JP2001094293A - Device and method for mounting electronic parts - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a device and a method for mounting electronic parts which can sharply enhance the efficiency in mounting of electronic parts. SOLUTION: In an electronic parts mounting method which picks up electronic parts by means of a plurality of unit transfer heads and transfers and mounts them on a board, the arrangement pitches of the plural unit transfer heads 8A, 8B, and 8C are conformed to the arrangement pitches D1 and D2 in the supply part of electronic parts, and the plural electronic parts 11A, 11B, and 11C are picked up in one pickup action by these unit transfer heads. The arrangement pitches of these unit transfer heads are conformed to the pitches of the mounting points P1, P2, and P3 on the board, in the middle of shifting these unit transfer heads onto the board, and the electronic parts held in these unit transfer heads are mounted on the board 3 in one and the same mounting action. Hereby, the mounting efficiency of the electronic parts can be enhanced, by sharply shortening the time required for the pickup and the mounting.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting apparatus and method for mounting an electronic component on a substrate.

[0002]

2. Description of the Related Art In a mounting process of an electronic component, an electronic component is picked up from a parts feeder provided in a supply unit and is transferred and mounted on a substrate. In order to improve the mounting efficiency of electronic components, a multi-transfer head including a plurality of transfer heads has been used. This multi-transfer head reduces the reciprocating movement time of the transfer head by picking up and mounting a plurality of electronic components on the substrate in one mounting turn in which the transfer head reciprocates between the supply unit and the substrate. This improves mounting efficiency.

[0003]

However, in the conventional multi-transfer head, the arrangement pitch between the plurality of transfer heads is generally fixed. Therefore, when a plurality of electronic components are picked up at the supply unit, Only when the arrangement pitch of the transfer heads coincides with the arrangement pitch of the parts feeder, a plurality of electronic components can be picked up at the same time. Generally, it is necessary to sequentially pick up one electronic component at a time.

Also, even when electronic components are mounted on a board, the arrangement pitch of the transfer head and the arrangement pitch of the mounting points do not almost always match. Therefore, even when a plurality of electronic components are simultaneously transferred, It was necessary to sequentially mount the plurality of held electronic components one by one. in this way,
Although conventional multi-transfer heads can move multiple electronic components while holding them collectively, the pick-up operation and mounting operation must be performed separately, and it is difficult to significantly improve mounting efficiency. There was a problem.

SUMMARY OF THE INVENTION It is an object of the present invention to provide an electronic component mounting apparatus and a mounting method capable of greatly improving the mounting efficiency of electronic components.

[0006]

According to a first aspect of the present invention, an electronic component mounting apparatus picks up an electronic component from an electronic component supply unit and transfers the electronic component onto a substrate by a multi-transfer head having a plurality of unit transfer heads. An electronic component mounting apparatus, comprising: an orthogonal table for moving the multi-transfer head in an orthogonal axis direction in a horizontal plane; and a pitch for changing an arrangement pitch between the unit transfer heads in the multi-transfer head. Change means.

According to a second aspect of the present invention, there is provided an electronic component mounting apparatus for picking up an electronic component from an electronic component supply unit by a plurality of transfer heads and transferring and mounting the electronic component on a substrate. There are provided individual moving means for individually moving the transfer head along a common moving axis in a horizontal plane, and axis moving means for moving the common moving axis in a direction orthogonal to the moving axis in a horizontal plane.

An electronic component mounting method according to claim 3, wherein the electronic component is picked up from a supply section of the electronic component by a plurality of transfer heads and transferred to a substrate for mounting. Adjusting the arrangement pitch of the electronic components to be picked up to the arrangement pitch of the electronic components in the supply section, picking up a plurality of electronic components from the supply section by the transfer head by the same pickup operation, and holding the electronic components. Moving the plurality of transfer heads above the substrate, adjusting the arrangement pitch of these transfer heads to the pitch of the mounting points of the substrate, and mounting the electronic components held by these transfer heads in the same manner Mounting on a substrate by operation.

According to the present invention, the arrangement pitch of the plurality of transfer heads is made variable, a plurality of electronic components are picked up from the supply unit by the same pickup operation, and these plurality of transfer heads are moved above the substrate. By mounting the electronic components held by a plurality of transfer heads on the board in the same mounting operation, the total time required for picking up and mounting the electronic components can be significantly reduced, and the mounting efficiency of the electronic components can be improved. it can.

