JP2019029647A - Columnar member loading device and columnar member loading method - Google Patents

Abstract

To provide a columnar member loading device and a columnar member loading method capable of loading columnar members at prescribed positions of a substrate without excess or shortage.SOLUTION: A columnar member loading device 1 for loading a columnar member 12, while standing, at a prescribed position of a substrate 5 has a columnar member transfer mask 21 having multiple mask openings 34 corresponding to prescribed positions of the substrate 5 and placed on the substrate 5, a columnar member arrangement brush squeegee 28 placed above the columnar member transfer mask 21, and transferring the columnar member 12 into the mask opening 34 while rotating and moving, and vibration exciters 22, 23 for giving a vibration to the columnar member transfer mask 21, when driving the columnar member arrangement brush squeegee 28. The columnar member loading device 1 and the columnar member loading method load the columnar member 12 on the substrate 5 by means of the columnar member arrangement brush squeegee 28, while imparting vibration to the columnar member transfer mask 21.SELECTED DRAWING: Figure 3

Description

  The present invention relates to a columnar member mounting apparatus and a columnar member mounting method.

  When electrically bonding a semiconductor substrate and a circuit board, an apparatus is known in which a plurality of solder bumps formed on the semiconductor substrate are melted and bonded to the circuit board (see, for example, Patent Document 1). ). However, in Patent Document 1, when bonding a semiconductor substrate and a circuit board using a solder bump as a bonding material, the solder bump is crushed and expanded in the radial direction, and the distance between adjacent solder bumps is reduced. It may not be possible to support the mounting of a board that advances. Therefore, Patent Document 2 discloses a technique in which a copper (Cu) pillar is formed on a semiconductor substrate and a solder layer is formed and bonded as a bonding material to the circuit board. The copper pillar disclosed in Patent Document 2 is suitable for miniaturization because the diameter does not change when the semiconductor substrate and the circuit board are joined. However, since the copper pillar is formed in a columnar shape on the semiconductor substrate by electroplating or the like, it takes a long time to form, and it cannot be said that the productivity is good. In addition, recently, there is a member that uses a columnar member (conductor pin) formed of a metal such as copper instead of the copper pillar formed on the semiconductor substrate as a bonding member.

  However, since the length of the columnar member (conductor pin) in the longitudinal direction is long with respect to the diameter (the aspect ratio is large), it is difficult to array and mount the columnar members on the semiconductor substrate. Patent Document 3 discloses a method of arranging and mounting columnar members on a semiconductor substrate. In the mounting method of the columnar member described in Patent Document 3, first, a jig pallet, a pin stand jig and an insertion guide jig are arranged in an overlapping manner, the columnar member is dropped from above the insertion guide jig, and a pin stand is cured. The jig pallet is vibrated so that the tool slides between the jig pallet and the insertion guide jig, and the columnar member is arranged in the pin hole of the pin stand jig. Then, the jig pallet, the pin stand jig, and the insertion guide jig are overlapped and turned upside down to join the printed wiring board in a state where the columnar member is erected.

JP-A-5-243232 JP 2014-157906 A JP 2002-314291 A

  In the mounting method of the columnar member described in Patent Document 3, the columnar member is dropped into the pin hole by applying vibration to the jig pallet. It may be biased, and it is difficult to mount the columnar member in a predetermined position on the substrate without excess or deficiency.

  Accordingly, the present invention has been made to solve such a problem, and provides a columnar member mounting apparatus and a columnar member mounting method capable of mounting a columnar member at a predetermined position on a substrate without excess or deficiency. It is what.

[1] A columnar member mounting device of the present invention is a columnar member mounting device that mounts a columnar member in a predetermined position on a substrate, and has a plurality of mask openings corresponding to the predetermined position of the substrate. A columnar member transfer mask disposed above, a columnar member arrangement brush squeegee that is disposed above the columnar member transfer mask and transfers the columnar member into the mask opening while rotating and moving, and the columnar member And a vibration device that applies vibration to the columnar member transfer mask when the array brush squeegee is driven.

  According to the columnar member mounting apparatus of the present invention, when the columnar member is transferred to the mask opening of the columnar member transfer mask by the columnar member arranging brush squeegee, vibration is applied to the columnar member transfer mask to thereby determine the predetermined substrate. It is possible to mount the columnar member without excessive or insufficient positions.

[2] In the columnar member mounting device of the present invention, it is preferable that the excitation device is movable along the upper surface of the columnar member transfer mask in conjunction with the movement of the columnar member arrangement brush squeegee. .

  Thus, if the vibration exciter is interlocked with the movement of the columnar member arrangement brush squeegee, it becomes possible to apply vibration to the columnar member transfer mask in the vicinity of the rotation position of the columnar member arrangement brush squeegee. It becomes possible to mount the columnar member at a predetermined position without excess or deficiency.

[3] In the columnar member mounting device of the present invention, it is preferable that a plurality of the vibration devices are arranged so as to sandwich the columnar member arrangement brush squeegee.

  If a plurality of vibration devices are arranged in the vicinity of the columnar member arrangement brush squeegee, vibration can be applied to the columnar member arrangement target position of the columnar member transfer mask in substantially the same manner, and a predetermined position on the substrate is excessively or insufficiently provided. Therefore, the columnar member can be mounted with high efficiency.

[4] In the columnar member mounting device of the present invention, it is preferable that the vibration frequency of the vibration exciting device is 100 Hz to 40 kHz.

  The vibration frequency of the vibration exciter is adjusted depending on the size and shape of the columnar member, but if appropriately adjusted in the range of 100 Hz to 40 kHz, the columnar member transfer mask can be given vibration suitable for the transfer of the columnar member. In addition, the columnar member can be mounted at a predetermined position on the substrate without excess or deficiency.

[5] In the columnar member mounting device of the present invention, it is preferable that the vibration frequency of the vibration exciting device is 10 kHz to 40 kHz.

  As described above, the vibration can be transferred to the substrate by applying vibration to the columnar member even when the vibration frequency of the vibration device is 100 Hz to 40 kHz. However, if the vibration frequency is 10 kHz to 40 kHz, for example, The mounting yield can be increased to 80% or more, and the columnar member can be transferred to the substrate more efficiently.

