TW201911511A - Columnar member mounting device and method for mounting a columnar member capable of mounting a columnar member at a predetermined position of a substrate without excess or deficiency - Google Patents

Abstract

The present invention provides a columnar member mounting device and a method for mounting a columnar member which are capable of mounting a columnar member at a predetermined position of a substrate without excess or deficiency. In the columnar member mounting device 1 of the present invention, the columnar member 12 is erected and mounted at a predetermined position on the substrate 5, and the columnar member mounting device 1 includes: a columnar member transfer mask 21 disposed on the substrate 5 and having a plurality of mask openings 34 corresponding to the predetermined positions of the substrate 5; a brush-squeegee 28 for arranging the columnar member disposed above the columnar member transfer mask 21, wherein the columnar member 12 is transferred to the mask openings 34 while rotating and moving; and the excitation devices 22 and 23 to apply vibration to the columnar member transfer mask 21 when the brush-squeegee 28 for arranging the columnar member is driven. In the columnar member mounting device 1 and the method for mounting a columnar member, the columnar member 12 is arranged and mounted on the substrate 5 by the brush-squeegee 28 for arranging the columnar member by applying vibration to the columnar member transfer mask 21.

Description

Column member mounting device and column member mounting method

The present invention relates to a columnar member mounting device and a columnar member mounting method.

Conventionally, when electrically connecting a semiconductor substrate and a circuit board, a device in which a plurality of solder bumps formed on a semiconductor substrate are melted between a semiconductor substrate and a circuit board for bonding is generally recognized (for example, reference) Patent Document 1). However, in Patent Document 1, when the semiconductor bump and the circuit substrate are joined by using the solder bump as a bonding material, the solder bumps are expanded in the radial direction after being pressed, thereby shortening the adjacent solder bumps. The distance between the blocks is therefore incapable of adapting to the trend of increasingly miniaturized substrate mounting. Therefore, Patent Document 2 discloses a method of forming a copper pillar (Cu pillar) on a semiconductor substrate as a bonding material with a circuit substrate and bonding by forming a solder layer. Since the copper pillar disclosed in Patent Document 2 does not change in diameter when the semiconductor substrate is bonded to the circuit board, it is suitable for a fine mounting operation. However, since the copper pillars are formed into a columnar shape by electroplating on the semiconductor substrate, it takes a lot of time and it is difficult to claim good productivity. In addition, in the past few years, a columnar member (a conductor pin (Pin)) formed of a metal such as copper has been used as a bonding material instead of a copper column formed on a semiconductor substrate.

However, since the length of the columnar member (conductor pin) in the longitudinal direction is extremely long (large in longitudinal and lateral directions) with respect to the diameter thereof, it is difficult to mount the columnar member on the semiconductor substrate. Patent Document 3 discloses a method of mounting a columnar member on a semiconductor substrate. In the columnar member mounting method described in Patent Document 3, first, a jig palette, a pin upright jig, and an insertion guide jig are stacked, and the columnar member is dropped from above the insertion guide jig to make the jig The panel is vibrated such that the pin upright clamp slides between the clamp panel and the insertion guide clamp, thereby arranging the columnar member in the pin upright fixture. Further, the jig panel, the pin erecting jig, and the insertion guide jig are stacked upside down, and the columnar member is joined to the printed wiring board while the columnar member is erected.

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However, in the columnar member mounting method described in Patent Document 3, since the columnar member is dropped into the pin hole by applying vibration to the jig panel, the vibration causes the columnar members to overlap or be biased into each other. A part of the jig is guided, which makes it difficult to mount the columnar member at a predetermined position on the substrate.

Therefore, in order to solve the above problems, an object of the present invention is to provide a columnar member mounting device and a columnar member mounting method capable of mounting a columnar member at a predetermined position on a substrate without much.

1. The columnar member mounting device according to the present invention, wherein the columnar member is erected at a predetermined position on the substrate, and includes a transfer member for transfer of a columnar member, which is disposed on the substrate and has a a plurality of mask openings corresponding to predetermined positions of the substrate; and a columnar member arranging brush, which is disposed above the columnar member transfer mask, rotates and moves while The columnar member is transferred to the mask opening portion, and the excitation device applies vibration to the columnar member transfer mask when the columnar member array brush blade is driven.

According to the columnar member mounting apparatus of the present invention, when the columnar member is transferred to the mask opening of the columnar member transfer mask by the columnar member arranging brush, the columnar member is shielded by the transfer of the columnar member. When the cover is vibrated, the columnar member can be mounted on a predetermined position of the substrate without much.

