JP5121621B2 - Substrate manufacturing method - Google Patents

Description

  The present invention relates to a method for manufacturing a substrate, and more particularly to a method for manufacturing a substrate that reliably supplies conductive balls to a plurality of pads on the substrate.

  For example, in a wiring board such as a BGA (Ball Grid Array) type or a flip chip type, a flux is applied to pads arranged at a predetermined interval, and then conductive balls are supplied onto the flux, and solder is applied to the pads by reflow. Bumps are formed.

  Also, in the wiring board production line, the diameter of the conductive balls and the pitch of the intervals are reduced with the miniaturization of the semiconductor chip, so that a large number of conductive balls are accurately and efficiently arranged on all pads. It is hoped that.

  As a conventional method for supplying conductive balls, for example, a mask (conductive ball supply member) having a plurality of holes arranged at the same pitch as a plurality of pads is placed on a substrate, and a large number of conductive materials are placed on the mask. A conductive ball is supplied into each hole of the mask to drop one conductive ball into each hole of the mask (see, for example, Patent Documents 1 and 2) and a suction jig with the mask attached to each hole of the mask. There is a suction mounting system (see, for example, Patent Document 3) that sucks a ball, moves a suction jig onto the substrate, and supplies a conductive ball to a pad on the substrate by releasing the suction.

  As described above, in the method using the mask, in order to increase the production efficiency, the conductive balls are collectively supplied to the plurality of wiring boards in a large substrate state before the plurality of wiring boards are separated. ing.

  Here, a manufacturing method using a conventional transfer method will be described. FIG. 1A is a plan view showing a multi-piece substrate. FIG. 1B is a plan view showing a mask corresponding to a multi-piece substrate. FIG. 1C is a longitudinal sectional view in the case where the alignment of the mask hole and the pad of the substrate coincides. FIG. 1D is a longitudinal sectional view in the case where the alignment of the mask hole and the pad of the substrate does not match.

As shown in FIG. 1A, a multi-chip substrate 10 includes a plurality of wiring substrates 20 (20 _{1 to} 20 _n ) arranged in parallel in the X direction and the Y direction, and each wiring substrate 20 has a plurality of pads. 30 (30 ₁ to 30 _n ) are arranged so as to be exposed at a constant pitch (interval) in the X direction and the Y direction. In FIG. 1A, for convenience of explanation, a boundary line is shown for clarifying the area of the wiring board 20, but such a boundary line does not actually exist.

As shown in FIG. 1B, the mask (conductive ball supply member) 40 is formed in a size larger in the X direction and the Y direction than the substrate 10, and is formed on the plurality of wiring boards 20 (20 _{1 to} 20 _n ). A plurality of conductive ball insertion holes 50 (50 ₁ to 50 _n ) having the same pitch as the plurality of pads 30 (30 ₁ to 30 _n ) are provided for each corresponding region. Further, the conductive ball insertion holes 50 (50 ₁ to 50 _n ) are provided with a slightly larger diameter than the pads 30 (30 ₁ to 30 _n ).

  The mask 40 is made of, for example, a thin metal plate having magnetism, and is transferred to a position facing the upper surface of the substrate 10 to be placed on the upper surface of the substrate 10 by adjusting the positions in the X and Y directions with respect to the substrate 10. Is done.

As shown in FIG. 1C, the mask 40 is adjusted and fixed at a position where the conductive ball insertion holes 50 (50 ₁ to 50 _n ) coincide with the pads 30 (30 ₁ to 30 _n ). As a method for fixing the mask 40, for example, when the mask 40 is formed of a magnetic material, a permanent magnet or an electromagnet is disposed on the lower surface side of the substrate 10, and the mask 40 is attracted by a magnetic force to attract the upper surface of the substrate 10. The method of fixing to is used.

Then, after adjusting the position of the mask 40 relative to the substrate 10 so that the conductive ball insertion holes 50 (50 ₁ to 50 _n ) coincide with the pads 30 (30 ₁ to 30 _n ), a large number of conductive balls 60 are supplied. Then, it is transferred to the conductive ball insertion hole 50 (50 ₁ to 50 _n ). Since the flux is applied to the surface of the pad 30 (30 ₁ to 30 _n ), the spherical conductive ball 60 inserted into the conductive ball insertion hole 50 (50 ₁ to 50 _n ) has an adhesive property. It is stuck to the flux that it has. Thereafter, reflow is performed to melt the conductive balls 60 to form solder bumps connected to the pads 30 (30 ₁ to 30 _n ).
JP 2006-005276 A JP 09-162533 A JP 2003-1000078 A

However, since the insulating layer and the conductive layer are laminated through various processes, the position of the pad 30 (30 ₁ to 30 _n ) expands and contracts in the X and Y directions in the process of performing each process. . For example, as shown in FIG. 1B, when divided into the regions A1 to A5 in which the conductive ball insertion holes 50 (50 ₁ to 50 _n ) of the mask 40 are provided, in the region A3 in the center of the mask, Since the conductive ball insertion hole 50 (50 ₁ to 50 _n ) and the pad 30 (30 ₁ to 30 _n ) coincide with each other, the conductive ball 60 can be supplied to the pad 30 (30 ₁ to 30 _n ). it can. Further, in the regions A2 and A4 located outside the region A3, the conductive ball insertion holes 50 (50 ₁ to 50 _n ) and the pads 30 (30 ₁ to 30 _n ) are slightly shifted, but the pads 30 ( Since a part of 30 ₁ to 30 _n ) coincides with the conductive ball insertion hole 50 (50 ₁ to 50 _n ), the conductive ball 60 can be supplied to the pad 30 (30 ₁ to 30 _n ). .

However, in the regions A1 and A5 provided in the vicinity of the peripheral edge of the mask 40, the conductive ball insertion holes 50 (50 ₁ to 50 _n ) and the pads 30 (30 ₁ to 30 _n ) are completely displaced. As shown in FIG. 1D, the conductive ball 60 inserted into the conductive ball insertion hole 50 (50 ₁ to 50 _n ) is mounted on the insulating layer of the substrate 10 that is off the pad 30 (30 ₁ to 30 _n ). As a result, solder bumps cannot be formed on the pads 30 (30 ₁ to 30 _n ).

As described above, in the conventional manufacturing method, the positions of the pads 30 (30 ₁ to 30 _n ) with respect to the conductive ball insertion holes 50 (50 ₁ to 50 _n ) of the mask 40 by the regions A1 to A5 on the substrate 10. In the case of large deviation, there arises a problem that an area where the conductive ball 60 cannot be supplied to the pad 30 is generated. Note that the relative positional deviation tendency between the conductive ball insertion holes 50 (50 ₁ to 50 _n ) and the pads 30 (30 ₁ to 30 _n ) in the respective regions A1 to A5 shown in FIG. Instead, the influence of the expansion and contraction of the substrate 10 is shown in an easy-to-understand manner.

  In addition, since the expansion and contraction of the substrate rarely appears uniformly, it often expands and contracts almost asymmetrically, and may expand and contract in different directions for each lot. As a countermeasure against such positional deviation of the pad 30 due to the expansion and contraction of the substrate, the mask 40 in which the conductive ball insertion hole 50 is formed at a position corresponding to the measurement result by measuring the expansion direction and expansion amount for each lot. A method of preparing However, this method is difficult to implement because different masks 40 are produced for each lot.

  In view of the above circumstances, an object of the present invention is to provide a method for manufacturing a substrate that solves the above-described problems.

From the first aspect of the present invention, the above problem is
A method for manufacturing a substrate in which bumps are formed by supplying conductive balls to a plurality of pads formed in a substrate region and then performing a reflow process,
A cutting step of cutting a multi-piece substrate having M (M is an integer) substrate regions into one or a plurality of substrate intermediates having N (N is an integer) substrate regions smaller than M; ,
A mounting step of mounting a plurality of the substrate intermediates on a table;
A detection step of detecting the position of the substrate intermediate placed on the table;
Based on the result of the position detection, a conductive ball supply member having a plurality of ball insertion holes corresponding to the pads included in the substrate intermediate is attached to the substrate intermediate so that the pads and the ball insertion holes face each other. A mounting process for mounting;
Supplying the conductive ball to the pad of the substrate intermediate through the ball insertion hole,
For each of the plurality of substrate intermediates, at least the mounting step, the mounting step, and the supplying step, wherein the substrate manufacturing method repeats,
A recess having a size capable of accommodating the substrate intermediate is formed at a position adjacent to a formation region of the ball insertion hole of the conductive ball supply member, and a frame portion of the conductive ball supply member is formed in a lattice shape. This can be solved by a method for manufacturing a substrate, which is characterized in that:

  As described above, in this manufacturing method, even if the substrate intermediate is mounted on the table with a slight shift in the mounting process, the position of the substrate intermediate is detected in the detection process, and each individual in the mounting process. A conductive ball supply member is mounted on the substrate intermediate. For this reason, it is not necessary to position and place the substrate intermediate on the table with high accuracy, and the production efficiency of the substrate can be increased.

  In addition, even if the positions of the pads change irregularly due to the expansion and contraction of the substrate, the holes of the conductive ball supply member can be easily aligned with the pads in each region. The conductive balls can be reliably supplied to all the pads of the multi-piece substrate.

  Further, when the substrate intermediate has M substrate regions, the conductive balls can be supplied to the pads of the M substrate regions all at once, thereby improving the manufacturing efficiency of the substrate. Can do. Further, since the substrate intermediate is mounted on the table, even if the substrate intermediate is thin and has low rigidity, it can be processed without being damaged.

  The best mode for carrying out the present invention will be described below with reference to the drawings.

[Reference Example 1]
FIG. 2A is a plan view schematically showing Reference Example 1 of the substrate manufacturing apparatus according to the present invention. FIG. 2B is a plan view showing a state where the individual mask is placed on the substrate on the table. FIG. 2C is a side view showing a state where the individual mask is placed on the substrate on the table. FIG. 2D is a side view showing a state in which conductive balls are supplied to the individual mask. FIG. 2E is a plan view for explaining the removal of the individual mask and the unloading of the substrate.

  As shown in FIG. 2A, the substrate manufacturing apparatus 100 includes a substrate transport path 120 through which a multi-piece substrate 110 is transported, a mask transport path 140 through which an individual mask (conductive ball supply member) 130 is transported, The apparatus includes a table 170 on which the substrate 110 is placed, a control device 180 that controls each device, a conductive ball supply device 240, a flux application device 250, a mask carry-out device 270, and a substrate carry-out device 280. The substrate 110 is in a state before a plurality of wiring substrates are separated, and the individual mask 130 is formed in a size corresponding to a region smaller than the substrate 110. In this reference example, the individual mask 130 is made of a magnetic material and has a size corresponding to the size of the wiring board.

