WO2011160435A1

WO2011160435A1 - Group-mounting method for smt electronic components

Info

Publication number: WO2011160435A1
Application number: PCT/CN2011/001028
Authority: WO
Inventors: 王定锋; 张平
Original assignee: Wang Dingfeng; Zhang Ping
Priority date: 2010-06-21
Filing date: 2011-06-21
Publication date: 2011-12-29
Also published as: CN102291944B; CN102291944A

Abstract

A group-mounting method for mounting surface mount technology (SMT) electronic components on a circuit board in groups is provided. The method includes: making a group-mounting-nozzle according to the position spacing between the electronic components required to be mounted on the circuit board, sucking a group of electronic components synchronously using the group-mounting-nozzle, aligning the position spacing between the electronic components which are required to be mounted on the circuit board and synchronously placing the group of electronic components on the corresponding position on the circuit board. When the position spacing between the components on a tape which packages the components is the same as that between the components required to be mounted on the circuit board, the group-mounting-nozzle sucks a group of components directly from the tape synchronously. When the position spacing between the components on the tape is different from that between the components required to be mounted on the circuit board, a direction changing template is provided to make sure that the position spacing between the components on the direction changing template is the same as that between the components required to be mounted on the circuit board, and the group-mounting-nozzle sucks a group of components synchronously from the direction changing template. The group-mounting-nozzle can be used on a traditional SMT surface mounting machine. This method improves the production efficiency and reduces the cost.

Description

Method for attaching electronic components to SMT group

The invention belongs to the field of SMT welding of electronic components, and uses a set of nozzles (or group suction cups) to simultaneously suck up a set of electronic components, and simultaneously put them on the corresponding positions of the circuit board, and then put them on the circuit by reflow soldering. The method of electronic components on the board. Compared with traditional manual and mechanical components, this manual mold production mode replaces machine production, which greatly reduces investment costs and greatly improves production efficiency. Or use the stacking nozzle on the traditional SMT placement machine, which will greatly improve the efficiency of the SMT placement machine. Background technique

The traditional SMT manual component has always taken a component and placed it on the corresponding solder joint of the board, so that the one-piece pick-and-place is very inefficient. As far as the traditional SMT automatic placement machine is concerned, it is also a suction component, and then placed one by one on the corresponding solder joints of the circuit board. The invention adopts the simultaneous action to take a group of two or more components to the corresponding position of the circuit board, and simultaneously places a group of components on the corresponding solder joint position of the circuit board, thereby greatly improving the production efficiency. Summary of the invention

According to the present invention, the SMT electronic component is simultaneously sucked up with a set of electronic components by a set of nozzles (or group suction cups), and simultaneously placed on the corresponding position of the circuit board, and then placed on the circuit by reflow soldering. The method of electronic components on the board. The specific implementation scheme is: a stacking nozzle made by the positional spacing of the electronic components to be attached to the circuit board.

A. Simultaneously pick up a set of components from the carrier tape of the packaged electronic components, align the board. The position of the components to be attached is placed on the corresponding position of the board at the same time.

B. Put the carrier tape of the packaged electronic components on the orientation template in advance, and then use the group to suck

1

Confirmation The mouth picks up a set of components from the change to the stencil at the same time, aligning the position of the board to which the components are to be attached, and affixing the set of components to the corresponding position of the board at the same time. The component board is then reflow soldered to solder the component to the board.

According to the present invention, there is provided a method for attaching an electronic component to an SMT, wherein a set of electronic components are simultaneously sucked up by a stacking nozzle and simultaneously attached to a corresponding position of the circuit board, and then the electronic component is reflowed. The device is soldered to the circuit board, wherein the package nozzle having the corresponding positional spacing for accommodating the electronic components is provided according to the positional spacing of the electronic components to be attached to the circuit board.

According to an embodiment of the invention, the set of suction nozzles simultaneously sucks up a set of electronic components by means of the component carrier tape set suction.

According to an embodiment of the present invention, a set of nozzles having a corresponding positional spacing for accommodating electronic components is formed according to the positional spacing of the electronic components to be attached to the circuit board; The component fabricated by the component carries the alignment set suction frame; and the alignment hole of the alignment placement component is formed on the circuit board for the purpose of attaching the component.