2. In the columnar member mounting device of the present invention, it is preferable that the excitation device is capable of transferring the mask along the columnar member in conjunction with the movement of the columnar member arranging brush blade. The upper end of the movement.

When the excitation device is moved in conjunction with the movement of the columnar member squeegee, the columnar member transfer mask can be vibrated in the vicinity of the rotational position of the columnar member arranging blade. The columnar member is mounted on a predetermined position of the substrate in a small amount.

3. In the columnar member mounting apparatus of the present invention, it is preferable that the excitation device is disposed in plural, and the columnar member arrangement squeegee is sandwiched in the arrangement.

When a plurality of excitation devices are disposed in the vicinity of the columnar member arranging brush, it is possible to apply almost the same vibration to the columnar member arrangement target position of the columnar member transfer mask, thereby efficiently performing the columnar shape. The member is mounted on a predetermined position of the substrate in a small amount.

4. In the columnar member mounting device of the present invention, it is preferable that the vibration frequency of the vibration excitation device is 100 Hz to 40 kHz.

Although the vibration frequency of the excitation device can be adjusted according to the size and shape of the columnar member, the columnar member can be transferred to the column member transfer mask as long as it is appropriately adjusted in the range of 100 Hz to 40 kHz. Appropriate vibration is applied to mount the columnar member at a predetermined position on the substrate without much.

5. In the columnar member mounting apparatus of the present invention, it is preferable that the vibration frequency of the excitation device is 10 kHz to 40 kHz.

As described above, if the vibration frequency of the excitation device is appropriately adjusted within the range of 100 Hz to 40 kHz, vibration can be applied to the columnar member to be transferred to the substrate. However, if the vibration frequency of the excitation device is further set In the range of 10 kHz to 40 kHz, it is possible to increase the mounting cost of the columnar member by 80% or more, and to transfer the columnar member to the substrate more efficiently.

6. In the columnar member mounting apparatus of the present invention, it is preferable that the amplitude of the vibration of the excitation device is set to be 0.1 μm to 10 μm.

Although the amplitude of the vibration of the excitation device can be adjusted according to the size and shape of the columnar member, if it is appropriately adjusted in the range of 0.1 μm to 10 μm, it is possible to prevent the columnar member from jumping or not vibrating. In this case, the columnar member is mounted on a predetermined position of the substrate in a small amount.

7. In the columnar member mounting apparatus of the present invention, it is preferable that the amplitude of the vibration of the excitation device is set to 0.1 μm to 0.3 μm.

As described above, the amplitude of the vibration of the excitation device can be transferred to the substrate as long as it is set in the range of 0.1 μm to 10 μm. However, if the amplitude is too large, the columnar member may jump up to hit the columnar member transfer mask and cause damage to the columnar member and the columnar member transfer mask. Therefore, by setting the amplitude of the vibration of the excitation device to be further in the range of 0.1 μm to 0.3 μm, it is possible to suppress damage to the columnar member and the columnar member transfer mask.

8. In the columnar member mounting apparatus of the present invention, preferably, the excitation device is an ultrasonic vibration device having an excitation unit and capable of transferring the columnar member. The distance between the mask and the excitation unit is adjusted to an excitation unit elevating mechanism unit in a range of 0 mm to 1 mm.

By using the ultrasonic vibration device as the excitation device, it is possible to apply vibration to the column-shaped member transfer mask regardless of whether or not the excitation portion comes into contact with the columnar member transfer mask, and the column is simply placed When the distance between the mask for transferring the member and the excitation unit is appropriately adjusted within a range of 0 mm to 1 mm, appropriate vibration can be applied to the mask for transferring the columnar member.

9. In the columnar member mounting apparatus of the present invention, preferably, the excitation device is an ultrasonic vibration device and includes an excitation unit, and the excitation unit further includes: for transferring the columnar member An elastic member that cancels the self-weight of the excitation unit while the end surface on the side of the mask is always in contact with the cover for transfer of the columnar member.

The elastic member is a member that generates the excitation portion to be pulled upward, and is, for example, a spring or the like. By offsetting the self-weight of the excitation unit by the elastic member, the load due to the vibration of the excitation unit itself can be reduced, and the column-shaped member transfer cover can be stably vibrated at a predetermined frequency and amplitude.