[0010]

(Embodiment 1) FIG. 1 is a perspective view of an electronic component mounting apparatus according to Embodiment 1 of the present invention, and FIG.
FIG. 2 is a front view of a transfer head of the electronic component mounting apparatus, and FIG.
3B is a plan view of the transfer head, and FIG. 3 is an operation explanatory diagram of the transfer head of the electronic component mounting apparatus.

First, an electronic component mounting apparatus will be described with reference to FIG. In FIG. 1, a transport path 2 is provided in the center of a base 1 in the X direction. The transport path 2 transports and positions the substrate 3. A supply unit 4 for electronic components is arranged on the front side of the transport path 2, and a large number of tape feeders 5 are arranged in the supply unit 4. The tape feeder 5 stores the electronic components held on the tape, and feeds the electronic components to a pickup position by the transfer head by feeding the tape at a pitch.

A transfer head 8 is mounted on an X-axis table 7 driven by an X-axis motor 7a. The transfer head 8 is a multiple transfer head including a plurality of unit transfer heads. The X-axis table 7 is composed of a Y-axis table 6A and a guide table
It is erected on B. The X-axis table 7 and the Y-axis table 6A constitute an orthogonal table for moving the transfer head 8 in the orthogonal axis direction. The Y-axis table 6A is driven by a Y-axis motor 6a. The transfer head 8 moves horizontally by driving the X-axis motor 7a and the Y-axis motor 6a, and picks up electronic components from the pickup position of the tape feeder 5 by each unit transfer head and mounts them on the substrate 3.

Next, the transfer head 8 will be described with reference to FIG. In FIGS. 2A and 2B, 8A, 8B,
Reference numeral 8C denotes a unit transfer head, which picks up an electronic component from a pickup position of the tape feeder 5 by a suction nozzle 8a provided at a lower end thereof. The unit transfer heads 8A, 8B, 8C are mounted on a moving block 9, and the moving block 9 is horizontally moved along a feed screw 7b of the X-axis table 7 by a nut 7c.

Here, three unit transfer heads 8A, 8B,
8C, the unit transfer head 8B located at the center is fixed to the moving block 9, and the two unit transfer heads 8A and 8C on both sides are movable in the horizontal direction. That is, the unit transfer heads 8A, 8C are connected to the moving tables 10A, 10C built in the moving block 9,
Motor 10a provided on moving tables 10A and 10C
Drives the unit transfer heads 8A and 8C relative to the unit transfer head 8B. This allows
The arrangement pitches D1 and D2 between the unit transfer heads can be changed. Therefore, moving table 1
Reference numerals 0A and 10C are pitch changing means for changing the arrangement pitch between the unit transfer heads.

Next, the mounting operation will be described with reference to FIG. FIG. 3A shows a plurality of unit transfer heads 8A and 8A.
3 shows a state in which the multi-transfer head 8 provided with B and 8C is moved onto the supply unit 4. Here, three unit transfer heads 8A, 8B, and 8 are simultaneously transferred from the tape feeder 5 containing electronic components to be picked up in the mounting turn.
In order to pick up an electronic component by C, the arrangement pitch of adjacent unit transfer heads is adjusted to the arrangement pitches D1 and D2 of the tape feeder 5.

In this state, as shown in FIG. 3B, the supply unit 4 is moved by the unit transfer heads 8A, 8B and 8C.
The three electronic components 11A, 11B, 11C are picked up from each tape feeder 5 by the same pickup operation. Next, the multi-transfer head 8 moves toward the substrate 3. In this movement process, the arrangement pitch between the unit transfer heads is adjusted to the pitch between the mounting points in the mounting turn. Thereafter, as shown in FIG. 3C, the multi-transfer head 8 moves and is positioned above the substrate 3. At this time, since the arrangement pitch between the unit transfer heads has already been adjusted to the pitches D3 and D4 between the mounting points in the moving process,
Immediately after the positioning of the multi-transfer head 8 to the mounting point, the three electronic components 11A, 11B, 11C can be mounted on the three mounting points P1, P2, P3.

As described above, in the multi-transfer head having a plurality of unit transfer heads, by changing the arrangement pitch between the unit transfer heads, the unit transfer unit can perform unit pick-up operation and mounting operation in the same mounting turn. The arrangement pitch between the transfer heads can be adjusted to the arrangement pitch of the tape feeder and the pitch between the mounting points, respectively. Accordingly, a plurality of components can be simultaneously picked up by the same pickup operation, and a plurality of components can be mounted by the same mounting operation, so that the efficiency of the mounting operation of the transfer head can be improved.