  The substrate transport path 120 includes a substrate carry-in device 150 that carries the substrate 110, a pad detection device 160 that detects the position of the pad 112 formed on the surface of the substrate 110, and an adhesive material coating device that applies an adhesive material to the pad 112. Have In this reference example, an example in which flux 254 is used as an adhesive material will be described. Therefore, in the following description, the adhesive material coating device is also referred to as a flux coating device 250.

  The pad detection device 160 detects, for example, a large number of pad positions (XY coordinate positions) formed on the substrate 110 placed on the table 170 using an imaging device such as a CCD camera, and the substrate detection data (pads). Position information) is output to the control device 180. The control device 180 stores the substrate detection data in the storage device 190. The flux application device 250 has an ink jet head, and applies a flux to each pad exposed on the substrate 110 based on the substrate detection data.

The pads 112 of the substrate 110 are arranged at predetermined intervals for each of the substrate regions 114 _{1 to} 114 _n serving as the wiring substrates (see FIG. 2E).

  Further, the table 170 includes a vacuum generator (substrate holding unit) 172 for vacuum chucking the substrate 110 inside, and a magnetic force generator (mask holding unit) 174 for magnetic chucking the individual mask 130. When the substrate 110 is transported and placed on the table 170 by the substrate carry-in device 150, the vacuum generated by the vacuum generator 172 is introduced into the suction passage in the table 170. As a result, the substrate 110 placed on the table 170 is attracted (fixed) to the table 170.

  The mask transport path 140 includes a mask storage unit 200 in which the individual mask 130 is stored, a mask carry-in device 210 that sucks the individual masks 130 one by one from the mask storage unit 200 and carries them on the substrate 110, and the individual mask 130. And a mask hole detection device 220 that detects the position of the conductive ball insertion hole 132.

  The mask carry-in device 210 sucks the individual mask 130 stored in the mask storage unit 200 from above with a suction force using vacuum or magnetism, lifts it upward, and conveys it to the table 170. The mask hole detection device 220 detects the positions (XY coordinate positions) of a large number of conductive ball insertion holes 132 formed in the individual mask 130 in the transport process using an imaging device such as a CCD camera, and the mask holes. Detection data (mask hole position information) is output to the control device 180. The control device 180 stores the mask hole detection data in the storage device 190.

The conductive ball supply device 240 inserts a conductive ball into the conductive ball insertion hole of each individual mask 130 (130 _{1 to} 130 _n ) placed on the substrate 110 based on the mask detection data.

As shown in FIG. 2B, the mask carry-in device 210 conveys the individual mask 130 to each area on the upper surface of the substrate 110 placed on the table 170 and adjusts the position for each area of the substrate 110. At that time, the control device 180 collates the substrate detection data stored in the storage device 190 with the mask hole detection data so that the position of the pad 112 and the position of the conductive ball insertion hole 132 coincide with each other. Position adjustment control of the individual mask 130 (130 _{1 to} 130 _n ) is performed.

  As shown in FIG. 2C, the table 170 is provided with an electromagnet 230 that generates an electromagnetic force when energized from the magnetic force generator 174. The individual mask 130 whose position with respect to the region of the substrate 110 is adjusted is attracted onto the substrate 110 by the magnetic force from the electromagnet 230. The individual mask 130 is made of a soft magnetic material such as Ni or Fe so as to be attracted by magnetic force.

When the individual mask 130 is placed in a position adjusted in all regions on the substrate 110, the head 242 of the conductive ball supply device 240 is moved to the individual mask 130 (130 _{1 to} 130 _n ) as shown in FIG. 2D. The conductive ball 260 is inserted into the conductive ball insertion hole 132 of the individual mask 130 while moving above. The conductive ball 260 has a spherical body formed of a conductive material (for example, Pb, Sn, Cu, Au, Ag, W, Ni, Mo, Al, etc.) or a resin as a core, and the surface thereof is the conductive material. It is a spherical body covered with a material, and is formed to have a smaller diameter than the conductive ball insertion hole of the individual mask 130.

  The substrate 110 has a pad 112 made of a Cu layer and a solder resist 113 covering the pad 112 formed on the upper surface of an insulating layer 116 made of an insulating resin such as an epoxy resin or a polyimide resin. Further, in the substrate 110, a pad 117 made of a Cu layer and a solder resist 118 covering the pad 117 are formed on the lower surface of the insulating layer 116, and a through-hole made of a Cu layer is formed between the pads 112 and 117. The electrodes 119 are electrically connected.

  Note that the pads 112 and 117 are not limited to the Cu layer, and may be configured such that the Au layer and the Ni layer are laminated so that the Au layer is exposed on the substrate surface, or the Au layer is exposed on the substrate surface. Other plating structures such as a structure in which an Au layer, a Ni layer, a Pd layer, and a Cu layer are stacked in this order, or a structure in which an Au layer, a Pd layer, and a Ni layer are stacked in this order may be employed.

When the conductive balls 260 are inserted into all the conductive ball insertion holes 132 of the individual masks 130 (130 _{1 to} 130 _n ) placed on the substrate 110, the mask unloading device 270 removes the all individual masks 130. Thereafter, as shown in FIG. 2E, the substrate 110 is unloaded from the table 170 by the substrate unloading device 280, and the substrate 110 is reflowed. By the reflow process, the conductive ball 260 becomes a hemispherical solder bump soldered to the pad 112 of the substrate 110. In FIG. 2E, for convenience of explanation, the boundary lines indicating the boundaries of the substrate regions 114 _{1 to} 114 _n are indicated by broken lines, but such boundary lines do not actually exist.

  Here, a substrate manufacturing method using the substrate manufacturing apparatus 100 will be described with reference to FIGS. 3A to 3L. 3A to 3L are views for explaining a method for manufacturing a substrate (No. 1 to No. 12). 3A to 3L, the substrate 110 is partially illustrated, and the overall configuration of the substrate manufacturing apparatus 100 is as shown in FIGS. 2A to 2E described above.

  In FIG. 3A, a multi-piece substrate 110 is manufactured and conveyed onto the table 170 by the substrate carry-in device 150. When the substrate 110 is placed on the table 170, a vacuum is introduced into the suction passage in the table 170 by the vacuum generator 172 to hold the substrate 110 on the table 170. As described above, the substrate 110 has a plurality of pads 112 formed on the upper surface of the insulating layer 116 at predetermined intervals.

  In FIG. 3B, the position (XY coordinate position) of the pads 112 arranged on the upper surface side in one substrate region 114 of the substrate 110 placed on the table 170 is detected by the CCD camera 162 of the pad detection device 160. The pad position information detected by the CCD camera 162 is stored in the storage device 190.

In FIG. 3C, the ink jet nozzle 252 of the flux applying device 250 is moved above the pad 112 in each substrate region 114 (114 _{1 to} 114 _n ) to apply the liquid flux 254 to the surface of the pad 112. Since the flux 254 has viscosity, when the conductive ball 260 is dropped, the conductive ball 260 is bonded to the pad 112 via the flux 254.

  3D, the position (XY coordinate position) of the conductive ball insertion hole 132 is detected by the CCD camera 222 of the mask hole detection device 220 from the lower surface side of the individual mask 130 vacuum-sucked by the suction head 212 of the mask carry-in device 210. . The mask hole position information detected by the CCD camera 222 is stored in the storage device 190.

  In FIG. 3E, the suction head 212 of the mask carry-in device 210 transports the individual mask 130 to the substrate area 114, and then the pad position information and mask hole position information corresponding to the substrate area 114 stored in the storage device 190. And the movement position of the suction head 212 is adjusted so that the position of the conductive ball insertion hole 132 matches the position of the pad 112 of the substrate 110 based on the pad position information and the mask hole position information. This position adjustment control collates the pad position information stored in the storage device 190 with the mask hole position information and lowers the individual mask 130. Therefore, the position of the conductive ball insertion hole 132 in the substrate region 114 is set to the pad 112. Can be matched to the position of

  In the substrate region 114 facing the individual mask 130, the substrate region 114 expands and contracts due to heat treatment in the manufacturing process of the substrate 110, but the expansion / contraction amount in the substrate region 114 is a fraction of the expansion / contraction amount of the entire substrate 110. Therefore, all the conductive ball insertion holes 132 of the individual mask 130 can be easily aligned with all the pads 112 of the substrate region 114.

  Therefore, according to this reference example, the position of the conductive ball insertion hole 132 in the substrate region 114 can be matched with the position of the pad 112 in units of each individual mask 130, so that each pad 112 in the entire substrate 110 can be matched. The positions of the respective conductive ball insertion holes 132 are coincident with the positions. As a result, the conductive balls 260 can be accurately supplied to all the pads 112 of the substrate 110.

In FIG. 3F, when the position of the conductive ball insertion hole 132 of the individual mask 130 coincides with the position of the pad 112 of the substrate 110, the suction head 212 is lowered to place the individual mask 130 on the substrate region 114 of the substrate 110. The transfer of the individual mask 130 is performed on the entire substrate region 114 (114 _{1 to} 114 _n ) of the substrate 110.

In FIG. 3G, when the individual mask 130 (130 _{1 to} 130 _n ) whose position is adjusted with respect to the entire substrate region 114 (114 _{1 to} 114 _n ) of the substrate 110 is placed (see FIG. 2B), the magnetic force generator. The electromagnet 230 is excited by 174, and all the individual masks 130 (130 _{1 to} 130 _n ) are held by the magnetic force of the electromagnet 230. This completes mask carry-in by the mask carry-in device 210. The excitation of the electromagnet 230 by the magnetic force generator 174 may be performed before the individual mask 130 is placed.

  In FIG. 3H, the conductive ball supply device 240 moves above each individual mask 130 on the substrate 110 and inserts the conductive ball 260 into the conductive ball insertion hole 132 of each individual mask 130. The conductive ball supply device 240 has a storage chamber 242 for storing a large number of conductive balls 260, and an opening 244 for dropping the conductive balls 260 is provided in the bottom plate of the storage chamber 242. The conductive ball supply device 240 supplies the conductive ball 260 from the opening 244 to the upper surface of the individual mask 130 while horizontally moving the opening 244 in close proximity to the upper surface of the individual mask 130.

  Since the position of the conductive ball insertion hole 132 in FIG. 3E is adjusted so as to coincide with the position of the pad 112 of the substrate 110, the conductive balls 260 dropped on the upper surface of each individual mask 130 It is bonded (temporarily fixed) to the flux 254 applied to each pad 112 through the 130 conductive ball insertion holes 132.

