JP2002232195A - Surface mounter - Google Patents

Abstract

PROBLEM TO BE SOLVED: To shorten a required time for chucking and mounting components and increase mounting efficiency of components. SOLUTION: When a component is mounted by one of a plurality of mounting heads 7 mounted to a head unit 5, at least one of the other mounting heads 7 arranges a component mounting position of a board 2 and a component supplier 4 in a position which can chuck the component from the component supplier 4, and a camera 8 for recognizing components is arranged between the component supplier 4 and the component mounting position, thereby simultaneously carrying out component mounting operations and component chucking operations.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a head unit on which a plurality of mounting heads which can be moved up and down are sucked and conveyed onto a substrate by picking up electronic components. it relates the surface mounting machine for mounting to.

[0002]

2. Description of the Related Art Conventionally, a mounting head capable of adsorbing components is mounted on a movable head unit, and electronic components are adsorbed from a component supply unit having a tape feeder and the like and transferred onto a printed circuit board. 2. Description of the Related Art A surface mounter for mounting on a predetermined position such as a printed circuit board has been proposed. Also, in this type of surface mounter, to improve mounting efficiency, multiple heads are mounted on the head unit, and each head sucks components from the component supply unit simultaneously or continuously, and then the head unit is placed on the board. Is also known, in which the components of each head are sequentially mounted on each mounting position on a substrate.

[0003]

In the conventional surface mounter as described above, even when a plurality of heads are mounted on a head unit, first, each head sucks a component from a component supply unit.
After that, the head unit moves onto the board and mounts it, and after completing the mounting of each component, it must move again to the component supply unit to pick up the next component, so that the component mounting and Since the adsorption and the adsorption cannot be performed simultaneously, there is a limit to the improvement of the cycle time.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-described problems, and it is an object of the present invention to provide a surface mounter capable of greatly improving mounting efficiency as compared with a conventional surface mounter of this type. With the goal.

[0005]

SUMMARY OF THE INVENTION In order to achieve the above object, the present invention provides a head unit having a plurality of vertically movable mounting heads, which picks up an electronic component from component supply means and transports the electronic component onto a substrate. In a surface mounter that mounts the component on a substrate as the mounting head descends, the head unit can linearly reciprocate in a fixed direction,
A plurality of mounting heads are arranged in the head unit moving direction, and when at least one mounting head among the plurality of mounting heads mounted on the head unit mounts a component, at least one other mounting head is mounted. 2. A surface mounter according to claim 1, wherein said component mounting position of said board and said component supply means are arranged at positions where two mounting heads can pick up components from said component supply means.

[0006] With this configuration, it is possible to simultaneously perform component suction by one mounting head and component mounting by another mounting head, thereby improving component mounting efficiency.

Further, the component recognizing means for recognizing the component adsorbed on the mounting head may be arranged between the component supply means in the moving direction of the head unit and the component mounting position of the substrate. .

According to the above configuration, the component recognition operation can be performed while the mounting head moves from the component supply means to the component mounting position, and the component mounting efficiency is further improved.

Further, the apparatus may further include a board positioning means for moving the board on the XY plane, and the positioning of the board with respect to the mounting head at the time of component mounting may be performed by the board positioning means. ).

[0010] Further, the component supply means is configured to be movable,
Positioning with respect to the mounting head during component suction
What is necessary is just to make it the structure performed by moving a component supply means (claim 4).

[0011] In the above configuration, the component or the mounting position can be positioned by using the moving time of the mounting head of the head unit that moves linearly in a certain direction. Can be shortened.

It is preferable that a plurality of component supply means are provided with a component mounting position interposed therebetween in the moving direction of the head unit.

In the above configuration, the mounting head after component mounting can perform the component suction operation in the next step, and the component mounting efficiency is further improved.

It is preferable that the component supply means and the board at the component mounting position are arranged so as to be vertically displaced from each other and overlap in a plan view.

In the above configuration, since the component supply means and the board located at the component mounting position are arranged so as to overlap with each other, the entire apparatus can be made small.

In this case, a guide means for guiding the mounting head in the moving direction may be provided so that the mounting head moves up and down with the movement of the head unit.

Further, the mounting head may be moved up and down by using a cam at the time of picking up a component or at the time of mounting (claim 8).

In the above configuration, the elevation of the mounting head during component pick-up or component mounting can be controlled with a simple configuration.

[0019]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A surface mounter according to an embodiment of the present invention will be described below with reference to the drawings. 1 and 2 schematically show a surface mounter according to the present invention.
It should be noted that FIG.
The coordinate axes are shown.