According to another embodiment of the present invention, when the direction and spacing of the electronic components on the carrier tape are consistent with the direction and positional spacing of the electronic components to be attached to the circuit board, the suction nozzle is directly sucked from the carrier tape. Group components, place them and solder them to the appropriate locations on the board.

According to another embodiment of the present invention, a component carrier tape redirecting template is provided, which facilitates when the direction and spacing of components on the carrier tape are inconsistent with the direction and positional spacing of the electronic components to be attached to the circuit board. When the direction and spacing of the components on the carrier tape can be changed to be consistent with the direction and positional spacing of the electronic components to be attached to the circuit board; when the direction and spacing of the components on the carrier tape and the circuit board need to be attached with electronic components When the direction and the positional spacing are inconsistent, the component tapes of the packaged electronic components are placed on the component carrier tape changing template by the component carrier tape changing template, so that the direction and the positional spacing of the two components are consistent; The nozzle picks up a set of components from the component carrier tape to the stencil, attaches them to the corresponding positions on the board.

According to another embodiment of the invention, a positioning pin or a positioning hole is provided on the labeling nozzle. According to another embodiment of the present invention, a carrier tape for packaging an electronic component is provided with a corresponding positioning hole.

According to another embodiment of the invention, a corresponding positioning hole or locating pin is provided on the component carrier redirecting template.

According to another embodiment of the invention, corresponding positioning holes or alignment holes are provided on the circuit board.

According to another embodiment of the present invention, the number of the assembled nozzles is two or more.

According to another embodiment of the present invention, the set suction nozzle is an aspirating nozzle, or an electromagnet type nozzle, or a rubber disc type nozzle.

According to another embodiment of the invention, the vacuum suction element is evacuated by arranging the suction nozzle, and then the component is placed on the circuit board when the pressure is released.

According to another embodiment of the present invention, the nozzle arrangement of the dispensing nozzle mold is linear or curved.

According to another embodiment of the present invention, the method of picking and placing components may be manually operated or automated. DRAWINGS

Figure 1 shows two different circuit boards. A is a circuit board that directly uses the direction of the electronic components on the carrier tape when attaching electronic components. B is used when attaching electronic components. A circuit board with rearrangements on the redirecting template to change the orientation of the component.

Figure 2 illustrates the solder paste printed on the board.

Figure 3 illustrates the component assembly nozzle.

Figure 4 illustrates the fabrication of a component carrier tape assembly for packaging electronic components. Figure 5 illustrates a variable orientation stencil made.

Figure 6 illustrates a board assembly step that does not require changing the orientation of the components.

Figure 7 illustrates the board assembly step that requires changing the orientation of the components. detailed description

The present invention will now be described in more detail with respect to a specific embodiment of a method of attaching electronic components to an SMT. However, it is to be understood by those skilled in the art that these specific embodiments are merely illustrative and are not intended to limit the scope of the invention.

The "circuit board" described in the present invention includes not only a rigid printed wiring board (also referred to as "hard board" in the industry) but also a flexible printed wiring board (also sometimes referred to as "soft board" in the industry).

1. The first is the production of various molds.

a. Make a set of nozzles according to the position of the circuit board to be attached to the electronic components (as shown in Figure 3).

b. Make the component carrier with the alignment group suction frame (as shown in Figure 4).

c. Make a component carrier with a variable direction grouping template (as shown in Figure 5).

2, the patch process, the following will list the patch flow of two different boards. Figure 1 shows two different boards. A is a circuit board that directly uses the direction of the electronic components on the carrier tape when attaching electronic components. B is required for loading electronic components. A circuit board with rearrangements on the redirecting template to change the orientation of the component. a, a stacking step of a board that does not require changing the orientation of the component (for example, as shown by A in Figure 1):

Put the circuit board with solder paste (as shown in Figure 2) → use the set of suction nozzles (Figure 3), on the components of the electronic components carrying the alignment group suction frame (Figure 4), the alignment position is simultaneously sucked up A set of components is then moved to the printed circuit board of the solder paste. Align the board to the location where the components are to be attached. Place the picked up component at the same location on the board. As shown in Figure 6. A circuit board assembly step that does not require changing the orientation of the components is illustrated in FIG. 6, the steps of which include: providing a circuit board;