In FIG. 3I, the energization of the electromagnet 230 by the magnetic force generator 174 is stopped, and the holding of the individual mask 130 (130 _{1 to} 130 _n ) is released. Further, the individual masks 130 are lifted one by one by the mask carry-out device 270 and removed from the substrate 110.

  In FIG. 3J, the substrate 110 is lifted and unloaded from the table 170 by the substrate carry-out device 280, and the substrate 110 is further transferred to the reflow process. The substrate 110 is heated by a reflow process, whereby the conductive balls 260 are melted to form hemispherical solder bumps 262. Therefore, the solder bump 262 is soldered to each pad 112 of the reflowed substrate 110.

  In FIG. 3K, cleaning liquid is sprayed from the cleaning nozzle 300 onto the surface of the substrate 110 to remove the flux 254 on the surface of the substrate.

  In FIG. 3L, the wiring substrate 310 is cut into pieces from the substrate 110 by cutting along a boundary line (see FIG. 2E) of each substrate region 114 of the substrate 110 by dicing or V-cutting with a dicing saw. In this reference example, each wiring board 310 corresponds to the substrate area 114 described above, and one wiring board 310 can be obtained from each board area 114.

  When an electronic component such as a semiconductor chip is mounted on the wiring board 310, the wiring board 310 may be separated into pieces after the electrodes of the electronic component are connected to the solder bumps 262. It is also possible to separate each wiring board 310 after mounting electronic components on the board 110.

Thus, the position of the individual mask 130 (130 _{1 to} 130 _n ) is adjusted and held so as to face the entire substrate region 114 (114 _{1 to} 114 _n ) of the multi-piece substrate 110, In addition to improving productivity, the solder bumps 262 can be accurately formed on each pad 112 of the substrate 110, and there is no need to manufacture a mask for each lot of the substrate 110 as in the prior art.

  In the reference example 1, the case where one wiring substrate 310 is obtained from each substrate region 114 has been described as an example. However, the present invention is not limited to this. For example, two pieces from each substrate region 114 are provided. You may make it expand the range of the board | substrate area | region 114 so that the above wiring board 310 may be obtained. In this case, the size of each side of the individual mask 130 is increased so that the area of the individual mask 130 is expanded in the X and Y directions so that the pads 112 of the plurality of wiring boards 310 can be covered with one individual mask. To do.

  In the reference example 1, the conductive ball 260 is supplied to the pad 112 exposed on the upper surface of the substrate 110. However, the upper and lower surfaces of the substrate 110 are inverted and the pad 112 is exposed on the lower surface of the substrate 110. Even in this case, it is possible to supply the conductive balls 260 by the above method.

[Reference Example 2]
FIG. 4 is a side view showing the substrate manufacturing apparatus of Reference Example 2. In FIG. 4, the same parts as those in the reference example 1 are denoted by the same reference numerals, and the description thereof is omitted. As shown in FIG. 4, the substrate manufacturing apparatus 400 of Reference Example 2 is configured to supply the conductive balls 260 to the pads 112 on the lower surface side of the substrate 110, and the conductive ball supply apparatus 410 (410 _1). ˜410 _n ), having a vacuum chuck 440 for transporting the substrate 110.

The substrate 110 is attracted by a vacuum chuck 440 having an electromagnet 230 and is transported together with the vacuum chuck 440 above the conductive ball supply device 410 (410 _{1 to} 410 _n ). The conductive ball supply devices 410 (410 _{1 to} 410 _n ) are individually arranged on the lower surface side of the substrate 110 so as to face the individual masks 130 (130 _{1 to} 130 _n ).

In addition, the conductive ball supply device 410 (410 _{1 to} 410 _n ) has a large number of conductive balls 260 stored inside a conductive ball storage box 412 having an upper opening, and the bottom of the conductive ball storage box 412 Are provided with a plurality of air injection holes 414. The plurality of air injection holes 414 are supplied with compressed air from the compressor 420 via the air pipe 430. The conductive ball supply device 410 (410 _{1 to} 410 _n ) individually discharges the conductive balls 260 stored in the conductive ball storage boxes 412 by injecting compressed air upward from the air injection holes 414. It is possible to fly toward the mask 130. As a result, the conductive ball 260 is bonded (temporarily fixed) to the flux 254 applied to the pad 112 through the conductive ball insertion hole 132.

  In this reference example, the conductive balls 260 are blown toward the individual mask 130 by the compressed air from the compressor 420. However, the present invention is not limited to this. For example, the conductive ball storage box 412 is vibrated and the vibration is caused. It is also possible to supply the conductive balls 260 to the individual mask 130 with acceleration.

  Here, the manufacturing method of the reference example 2 is demonstrated with reference to FIG. 5A-FIG. 5E. 5A to 5E are views for explaining a manufacturing method (No. 1 to No. 5) of Reference Example 2. FIG. The process of attaching the individual mask 130 to each substrate region 114 of the substrate 110 is the same as the method shown in FIGS. 3A to 3G described above, and a description thereof will be omitted.

  In FIG. 5A, a vacuum chuck 440 that is moved by the transfer device moves while the substrate 110 is attracted by vacuum and the individual mask 130 is held at each mounting position of the substrate 110 by the magnetic force of the electromagnet 230. The substrate 110 is transported with its upper and lower surfaces reversed so that the individual mask 130 is on the lower surface side.

5B, the vacuum chuck 440 stops at a position where each individual mask 130 (130 _{1 to} 130 _n ) on the lower surface side of the substrate 110 faces the conductive ball supply device 410 (410 _{1 to} 410 _n ).

5C, the vacuum chuck 440 lowers the substrate 110 to a height position close to the conductive ball supply device 410 (410 _{1 to} 410 _n ) by the lowering operation of the transfer device.

In FIG. 5D, the compressor 420 is activated to generate compressed air. Compressed air from the compressor 420 is supplied to the plurality of air injection holes 414 through the air pipe 430. As a result, the conductive balls 260 stored in the conductive ball storage boxes 412 of the conductive ball supply device 410 (410 _{1 to} 410 _n ) float by the jet of compressed air injected from the air injection holes 414, Sprayed toward the individual mask 130.

Since the individual mask 130 is adjusted so that the position of the conductive ball insertion hole 132 coincides with the position of the pad 112 of the substrate 110 in the same manner as in Reference Example 1 described above, the conductive ball supply device 410 (410 _1). ˜410 _n ), the conductive balls 260 are bonded (temporarily fixed) to the flux 254 applied to the pads 112 through the conductive ball insertion holes 132.

In FIG. 5E, the vacuum chuck 440 stops energization of the electromagnet 230 and removes the individual masks 130 from the substrate 110, and then transfers the substrate 110 to the conductive ball supply device 410 (410 _{1 to} 410) by the transfer operation of the transfer device. _n ). Thereafter, similar to FIGS. 3J to 3L of Reference Example 1 described above, the conductive balls 260 are reflowed so that the solder bumps 262 are connected to the pads 112, and the flux 254 is further washed to be connected to each wiring board 310. Tidy up.

As described above, in Reference Example 2, the position is adjusted so that the individual masks 130 (130 _{1 to} 130 _n ) face the entire substrate region 114 (114 _{1 to} 114 _n ) of the multi-piece substrate 110. By being held, productivity can be improved and solder bumps 262 can be accurately formed on each pad 112 of the substrate 110, and there is no need to manufacture a mask for each lot of the substrate 110 as in the prior art.

[Reference Example 3]
FIG. 6 is a side view showing the substrate manufacturing apparatus of Reference Example 3. In FIG. 6, the same parts as those in the reference examples 1 and 2 are denoted by the same reference numerals, and the description thereof is omitted. As shown in FIG. 6, the substrate manufacturing apparatus 500 of Reference Example 3 is configured to supply the conductive balls 260 to the pads 112 on the lower surface side of the substrate 110, and the conductive ball supply apparatus 510 (510 _1). ˜510 _n ), having a vacuum chuck 440 for transporting the substrate 110. An individual mask 130 (130 _{1 to} 130 _n ) is attached to the upper opening of the conductive ball supply device 510 (510 _{1 to} 510 _n ).
The substrate 110 is adsorbed by the vacuum chuck 440 and is transported together with the vacuum chuck 440 above the conductive ball supply device 510 (510 _{1 to} 510 _n ).

In addition, the conductive ball supply device 510 (510 _{1 to} 510 _n ) stores a large number of conductive balls 260 inside a conductive ball storage box 512 in which the individual mask 130 is mounted in the upper opening. A plurality of air injection holes 514 are provided at the bottom of the box 512. An air pipe 430 communicates with the plurality of air injection holes 514 from the compressor 420.

In the conductive ball supply device 510 (510 _{1 to} 510 _n ), the compressed balls are injected upward from the air injection holes 514, whereby the conductive balls 260 stored in the respective conductive ball storage boxes 512 are individually provided. It is bonded (temporarily fixed) to the flux 254 applied to the pad 112 through the conductive ball insertion hole 132 of the mask 130.

  Here, the manufacturing method of the reference example 3 is demonstrated with reference to FIG. 7A-FIG. 7E. 7A to 7E are views for explaining a manufacturing method (No. 1 to No. 5) of Reference Example 3. FIG.

  In FIG. 7A, the vacuum chuck 440 moved by the transfer device moves while adsorbing the substrate 110. The substrate 110 is not attached with the individual mask 130 and is conveyed with its upper and lower surfaces reversed so that the pad 112 is on the lower surface side.

7B, the vacuum chuck 440, the conductive balls on the lower surface side pads 112 of the conductive ball supplying device _{510 (510} 1 _{~510 n)} separately provided on the mask ₁₃₀ of the substrate 110 (130 1 ~130 _n) The position is adjusted so as to coincide with the insertion hole 132 and stops. The position adjustment between the conductive ball insertion hole 132 and the pad 112 is performed by detecting the position of the pad 112 (XY coordinate position) by the CCD camera 162 of the pad detection device 160 as in the case of the reference example 1 described above. The position (XY coordinate position) of the conductive ball insertion hole 132 is detected by the CCD camera 222 of the mask hole detection device 220. The pad position information and mask hole position information detected by the CCD cameras 162 and 222 are stored in the storage device 190. By collating the pad position information and the mask hole position information, it is possible to adjust the position so that each conductive ball insertion hole 132 of each individual mask 130 (130 _{1 to} 130 _n ) and each pad 112 coincide. Become.

In FIG. 7C, the vacuum chuck 440 moves the lower surface of the substrate 110 to a height position close to the individual mask 130 (130 _{1 to} 130 _n ) of the conductive ball supply device 510 (510 _{1 to} 510 _n ) by the lowering operation of the transfer device. Lower.