10. In the columnar member mounting device of the present invention, it is preferable that the columnar member arranging brush has a thin twisted wire assembly having conductivity and flexibility, and The columnar member transfers a bundled linear member that moves while rotating on the surface of the mask, and the bundled linear member applies the mask for transferring the columnar member during the transfer operation of the columnar member. Contact pressure of 5 g/cm ² to 10 g/cm ² .

In this case, the columnar member can be prevented from being mixed between the columnar member transfer mask and the bundled linear member by the vibration of the column member transfer mask. Even if the columnar member is occasionally mixed between the columnar member transfer mask and the bundled linear member, since the contact pressure pressed by the bundled linear member is a minimum pressure of 5 g/cm ² to 10 g/cm ² , It is possible to carry out the transfer in a good state without causing damage to the columnar member such as a wound or a dent. In addition, since the bundled linear member has moderate flexibility and is always in contact with the surface of the minute member for the columnar member for fine vibration, it is possible to suppress the columnar member from being left outside.

11. The columnar member mounting method according to the present invention, wherein the columnar member is erected at a predetermined position on the substrate, and includes a printing step of disposing a mask for solder printing on the upper end surface of the substrate, Solder printing at a predetermined position of the substrate; and an arranging step of disposing the columnar member transfer mask over the substrate on which the solder is printed, and then providing the column on the columnar member transfer mask And the columnar member is rotated and moved by the brush squeegee while the vibration is applied to the columnar member transfer mask, and the column is arranged at a predetermined position of the substrate on which the solder is printed. Shaped member.

According to the columnar member mounting method of the present invention, when the columnar member is transferred to the mask opening of the columnar member transfer mask by the columnar member arranging brush, the columnar member is shielded by the transfer of the columnar member. When the cover is vibrated, the columnar member can be mounted on a predetermined position of the substrate without much.

Hereinafter, a columnar member mounting device 1 according to an embodiment of the present invention and a columnar member mounting method using the columnar member mounting device 1 will be described with reference to FIGS. 1 to 8 .

Configuration and operation of the columnar member mounting device 1

FIG. 1 is a plan view showing a schematic configuration of a columnar member mounting device 1 according to an embodiment. The columnar member mounting device 1 includes a substrate holder 4 for storing the substrate 5 on which the columnar member 12 (see FIGS. 3 and 4) should be mounted; and transporting the substrate 5 from the substrate holder 4 to the pre-alignment a pre-aligner 6, and further transport the substrate 5 from the pre-aligner 6 to the substrate transport robot 7 of the stage 9; the solder printing device 2 that prints the solder 35 (see FIG. 2) on the substrate 5; And the columnar member transfer device 3 that transfers the columnar member 12 onto the substrate 5 on which the solder 35 is printed. Further, the columnar member mounting device 1 further includes an inspection device 26 for inspecting the mounted state of the columnar member 12, and a cleaning device 20 for removing excess solder 35 adhering to the back surface of the solder printing mask 15.

The substrate 5 is a plate-shaped or film-like member for fixing an electronic component, and is mounted with an electronic component including an integrated circuit, and includes a wafer such as a semiconductor substrate and a compound semiconductor substrate, and a glass substrate. The solder 35 is used to join the columnar member 12 to the substrate 5, and the material of the columnar member 12 is copper or a copper-based alloy. The solder 35 is made of a solder having a high adhesive force so that the transferred columnar member 12 does not move or fall.

The substrate stocker 4 is composed of a load port (Unloaded Port) and an unloaded port (UnLoad Port) (sometimes referred to as a load port when the target substrate is a wafer), and the transport robot 7 takes out the substrate 5 from the load port. It is delivered to the pre-aligner 6. When the substrate 5 is a wafer, the substrate 5 corrected by the position of the center of gravity of the substrate 5 and the notch direction formed on the outer periphery of the substrate 5 by the pre-aligner 6 is transported to the stage 9, and then The transport robot 7 returns to the standby position. The substrate 5 placed on the stage 9 is decompressed and adsorbed on the stage 9, and the substrate 5 is pressed by the substrate correcting device 8 to correct the warpage of the substrate. The stage 9 is adjusted in the Y-axis direction on the Y-axis guide rail 10, and is moved on the X-axis guide rail 11 while the substrate 5 is placed, and is transported to a predetermined position of the solder printing apparatus 2. Here, the horizontal direction in the first drawing is referred to as an X axis, the vertical direction is referred to as a Y axis, and the height direction (thickness direction) is referred to as a Z axis.