As shown in the drawing, the surface mounter 1 is provided with a board position adjusting section 3 for adjusting the position of a printed board (hereinafter, referred to as a board) 2 at the time of mounting, and also on both sides of the board transport section 3. The components are provided with a component supply unit 4, respectively, and a head unit 5 for component mounting is provided above the board transport unit 3 and the component supply unit 4. The head unit 5 is configured to linearly reciprocate in a fixed direction (X-axis direction). The head unit 5 includes a plurality of mounting heads 7 for component suction and component mounting in the head unit moving direction. In this embodiment, as shown in FIGS. 1 and 2, twelve mounting heads 7 are provided in a line in the X-axis direction.

The arrangement of the board position adjusting section 3 and the component supply section 4 is such that the board position adjusting section 3 is located at the center of the moving range of the head unit, and the component supply sections 4 are located on both sides. The positional relationship is such that when the head 7 is mounting a component, another mounting head 7 can suck the component. In particular, in the illustrated embodiment, the board position adjustment unit 3 and the component supply unit 4 are arranged so as to be vertically displaced from each other and to overlap in a plan view in order to make the X-axis direction compact.

The specific structure of the surface mounter 1 will be described. The board position adjusting section 3 moves the board 2 to X so that the component mounting location of the board 2 corresponds to the mounting head that has reached the component mounting position. A substrate supporting frame 3a that is movable on the Y plane and supports the substrate 2;
And a driving means (not shown) for moving the X-axis in the X-axis direction and the Y-axis direction. The substrate 2 is transported by a substrate transporting means such as a conveyor (not shown), and is transferred onto the substrate support frame 3a.

The component supply unit 4 includes a plurality of rows of tape feeders 4a. The tape feeders 4a respectively store and hold small chip-shaped chip components such as ICs, transistors, and capacitors at predetermined intervals. Is drawn out from the reel, and a feed mechanism is provided at the tape feed end, so that the tape is intermittently fed as components are picked up by a head unit 5 described later.

The tape feeder 4a is configured to feed the tape in parallel with the X-axis direction (the direction in which the mounting heads are arranged), which is the moving direction of the head unit 5. The tape feeders 4a are arranged in the Y-axis direction.

Further, the component supply unit 4 is provided with a ball screw shaft 4b driven by a servo motor (not shown).
The nut part provided in the component supply part 4 is a ball screw shaft 4
b. The operation of the servomotor rotates the ball screw shaft 4b, so that the component supply unit 4 can move in the Y-axis direction. With this arrangement, the positioning of the Y-axis direction with respect to the mounting head 7 at the time of component suction is the component supply section 4 is performed by moving.

The head unit 5 is supported by a main shaft 6. The main shaft 6 has a guide member (not shown) extending in the X-axis direction and a ball screw shaft driven by an X-axis servomotor. The head unit 5 is movably held by the guide member, and a nut portion provided on the head unit 5 is screwed to the ball screw shaft. The ball screw shaft is rotated by the operation of the servomotor, and the head unit 5 moves in the X-axis direction.

Each mounting head 7 is mounted so as to be able to move up and down with respect to the frame of the head unit 5 (an elevating mechanism will be described later). At the lower end of each mounting head 7 is provided a suction nozzle for picking up a component. At the time of picking up a component, a negative pressure is supplied from a negative pressure supply means (not shown). Thus, the component is sucked and held at the tip of the suction nozzle.

In FIGS. 1 and 2, reference numeral 8 denotes a camera for recognizing a component, such as a line sensor, which is provided at a position adjacent to the component supply unit 4 above both sides of the component mounting position. That is, the camera 8 is arranged between the component supply unit 4 and the component mounting position in the moving direction of the head unit 5. As a result, after the components are adsorbed by the mounting heads 7, each adsorbed component passes above the camera 8 and is photographed before the mounting head 7 moves to the component mounting position. Note that an area sensor camera may be used as the camera 8, but the head unit 5
It is preferable to use a line sensor camera so that the picked-up components of each mounting head 7 can be continuously imaged during the movement of.

Next, the lifting mechanism of each mounting head 7 of the head unit 5 will be described. FIG. 3 is a diagram showing a schematic configuration of a lifting / lowering mechanism of the mounting head, and FIG. 4 is a diagram schematically showing an operation of the mounting head at the time of component mounting and component suction. In FIG. 3, XYZ coordinate axes are shown to clarify the directional relationship.