In FIG. 7D, the compressed air generated by the compressor 420 is supplied to the plurality of air injection holes 514 through the air pipe 430. Thereby, the conductive ball 260 accommodated in each conductive ball storage box 512 of the conductive ball supply device 510 (510 _{1 to} 510 _n ) floats by the jet of compressed air injected from the air injection hole 514, It passes through each conductive ball insertion hole 132 of the individual mask 130 and is sprayed toward each pad 112 of the substrate 110.

In the individual mask 130 mounted on the conductive ball supply device 510 (510 _{1 to} 510 _n ), the position of the conductive ball insertion hole 132 coincides with the position of the pad 112 of the substrate 110, as in Reference Example 1 described above. Therefore, the conductive ball 260 blown from the conductive ball supply device 510 (510 _{1 to} 510 _n ) passes through the conductive ball insertion hole 132 to the flux 254 applied to the pad 112. Bonded (temporarily fixed).

In FIG. 7E, the vacuum chuck 440 separates the substrate 110 from the conductive ball supply device 510 (510 _{1 to} 510 _n ) by the transfer operation of the transfer device. Thereafter, similar to FIGS. 3J to 3L of Reference Example 1 described above, the conductive balls 260 are reflowed so that the solder bumps 262 are connected to the pads 112, and the flux 254 is further washed to be connected to each wiring board 310. Tidy up.

In the present embodiment, since the conductive ball supplying device _{510 (510} 1 _{~510 n)} to the individual mask _{130 (130} 1 _{~130 n)} is attached, the step of removing the individual mask _{130 (130} 1 _{~130 n)} Can be omitted.

Thus, in the reference example 3, the position is adjusted so that the individual masks 130 (130 _{1 to} 130 _n ) face the entire substrate region 114 (114 _{1 to} 114 _n ) of the multi-piece substrate 110. By being held, productivity can be improved and solder bumps 262 can be accurately formed on each pad 112 of the substrate 110, and there is no need to manufacture a mask for each lot of the substrate 110 as in the prior art.

[Reference Example 4]
FIG. 8 is a side view showing the substrate manufacturing apparatus of Reference Example 4. In FIG. 8, the same parts as those in the reference examples 1 to 3 are denoted by the same reference numerals and the description thereof is omitted. As shown in FIG. 8, the substrate manufacturing apparatus 600 of Reference Example 4 transfers the conductive ball 260 to the pad 112 of the substrate 110 placed on the table 170 by the conductive ball transfer device 610. It is configured.

  The conductive ball transfer device 610 has a plurality of individual suction heads (conductive ball supply members) 630 for sucking the conductive balls 260 on the lower surface of the moving base 620. The moving base 620 includes a vacuum generator 640 for vacuum-sucking the conductive balls 260 and a magnetic force generator 650 for magnetically attracting the suction head 630.

  Each individual suction head 630 is disposed to face each substrate region 114 of the substrate 110, and a plurality of suction holes 632 for sucking the conductive balls 260 are provided therein. The plurality of suction holes 632 are arranged at intervals corresponding to the pads 112 of the substrate 110.

  Furthermore, the position of each individual suction head 630 is adjusted so that the position of each suction hole 632 matches the position of the pad 112 in each area of the substrate 110. When the position adjustment of each individual suction head 630 is completed, each individual suction head 630 is fixed to the moving base 620 by the magnetic force generated by the magnetic force generator 650.

  As described above, the vacuum generated by the vacuum generator 640 is introduced into the suction holes 632 of the individual suction heads 630 while the positions of the individual suction heads 630 are adjusted so as to correspond to the pads 112, and the suction holes 632 are electrically conductive. The sex balls 260 are adsorbed. In addition, since the opening of the suction hole 632 is smaller than the diameter of the conductive ball 260, the conductive ball 260 is attracted to the lower surface of each individual suction head 630 at the same interval as the pad 112.

  The conductive ball transport device 610 transports the plurality of conductive balls 260 sucked on the lower surface of each individual suction head 630 onto the substrate 110 placed on the table 170, and performs a descending operation to perform a plurality of conductivity. The balls 260 are collectively supplied to all the pads 112 of the substrate 110. When the conductive ball 260 is bonded (temporarily fixed) to the flux 254 applied to each pad 112, the vacuum generator 640 is stopped to stop the suction of the conductive ball 260, and then the moving base 620 is raised.

  Thus, the conductive balls 260 are supplied to all the pads 112 of the substrate 110. Thereafter, the substrate 110 is reflowed so that the solder bumps 262 are connected to the pads 112, the flux is washed, and then separated into individual wiring substrates 310.

  In Reference Example 4, the position of each individual suction head 630 is adjusted for each substrate region 114 instead of the individual mask 130 so that the position of the suction hole 632 of each individual suction head 630 and the position of each pad 112 of the substrate 110 are adjusted. Can be easily matched.

As described above, in the reference example 4, the position is adjusted so that the individual suction heads 630 face the entire substrate region 114 (114 _{1 to} 114 _n ) of the multi-piece substrate 110, thereby improving productivity. In addition, the solder bumps 262 can be accurately formed on each pad 112 of the substrate 110, and it is not necessary to manufacture a mask for each lot of the substrate 110 as in the prior art.

[Reference Example 5]
FIG. 9 is a side view showing the substrate manufacturing apparatus of Reference Example 5. In FIG. 9, the same parts as those in the reference examples 1 to 4 are denoted by the same reference numerals and the description thereof is omitted. As shown in FIG. 9, the substrate manufacturing apparatus 700 of Reference Example 5 is configured to supply the conductive balls 260 to the pads 112 on the upper surface side of the substrate 110, and includes a conductive ball supply apparatus 710. The individual mask 130 is held in the lower opening of the conductive ball supply device 710.

  The table 170 is provided with a vacuum generator (not shown) for vacuum-sucking the substrate 110 inside. When the substrate 110 is transported and placed on the table 170 by the substrate carry-in device 150 (see FIG. 2A), the vacuum generated by the vacuum generator is introduced into the adsorption passage in the table 170. As a result, the substrate 110 placed on the table 170 is attracted (fixed) to the table 170.

  The conductive ball supply device 710 is configured to be movable in the X, Y direction (horizontal direction) and Z direction (vertical direction) on the upper portion of the multi-piece substrate 110 by a moving device (not shown). The conductive ball supply device 710 includes a head 242, a ball storage unit 274, an individual mask 130, and the like.

  The head 242 has an individual mask 130 attached to the lower opening. That is, in this reference example, the individual mask 130 is held by the conductive ball supply device 710. A ball collection path 282 is connected to a position slightly above the holding position of the individual mask 130 of the head 242. Further, a ball storage portion 274 that stores the conductive ball 260 is provided inside the head 242.

  The ball storage portion 274 has a function of storing the conductive ball 260 therein. An opening 275 is formed on the upper surface of the ball storage portion 274. A plurality of air injection holes 714 are provided on the side surface of the ball storage portion 274. The air injection hole 714 is connected to a compressor 420 (similar to that shown in FIG. 4). Therefore, the compressed air generated by the compressor 420 is jetted from the air jet hole 714 into the ball storage portion 274.

  Further, a sieve 278 is provided between the upper surface of the ball storage portion 274 where the opening 275 is formed and the position where the air injection hole 714 is disposed. The sieve 278 has a plurality of sieve holes 279 formed therein. The diameter of the sieving hole 279 is set to be slightly larger than the diameter of the conductive ball 260 so that the conductive ball 260 can pass (so that it can be screened off). As described above, since the sieve hole 279 is a hole having a diameter slightly larger than the diameter of the conductive ball 260, when a large number of conductive balls 260 are stored in the upper part of the screen 278 of the ball storage unit 274, FIG. As shown in FIG. 9, the conductive ball 260 does not immediately pass through the sieve hole 279 and is stored in the ball storage portion 274.

  The ball storage unit 274 is connected to the vibration generator 722. The vibration generator 722 is activated to vibrate the ball storage portion 274. Therefore, the conductive ball 260 stored in the upper part of the sieve 278 of the ball storage unit 274 moves in the ball storage unit 274 by the vibration generator 722. When the conductive ball 260 enters the formation position of the sieve hole 279 along with this movement, the conductive ball 260 passes through the sieve hole 279 and falls toward the individual mask 130.

  The conductive ball 260 dropped on the individual mask 130 passes through the conductive ball insertion hole 132 of the individual mask 130 and is bonded (temporarily fixed) to the flux 254 applied to the pad 112. At this time, in this reference example, not all the conductive balls 260 stored in the ball storage portion 274 are supplied to the individual mask 130 at the same time, but first, the conductive balls 260 are vibrated in the ball storage portion 274 to thereby sieve 278. Remove from sieve. Then, the conductive ball 260 that has been sieved off passes through the conductive ball insertion hole 132 and is bonded (temporarily fixed) to the flux 254 on the pad 112. Therefore, the conductive ball 260 is smoothly inserted into the conductive ball insertion hole 132, and insertion efficiency and insertion reliability can be improved.

  On the other hand, a ball return path 284 is connected to a position facing the opening 275 of the head 242. The ball return path 284 is connected to the ball collection device 720. The ball collection device 720 is a device that collects the conductive balls 260 that have dropped to the lower portion of the ball storage portion 274 and that did not adhere to the flux 254.

  Specifically, the ball collection device 720 first collects the conductive balls 260 remaining in the lower part of the ball storage unit 274 by sucking them through the ball collection path 282. Subsequently, the ball collection device 720 discharges the collected conductive balls 260 together with the compressed air toward the ball return path 284. The end of the ball return path 284 opens toward an opening 275 formed in the ball storage portion 274. Therefore, the conductive ball 260 delivered from the ball collection device 720 is stored again in the upper position of the sieve 278 of the ball storage unit 274. The moving device that moves the ball collection device 720, the vibration generation device 722, and the conductive ball supply device 710 is driven and controlled by the control device 180 (see FIG. 2A).

  Here, the manufacturing method of the reference example 5 is demonstrated with reference to FIG. 9, FIG. 10A-FIG. 10C. 9 and 10A to 10C are diagrams for explaining the manufacturing method (No. 1 to No. 4) of Reference Example 5. FIG.

  The processing described above with reference to FIGS. 3A to 3C is similarly performed in the book. That is, the multi-piece substrate 110 created in a separate process is transported and placed on the table 170 by the substrate carry-in device 150. Then, a vacuum is introduced into the suction passage in the table 170 by the vacuum generator 172, whereby the substrate 110 is held on the table 170.

  When the substrate 110 is placed on the table 170, the position of the pad 112 arranged on the upper surface side of the one substrate region 114 is detected by a CCD camera or the like. Further, the position of the conductive ball insertion hole 132 of the individual mask 130 provided in the lower opening of the conductive ball supply device 710 is also detected by a CCD camera or the like. Further, a flux 254 is previously disposed on the pad 112 provided on the substrate 110 using an inkjet nozzle.