The stage 9 can be moved in the XY plane and the Z direction by the X-axis guide rail 11, the Y-axis guide rail 10, the Z-stage (not shown), and the θ stage (not shown), so that the substrate 5 can be transported to Below the solder printing device 2 and the columnar member transfer device 3. The stage 9 reciprocates along the X-axis guide rail 11 between the substrate correcting device 8, the solder printing device 2, and the columnar member transfer device 3, thereby transporting the substrate 5 to each predetermined position.

After the stage 9 on which the substrate 5 is placed is moved along the X-axis guide 11 to the lower side of the solder printing apparatus 2, the solder 35 is printed on the substrate 5 using the solder printing mask 15. If the solder 35 has been previously printed on the substrate 5 elsewhere or in other steps, the printing step can be skipped. The cleaning device 20 removes the excess solder 35 adhering to the back surface of the solder printing mask 15 using a cleaning sheet or a roller containing a solvent. The cleaning device 20 can also blow away or vacuum-extract the excess solder 35 adhering to the back surface of the solder printing mask 15 by means of an air gun. The procedure for printing the solder 35 on the substrate 5 will be specifically described with reference to FIG. The substrate 5 on which the solder 35 is printed is moved along the X-axis guide 11 to the lower side of the columnar member transfer device 3 while being placed on the stage 9.

The columnar member transfer device 3 includes an X-axis drive device 17, a Y-axis drive device 18, and a Z-axis drive device 19, and can move the columnar member transfer portion 25 in the X-axis direction, the Y-axis direction, and the Z-axis direction. Further, the Z-axis and the θ-axis (not shown) are present on the Y-axis guide rail 10 and the X-axis guide rail 11, and the shield opening 15a of the solder printing mask 15 is driven by the Z-axis and the θ-axis. (refer to FIG. 2), the mask opening portion 34 of the columnar member transfer mask 21 (see FIG. 3), and the position of the metal electrode 16 of the substrate 5, and solder printing and mounting of the columnar member on the substrate 5. 12.

The X-axis driving device 17 is provided with excitation devices 22 and 23 that sandwich the columnar member transfer portion 25 on both sides. The excitation devices 22 and 23 move in conjunction with the movement of the columnar member transfer unit 25, and apply vibration in the Z direction to the columnar member transfer mask 21, and the columnar member arrangement brush blade 28 to be described later (refer to Fig. 3) cooperates to transfer the columnar member 12 into the opening portion 34 of the columnar member transfer mask 21. The configuration and transfer operation of the columnar member transfer unit 25 will be described with reference to FIGS. 3 and 4 .

The substrate 5 on which the columnar member 12 is mounted passes through the solder printing apparatus 2 and the substrate correcting device 8, and is then transported to the inspection device 26 to inspect the columnar member 12 by an image recognition camera (not shown). The state is arranged and then discharged into the substrate stocker. In the return journey, the pre-aligner 6 is not routed.

Printing of solder 35

FIG. 2 is an explanatory diagram of a printing process of the solder 35 by the solder printing device 2 used in the columnar member mounting device 1. In the figure, each part is subjected to, for example, an enlarged display. A recess 5a is formed in a position on the substrate 5 where the columnar member 12 is to be mounted, and a metal electrode 16 is formed on the bottom of the recess 5a. The printing blade 24 moves along the upper end surface of the solder printing mask 15 from the left side to the right side of the drawing. The printing blade 24 is made of a flexible resin material so as not to damage the surface of the solder printing mask 15. In the solder printing mask 15, an opening 15a is formed corresponding to the position at which the concave portion 5a of the substrate 5 is formed.

In the second drawing, the position of the leftmost mask opening 15a is taken as the position (a), the position of the intermediate mask opening 15a is the position (b), and the position of the rightmost mask opening 15a is used as the position. (c). The position (a) indicates the solder 35 after the printing blade 24 is covered by the opening 15a, and the solder 35 does not leave the surface of the solder printing mask 15. Further, it is included in the recess 5a of the substrate 5 in contact with the metal electrode 16. The position (b) indicates a state before the printing blade 24 prints the solder 35 on the substrate 5 from the mask opening 15a.