[6] In the columnar member mounting device of the present invention, it is preferable that the vibration amplitude of the vibration exciting device is 0.1 μm to 10 μm.

  The amplitude of vibration of the vibration exciter is adjusted according to the size and shape of the columnar member, but if adjusted appropriately within the range of 0.1 μm to 10 μm, the columnar member will not bounce or vibrate, It is possible to mount the columnar member at a predetermined position on the substrate without excess or deficiency.

[7] In the columnar member mounting device of the present invention, it is preferable that the vibration amplitude of the vibration exciting device is 0.1 μm to 0.3 μm.

  As described above, the columnar member can be transferred to the substrate by setting the vibration amplitude of the vibration exciter to 0.1 μm to 10 μm. However, as the amplitude is increased, the columnar member jumps up, and the columnar member transfer mask and the columnar member may be damaged by colliding with the columnar member transfer mask. Therefore, it is possible to suppress damage to the columnar member transfer mask and the columnar member by limiting the amplitude to 0.1 μm to 0.3 μm.

[8] In the columnar member mounting device of the present invention, the vibration device is an ultrasonic vibration device, the vibration device includes a vibration unit, and the columnar member transfer mask, the vibration unit, It is preferable to have a vibration part raising / lowering mechanism part which can adjust the distance in the range of 0-1 mm.

  If the vibration device is an ultrasonic vibration device, vibration can be applied to the columnar member transfer mask regardless of whether or not the vibration unit contacts the columnar member transfer mask. If the distance between the mask and the vibrating portion is appropriately adjusted within a range of 0 to 1 mm, it is possible to apply appropriate vibration to the columnar member transfer mask.

[9] In the columnar member mounting device of the present invention, the vibration device is an ultrasonic vibration device and has a vibration unit, and the vibration unit has an end surface on the columnar member transfer mask side as the columnar member. It is preferable to further include an elastic member that cancels the weight of the vibrating portion while always contacting the member transfer mask.

  The elastic member generates a force that pulls up the excitation unit upward, and is, for example, a spring. By canceling the dead weight of the vibrating portion by the elastic member, it is possible to reduce the load related to the vibration of the vibrating portion itself and to vibrate the columnar member transfer mask stably at a predetermined frequency and amplitude.

[10] In the columnar member mounting device of the present invention, the brush squeegee for arranging the columnar members is composed of a thin twisted yarn assembly having conductivity and flexibility, and moves while rotating on the surface of the columnar member transfer mask. has the tie wire-like member, the tie wire-like member during a transfer operation of the columnar member, biased by the contact pressure of 5g ^/ cm ² ~10g / cm 2 to the columnar member transfer mask It is preferable.

If it does in this way, it will become possible to suppress that a columnar member enters between between a columnar member transfer mask and a binding linear member by vibrating a columnar member transfer mask. Rarely even columnar member enters between the tie wire-like member and the columnar member transfer mask, since the contact surface pressure of the pressing of the tie wire-like member is very small and ^{5g / cm 2 ~10g / cm 2} , The columnar member can be transferred in a good state without damage such as scratches and dents. In addition, since the binding linear member is always in contact with the surface of the columnar member transfer mask that has moderate flexibility and microvibrates, it is also possible to suppress the leakage of the columnar member to the outside. .

[11] The columnar member mounting method of the present invention is a columnar member mounting method in which the columnar member is mounted upright at a predetermined position on the substrate, and a solder paste printing mask is disposed on the upper surface of the substrate, A step of printing a solder paste at a predetermined position, and a columnar member transfer mask disposed above the substrate on which the solder paste is printed, and then supplying the columnar member onto the columnar member transfer mask, A step of rotating and moving a columnar member arrangement brush squeegee while applying vibration to the member transfer mask, and arranging the columnar members at predetermined positions on the substrate on which the solder paste is printed. To do.

  According to the columnar member mounting method of the present invention, when the columnar member is transferred to the mask opening of the columnar member transfer mask by the columnar member arranging brush squeegee, vibration is applied to the columnar member transfer mask. It is possible to mount the columnar member without excessive or insufficient positions.

It is a top view which shows schematic structure of the columnar member mounting apparatus 1 which concerns on embodiment. It is explanatory drawing which shows the printing process of the solder paste 35 by the solder paste printing apparatus 2 used for the columnar member mounting apparatus 1. FIG. It is a figure explaining the schematic structure of the columnar member transfer part 25 used for the columnar member mounting apparatus 1. FIG. It is explanatory drawing showing transfer operation of the columnar member 12 by the columnar member transfer part 25 used for the columnar member mounting apparatus 1. FIG. It is a perspective view showing one example of substrate 5 in which a plurality of columnar members 12 in an embodiment are arranged and mounted. It is a top view which shows an example when the board | substrate 5 in embodiment is a wafer. It is process flow explanatory drawing which shows the main processes of the columnar member mounting method which concerns on embodiment. It is explanatory drawing which shows the main processes of the columnar member mounting method which concerns on embodiment. It is a figure explaining schematic structure of columnar member transfer device 3A concerning the 2nd example. It is a graph which shows the relationship between the excitation frequency f obtained by experiment, and the mounting (transfer) yield of the columnar member 12. FIG. It is a figure explaining an example of the evaluation result of mounting yield.

  Hereinafter, a columnar member mounting apparatus 1 according to an embodiment of the present invention and a columnar member mounting method using the columnar member mounting apparatus 1 will be described with reference to FIGS.

[Configuration and operation of columnar member mounting apparatus 1]
FIG. 1 is a plan view showing a schematic configuration of a columnar member mounting apparatus 1 according to the embodiment. The columnar member mounting apparatus 1 conveys the substrate 5 from the substrate stocker 4 to the pre-aligner 6, and stores the substrate 5 on which the columnar member 12 (see FIGS. 3 and 4) is to be mounted. A substrate transport robot 7 that transports the substrate 5 to the stage 9, a solder paste printer 2 that prints the solder paste 35 (see FIG. 2) on the substrate 5, and the columnar member 12 is transferred to the substrate 5 on which the solder paste 35 is printed. A columnar member transfer device 3 is provided. Further, the columnar member mounting apparatus 1 includes an inspection apparatus 26 that inspects the mounting state of the columnar member 12 and a cleaning apparatus 20 that removes excess solder paste 35 attached to the back surface of the solder paste printing mask 15. ing.