  When the flux 254 is disposed on the pad 112 as described above, the moving device is activated, and the conductive ball supply device 710 is directed toward the one substrate region 114 where the conductive ball 260 of the substrate 110 is to be disposed. Move horizontally. When the conductive ball insertion hole 132 formed in the individual mask 130 held under the head 242 moves to a position where the pad 112 of the substrate 110 coincides, the moving device moves the conductive ball supply device 710. Stop.

  The position adjustment between the conductive ball insertion hole 132 and the pad 112 is performed in the same manner as in each of the reference examples described above, with information obtained by detecting the position of the pad 112 (XY coordinate position) by the CCD camera 162 of the pad detection device 160. The position (XY coordinate position) of the conductive ball insertion hole 132 can be determined based on information detected by the CCD camera 222 of the mask hole detection device 220.

  As described above, when the conductive ball supply device 710 moves to a position where the conductive ball insertion hole 132 and the pad 112 coincide with each other, the moving device subsequently moves the conductive ball supply device to a position where the individual mask 130 is close to the substrate 110. 710 is lowered toward the substrate 110. At this time, the conductive ball supply device 710 is lowered (vertically moved) to a position where the flux 254 of the substrate 110 does not adhere to the individual mask 130. FIG. 9 shows a state where the conductive ball supply device 710 is lowered to the predetermined position. It should be noted that while the conductive ball supply device 710 is moving, the ball collection device 720, the vibration generator 722, and the compressor 420 are stopped.

  When the conductive ball supply device 710 as described above is positioned on the substrate 110, the vibration generator 722 is subsequently activated. When the vibration generator 722 is activated, the ball storage portion 274 vibrates (at this time, the head 242 is configured not to vibrate). Accordingly, the sieve 278 also vibrates with the vibration of the ball storage portion 274, and only the conductive balls 260 that have been sieved off from the sieve 278 fall toward the individual mask 130. The conductive balls 260 dropped on the individual mask 130 pass through the conductive ball insertion holes 132 of the individual mask 130 and are bonded (temporarily fixed) to the flux 254 applied to the pad 112.

  At this time, in this reference example, not all the conductive balls 260 stored in the ball storage portion 274 are supplied to the individual mask 130 at the same time, but the conductive balls 260 that have been screened off from the screen 278 are the upper portions of the individual mask 130. In addition, only the conductive ball 260 that has passed through the conductive ball insertion hole 132 of the individual mask 130 is bonded (temporarily fixed) to the flux 254 on the pad 112. With this configuration, the conductive ball 260 can be smoothly inserted into the conductive ball insertion hole 132, and the insertion efficiency and insertion reliability can be improved.

  That is, when all the conductive balls 260 are collectively supplied to the individual mask 130 as in the prior art, the conductive balls 260 positioned at the lower portion are smooth due to the weight of the conductive balls 260 stacked on the upper portion. The phenomenon that the movement is hindered and the conductive ball 260 is not smoothly introduced into the conductive ball insertion hole 132 occurs. However, by gradually supplying the conductive balls 260 to the individual mask 130, the movement of the conductive balls 260 on the individual mask 130 can be allowed, and therefore, the insertion efficiency and the insertion reliability can be improved.

  FIG. 10A shows a state in which the ball storage portion 274 vibrates, and as a result, the conductive balls 260 are supplied to all the pads 112 in one substrate region 114 through the conductive ball insertion holes 132 of the individual mask 130. Yes. It should be noted that a predetermined time is required until the conductive balls 260 are supplied to all the pads 112, and the ball storage portion 274 is maintained to vibrate during this time. And a plurality of conductive balls 260 that have not been supplied to the pad 112 remain.

  When the supply of the conductive balls 260 to all the pads 112 is completed as described above, the vibration generating device 722 stops the vibration of the ball storage portion 274 and collects the conductive balls 260 remaining on the upper portion of the individual mask 130. Processing is performed. In this recovery process, the compressed air generated by the compressor 420 is supplied into the ball storage portion 274 via the air injection hole 714.

  At the same time, the ball collection device 720 collects the conductive balls 260 remaining under the ball storage portion 274 by sucking them through the ball collection path 282. FIG. 10B shows a state in which the conductive balls 260 remaining on the individual mask 130 are collected from the ball collection path 282. During the collection process of the conductive ball 260, since the compressed air is discharged from the air injection hole 714, the conductive ball 260 is smoothly introduced into the ball collection path 282. The ball 260 does not remain.

  The conductive balls 260 collected by the ball collection device 720 are discharged toward the ball return path 284 together with the compressed air. As described above, since the end of the ball return path 284 opens toward the opening 275 formed in the ball storage portion 274, the conductive ball 260 delivered from the ball collection device 720 is not in the ball storage portion 274. It is stored again in the upper position of the sieve 278.

When all the conductive balls 260 remaining on the individual mask 130 are returned to the ball storage portion 274, the moving device of the conductive ball supply device 710 is activated, and first, as shown in FIG. 710 is raised away from the substrate 110. Subsequently, the moving device moves the conductive ball supply device 710 to a substrate region where the conductive ball 260 is not disposed (for example, a substrate region indicated by 114 _n in FIG. 10C). And the process which adhere | attaches the conductive ball 260 similar to the above to the flux 254 on the pad 112 is repeatedly implemented.

When the supply process of the conductive balls 260 to all the substrate regions 114 (114 _{1 to} 114 _n ) on the substrate 110 is completed, the conductive balls 260 are reflowed to form solder bumps 262 on the pads 112, and further, flux 254 is applied. Wash and separate into individual wiring boards 310.

  In this reference example, the individual mask 130 is attached to the conductive ball supply device 710, and the conductive ball 260 is supplied to a predetermined substrate region 114 on the substrate 110 by moving the conductive ball supply device 710. Therefore, it is not necessary to prepare a large number of individual masks 130 and conductive ball supply devices, and the cost of manufacturing equipment can be reduced.

[Reference Example 6]
11A and 11B are diagrams for explaining a substrate manufacturing apparatus according to Reference Example 6 of the present invention. In FIG. 11A and FIG. 11B, the same parts as those in Reference Examples 1 to 5 are denoted by the same reference numerals, and the description thereof is omitted. Further, in this reference example, since the individual mask 730 which is a conductive ball supply member has a feature, for convenience of explanation and illustration, only the substrate 110 and the individual mask 730 are shown in each drawing, and other configurations are shown and explained. Shall be omitted.

  The area of the individual mask 730 used in the substrate manufacturing apparatus according to this reference example is set larger than the area of one substrate region 114 formed on the substrate 110. The individual mask 730 has a configuration in which a plurality of frames 734 are combined in a lattice shape, and has a configuration in which a ball supply portion 731 having a conductive ball insertion hole 132 formed at the center is provided. In this manner, a plurality of openings 732 are formed in the individual mask 730 by combining the plurality of frames 734 in a lattice shape.

The shape and size of the opening 732 are configured to be the same as the shape and size of each one substrate region 114 (substrate regions 114 _{1 to} 114 _n ) provided in the substrate 110. Therefore, when the ball supply unit 731 is positioned on the substrate region 114 where the conductive ball 260 of the substrate 110 is to be supplied, the other substrate region 114 is opposed to the opening 732.

  Here, a specific method of supplying the conductive ball 260 to the substrate 110 using the individual mask 730 having the opening 732 in a portion adjacent to the ball supply unit 731 will be described mainly using FIG. 11B. In the following description, in each drawing, the opening 732 positioned on the left side of the ball supply unit 731 in the drawing is particularly referred to as an opening 732A, and the opening 732 positioned on the right is referred to as an opening 732B.

In order to supply the conductive balls 260 to the substrate 110, first, the ball supply unit 731 provided in the individual mask 730 and the substrate region 114n _-1 from which the conductive balls 260 are to be supplied are positioned. When this positioning process is completed, the positions of the ball supply unit 731 and the substrate region 114 _n-1 are maintained, and the individual mask 730 is brought into contact with the substrate 110 or lowered to a position having a predetermined separation distance.

  FIG. 11B shows a state where the individual mask 730 is in contact with the substrate 110. A flux 254 is applied to the pads 112 of the substrate 110 in advance.

11B, in a state where the individual mask 730 is positioned and disposed on the substrate 110, the conductive ball insertion hole 132 of the ball supply unit 731 is a pad formed in the substrate region 114 _n-1 of the substrate 110. 112 is in a state of facing. Therefore, by supplying the conductive ball 260 from the conductive ball insertion hole 132 in this positioned state, the conductive ball 260 is bonded to the pad 112 via the flux 254.

At this time, in a state where the individual mask 730 is positioned on the substrate 110, the substrate region 114 _n-2 of the substrate 110 faces the opening 732A of the individual mask 730, and the substrate region 114 _n faces the opening 732B. It has become. In this reference example, the substrate region 114 _n-2 is a region where the flux 254 is applied to the pad 112, and the substrate region 114 _n is a region _where the conductive ball 260 is already bonded to the pad 112. Therefore, the opening 732A of the individual mask 730 functions as an opening for the applied flux 254 to escape, and the opening 732B functions as an opening for the supplied conductive ball 260 to escape.

Therefore, it is possible to prevent the individual mask 730 from coming into contact with the pads 112 or the supplied conductive balls 260 when the conductive balls 260 are supplied (mounted) to the substrate region 114 _n-1 .

As described above, when the supply process of the conductive balls 260 to the substrate region 114 _n−1 is completed, the individual mask 730 is lifted away from the substrate 110. Subsequently, the individual mask 730 moves to the upper part of the substrate region 114 _n-2 (the substrate region from which the conductive ball 260 is to be supplied), which is a region where the conductive ball 260 is not supplied, and this substrate region 114 _{n. -2} and the ball supply unit 731 are positioned.

Thereafter, the conductive ball 260 is supplied to all the substrate regions 114 _{1 to} 114 _n by repeatedly performing the same process as described above. Thus, by supplying the conductive balls 260 to the substrate 110 using the method according to this reference example, the conductive balls 260 can be stably supplied to the substrate 110.

[Reference Example 7]
12A to 12C are diagrams for explaining a substrate manufacturing apparatus according to Reference Example 7 of the present invention. In FIGS. 12A to 12C, the same parts as those in the reference example are given the same reference numerals, and the description thereof is omitted. Further, since this reference example also has a feature in the individual mask 830 which is a conductive ball supply member, for convenience of explanation and illustration, only the substrate 110 and the individual mask 830 are shown in each drawing, and the other configurations are shown and explained. Shall be omitted.