The position (c) indicates the mask opening portion 15a for printing the next solder paste. After the squeegeeing operation is completed, the printing mask 15 is removed, the solder paste 35 is separated from the mask opening portion 15a, and transferred to the bottom of the opening of the substrate 5 to complete the printing of the solder paste 35. Fig. 8(b) shows the state of the solder paste 35 after the end of printing. At the position (c), the residue of the solder paste 35 remaining at the time of the previous solder paste printing has a small amount attached to the inner peripheral surface of the mask opening portion 15a. Therefore, when the excess solder paste is larger than the reference amount, the excess solder paste is cleaned and removed by the cleaning device 20.

The structure and transfer operation of the columnar member transfer unit 25

FIG. 3 is an explanatory view showing a schematic configuration of a columnar member transfer portion 25 used in the columnar member mounting device 1. The columnar member transfer portion 25 has a rotatable columnar member arranging brush blade 28 attached to the X-axis driving device 17. The columnar member arranging brush blade 28 has a bundled linear member 31 that is implanted on the mounting portion 30 fixed to the blade rotation driving device 29. The bundled linear member 31 has a double structure (double concentric circles) in the radial direction of the rotational trajectory of the columnar member arranging brush blade 28, and is composed of the inner bundled linear member 32 and the outer bundled linear member 33. . Both the inner bundled linear member 32 and the outer bundled linear member 33 are brushes having a diverging shape from the attachment portion 30 to the columnar member transfer mask 21. In Fig. 3, the bundled linear member 31 is shown in a simplified manner.

The inner bundled linear member 32 mainly functions to introduce the columnar member 12 into the mask opening portion 34 of the columnar member transfer mask 21, and the outer bundled linear member 33 has a main function of not allowing the columnar member 12 is detached from the outer side of the columnar member arranging brush blade 28, that is, the columnar member 12 is not allowed to be separated from the outer side of the bundled linear member 33. Further, the outer bundled linear member 33 further has a columnar member 12 that is disposed between the inner and inner bundled linear members 32, and is introduced into the mask opening portion 34, and returns to the inner side of the bundled linear member 32. The function. For example, if the columnar member array squeegee 28 is rotated in the direction of the arrow and the columnar member 12 is introduced into the mask opening portion 34, the columnar member arranging brush blade 28 can be rotated in the opposite direction of the arrow to cause the column. The member 12 returns to the inside of the bundled linear member 32.

The bundled linear member 31 is a thin twisted wire assembly having conductivity and flexibility, and is swung over the surface of the columnar member transfer mask 21 and moved in the X-axis direction and the Y-axis direction. During this period, the columnar member 12 is introduced into the mask opening portion 34. Therefore, it does not cause damage to the columnar member 12.

Further, since the bundled linear member 31 is electrically conductive, dust does not adhere to it by static electricity, and it is possible to perform mounting with high cleanliness. Further, although simplified in FIG. 3, the outer bundled linear member 33 is more densely arranged than the inner bundled linear member 32.

On the stage 9 on which the substrate 5 is placed, a suction passage 40 penetrating in the thickness direction is provided, and the suction passage 40 communicates with the vacuum suction passage 42 provided on the base portion 41 and vacuum-attracts the substrate 5 to the stage 9.

Exciting devices 22 and 23 are disposed on both sides of the columnar member transfer portion 25. Each of the excitation devices 22 and 23 has an excitation unit 45, and the excitation unit 45 is in contact with the columnar member transfer mask 21. The excitation devices 22 and 23 further include an excitation unit elevating mechanism unit 46 that adjusts the distance between the columnar member transfer mask 21 and the excitation unit 45 within a range of 0 mm to 1 mm. The excitation devices 22 and 23 are ultrasonic vibration devices, and when the columnar member arrangement squeegee 28 performs the transfer operation of the columnar member 12, vibration is applied to the columnar member transfer mask 21. When the excitation devices 22 and 23 are ultrasonic vibration devices, it is possible to apply vibration to the columnar member transfer mask 21 when the distance between the excitation unit 45 and the columnar member transfer mask 21 is less than 1 mm. Further, it is preferable to set the vibration frequency of the excitation devices 22 and 23 (excitation portion 45) to be in the range of 100 Hz to 40 kHz, and to set the amplitude to be 0.1 μm to 10 μm. By appropriately selecting the vibration conditions as described above, the columnar member arrangement squeegee 28 can be operated in cooperation, and the columnar members 12 can be arranged in a predetermined position on the substrate 5 without being arranged in a large amount. Further, in addition to the ultrasonic vibration device, a mechanism for converting the rotation of the motor into vibration, a mechanism for continuously operating the cylinder, a magnetostrictive oscillator, or a voice coil motor may be used as the vibration excitation device.