(Second Embodiment) FIGS. 4A and 4B are front views of a transfer head of an electronic component mounting apparatus according to a second embodiment of the present invention. 4A and 4B, three unit transfer heads 12A, 12B, and 12C are mounted on a feed screw 7b of the X-axis table 7 via nuts (not shown). These unit transfer heads 12A, 12B, 1
Each of the units 2C is provided with a motor 12a for moving in the X-axis direction, and can be moved along the X-direction moving axis by each unit transfer head alone. That is, the unit transfer head 12
Each of A, 12B, and 12C includes an individual moving unit that individually moves in the X-axis direction, which is a common moving axis. Then, these unit transfer heads 12A, 12B,
12C is a common movement axis (X axis) by the Y axis table 6
Move in a direction (Y direction) orthogonal to. That is, the Y-axis table 6 serves as axis moving means for moving a common moving axis in a direction orthogonal to the moving axis.

By individually controlling the motors 12a of the unit transfer heads 12A, 12B, and 12C, FIG.
Pitches D1, D of adjacent unit transfer heads shown in FIG.
2 can be set arbitrarily. Therefore, similarly to the mounting operation shown in the first embodiment, the arrangement pitch between the unit transfer heads is adjusted to the arrangement pitch of the tape feeder and the pitch between the mounting points during the pickup operation and the mounting operation in the same mounting turn, respectively. As in the first embodiment, the effect of improving the mounting efficiency can be obtained.

[0020]

According to the present invention, the arrangement pitch of a plurality of transfer heads is made variable, a plurality of electronic components are picked up from the supply unit by the same pickup operation, and these plurality of transfer heads are placed above the substrate. The electronic components held by a plurality of transfer heads are moved and mounted on the board in the same mounting operation, so the total time required for picking up and mounting electronic components is greatly reduced, and the mounting efficiency of electronic components is reduced. Can be improved.

[Brief description of the drawings]

FIG. 1 is a perspective view of an electronic component mounting apparatus according to a first embodiment of the present invention.

2A is a front view of a transfer head of the electronic component mounting apparatus according to the first embodiment of the present invention. FIG. 2B is a plan view of the transfer head according to the first embodiment of the present invention.

FIG. 3 is an operation explanatory view of a transfer head of the electronic component mounting apparatus according to the first embodiment of the present invention;

4A is a front view of a transfer head of the electronic component mounting apparatus according to the second embodiment of the present invention. FIG. 4B is a front view of a transfer head of the electronic component mounting apparatus according to the second embodiment of the present invention.

[Explanation of symbols]

 Reference Signs List 3 substrate 4 supply unit 6A Y axis table 7 X axis table 8 Transfer head 8A, 8B, 8C Unit transfer head 11A, 11B, 11C Electronic component 12A, 12B, 12C Unit transfer head

Claims (3)

[Claims] 1. An electronic component mounting apparatus for picking up an electronic component from an electronic component supply unit by a multi-transfer head having a plurality of unit transfer heads, and transferring and mounting the electronic component on a substrate. An electronic component mounting apparatus, comprising: an orthogonal table that moves the unit transfer heads in an orthogonal axis direction in a horizontal plane; and a pitch changing unit that changes an arrangement pitch between the unit transfer heads in the multi-transfer head. . 2. An electronic component mounting apparatus for picking up an electronic component from an electronic component supply unit by a plurality of transfer heads and transferring and mounting the electronic component on a substrate, wherein the plurality of transfer heads are moved in common in a horizontal plane. An electronic component mounting apparatus, comprising: individual moving means for individually moving along an axis; and axis moving means for moving the common moving axis in a direction orthogonal to the moving axis in a horizontal plane. 3. A method for mounting an electronic component, wherein the electronic component is picked up from a supply section of the electronic component by a plurality of transfer heads and transferred and mounted on a substrate, wherein an arrangement pitch of the plurality of transfer heads is set as an object to be picked up. A step of adjusting the arrangement pitch of the electronic components in the supply unit, a step of picking up a plurality of electronic components from the supply unit by the transfer head by the same pickup operation, and a plurality of transfer heads holding the electronic components. A step of moving the transfer heads above the substrate, a step of adjusting the arrangement pitch of these transfer heads to the pitch of the mounting points of the substrate, and a step of mounting the electronic components held by these transfer heads on the substrate in the same mounting operation And a method for mounting an electronic component.