  The substrate 5 is a plate-like or film-like member for fixing and wiring the electronic component, and is mounted with an electronic component such as a semiconductor integrated circuit, or a wafer such as a silicon semiconductor substrate or a compound semiconductor substrate. Including glass substrates. The solder paste 35 joins the columnar member 12 and the substrate 5, and the material of the columnar member 12 is copper or a copper-based alloy. The solder paste 35 is selected to have a high adhesive strength so that the transferred columnar member 12 does not move or fall over.

  The substrate stocker 4 includes a load port and an unload port (not shown) (sometimes called a load port when the target substrate is a wafer), and the transfer robot 7 takes out the substrate 5 from the load port and supplies it to the pre-aligner 6. Transport. When the substrate 5 is a wafer, the pre-aligner 6 transports the substrate 5 corrected for both the center position of the substrate 5 and the notch direction formed on the outer periphery of the substrate 5 to the stage 9, and then the transport robot 7 waits at the standby position. Return to. The substrate 5 placed on the stage 9 is adsorbed to the stage 9 under reduced pressure, and the warpage is corrected by pressing the substrate 5 with the substrate correcting device 8. The stage 9 is adjusted in the Y-axis direction on the Y-axis rail 10, moved on the X-axis rail 11 with the substrate 5 placed thereon, and conveyed to a predetermined position of the solder paste printing apparatus 2. The horizontal direction shown in FIG. 1 is the X axis, the vertical direction is the Y axis, and the height direction (thickness direction) is the Z axis.

  The stage 9 is movable in the XY plane and the Z direction by an X-axis rail 11, a Y-axis rail 10, a Z table (not shown), and a θ table (not shown). And the board | substrate 5 can be conveyed below the columnar member transfer apparatus 3. FIG. The stage 9 reciprocates between the substrate correction device 8, the solder paste printing device 2, and the columnar member transfer device 3 on the X-axis rail 11 to convey the substrate 5 to each predetermined position.

  After moving the stage 9 on which the substrate 5 is placed on the X-axis rail 11 below the solder paste printing apparatus 2, the solder paste 35 is printed on the substrate 5 using the solder paste printing mask 15. If the solder paste 35 has been printed on the substrate 5 in advance elsewhere or in another process, this printing process is skipped. The cleaning device 20 is a device that removes excess solder paste 35 adhering to the back surface of the solder paste printing mask 15 using a sheet or roll containing a solvent. The cleaning device 20 may blow off excess solder paste 35 attached to the solder paste printing mask 15 with an air gun or vacuum suction. The printing of the solder paste 35 on the substrate 5 will be described in detail with reference to FIG. The substrate 5 on which the solder paste 35 is printed moves on the X-axis rail 11 below the columnar member transfer device 3 while being placed on the stage 9.

  The columnar member transfer device 3 includes an X-axis drive device 17, a Y-axis drive device 18, and a Z-axis drive device 19, and moves the columnar member transfer unit 25 in the X-axis direction, the Y-axis direction, and the Z-axis direction. Is possible. There are a Z-axis and a θ-axis (not shown) on the Y-axis rail 10 and the X-axis rail 11, and the mask opening 15a of the solder paste printing mask 15 is driven by driving the Z-axis and the θ-axis (see FIG. 2). ), Aligning the mask opening 34 (see FIG. 3) of the columnar member transfer mask 21 and the position of the metal electrode 16 of the substrate 5, and printing the solder paste on the substrate 5 and mounting the columnar member 12.

  In the X-axis drive device 17, vibration devices 22 and 23 are arranged on both sides of the columnar member transfer portion 25. The vibration exciters 22 and 23 move in conjunction with the movement of the columnar member transfer portion 25 to give vibration in the Z direction to the columnar member transfer mask 21, and a columnar member arrangement brush squeegee 28 described later (see FIG. 3). The columnar member 12 is transferred into the mask opening 34 of the columnar member transfer mask 21 in cooperation with the above. The configuration and transfer operation of the columnar member transfer unit 25 will be described with reference to FIGS. 3 and 4.

  The substrate 5 on which the columnar members 12 are mounted passes through the solder paste printing device 2 and the substrate correction device 8, is conveyed to the inspection device 26 by the substrate conveyance robot 7, and is arranged by the image recognition camera (not shown). Is discharged to the substrate stocker 4. On the return stroke, the pre-aligner 6 does not pass.

[Printing of solder paste 35]
FIG. 2 is an explanatory diagram showing a printing process of the solder paste 35 by the solder paste printing apparatus 2. FIG. 2 is a schematic diagram showing each part in an enlarged manner. The substrate 5 is provided with a recess 5a at a position where the columnar member 12 is to be mounted, and a metal electrode 16 is formed at the bottom of the recess 5a. The printing squeegee 24 moves from the left to the right in the drawing along the upper surface of the solder paste printing mask 15. The printing squeegee 24 is made of a flexible resin so as not to damage the surface of the solder paste printing mask 15. The solder paste printing mask 15 is provided with a mask opening 15 a corresponding to the position where the concave portion 5 a of the substrate 5 is formed.

  In FIG. 2, the position of the leftmost mask opening 15a is represented as position (a), the position of the middle mask opening 15a is represented as position (b), and the position of the rightmost mask opening 15a is represented as position (c). The position (a) represents the solder paste 35 after the printing squeegee 24 passes through the mask opening 15 a, and the solder paste 35 does not come out of the surface of the solder paste printing mask 15. And it is settled so as to be in contact with the metal electrode 16 in the recess 5 a of the substrate 5. The position (b) represents the state immediately before the printing squeegee 24 prints the solder paste 35 on the substrate 5 from the mask opening 15. The position (c) represents the mask opening 15a for the next solder paste printing. After completion of the squeegee operation, the printing mask 15 is released from the plate, and the solder paste 35 is separated from the mask opening 15a and transferred to the bottom of the opening of the substrate 5 to complete the printing of the solder paste 35. The state of the solder paste 35 after the printing is completed is shown in FIG. At position (c), a small amount of residue of the solder paste 35 in the previous solder paste printing adheres to the inner peripheral surface of the mask opening 15a. Therefore, when the surplus solder paste exceeds the reference, the surplus solder paste is cleaned and removed by the cleaning device 20.