  The individual mask 730 according to Reference Example 6 described above forms the opening 732 (732A, 732B) at least at a position adjacent to the ball mounting portion 731 by combining the frames 734 in a lattice shape, and this is formed with the flux 254 and the conductive balls. Used as 260 escape. On the other hand, in this reference example, a plurality of recesses 832 are formed in the individual mask 830 so that the same function as the individual mask 730 according to the reference example 6 is achieved.

12A shows a state before the individual mask 830 is mounted on the substrate 110, and FIG. 12B shows a state where the individual mask 830 is mounted on the substrate 110. The shape and size of the concave portion 832 formed in the individual mask 830 are configured to be the same as the shape and size of each one substrate region 114 (substrate regions 114 _{1 to} 114 _n ) provided in the substrate 110. . Accordingly, when the ball supply unit 731 is positioned on the substrate region 114 where the conductive balls 260 of the substrate 110 are to be supplied, the other substrate regions 114 face the corresponding concave portions 832 of the individual mask 830.

  Here, a specific method of supplying the conductive balls 260 to the substrate 110 using the individual mask 830 having the above configuration will be described mainly using FIG. 12C. In the following description, in each drawing, the concave portion 832 located on the left side of the ball supply unit 731 in the drawing is particularly indicated as a concave portion 832A, and the concave portion 832 located on the right side is indicated as a concave portion 832B.

In order to supply the conductive ball 260 to the substrate 110, first, the ball supply unit 731 provided in the individual mask 830 and the substrate region 114n _-1 from which the conductive ball 260 is to be supplied are positioned. When this positioning process is completed, the position of the ball supply unit 731 and the substrate region 114 _n-1 is maintained, and then the individual mask 830 is brought into contact with the substrate 110 or lowered to a position having a predetermined separation distance.

  FIG. 12C shows a state where the individual mask 830 is in contact with the substrate 110. A flux 254 is applied to the pads 112 of the substrate 110 in advance.

As shown in FIG. 12C, in a state where the individual mask 830 is positioned and disposed on the substrate 110, the conductive ball insertion hole 132 of the ball supply unit 731 is a pad formed in the substrate region 114 _n-1 of the substrate 110. 112 is in a state of facing. Therefore, by supplying the conductive ball 260 from the conductive ball insertion hole 132 in this positioned state, the conductive ball 260 is bonded to the pad 112 via the flux 254.

At this time, in a state where the individual mask 830 is positioned on the substrate 110, the substrate region 114 _n-2 of the substrate 110 faces the recess 832A of the individual mask 830, and the substrate region 114 _n faces the recess 832B. ing. In this reference example, the substrate region 114 _n-2 is a region where the flux 254 is applied to the pad 112, and the substrate region 114 _n is a region _where the conductive ball 260 is already bonded to the pad 112. Therefore, the concave portion 832A of the individual mask 830 functions as a relief portion for protecting the applied flux 254, and the concave portion 832B functions as a relief portion for protecting the supplied conductive ball 260.

As described above, when the supply process of the conductive balls 260 to the substrate region 114 _n−1 is completed, the individual mask 830 is lifted away from the substrate 110. Subsequently, the individual mask 830 moves to the upper part of the substrate region 114 _n-2 (the substrate region from which the conductive ball 260 is to be supplied), which is a region where the conductive ball 260 is not supplied, and this substrate region 114 _{n. -2} and the ball supply unit 731 are positioned.

Thereafter, the conductive ball 260 is supplied to all the substrate regions 114 _{1 to} 114 _n by repeatedly performing the same process as described above. By performing the supply process of the conductive ball 260 using the individual mask 830 according to the present embodiment, substrate region 114 flux 254 is coated _n-2, and the substrate region 114 in which the conductive ball 260 is adhered already _n Is covered with a recess 832 constituting the individual mask 830.

Thereby, it is possible to prevent the individual mask 830 from coming into contact with the pads 112 or the supplied conductive balls 260 when the conductive balls 260 are supplied (mounted) to the substrate region 114 _n−1 .

Also, as shown in FIG. 12C, in this reference example, unlike the reference example 6, the substrate regions 114 _n-2 and 114 _n of the substrate 110 are completely covered with the individual mask 830 without being exposed. For this reason, the flux 254 and the conductive ball 260 can be more reliably protected, and higher reliability can be realized.

[Reference Example 8]
FIG. 13 is a diagram for explaining a substrate manufacturing apparatus according to Reference Example 8 of the present invention. In FIG. 13, the same parts as those in the above-mentioned reference are denoted by the same reference numerals, and the description thereof is omitted. Further, since this reference example also has a feature in the individual mask 930 that is a conductive ball supply member, for convenience of explanation and illustration, only the substrate 110 and the individual mask 930 are shown in each drawing, and the other configurations are shown and explained. Shall be omitted.

  In the reference example described above, the individual masks 130, 730, and 830 are used to supply the conductive balls 260 to the substrate 110. On the other hand, this reference example is characterized in that the individual mask 930 is used as a screen plate and the cream solder 840 is screen-printed on the pad 112 using a squeegee 842.

  The basic configuration of the individual mask 930 is the same as that of the individual mask 830 shown in Reference Example 7. However, since the squeegee 842 moves while pressing the upper surface, a reinforcing column 934 is provided in the recess 932 (932A, 932B), and the column 934 is configured to abut against the substrate 110. . Thereby, the strength of the individual mask 930 can be increased, and even if the squeegee 842 moves on the upper surface, the individual mask 930 can be prevented from being deformed or damaged.

  14 to 17 are views for explaining a substrate manufacturing apparatus according to a first embodiment (referred to as Embodiment 1) of the present invention. 14 to 17, the same parts as those in the reference example are given the same reference numerals, and the description thereof is omitted. In addition, since the first embodiment has a feature in the method of supplying the conductive balls 260, for convenience of explanation and illustration, only the substrate 1010 and the individual mask 1130 are shown in each figure, and illustration and explanation of other configurations are omitted. It shall be.

In the substrate manufacturing method according to each of the reference examples described above, the substrate 110 in a state before being singulated, in which a plurality of substrate regions 114 are formed, was used as a substrate for supplying the conductive balls 260. On the other hand, this embodiment is characterized in that the substrate 1010 is cut in advance and separated into pieces before the step of supplying the conductive balls 260 is performed.

  Hereinafter, a specific procedure of the substrate manufacturing method according to the present embodiment will be described. In the following description, the supply process of the conductive ball 260 which is a main part of the present invention will be mainly described.

  In the method for manufacturing a substrate according to the present invention, before performing the process of supplying the conductive balls 260 as described above, a cutting process for separating the substrate 1010 is performed (cutting process).

  FIG. 14 shows a substrate 1010 used in this embodiment. The substrate 1010 is five vertically and five horizontally, and a total of 25 substrate regions 1020 (corresponding to M in the claims) are formed. In this embodiment, the substrate 1010 is cut into 25 pieces (M pieces). Hereinafter, each substrate region 1020 obtained by cutting the substrate 1010 in this way is referred to as a substrate intermediate 1030A.

  When the substrate intermediate 1030A is formed as described above, a table 1050 is prepared and the substrate intermediate 1030A is placed on the table 1050 as shown in FIG. The table 1050 functions as a base in the supply process of the conductive balls 260 described later, and the surface thereof is a flat surface.

  The substrate intermediate 1030A is placed on the table 1050 in a grid (mounting process). At this time, it is not necessary to position and mount the substrate intermediate 1030A with high accuracy, and the substrate intermediate 1030A may be mounted with a slight shift in the vertical and horizontal directions. The allowable deviation amount is an amount that allows the substrate intermediate 1030A to be mounted on the table 1050 efficiently and easily. The substrate intermediate 1030A is temporarily fixed using a resin film whose adhesive strength is reduced when heated on the table 1050.

  Subsequently, a position detection process of the substrate intermediate 1030A mounted on the table 1050 is performed (detection step). In this embodiment, the positions of all the substrate intermediates 1030A mounted on the table 1050 are collectively imaged using an imaging device (not shown), and the control device 180 (see FIG. 2A) is based on this imaging data. Position data including information related to the position of the substrate intermediate 1030A is created. The created position data is stored in the storage device 190 (see FIG. 2A).

When this detection process is completed, a process of mounting the individual mask 1130 on the substrate intermediate 1030A is performed (mounting process). The individual mask 1130 used in the present embodiment employs substantially the same configuration as the individual mask 830 used in Reference Example 7 earlier. However, the size of the recess 832A and the recess 832B is such that the substrate intermediate body 1030A can be accommodated even if it is displaced by a predetermined amount. FIG. 16 shows a state in which the individual mask 1130 is mounted on the substrate intermediate 1030A (1030A _n-1 ) mounted on the table 1050.

  Here, the predetermined amount is a shift amount that allows the substrate intermediate 1030A to be efficiently and easily placed on the table 1050 in the mounting step of mounting the substrate intermediate 1030A on the table 1050 described above. This predetermined amount (deviation amount) is, for example, about ± 2 mm.

Specifically, the individual mask 1130 is attached to the substrate intermediate 1030A as follows. First, the ball supply unit 731 provided in the individual mask 1130 and the substrate intermediate 1030A (substrate intermediate 1030A _n-1 shown in FIG. 17) from which the conductive balls 260 are to be supplied are positioned.

In the present embodiment, as described above, information regarding the positions of all the substrate intermediates 1030A is stored in the storage device 190 as position data in the detection step. The control device 180 moves the individual mask 1130 based on the position data stored in the storage device 190 so that the ball supply unit 731 and the substrate intermediate 1030A _n-1 are positioned. In the present embodiment, the individual mask 1130 is moved. However, the ball supply unit 731 and the substrate intermediate 1030A _n-1 may be positioned by moving the table 1050.

When this positioning process is completed, the position of the ball supply unit 731 and the substrate intermediate 1030A _n-1 is maintained, and the individual mask 1130 comes into contact with the substrate intermediate 1030A _n-1 , or a predetermined separation distance is set. Lower to the position you have.

FIG. 17 shows a state where the individual mask 1130 is in contact with the substrate intermediate 1030A _n-1 . At this time, in this embodiment, as described above, the substrate intermediate 1030A is mounted on the table 1050 with a slight shift in the vertical and horizontal directions. Therefore, the substrate intermediate 1030A other than the substrate intermediate 1030A _n-1 to be mounted with the conductive ball 260 is not positioned with the individual mask 1130. However, as described above, the size of the recess 832 is set such that the substrate intermediate 1030A can be accommodated even if the substrate intermediate 1030A is displaced (shifted) on the table 1050 by a predetermined amount. Therefore, the substrate intermediate 1030A other than the substrate intermediate 1030A _n-1 from which the conductive balls 260 are to be mounted is also reliably stored in the recess 832 of the individual mask 1130 and interferes with the individual mask 1130. Absent.