Printing solder paste on the circuit board;

Providing a component carrier with a set of suction cups;

Providing a set of nozzles; Using a set of suction nozzles by means of a component carrier with a set of suction cup absorbing elements; and

Group components.

b. A grouping step of a board that needs to change the direction of the component (for example, as shown by B in Figure 1):

Put the board on the solder paste (Figure 2) → Put the carrier tape of the packaged electronic components on the component tape changer template (Fig. 5), and then use the stack nozzle (Figure 3). The component carrier tape is aligned to the position on the template while picking up a set of components, and then moving to the printed circuit board of the solder paste, aligning the position of the board to which the component is to be attached, and simultaneously affixing the set of components to the circuit The corresponding position of the board. As shown in Figure 7. The board stacking steps that need to change the orientation of the components are illustrated in Figure 7, including:

Providing a circuit board;

Printing solder paste on the circuit board;

Providing a component with a variable direction grouping template;

Providing a set of nozzles;

Using a set of suction nozzles to align the template absorbing member by means of a component carrier tape; and

Group components.

3. The board with the components attached is soldered by reflow soldering to solder the components and the board together.

The present invention has been described in detail above with reference to the accompanying drawings. However, those skilled in the art should understand that the above description is only illustrative of the specific embodiments, and the scope of the invention is not limited.

Claims

Claim

1. A method for attaching electronic components to an SMT group, using a set of suction nozzles to simultaneously suck up a set of electronic components and simultaneously attaching them to corresponding positions on the circuit board, and then soldering the electronic components to the circuit through a reflow port. On the board, the grouping nozzle having the corresponding positional spacing for accommodating the electronic components is provided according to the positional spacing of the electronic components to be attached to the circuit board.

The method of attaching an electronic component to an SMT according to claim 1, wherein: the set of suction nozzles simultaneously sucks up a set of electronic components by means of the component carrier tape collimator.

The method for attaching an electronic component to an SMT according to claim 1 or 2, wherein the direction and the pitch of the electronic component on the carrier tape are the same as the direction and the positional distance of the electronic component to be attached to the circuit board. When the nozzle is directly sucked away from the carrier tape, the component is attached and attached to the corresponding position on the circuit board.

A method of attaching an electronic component to an SMT according to claim 1 or 2, wherein:

Providing a component carrier with a redirecting template, the component carrying a redirecting template can facilitate the element on the carrier when the direction and spacing of the components on the tape are inconsistent with the direction and positional spacing of the electronic components to be attached to the circuit board The orientation and spacing of the device are changed to match the direction and positional spacing of the board to which the electronic components are to be attached;

When the direction and spacing of the components on the carrier tape are inconsistent with the direction and positional spacing of the electronic components to be attached to the circuit board, the carrier tape of the packaged electronic components is placed on the component carrier tape by the component carrier tape changeable template. On the template, make the direction and position of the two consistent;

Then, the set of suction nozzles is used to simultaneously suck up a set of components from the component carrier tape to the template.

The method of attaching an electronic component to an SMT according to claim 1 or 2, wherein the positioning nozzle is provided with a positioning pin or a positioning hole.

6. The method of attaching an electronic component to an SMT according to claim 1 or 2, comprising A corresponding positioning hole is provided on the carrier tape on which the electronic component is mounted.

7. The method of attaching an electronic component to an SMT according to claim 1 or 2, wherein a corresponding positioning hole or positioning pin is disposed on the component carrier tape changing template.

8. The method of attaching an electronic component to an SMT according to claim 4, wherein a corresponding positioning hole or alignment hole is provided on the circuit board.

The method of attaching an electronic component to an SMT according to claim 1 or 2, wherein the number of the nozzles is two or more.

10. The method of attaching an electronic component to an SMT according to claim 1 or 2, wherein the set of nozzles is an aspirating nozzle, or an electromagnet type nozzle, or a rubber disc type nozzle .