[Configuration of Columnar Member Transfer Part 25 and Transfer Operation]
FIG. 3 is a diagram illustrating a schematic configuration of the columnar member transfer unit 25 used in the columnar member transfer device 3. The columnar member transfer portion 25 has a rotatable columnar member arrangement brush squeegee 28 attached to the X-axis drive device 17. The columnar member arrangement brush squeegee 28 has a binding linear member 31 implanted in an attachment portion 30 fixed to a squeegee rotation drive device 29. The binding linear member 31 has a double structure (double concentric circles) in the radial direction of the rotation trajectory of the columnar member arranging brush squeegee 28, and has an inner binding linear member 32 and an outer binding linear member 33. It consists of and. Both the inner binding linear member 32 and the outer binding linear member 33 are brushes having a shape that spreads from the attachment portion 30 toward the columnar member transfer mask 21. In addition, in FIG. 3, the binding linear member 31 is expressed in a simplified manner.

  The inner binding linear member 32 has a function of mainly introducing the columnar member 12 into the mask opening 34 of the columnar member transfer mask 21, and the outer binding linear member 33 mainly has the columnar member 12 as the columnar member. It has a function not to deviate to the outside of the arrangement brush squeegee 28, that is, not to deviate to the outside of the outer binding wire member 33. Further, the outer binding linear member 33 has a function of returning the columnar member 12 between the outer binding linear member 32 and the inner binding linear member 32 to the inner binding linear member 32 while introducing the columnar member 12 into the mask opening 34. For example, if the columnar member arranging brush squeegee 28 is rotated in the direction of the arrow and the columnar member 12 is introduced into the mask opening 34, the columnar member arranging brush squeegee 28 is rotated in the direction opposite to the arrow and the columnar member 12 is moved. It is possible to make it function so as to return to the inner bound linear member 32.

  The binding linear member 31 is a thin twisted yarn assembly having conductivity and flexibility, and moves in the X-axis direction and the Y-axis direction while rotating so as to sweep the surface of the columnar member transfer mask 21. In the meantime, the columnar member 12 is introduced into the mask opening 34. Therefore, the columnar member 12 is not damaged.

  Further, since the binding linear member 31 has conductivity, it can be mounted with a high degree of cleanness without attracting dust and the like due to static electricity. Although the illustration is simplified in FIG. 3, the outer binding linear members 33 are arranged more densely than the inner binding linear members 32.

  The stage 9 on which the substrate 15 is placed is provided with a suction path 40 penetrating in the thickness direction. The suction path 40 communicates with a vacuum suction path 42 provided in the base portion 41, and the substrate 5 is placed on the stage 9. Adsorbed in a vacuum.

  Exciters 22 and 23 are arranged on both sides of the columnar member transfer portion 25. The vibration devices 22 and 23 each have a vibration part 45, and the vibration part 45 is in contact with the columnar member transfer mask 21. The vibration devices 22 and 23 have a vibration unit lifting mechanism 46 that adjusts the distance between the vibration unit 45 and the columnar member transfer mask 21 to 0 to 1 mm. The vibration devices 22 and 23 are ultrasonic vibration devices, and apply vibration to the columnar member transfer mask 21 while the columnar member arrangement brush squeegee 28 performs the transfer operation of the columnar member 12. If the vibration devices 22 and 23 are ultrasonic vibration devices, the columnar member transfer mask 21 can be vibrated even if the vibration unit 45 has a distance of less than 1 mm from the columnar member transfer mask 21. It is. In addition, it is preferable that the vibration frequency of the vibration devices 22 and 23 (vibration unit 45) is 100 Hz to 40 kHz, and the vibration amplitude is 0.1 μm to 10 μm. By appropriately selecting such vibration conditions, the columnar members 12 can be arrayed and mounted at predetermined positions on the substrate 5 in cooperation with the columnar member arranging brush squeegee 28. In addition to the ultrasonic vibration device, it is possible to use a mechanism for converting the rotation of the motor into vibration, a mechanism using a continuous operation of an air cylinder, a magnetostrictive vibrator, a voice coil motor, etc. It is.

  The vibration devices 22 and 23 are attached to the X drive device 17, and can be moved in the Y-axis direction in conjunction with the movement of the columnar member arrangement brush squeegee 28 by the Y-axis drive device 18. The distance between the vibration device 23 and the vibration device 23 is constant. The vibration devices 22 and 23 may be movable in the X-axis direction, and each may be synchronously movable in the X-axis direction, and each may be independently movable in the X-axis direction. The distance from the brush squeegee 28 may be kept constant. However, the movement range of the vibration devices 22 and 23 is outside the range in which the columnar member 12 is mounted on the substrate 5. The transfer operation of the columnar member 12 will be described in more detail with reference to FIG.

  FIG. 4 is an explanatory diagram illustrating the transfer operation of the columnar member 12 by the columnar member transfer unit 25. FIG. 4 shows a part of the columnar member transfer portion 25 in a simplified manner. A plurality of metal electrodes 16 are formed on the substrate 5 placed on the stage 9, and a solder paste 35 is printed on the upper surface of the metal electrodes 16. A columnar member transfer mask 21 is disposed above the substrate 5. On the upper surface of the columnar member transfer mask 21, a large number of columnar members 12 are randomly supplied from the columnar member passages 27. A fixed amount (or a fixed number) measured by a columnar member measuring device (not shown) is dropped and supplied onto the columnar member arrangement mask 21. The columnar member arrangement brush squeegee 28 moves in a spiral while rotating along the upper surface of the columnar member transfer mask 21, and the columnar member arrangement mask 21 is moved by the inner binding linear member 32 and the outer binding linear member 33. The columnar member 12 is moved so as to sweep over the surface of the columnar member 12 and is transferred into the mask opening 34 provided in the columnar member transfer mask 21. Since the solder paste 35 is applied to the substrate 5 at a predetermined position, the columnar member 12 is maintained in the position and posture when it is transferred using the viscosity of the solder paste 35.