In the head unit 5, each mounting head 7 is held by a holding member 9 so as to be movable up and down, and is urged upward by a spring 10;
The movement range in the vertical direction (Z-axis direction) is limited by 1a and 11b. A guide portion 12 for guiding the mounting head 7 up and down is provided below the main shaft 6. On the other hand, each mounting head 7 is provided with a follower 13 that slides on the lower surface of the guide portion 12, and when the head unit 5 moves in the X-axis direction, the mounting head 7 takes on the shape below the guide portion 12. It is configured to move up and down along. The guide section 12 moves the mounting head 7 up and down in accordance with the height difference between the component supply section 4 and the board position adjusting section 3 in the X-axis direction. It has a shape protruding downward at the center in the direction.

In addition, the outer portion of the guide portion 12
The component suction position A and the component mounting position B shown in, the cam 15 for vertically moving the mounting head 7 by a predetermined stroke
Is provided. The cam 15 is driven to rotate by a nozzle lowering motor 16. On the other hand, each mounting head 7
Is provided with a cam follower 14 coaxially with the follower 13. When the head unit 5 moves in the X direction and the mounting head 7 reaches the component suction position or the component mounting position, the cam 15 is driven to rotate and the cam follower 1 is rotated.
By pressing down 4, the lower end of the mounting head 7 is lowered from the position shown in FIG. 4A to the component suction or mounting position shown in FIG. 4B.

Next, the operation of mounting components by the surface mounter 1 will be described. Note that, as will be described later, the suction, recognition, and mounting of the components are performed as a group of half of the plurality of mounting heads 7 provided in the head unit 5, and therefore, in the following description, half of the mounting heads on one side (left side) are mounted. The head 7 is the first group, and the remaining half of the mounting heads 7 are the second group.
Call a group.

In the mounting operation, first, the head unit 5 moves to one (the left side in FIG. 1) component supply unit 4 in the X direction. At the same time, the component supply unit 4 moves in the Y direction to perform positioning of the component on the mounting head 7 at the time of component suction, and is performed by the mounting heads 7 of the first group (the sixth from the end) of the head unit 5. The components are sequentially sucked. More specifically, as shown in FIG. 5A, the component supply is performed in accordance with the movement of the head unit 5 in the X direction indicated by the arrow and the first mounting head 7 to the predetermined component suction position. The unit 4 moves in the Y direction indicated by the arrow, and the tape holding the components to be sucked by the mounting head 7 is positioned below the mounting head 7. Then, the mounting head 7 is lowered by the rotation of the cam 15 to adsorb the component, and is lifted while adsorbing the component, so that the component is picked up from the component supply unit 4.

Thereafter, when the head unit 5 further moves in the X direction and the next mounting head 7 moves to the component supply unit 4, as shown in FIG. The component supply unit 4 moves so that another row of tapes holding components to be sucked is located below the mounting head 7. 5C to 5F, the same operation is sequentially performed on each of the subsequent mounting heads 7, and the components from the end of the head unit 5 to the sixth mounting head 7 are formed. Is adsorbed.

After the components are sucked by the mounting heads 7 of the first group as described above, the head unit 5
Reverses the moving direction, so that each mounting head 7 of the second group goes to the component supply unit 4 on the other side (right side in FIG. 1), and each mounting head 7 of the first group goes to the component mounting position. When the head unit 5 moves like this,
Each mounting head 7 of the first group in a state where components are sucked
Sequentially pass above the camera 8, the suction component is recognized, and the suction state is checked.

When the head unit 5 further moves in the same direction, the mounting heads 7 of the first group that have absorbed the components are gradually lowered by the guide portions 12 and the followers 13, and are most likely to be mounted on the board 2 at the component mounting position. approach. In accordance with the operation of the mounting head 7, the substrate is positioned with respect to the mounting head 7 by the substrate transport unit 3. When the mounting head 7 having picked up the component reaches the component mounting position, the mounting head 7 is further lowered by the rotation of the cam 15, and the component is mounted on the substrate 2. This mounting operation is performed successively for the six mounting heads 7 of the first group that have absorbed the components as the head unit 5 moves.

When the above mounting operation is being performed, the mounting heads 7 of the second group, which have not performed the mounting operation, have already reached the component supply unit 4 on the opposite side, and have been described above by the other mounting heads 7. The same suction operation as described above is performed. Therefore, in the head unit 5, the component mounting operation by each head in one group and the component suction operation by each head in the other group are performed simultaneously.

