking the wafer component sucked by the suction nozzle and inverted upward, and in the configuration where the pickup apparatus has a plurality of pickup heads, it is preferable that the pickup apparatus has two pickup heads as the plurality of pickup heads, and has a driving device for inverting the pickup heads upward and downward, the two pickup heads being disposed adjacent to each other, and the driving device being disposed outside the two pickup heads. According to this configuration, since there is no driving device between the two taking-out heads, the interval between the two taking-out heads can be reduced accordingly, and therefore the interval between the two taking-out heads of the taking-out device and the interval between the mounting heads of the head unit can be easily made equal.

In addition, in the configuration in which the taking-out device has a plurality of taking-out heads, it is preferable that the taking-out device includes: a first extraction device having at least one extraction head and movable in a horizontal plane; a second extraction device having at least one of said extraction heads and being movable in a horizontal plane independently of said first extraction device; wherein at least one of the first and second takeout devices moves such that a distance between the takeout head of the first takeout device and the takeout head of the second takeout device becomes equal to an arrangement distance between the mounting heads of the plurality of mounting heads of the head unit when the wafer elements are delivered from the takeout head of the first takeout device and the takeout head of the second takeout device to the head unit. According to this configuration, the wafer elements of the respective take-out heads can be simultaneously delivered to the plurality of mounting heads of the head unit by using the take-out head of the first take-out apparatus and the take-out head of the second take-out apparatus which are movable independently of each other.

In the above-described configuration in which the take-out apparatus includes a plurality of take-out heads, it is preferable that the wafer holding stage is movable in a Y direction orthogonal to an X direction in which the substrate is conveyed on a horizontal plane with respect to the susceptor, the push-up apparatus is movable at least in the X direction with respect to the susceptor, and the take-out apparatus is movable at least in the X direction with respect to the susceptor. According to this configuration, even if the wafer holding stage is not moved in the X direction, the component to be taken out can be aligned with the push-up device and the take-out device by moving the push-up device and the take-out device in the X direction. Accordingly, since it is not necessary to move the wafer holding table having a relatively large planar area in the X direction, the mounting machine can be prevented from being increased in the X direction in the horizontal plane.

In the mounting machine according to the present invention, it is preferable that the wafer holding stage is movable with respect to the base in an X direction in which the substrate is conveyed and in a Y direction orthogonal to the X direction on a horizontal plane. According to this configuration, by moving the wafer holding table in the X direction and the Y direction, the wafer element to be taken out can be moved to the taking-out position between the taking-out head of the taking-out device and the pushing-up device, and the taking-out operation can be performed.

Claims

1. A mounting machine, characterized by comprising:

a base;

a wafer holding stage capable of holding a wafer element;

a push-up device having a mechanism for pushing up the wafer element held on the wafer holding stage from below;

a plurality of take-out heads for adsorbing the wafer elements pushed up by the push-up means;

a head unit having a plurality of mounting heads for receiving the wafer component from the take-out head and mounting the wafer component on a substrate; wherein,

each of the plurality of mounting heads simultaneously receives the wafer element sucked by each of the plurality of pickup heads.

2. The mounting machine according to claim 1, wherein:

the arrangement interval between the respective take-out heads of the plurality of take-out heads is the same as the arrangement interval between the respective mounting heads of the plurality of mounting heads of the head unit at least when the wafer element is delivered from the take-out head to the head unit.

3. The mounting machine according to claim 2, further comprising:

a take-out device having the plurality of take-out heads; wherein,

the arrangement interval between the respective taking-out heads of the plurality of taking-out heads of the taking-out device is the same as the arrangement interval between the respective mounting heads of the plurality of mounting heads of the head unit.

4. The mounting machine according to claim 3, wherein:

the taking-out head has a suction nozzle for sucking the wafer component, and the taking-out head turns over the wafer component sucked by the suction nozzle upwards by turning over the taking-out head upwards and downwards,

the mounting head receives the wafer component from the take-out head by sucking the wafer component sucked on the suction nozzle and turned upside down,

the taking-out device has two taking-out heads as the plurality of taking-out heads, and has a driving device for turning the taking-out heads upside down,

the two take-out heads are arranged adjacent to each other, the drive being arranged outside the two take-out heads.

5. The mounting machine according to claim 3 or 4, wherein:

the taking-out device includes: a first extraction device having at least one extraction head and movable in a horizontal plane; a second extraction device having at least one of said extraction heads and being movable in a horizontal plane independently of said first extraction device; wherein,

at least one of the first and second takeout devices is moved so that a distance between the takeout head of the first takeout device and the takeout head of the second takeout device becomes equal to an arrangement distance between the mounting heads of the plurality of mounting heads of the head unit when the wafer elements are delivered from the takeout head of the first takeout device and the takeout head of the second takeout device to the head unit.

6. The mounting machine according to claim 3 or 4, wherein:

the wafer holding stage is movable relative to the base in a Y direction orthogonal to an X direction in which the substrate is conveyed on a horizontal plane,

said push-up means being movable with respect to said base at least in said X-direction,

the take-out device is movable relative to the base at least in the X direction.

7. The mounting machine according to any one of claims 1 to 4, wherein:

the wafer holding stage is movable relative to the base in an X direction in which the substrate is conveyed and in a Y direction orthogonal to the X direction on a horizontal plane.