  The inner binding linear member 32 and the outer binding linear member 33 are arranged so that the position and posture of the columnar member 12 can be maintained by the solder paste 35 after the columnar member 12 is transferred into the mask opening 34. You may make it push 12 slightly downward. In order to do so, it is preferable to set the thickness of the columnar member arrangement mask 21 to an appropriate dimension with respect to the length of the columnar member 12 in the longitudinal direction (hereinafter referred to as the “full length”). Further, as the solder paste 35, it is preferable to select a solder paste having such a viscosity that the posture can be maintained until the reflow process for bonding and hardening after the columnar member 12 is mounted on the substrate 5.

  In the case where the columnar member 12 is a cylinder, the size of the mask opening 34 provided in the columnar member transfer mask 21 is such that the guide port portion 36 on the supply side of the columnar member 12 is larger than the maximum diameter of the columnar member 12. Less than 12 total lengths. Further, the diameter of the mask opening 34 on the substrate 5 side is a position defining hole 37 having a size capable of defining the position of the columnar member 12 within the application range of the solder paste 35. The guide port portion 36 and the position defining hole portion 37 are continuous with a tapered hole. If the mask opening 34 has such a shape, the columnar member 12 can be smoothly dropped into the mask opening 34 including the effect of vibrating the columnar member transfer mask 21, and the application range of the solder paste 35 can be reduced. It is possible to accurately arrange and mount at predetermined positions. The shape of the mask opening 34 is set in accordance with the shape of the columnar member 12.

  FIG. 5 is a perspective view showing an example of a substrate 5 on which a plurality of columnar members 12 are arranged and mounted. On the substrate 5, the columnar members 12 are arranged at predetermined positions on the solder paste 35, that is, on the metal electrodes 16. The posture of the columnar member 12 is maintained by the viscosity of the solder paste 35. Thereafter, the alignment state of the columnar members 12 is inspected by the inspection device 26 (see FIG. 1), and discharged to the substrate stocker 4. The semiconductor substrate 5 on which the columnar member 12 is mounted is conveyed to, for example, a reflow apparatus, and the substrate 5 and the columnar member 12 are bonded and fixed.

  6 is a plan view showing an example when the substrate 5 is a wafer, FIG. 6A is a plan view of the wafer 5, and FIG. 6B is a dotted line A shown in FIG. 6A. FIG. 5 is an enlarged view showing a part of an enclosed electrode formation region (semiconductor integrated circuit formation region) 51; The semiconductor integrated circuit 52 is surrounded by four scribe lines 53 provided between the groups of metal electrodes 16 and cut by the scribe lines 53 to form individual semiconductor integrated circuit chips. This cutting is performed after the substrate (wafer) 5 on which the columnar member 12 is mounted is reflowed by a reflow apparatus or at the end of the mounting process.

  The electrode 16 is a rewired electrode. The pitch of the rewiring electrodes 16 is approximately 50 μm to 400 μm. FIG. 6 is for explaining the electrode 16 formed on the substrate (wafer) 5 and the arrangement of the electrode forming region 51 on which the electrode 16 is formed. The size, distribution, and electrode forming region of the electrode The shape of 81 is different from the actual one and is not further similar.

  The size of the substrate (wafer) 5 is 300 mm or 200 mm in diameter. The arrangement of the electrodes 16 formed in the polygonal electrode formation region 51 surrounded by the dotted line is called an electrode pattern. The pattern of the mask opening 34 formed in the columnar member transfer mask 21 is a pattern similar to the electrode pattern formed on the substrate (wafer) 5.

[Columnar mounting method]
Next, a columnar member mounting method will be described with reference to FIGS.

  FIG. 7 is a process flow explanatory diagram illustrating the main processes of the columnar member mounting method, and FIG. 8 is an explanatory diagram illustrating the main processes. First, the substrate 5 is set on the stage 9 by the substrate transfer robot 7 from the substrate stocker 4 (step S10). Subsequently, after correcting the warp of the substrate 5 by the substrate correcting device 8, the substrate 5 is conveyed to the solder paste printing device 2. FIG. 8A shows the substrate 5 when it is conveyed to the solder paste printing apparatus 2. A metal electrode 16 is formed on the bottom of the recess 5 a provided on the substrate 5.

  Subsequently, the solder paste printing mask 15 is set, and the solder paste 35 is printed on the substrate 5 by the solder paste printing apparatus 2 (step S20). FIG. 8B shows a state after the solder paste 35 is printed on the substrate 5. The solder paste 35 spreads on the metal electrode 16 due to surface tension and is accommodated in the recess 5a. Subsequently, the substrate 5 is transported to the columnar member transfer device 3, the columnar member transfer mask 21 is set, a predetermined amount of the columnar member 12 is supplied onto the columnar member transfer mask 21, and the excitation devices 22 and 23 are used. While applying vibration to the columnar member transfer mask 21, the columnar member arrangement brush squeegee 28 is driven to introduce the columnar member 12 into the mask opening 34 of the columnar member transfer mask 21 and onto the metal electrode 16 of the substrate 5. Arrange (step S30).

  FIG. 8C shows a state in which the columnar members 12 are arranged on the substrate 5. The solder paste 35 wraps around the bottom and side surfaces of the columnar member 12 in the recess 5a and supports the columnar member 12 with adhesive force. After the columnar members are arranged, the substrate 5 is transported to the inspection device 26, and the arrangement state of the columnar members 12 is inspected (step S40). When there is no excess or deficiency in the arrangement of the columnar members 12 (GO), the material is removed from the columnar member mounting apparatus 1, the process proceeds to the reflow process, and the columnar members 12 are fixed to the substrate 5 (step S 50). Thereafter, the substrate 5 on which the columnar member 12 is mounted is cleaned (step S60). The substrate 5 on which the columnar member 12 is mounted is completed through such steps.