After the above mounting operation is completed, the head unit 5 changes its moving direction, returns to the original component supply unit 4 which has previously picked up the components, and uses the mounting heads 7 of the first group to mount the same components as described above. The suction operation is performed again. At the same time as the component suction operation, components are mounted on the board 2 by the mounting heads 7 of the second group. Thereafter, the above-described component suction and component mounting operations are repeated.

As described above, in the surface mounter 1, the head unit 5 can perform the component suction, recognition and mounting operations only by moving in the X direction, and the mounting and suction are simultaneously performed by the mounting head 7. Therefore, component mounting can be completed in a short time.

The present invention is not limited to the configuration of the above embodiment, and various modifications are possible. For example, in the above embodiment, the component supply units 4 are provided on both sides of the component mounting position, but the component supply unit 4 may be provided on only one of the component mounting positions. Further, in the above configuration, the mounting head 7 of the head unit 5 is moved up and down by the guide portion 12 and the cam 15, but the mounting head 7 may be moved up and down by a driving means such as a motor.

In the above configuration, the head unit 5 is provided with twelve mounting heads 7. However, the number of mounting heads 7 is not limited to this and can be changed as appropriate. Further, in the above configuration, the board position adjusting unit 3 movable in the X-axis direction and the Y-axis direction is provided to thereby perform the positioning of the board at the time of component mounting, but the present invention is not limited to this configuration. Instead, the positioning operation may be performed using a substrate transport conveyor.

[0042]

As described above, according to the present invention, the head unit can be linearly reciprocated in a fixed direction, and can be moved to a position where the mounting head can simultaneously perform the component suction operation and the component mounting operation. , Parts supply means,
Since the board at the component mounting position is arranged, the component mounting efficiency can be greatly increased.

If a plurality of component supply means are provided in the moving direction of the head unit, the mounting head after component mounting can perform the component suction operation in the next step, and the component mounting efficiency can be improved. Can be even higher.

Further, by arranging the component supply means and the board at the component mounting position so as to overlap with each other, the size of the entire apparatus can be reduced.

[Brief description of the drawings]

FIG. 1 is a front view showing a surface mounter according to the present invention.

FIG. 2 is a plan view showing a surface mounter according to the present invention.

FIG. 3 is a cross-sectional view illustrating a schematic configuration of an elevating mechanism of the mounting head.

FIG. 4 is a diagram schematically illustrating the elevating operation of the mounting head during component mounting and component suction.

FIG. 5 is a plan view illustrating a positional relationship between a head unit and a component supply unit during component suction.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Surface mounting machine 2 Substrate 3 Substrate position adjustment part 4 Component supply part 5 Head unit 7 Mounting head 8 Camera 12 Guide part 15 Cam

Claims (8)

[Claims] An electronic component is sucked from a component supply means by a head unit on which a plurality of mounting heads capable of moving up and down are mounted, and is conveyed onto a substrate. The component is placed on the substrate as the mounting head is lowered. In the surface mounting machine to be mounted, the head unit can linearly reciprocate in a fixed direction, a plurality of mounting heads are arranged in the moving direction of the head unit, and a plurality of mounting heads mounted on the head unit. When at least one mounting head mounts a component, the component mounting position of the substrate and the component supply position are set to a position at which the at least one other mounting head can pick up the component from the component supply means. A surface mounting machine characterized by arranging means. 2. A component recognizing means for recognizing a component sucked by the mounting head is disposed between the component supply means and a component mounting position of a substrate in a moving direction of a head unit. 2. The surface mounting machine according to 1. 3. The apparatus according to claim 1, further comprising: a board position adjusting section that allows the board to move on the XY plane, wherein the positioning of the board with respect to the mounting head during component mounting is performed by the board position adjusting section. The surface mounting machine according to claim 1 or 2. 4. The component supply means is configured to be movable,
The surface mounter according to claim 1, wherein positioning of the component mounting head with respect to the mounting head is performed by moving the component supply unit. 5. The surface mounter according to claim 1, wherein a plurality of component supply means are provided with a component mounting position interposed therebetween in a moving direction of the head unit. . 6. The device according to claim 1, wherein the component supply means and the substrate at the component mounting position are arranged so as to be vertically displaced from each other and overlap in a plan view. Surface mounting machine described in Crab. 7. The device according to claim 6, wherein a guide means for guiding a moving direction of the mounting head is provided so that the mounting head is moved up and down with movement of the head unit. Surface mounter. 8. The surface mounter according to claim 7, wherein the mounting head is moved up and down during picking up the component or mounting the component using a cam.