  Note that flux 254 is applied to the pads 112 of the substrate 110 in advance. The timing for applying the flux 254 is not particularly limited. It can be applied before the cutting step described above, or can be applied to each substrate intermediate 1030A after cutting.

As shown in FIG. 17, in the state where the individual mask 1130 is mounted on the substrate intermediate 1030A _n-1 , the conductive ball insertion hole 132 of the ball supply unit 731 is formed on the pad 112 formed on the substrate intermediate 1030A _n-1. It is in a state of facing. Therefore, by supplying the conductive ball 260 from the conductive ball insertion hole 132 in this positioned state, the conductive ball 260 is bonded to the pad 112 via the flux 254.

At this time, in a state where the individual mask 1130 is positioned on the substrate intermediate 1030A _n-1 , the substrate intermediate 1030A _n-2 faces the recess 832A of the individual mask 1130, and the substrate intermediate 1030A _n faces the recess 832B. It has become a state. In this embodiment, the substrate intermediate 1030A _n-2 is a region where the flux 254 is applied to the pad 112, and the substrate intermediate 1030A _n is a region _where the conductive ball 260 is already bonded to the pad 112. . Accordingly, the concave portion 832A of the individual mask 1130 functions as a relief portion for protecting the applied flux 254, and the concave portion 832B functions as a relief portion for protecting the supplied conductive ball 260.

As described above, when the supply process of the conductive balls 260 to the substrate intermediate 1030A _n-1 is completed, the individual mask 1130 is moved away from the substrate intermediate 1030A _n-1 . Subsequently, the individual mask 1130 moves to the upper part of the substrate intermediate 1030A _n-2 (the substrate intermediate from which the conductive balls 260 are to be supplied), which is a region where the conductive balls 260 are not supplied. 1030A _n-2 and the ball supply unit 731 are positioned. Thereafter, the conductive ball 260 is supplied to the entire substrate intermediate 1030A by repeatedly performing the same process as described above.

  As described above, in this embodiment, even if the substrate intermediate 1030A is mounted on the table 1050 with a slight shift in the mounting process, the position of the substrate intermediate 1030A is detected in the detection process, and then the mounting process. The individual mask 1130 is mounted on each substrate intermediate 1030A. For this reason, it is not necessary to position and mount the substrate intermediate 1030A on the table 1050 with high accuracy, and the manufacturing efficiency can be improved.

In addition, since the individual substrate intermediate 1030A is divided into small pieces and the shape thereof is small, even if the substrate intermediate 1030A is deformed by the stress due to heat applied in the previous process of supplying the conductive balls 260, The amount of deformation is small. Therefore, when the individual mask 1130 is mounted on the substrate intermediate 1030A (substrate intermediate 1030A _n-1 ), the conductive ball insertion hole 132 formed in the ball supply unit 731 and the substrate intermediate 1030A (substrate intermediate) 1030A _n-1 ) is small in positional deviation with respect to the pad 112, so that the conductive balls 260 can be reliably supplied to all the pads 112.

Also in this embodiment, by supplying the conductive balls 260 using the individual mask 1130, the substrate intermediate 1030A _n-2 to which the flux 254 is applied, and the substrate to which the conductive balls 260 have already been bonded. intermediate 1030A _n is the configuration covered by the recess 832 constituting the individual mask 1130. Thereby, it is possible to prevent the individual mask 830 from contacting the pad 112 or the supplied conductive ball 260 when the conductive ball 260 is supplied (mounted).

The substrate Intermediate _{1030A n-2, 1030A} n Also in this embodiment, as shown in FIG. 17 is completely covered by the individual mask 1130 without being exposed. For this reason, the flux 254 and the conductive ball 260 can be more reliably protected, and higher reliability can be realized.

  18 to 20 are views for explaining a substrate manufacturing apparatus according to a second embodiment (referred to as a second embodiment) of the present invention. 18 to 17, the same reference numerals are given to the same parts as those of the above-described reference examples and Example 1, and the description thereof is omitted. In addition, since the second embodiment also has a feature in the method of supplying the conductive balls 260, for convenience of explanation and illustration, only the substrate 1010 and the individual mask 1140 are shown in each figure, and illustration and explanation of other configurations are omitted. It shall be.

  The above-described substrate manufacturing method according to the first embodiment includes 25 substrates 1010 in which a total of 25 substrate regions 1020 (corresponding to M in the claims) are formed, with 5 vertically and 5 horizontally. The substrate intermediate body 1030A was formed by cutting into pieces (M pieces), and the conductive balls 260 were supplied to the individual substrate intermediate bodies 1030A.

  On the other hand, in the manufacturing method according to the second embodiment, as shown in FIG. 18, there are 6 vertical substrates and 6 horizontal substrates, for a total of 36 substrate regions (corresponding to M in the claims). By cutting the formed substrate 1010, a substrate intermediate 1030B having three (corresponding to N in the claims) substrate regions 1020 is cut out, and the supply process of the conductive balls 260 is performed thereon. It is characterized by this.

  Hereinafter, a specific procedure of the substrate manufacturing method according to the present embodiment will be described. In the following description, the supply process of the conductive ball 260 which is a main part of the present invention will be mainly described.

  In the substrate manufacturing method according to the present invention, as in the first embodiment, a cutting process for separating the substrate 1010 is performed (cutting process) before the process of supplying the conductive balls 260 is performed.

  FIG. 18 shows a substrate 1010 used in this embodiment. As described above, the substrate 1010 is six vertically and six horizontally, and a total of 36 substrate regions 1020 are formed. In this embodiment, this substrate 1010 is cut into a number of substrate intermediates having N substrate regions smaller than 36. Specifically, in this embodiment, the substrate 1010 is cut into a substrate intermediate 1030B having three substrate regions 1020 smaller than 36. Therefore, in this embodiment, each cut substrate intermediate 1030B has a strip shape.

  When the substrate intermediate 1030B is formed as described above, a table 1050 is prepared and the substrate intermediate 1030B is placed on the table 1050 as shown in FIG. At this time, the substrate intermediate 1030B is placed in a grid pattern on the table 1050 (mounting process).

  Also in the present embodiment, when the substrate intermediate 1030B is placed on the table 1050, it is not necessary to position and place the substrate intermediate 1030B with high accuracy, and the substrate intermediate 1030B may be slightly shifted vertically and horizontally. The allowable deviation amount is the same as that of the first embodiment in that the substrate intermediate 1030B can be efficiently and easily placed on the table 1050.

  Subsequently, a position detection process for the substrate intermediate 1030B mounted on the table 1050 is performed (detection step). Also in this embodiment, the positions of all the substrate intermediates 1030B mounted on the table 1050 are collectively imaged using an imaging device (not shown), and information on the positions of all the substrate intermediates 1030B is based on this imaging data. Create location data that includes. The created position data is stored in the storage device 190 (see FIG. 2A).

  When this detection process is completed, a process of mounting the individual mask 1140 on the substrate intermediate 1030B is performed (mounting process). The individual mask 1140 used in the present embodiment also has a configuration substantially the same as that of the individual mask 830 used in Reference Example 7 earlier. However, the shape of each recess 832 and the shape of the ball supply unit 731 are formed so as to correspond to the shape of the substrate intermediate 1030B which is a strip shape (see FIG. 20). Further, the size of the recess 832 is set such that it can be accommodated even if the substrate intermediate 1030B is displaced by a predetermined amount.

  Here, the predetermined amount is a deviation amount that allows the substrate intermediate 1030B to be efficiently and easily placed on the table 1050 in the mounting step of mounting the substrate intermediate 1030B on the table 1050 described above.

  Specifically, the individual mask 1140 is attached to the substrate intermediate 1030B as follows. First, the ball supply unit 731 provided in the individual mask 1140 and the substrate intermediate 1030B from which the conductive balls 260 are to be supplied are positioned.

  In the present embodiment, as described above, information regarding the positions of all the substrate intermediates 1030B is stored in the storage device 190 as position data in the detection step. Based on the position data stored in the storage device 190, the control device 180 positions the ball supply unit 731 and the substrate intermediate 1030B (the substrate intermediate 1030B from which the conductive ball 260 is to be supplied). The individual mask 1140 is moved. In this case, the configuration in which the table 1050 (substrate intermediate 1030B) may be moved is the same as in the first embodiment.

  When this positioning process is completed, the positions of the ball supply unit 731 and the substrate intermediate 1030B are maintained, and the individual mask 1140 is brought into contact with the substrate intermediate 1030B or lowered to a position having a predetermined separation distance. FIG. 20 shows a state where the individual mask 1140 is attached to the substrate intermediate 1030B.

  At this time, in this embodiment, the substrate intermediate 1030B other than the substrate intermediate 1030B to be mounted with the conductive ball 260 is not positioned with the individual mask 1140. However, as described above, the size of the recess 832 is set such that it can be accommodated even if the substrate intermediate 1030B is displaced (shifted) on the table 1050 by a predetermined amount. Therefore, the substrate intermediate 1030B other than the substrate intermediate 1030B on which the conductive ball 260 is to be mounted will be securely stored in the recess 832 of the individual mask 1140 and will not interfere with the individual mask 1140.

  When the individual mask 1140 is mounted on the substrate intermediate 1030B as described above, the conductive balls 260 are supplied from the conductive ball insertion holes 132 in the same manner as in the first embodiment, and the pads 112 are electrically conductive via the flux 254. Ball 260 is bonded.

  As described above, when the supply process of the conductive ball 260 to the substrate intermediate 1030B is completed, the individual mask 1140 is moved away from the substrate intermediate 1030B. Subsequently, the individual mask 1130 moves to the upper part of the substrate intermediate 1030B to be supplied with the conductive ball 260, and is positioned in the same manner as in the first embodiment. Thereafter, the conductive ball 260 is supplied to the entire substrate intermediate 1030B by repeatedly performing the same process as described above. The substrate intermediate 1030B supplied with the conductive balls 260 is further cut into units of the substrate region 1020 to be separated.

  As described above, also in this embodiment, even if the substrate intermediate 1030B is mounted on the table 1050 with a slight deviation in the mounting process, the mounting is performed after the position of the substrate intermediate 1030B is detected in the detection process. In the process, an individual mask 1140 is attached to each substrate intermediate 1030B. For this reason, it is not necessary to position and place the substrate intermediate 1030B on the table 1050 with high accuracy, and the manufacturing efficiency can be improved.