  If the columnar members 12 are found to be excessive or insufficient (NG) by inspection of the arrangement of the columnar members 12 (step S40), a repair operation is performed (step 45), and the process proceeds to the reflow process (step 50). When the columnar member 12 is insufficient, the columnar member 12 is added to the substrate 5, and when the columnar member 12 is excessive, the excess columnar member is removed. In the inspection process (step S40), the substrate 5 in which the columnar member is mounted at a predetermined yield or more is sent to the reflow process (step 50) as it is, and the substrate 5 below the predetermined yield stores its excess / deficiency position. Then, after correcting with another repair machine, it is possible to join the normal transport route and shift to the reflow process (step S50). In addition, when the substrates 5 having a predetermined yield or lower continue, the operation is automatically stopped and an operator call or the like can be transmitted. In addition, when it becomes NG in an inspection process (step 40), the board | substrate 5 may be returned to the columnar member transfer apparatus 3, and an arrangement | sequence process (step S30) may be performed again. Further, a repair device, a reflow device, and a cleaning device may be connected to the columnar member mounting device 1.

  The columnar member mounting apparatus 1 described above is a columnar member mounting apparatus that mounts the columnar member 12 in a predetermined position on the substrate 5, and has a plurality of mask openings 34 corresponding to the predetermined positions of the substrate 5. A columnar member transfer mask 21 disposed above the columnar member transfer mask 21, and a columnar member arrangement brush squeegee 28 which is disposed above the columnar member transfer mask 21 and transfers the columnar member 12 into the mask opening 34 while rotating and moving; Further, there are vibration devices 22 and 23 that apply vibration to the columnar member transfer mask 21 when the columnar member arrangement brush squeegee 28 is driven.

  According to the columnar member mounting apparatus 1, when the columnar member 12 is transferred into the mask opening 34 of the columnar member transfer mask 21 by the columnar member arrangement brush squeegee 28, the columnar member mounting device 1 is used for transferring the columnar member. By applying vibration to the mask 43, the columnar member 12 can be mounted at a predetermined position of the substrate 5 without excess or deficiency.

  The vibration devices 22 and 23 are movable along the upper surface of the columnar member transfer mask 21 in conjunction with the movement of the columnar member arrangement brush squeegee 82. Thus, if the vibration devices 22 and 23 are interlocked with the movement of the columnar member arrangement brush squeegee 28, the columnar member transfer mask 21 is vibrated in the vicinity of the rotational position of the columnar member arrangement brush squeegee 28. This makes it possible to mount the columnar member 12 at a predetermined position of the substrate 5 without excess or deficiency.

  The vibration devices 22 and 23 are arranged so as to sandwich the columnar member arrangement brush squeegee 28. If the vibration devices 22 and 23 are arranged in the vicinity of the columnar member arrangement brush squeegee 28, vibrations can be applied to the columnar member arrangement target position of the columnar member transfer mask 21 in substantially the same manner. It is possible to mount the columnar member 12 with high efficiency without excessive or insufficient positions. Note that the number of vibration devices is not limited to two, and three or four or more vibration devices may be provided.

  The vibration frequency of the vibration devices 22 and 23 used in the columnar member mounting device 1 is 100 Hz to 40 kHz. The vibration frequency of the vibrating devices 22 and 23 is adjusted according to the size and shape of the columnar member 12, but if appropriately adjusted in the range of 100 Hz to 40 kHz, it is suitable for transferring the columnar member 12 to the columnar member transfer mask 21. Therefore, it is possible to mount the columnar member at a predetermined position on the substrate without excess or deficiency.

  Further, if the vibration amplitude of the vibration devices 22 and 23 is appropriately adjusted within a range of 0.1 μm to 10 μm, the columnar member 12 does not jump or vibrate, and the substrate 5 is excessively moved to a predetermined position. It becomes possible to mount the columnar member 12 without shortage.

  The vibration devices 22 and 23 used in the columnar member mounting device 1 are ultrasonic vibration devices, and the vibration devices 22 and 23 have a vibration unit 45, and the columnar member transfer mask 21, the vibration unit 45, and the like. Is provided with a vibration raising / lowering mechanism 46 that can be adjusted within a range of 0 to 1 mm. If the vibration devices 22 and 23 are ultrasonic vibration devices, it is possible to apply vibration to the columnar member transfer mask regardless of whether the vibration unit 45 is in contact with the columnar member transfer mask 21 or not. If the distance between the columnar member transfer mask 21 and the excitation unit 45 is appropriately adjusted within a range of 0 to 1 mm, it is possible to apply appropriate vibration to the columnar member transfer mask 21.

  Further, in the columnar member mounting method, a solder paste printing mask 15 is disposed on the upper surface of the substrate 5 and the solder paste 35 is printed at a predetermined position on the substrate 5 (step S20). After the columnar member transfer mask 21 is disposed above the substrate 5, the columnar member 12 is supplied onto the columnar member transfer mask 21, and the columnar member transfer mask 21 is vibrated while being vibrated. The columnar member 12 is mounted on the substrate 5 by the step (step S30) of rotating and moving 28 to arrange the columnar member 12 at a predetermined position of the substrate 5 on which the solder paste 35 is printed.

  According to such a columnar member mounting method, when the columnar member 12 is transferred to the mask opening 34 of the columnar member transfer mask 21 by the columnar member arrangement brush squeegee 28, vibration is applied to the columnar member transfer mask 21. Thus, the columnar member can be mounted at a predetermined position of the substrate 5 without excess or deficiency.

  When the configuration of the columnar transfer device 3 described with reference to FIG. 3 is taken as a first example, the configuration of the columnar member arrangement brush squeegee 28 and the excitation devices 22 and 23 can be changed. This is the second example. Will be described with reference to FIG.

  FIG. 9 is a diagram illustrating a schematic configuration of a columnar member transfer device 3A according to the second example. Here, differences from the first example (see FIG. 3) will be described, and the same parts and members as in FIG. 3 are denoted by the same reference numerals as in FIG. As shown in FIG. 9, the columnar member arrangement brush squeegee 28 has a binding wire-like member 33 implanted in an attachment portion 30 fixed to the squeegee rotation driving device 29. The binding linear member 33 is configured to follow the rotation locus of the columnar member arrangement brush squeegee 28. The binding wire member 33 shown in FIG. 9 corresponds to the outer binding wire member 33 shown in FIG. 3, and the inner binding wire member 32 is omitted. In FIG. 9, the binding linear member 33 is simplified (schematic).

The binding wire member 33 is a thin twisted yarn assembly having conductivity and flexibility, and moves in the X-axis direction and the Y-axis direction while rotating so as to sweep the surface of the columnar member transfer mask 21. In the meantime, the columnar member 12 is introduced into the mask opening 34. At this time, the tie wire-like member 33 is biased by the contact pressure of ^5g / cm ^{2 ~10g} / cm 2 to the columnar member transfer mask 21 during the transfer operation of the columnar member 12.

Thus, if energized by the contact surface pressure of ^5g / cm ^{2 ~10g} / cm 2 the tie wire-like member 33 to the columnar member transfer mask 21 during the transfer operation of the columnar member 12, the columnar member transfer mask The vibration of 21 is not disturbed. In addition, the columnar member 12 can be prevented from entering between the columnar member transfer mask 21 and the bundling member 33, and the columnar member 21 and the columnar member transfer mask 21 are damaged or deformed. Can be suppressed. Rarely columnar member 12 is a columnar member transfer mask 12 is inadvertently entered between the tie wire-like member 33, the contact surface pressure of the pressing of the tie wire-like member 33 and ^5g / cm ^{2 ~10g} / cm 2 Since it is extremely small, the columnar member 12 can be transferred in a good state without damage such as scratches and dents. Moreover, since the binding linear member 33 is always in contact with the surface of the columnar member transfer mask 21 having moderate flexibility and minute vibration, it is possible to prevent the columnar member 12 from leaking to the outside. It has become.

As shown in FIG. 9, vibration devices 22 and 23 are arranged on both sides of the columnar member transfer portion 25. Each of the vibration exciters 22 and 23 has a vibration portion 45, and an end surface 45 a of the vibration portion 45 on the columnar member transfer mask 21 side comes into contact with the columnar member transfer mask 21 and the columnar member transfer mask. 21 is vibrated. The vibration unit 45 includes a coil spring 55 that is an example of an elastic member.
The force applied by the excitation unit 45 to the columnar member transfer mask 21 is the weight of the excitation unit 45 and the pressing force of the excitation unit lifting mechanism unit 46. The coil spring 55 has a force in a direction that cancels the weight of the vibrating portion 45 in synchronization with the vibration while the end surface 45a of the vibrating portion 45 is always in contact with the columnar member transfer mask 21.

  During the transfer operation of the columnar member 12, the load related to the vibration of the excitation unit itself is canceled by canceling the weight of the excitation unit with the coil spring 55 while the excitation unit 45 is always in contact with the columnar member transfer mask 21. Thus, the columnar member transfer mask can be stably vibrated at a predetermined frequency and amplitude.

[Experimental example]
Subsequently, it is tested that there is an appropriate vibration frequency f and amplitude Z (single amplitude Z ₀ ) of the vibrating devices 22 and 23 (that is, the columnar member transfer mask 21) for mounting (transferring) the columnar member 12. Clarified by. This will be described with reference to FIGS. The experimental example described below shows experimental results when a wafer 5 having a diameter of 200 mm and a Cu columnar member 12 having a diameter of 150 μm and a length of 200 μm are mounted.

In order to vibrate so that the columnar member 12 can be transferred, it is necessary to apply an acceleration equal to or higher than the gravitational acceleration G to the columnar member 12. That is, when the columnar member transfer mask 21 turns from rising to lowering, acceleration of Z ₀ (2πf) ² is applied to the columnar member transfer mask 21. When this value exceeds the gravitational acceleration G (9.8 m / sec ² ), the columnar member 12 moves away from the columnar member transfer mask 21. That is, the columnar member 12 jumps up when the columnar member transfer mask 21 changes from rising to lowering or from falling to rising.

That is, when Z ₀ (2πf) ² > G is satisfied, the columnar member 12 vibrates alone and is easily transferred into the mask opening 34. Here, Z ₀ is the amplitude (one-side amplitude), and f is the excitation frequency. Accordingly, the acceleration applied to the columnar member transfer mask 21 is determined by the amplitude Z ₀ and the excitation frequency f. When the amplitude Z ₀ is large, the acceleration is performed at a low excitation frequency f, and when the amplitude Z ₀ is small, the acceleration is high. It vibrates at the excitation frequency f. The ease of vibration of the columnar member 12 is not affected by the mass of the columnar member 12.

FIG. 10 is a graph showing the relationship between the excitation frequency f obtained by the experiment and the mounting (transfer) yield of the columnar member 12. The horizontal axis represents the excitation frequency (kHz), and the vertical axis represents the mounting yield (%). In the experiment, the mounting yield was measured for each excitation frequency of 0.01 kHz, 0.1 kHz, 1 kHz, 10 kHz, 20 kHz, and 40 kHz with an amplitude Z ₀ of 0.15 μm to 0.3 μm. The vibration application time at each excitation frequency was constant. In the acceleration calculation formula described above, since the excitation frequency f is affected by the square, the mounting yield with respect to the excitation frequency f was measured. The concept of the mounting yield will be described with reference to FIG.

  As shown in FIG. 10, when the excitation frequency f is 1 kHz or less, the mounting yield is 10% to 20%, but the mounting yield rapidly increases beyond 0.1 kHz, and at 10 kHz, 80% and 20 kHz. Was 85% and 90% at 40 kHz. If it is set to 40 kHz or more, the mounting yield can be expected to be further improved, but it is preferable to set it to about 40 kHz in consideration of the size of the vibration unit 45, heat generation, and the like. In FIG. 10, when the excitation frequency f is 10 kHz or less, the mounting portion yield is low. However, it is confirmed that the mounting yield increases as the excitation time is increased.

The columnar member 12 can be transferred in the amplitude Z ₀ in the range of 0.1 μm to 10 μm. Jumping amount of the columnar member 12 is likely to transfer becomes larger when increasing the amplitude Z _0. However, there are restrictions on the output capability and rigidity of the vibration exciters 22 and 23 (enlargement). Further, if the amount of jumping of the columnar member 12 becomes too large, the columnar member transfer mask 21 and the columnar member 12 may be scratched or deformed, and therefore, estimated from the experimental results, 0.1 μm to 0.3 μm. It is preferable that

  FIG. 11 is a diagram for explaining an example of the evaluation result of the mounting yield. As shown in FIG. 11, the wafer 5 is an aggregate of semiconductor integrated circuits (semiconductor chips) 52. In the example shown in FIG. The number of semiconductor chips 52 is 89, and the number of poorly mounted semiconductor chips 52a is ten. The mounting yield is 10/89 = 88.8 (%). In FIG. 11, the number described in the frame of the defective semiconductor chip 52 a represents the number of mounting defects (the number of excess and deficiency of the columnar member 12) in one semiconductor chip 52 a. In the experimental example, the number of columnar members 12 mounted in one chip was 400. Therefore, the above mounting yield represents a so-called chip yield. The poorly mounted semiconductor chip 52a corrects the excess or deficiency in the columnar member transfer device 3 or 3A, or corrects the excess or deficiency by a repair device (not shown).