  In addition, according to the above method, the supply of the conductive balls 260 can be simultaneously performed on a plurality (three in the present embodiment) of the substrate regions 1020, so that the supply efficiency of the conductive balls 260 can be improved. it can.

  On the other hand, in this embodiment, since the number of substrate regions 1020 included in one substrate intermediate 1030B increases, the shape of the substrate intermediate 1030B naturally increases. Therefore, the deformation amount generated in the substrate intermediate 1030B due to the heat treatment or the like performed before the supply process of the conductive ball 260 is larger than that in the first embodiment.

  However, in this embodiment, when the individual mask 1140 is mounted on the substrate intermediate 1030B, the shape of the substrate intermediate 1030B (hereinafter referred to as this shape) that allows all the conductive ball insertion holes 132 and the pads 112 to face each other within an error range. Based on this allowable shape, the number of substrate regions 1020 that can be included in the substrate intermediate 1030B is set. Therefore, even if the substrate intermediate 1030B has a plurality of substrate regions 1020, in other words, a configuration having a larger shape than that of the first embodiment, the conductive balls 260 with respect to all the pads 112 of the substrate intermediate 1030B. Can be reliably supplied.

  The preferred embodiments of the present invention have been described in detail above. However, the present invention is not limited to the specific embodiments described above, and various modifications can be made within the scope of the present invention described in the claims. It can be modified and changed.

  Specifically, in the above-described embodiment, an example in which flux is used as the adhesive material is shown. However, the adhesive material is not limited to this, and other conductive paste such as solder paste and silver paste is used. Is also possible.

  In the first and second embodiments, the individual masks 1130 and 1140 are used to supply the conductive balls 260 to the substrate intermediates 1030A and 1030B. Instead, as shown in Reference Example 8, It is also possible to use a method in which the individual masks 1130 and 1140 are used as a screen plate and the cream solder 840 is screen-printed on the pad 112 using a squeegee 842 (see FIG. 13).

  Further, in the first and second embodiments, in the detection process, all the substrate intermediates 1030A and 1030B placed on the table 1050 are collectively fetched by the imaging device, and the position information of all the substrate intermediates 1030A and 1030B is acquired. Is used, and based on this, the method of positioning the individual masks 1130 and 1140 and the substrate intermediates 1030A and 1030B is used.

  However, the method of positioning the individual masks 1130 and 1140 and the substrate intermediates 1030A and 1030B is not limited to this, and alignment marks are formed in advance on the individual substrate intermediates 1030A and 1030B. It is also possible to use a method of individually positioning the individual masks 1130 and 1140 for each of the substrate intermediates 1030A and 1030B by detecting the marks.

  In the above-described embodiments, the substrate having the resin material laminated is described as an example. However, the present invention is not limited to the manufacture of the wiring substrate, and may be applied to a multi-cavity substrate such as a silicon substrate. Of course you can.

It is a top view which shows the board | substrate of many pieces. It is a top view which shows the mask corresponding to a multi-piece board | substrate. It is a longitudinal cross-sectional view when the alignment of the hole of a mask and the pad of a board | substrate corresponds. It is a longitudinal cross-sectional view in case the alignment of the hole of a mask and the pad of a board | substrate does not correspond. It is a top view which shows typically the reference example 1 of the manufacturing apparatus of the board | substrate by this invention. It is a top view which shows the state in which the individual mask was mounted in the board | substrate on a table. It is a side view which shows the state which mounted the individual mask on the board | substrate on a table. It is a side view which shows the state which supplies a conductive ball to an individual mask. It is a top view for demonstrating removal of an individual mask, and carrying out of a board | substrate. It is a figure for demonstrating the manufacturing method (the 1) of the board | substrate of the reference example 1. FIG. It is a figure for demonstrating the manufacturing method (the 2) of the board | substrate of the reference example 1. FIG. It is a figure for demonstrating the manufacturing method (the 3) of the board | substrate of the reference example 1. FIG. It is a figure for demonstrating the manufacturing method (the 4) of the board | substrate of the reference example 1. FIG. It is a figure for demonstrating the manufacturing method (the 5) of the board | substrate of the reference example 1. FIG. It is a figure for demonstrating the manufacturing method (the 6) of the board | substrate of the reference example 1. FIG. It is a figure for demonstrating the manufacturing method (the 7) of the board | substrate of the reference example 1. FIG. It is a figure for demonstrating the manufacturing method (the 8) of the board | substrate of the reference example 1. FIG. It is a figure for demonstrating the manufacturing method (the 9) of the board | substrate of the reference example 1. FIG. It is a figure for demonstrating the manufacturing method (the 10) of the board | substrate of the reference example 1. FIG. It is a figure for demonstrating the manufacturing method (the 11) of the board | substrate of the reference example 1. FIG. It is a figure for demonstrating the manufacturing method (the 12) of the board | substrate of the reference example 1. FIG. It is a side view which shows the board | substrate manufacturing apparatus of the reference example 2. It is a figure for demonstrating the manufacturing method (the 1) of the board | substrate of the reference example 2. FIG. It is a figure for demonstrating the manufacturing method (the 2) of the board | substrate of the reference example 2. FIG. It is a figure for demonstrating the manufacturing method (the 3) of the board | substrate of the reference example 2. FIG. It is a figure for demonstrating the manufacturing method (the 4) of the board | substrate of the reference example 2. FIG. It is a figure for demonstrating the manufacturing method (the 5) of the board | substrate of the reference example 2. FIG. It is a side view which shows the board | substrate manufacturing apparatus of the reference example 3. It is a figure for demonstrating the manufacturing method (the 1) of the board | substrate of the reference example 3. FIG. It is a figure for demonstrating the manufacturing method (the 2) of the board | substrate of Example 3. FIG. It is a figure for demonstrating the manufacturing method (the 3) of the board | substrate of the reference example 3. FIG. It is a figure for demonstrating the manufacturing method (the 4) of the board | substrate of the reference example 3. FIG. It is a figure for demonstrating the manufacturing method (the 5) of the board | substrate of the reference example 3. FIG. It is a side view which shows the board | substrate manufacturing apparatus of the reference example 4. It is a figure for demonstrating the board | substrate manufacturing apparatus of the reference example 5, and the manufacturing method (the 1) of a board | substrate. It is a figure for demonstrating the manufacturing method (the 2) of the board | substrate of the reference example 5. FIG. It is a figure for demonstrating the manufacturing method (the 3) of the board | substrate of the reference example 5. FIG. It is a figure for demonstrating the manufacturing method (the 4) of the board | substrate of the reference example 5. FIG. 10 is a diagram for explaining a method of manufacturing a substrate in Reference Example 6. FIG. It is sectional drawing which follows the AA line in FIG. 11A. It is a figure for demonstrating the manufacturing method (the 1) of the board | substrate of the reference example 7. FIG. It is a figure for demonstrating the manufacturing method (the 2) of the board | substrate of the reference example 7. FIG. It is sectional drawing which follows the BB line in FIG. 12B. 10 is a diagram for explaining a method of manufacturing a substrate in Reference Example 8. FIG. It is a figure for demonstrating the manufacturing method (the 1) of the board | substrate which is Example 1 of this invention. It is a figure for demonstrating the manufacturing method (the 2) of the board | substrate which is Example 1 of this invention. It is a figure for demonstrating the manufacturing method (the 3) of the board | substrate which is Example 1 of this invention. It is a figure for demonstrating the manufacturing method (the 4) of the board | substrate which is Example 1 of this invention. It is a figure for demonstrating the manufacturing method (the 1) of the board | substrate which is Example 2 of this invention. It is a figure for demonstrating the manufacturing method (the 2) of the board | substrate which is Example 2 of this invention. It is a figure for demonstrating the manufacturing method (the 3) of the board | substrate which is Example 2 of this invention.

Explanation of symbols

100, 400, 500, 600, 700 Substrate manufacturing apparatus 110, 1010 Substrate 112 Pad 114, 114 _{1 to} 114 _n , 1020 Substrate region 120 Substrate transport path 130, 130 _{1 to} 130 _n , 730, 830, 930, 1130, 1140 Individual mask 132 Conductive ball insertion hole 140 Mask transfer path 150 Substrate carry-in device 160 Pad detection device 170 Table 172 Vacuum generator 210 Mask carry-in device 220 Mask hole detection device 240,410,510,610,710 Conductive ball supply device 242 Head 260 Conductive ball 270 Mask unloading device 274 Ball housing portion 280 Substrate unloading device 282 Ball collection path 284 Ball return path 414, 514, 714 Air injection hole 420 Compressor 620 Moving base 630 Individual adsorption head 6 32 Suction hole 720 Ball collecting device 722 Vibration generating device 731 Ball mounting portion 732, 732 A, 732 B Opening portion 734 Frame 832, 832 A, 832 B, 932, 932 A, 932 B Recessed portion 840 Cream solder 842 Squeegee 931 Cream solder disposing portion 934 Column portion 1030A, 1030B Substrate intermediate 1050 Table

Claims (4)

A method for manufacturing a substrate in which bumps are formed by supplying conductive balls to a plurality of pads formed in a substrate region and then performing a reflow process,
A cutting step of cutting a multi-piece substrate having M (M is an integer) substrate regions into one or a plurality of substrate intermediates having N (N is an integer) substrate regions smaller than M; ,
A mounting step of mounting a plurality of the substrate intermediates on a table;
A detection step of detecting the position of the substrate intermediate placed on the table;
Based on the result of the position detection, a conductive ball supply member having a plurality of ball insertion holes corresponding to the pads included in the substrate intermediate is attached to the substrate intermediate so that the pads and the ball insertion holes face each other. A mounting process for mounting;
Supplying the conductive ball to the pad of the substrate intermediate through the ball insertion hole,
For each of the plurality of substrate intermediates, at least the mounting step, the mounting step, and the supplying step, wherein the substrate manufacturing method repeats,
A recess having a size capable of accommodating the substrate intermediate is formed at a position adjacent to a formation region of the ball insertion hole of the conductive ball supply member, and a frame portion of the conductive ball supply member is formed in a lattice shape. A method for manufacturing a substrate, comprising: In the detection step, the positions of the plurality of substrate intermediates placed on the table are collectively detected,
The substrate manufacturing method according to claim 1, wherein in the mounting step, the conductive ball supply member is mounted on each of the substrate intermediates based on a detection result obtained by collectively detecting the positions of the plurality of substrate intermediates.   The method of manufacturing a substrate according to claim 1, wherein an adhesive material is applied to the pad, and the conductive ball is bonded to the pad via the adhesive material.   The method for manufacturing a substrate according to claim 3, wherein the adhesive material is one adhesive material selected from the group consisting of flux, solder paste, and silver paste.

Images