  As described above, in the columnar member mounting apparatus 1, the mounting yield of the columnar member 12 is increased to 80% or more by setting the vibration frequency (excitation frequency) f of the vibration devices 22 and 23 to 10 kHz to 40 kHz. Therefore, the columnar member can be efficiently transferred to the substrate.

Further, in the columnar member mounting apparatus 1, the columnar member 12 can be efficiently transferred onto the substrate (wafer) 5 by setting the vibration amplitude Z ₀ of the vibration exciters 22 and 23 to 0.1 μm to 0.3 μm. It becomes possible. Further, by setting the amplitude to 0.1 μm to 0.3 μm, it is possible to suppress the occurrence of damage such as damage to the columnar member transfer mask 21 and the columnar member 12.

  It should be noted that the present invention is not limited to the above-described embodiment, but includes modifications and improvements as long as the object of the present invention can be achieved. For example, in the above-described embodiment, the columnar member transfer mask 21 is vibrated by the vibration devices 22 and 23, but the columnar member arrangement brush squeegee 28 is used as a part of the vibration device and the columnar member arrangement brush. It is possible to swing the columnar member 12 by vibrating the squeegee 28. Alternatively, the columnar member transfer mask 21 may be vibrated by the vibration of the columnar member arrangement brush squeegee 28.

  DESCRIPTION OF SYMBOLS 1 ... Columnar member mounting apparatus, 2 ... Solder paste printing apparatus, 3, 3A ... Columnar member transfer apparatus, 5 ... Board | substrate (wafer), 9 ... Stage, 12 ... Columnar member, 15 ... Solder paste printing mask, 15a ... Mask Opening portion (mask for solder paste printing), 16 ... metal electrode, 21 ... mask for columnar member transfer, 22,23 ... vibrating device, 25 ... columnar member transfer portion, 28 ... brush squeegee for columnar member arrangement, 31,32 33 ... Bundling linear member, 34 ... Mask opening (columnar member transfer mask), 35 ... Solder paste, 45 ... Excitation part, 45a ... (excitation part) end face, 46 ... Excitation part raising / lowering mechanism part 51 spring

Claims (11)

A columnar member mounting device for mounting a columnar member in a predetermined position on a substrate,
A columnar member transfer mask having a plurality of mask openings corresponding to predetermined positions of the substrate and disposed on the substrate;
A columnar member arrangement brush squeegee that is disposed above the columnar member transfer mask and transfers the columnar member into the opening while rotating and moving;
An excitation device that vibrates the columnar member transfer mask when driving the columnar member arrangement brush squeegee;
A columnar member mounting apparatus characterized by comprising: In the columnar member mounting apparatus according to claim 1,
The vibration exciter is movable along the upper surface of the columnar member transfer mask in conjunction with the movement of the columnar member arrangement brush squeegee.
The columnar member mounting apparatus characterized by the above-mentioned. In the columnar member mounting measure according to claim 1 or claim 2,
A plurality of the vibration devices are arranged so as to sandwich the columnar member arrangement brush squeegee,
The columnar member mounting apparatus characterized by the above-mentioned. In the columnar member mounting apparatus according to any one of claims 1 to 3,
The vibration frequency of the vibration exciter is 100 Hz to 40 kHz.
The columnar member mounting apparatus characterized by the above-mentioned. In the columnar member mounting apparatus according to claim 4,
The vibration frequency of the vibration exciter is 10 kHz to 40 kHz.
The columnar member mounting apparatus characterized by the above-mentioned. In the columnar member mounting apparatus according to any one of claims 1 to 5,
The amplitude of vibration of the vibration exciter is 0.1 μm to 10 μm.
The columnar member mounting apparatus characterized by the above-mentioned. In the columnar member mounting apparatus according to claim 6,
The amplitude of vibration of the vibration exciter is 0.1 μm to 0.3 μm.
The columnar member mounting apparatus characterized by the above-mentioned. In the columnar part mounting device according to any one of claims 1 to 7,
The vibration device is an ultrasonic vibration device, and the vibration device has a vibration part, and the vibration member adjusts the distance between the columnar member transfer mask and the vibration part within a range of 0 to 1 mm. Having a part lifting mechanism part,
The columnar member mounting apparatus characterized by the above-mentioned. In the columnar member mounting apparatus according to any one of claims 1 to 8,
The vibration device is an ultrasonic vibration device having a vibration unit,
The excitation unit further includes an elastic member that cancels the weight of the excitation unit while always contacting the end surface on the columnar member transfer mask side with the columnar member transfer mask.
The columnar member mounting apparatus characterized by the above-mentioned. In the columnar member mounting apparatus according to any one of claims 1 to 9,
The columnar member arrangement brush squeegee is composed of a thin twisted yarn assembly having electrical conductivity and flexibility, and has the binding linear member that moves while rotating the columnar member arrangement mask surface,
The tie wire-like member is urged by the contact pressure of the columnar member in the transfer mask 5g ^/ cm ² ~10g / cm 2 during the transfer operation of the columnar member,
The columnar member mounting apparatus characterized by the above-mentioned. A columnar member mounting method for mounting a columnar member in a predetermined position on a substrate,
Placing a solder paste printing mask on the upper surface of the substrate, and printing the solder paste at a predetermined position on the substrate;
After the columnar member transfer mask is disposed above the substrate on which the solder paste is printed, the columnar member is supplied onto the columnar member transfer mask, and the columnar member transfer mask is vibrated while being vibrated. And rotating and moving the member arrangement brush squeegee to arrange the columnar members at predetermined positions on the substrate on which the solder paste is printed.
A columnar member mounting method characterized by that.

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