The excitation devices 22 and 23 are attached to the X drive device 17, and are movable in the Y-axis direction in conjunction with the movement of the columnar member arrangement squeegee 28 by the Y drive device 18. In addition, the distance between the excitation device 22 and the excitation device 23 is fixed. Further, the excitation devices 22 and 23 can be moved in the X-axis direction in synchronization with each other, and the excitation devices 22 and 23 can be independently moved in the X-axis direction and arranged in the columnar member. The distance between the brush blades 28 is kept constant. However, the range of movement of the excitation devices 22 and 23 is set outside the range in which the columnar member 12 is mounted on the substrate 5. The transfer operation of the columnar member 12 will be described in detail with reference to FIG.

Fig. 4 is an explanatory view of the transfer operation of the columnar member 12 by the columnar member transfer portion 25. A part of the columnar member transfer portion 25 is shown in the drawing. On the substrate 5 placed on the stage 9, a plurality of ''metal electrodes 16 are formed, and solder 35 is printed on the upper end surface of the metal electrodes 16. A columnar member transfer mask 21 is disposed above the substrate 5. The plurality of columnar members 12 are randomly supplied from the columnar member passages 27 to the upper end surface of the columnar member transfer mask 21. The columnar member 12 is dropped by a columnar member weighing device (not shown) by a fixed amount (or a fixed amount) and supplied to the columnar member transfer mask 21. The columnar member arranging brush blade 28 is spirally moved while rotating along the upper end surface of the columnar member transfer mask 21, and is bundled from the column by the inner bundled linear member 32 and the outer bundled linear member 33. The surface of the mask transition 21 is swept to transfer the columnar member 12 to the mask opening portion 34 provided in the columnar member transfer mask 21. Since the solder 35 is applied to a predetermined position on the substrate 5, the position and posture of the columnar member 12 when the transfer is performed by the viscosity of the solder 35 is maintained.

The inner bundled linear member 32 and the outer bundled linear member 33 can be gently pressed downward by the columnar member 12 after the columnar member 12 is transferred into the mask opening portion 34 so that it can be soldered 35 maintains the position and posture of the columnar member 12. In order to achieve such an object, it is preferable to set the thickness of the columnar member transfer mask 21 to a suitable length in the longitudinal direction of the columnar member arranging brush blade 28. Further, it is preferable that the solder 35 maintains its posture before the columnar member 12 is mounted on the substrate 5 until the reflow step of bonding hardening is performed.

When the columnar member 12 is a cylinder, the size of the guide opening portion 36 on the side of the mask opening portion 34 provided on the column member transfer mask 21 that provides the columnar member 12 is larger than the maximum value of the columnar member 12. The diameter is larger and smaller than the length of the columnar member 12. Further, the diameter of the mask opening portion 34 on the substrate 5 side is the size of the position specification hole portion 37 capable of specifying the position of the columnar member 12 within the application range of the solder paste 35. Further, the guide port portion 36 is connected to the position gauge hole portion 37 in a tapered hole. By providing the mask opening portion 34 in this shape, the columnar member 12 can be smoothly dropped into the mask opening portion 34 together with the effect of vibrating the columnar member transfer mask 21, so that the solder 35 is formed. Arrange and mount correctly at a predetermined position in the coating range. In addition, the shape of the mask opening portion 34 is set in accordance with the shape of the columnar member 12.

Fig. 5 is a perspective view showing an example of a substrate 5 in which a plurality of columnar members 12 are arranged and mounted. On the substrate 5, the columnar member 12 is disposed on the solder 35, that is, at a predetermined position on the metal electrode 16. The columnar member 12 maintains the posture by the viscosity of the solder 35. Then, the arrangement state of the columnar members 12 is inspected by the inspection device 26 (refer to Fig. 1), and is discharged into the substrate stocker 4. The semiconductor substrate 5 on which the columnar member 12 is mounted is transported, for example, to a reflow device, and the substrate 5 and the columnar member 12 are joined and fixed.

Fig. 6 is a plan view showing an example of a case where the substrate 5 is a wafer, wherein Fig. 6(a) is a plan view of the wafer 5, and Fig. 6(b) is an electrode forming region surrounded by a broken line A on the sixth (a) side. A partially enlarged view of the (semiconductor integrated circuit region) 51. The four sides of the semiconductor integrated circuit 52 are surrounded by a dicing line 53 disposed between a group of metal electrodes 16, and are cut by the dicing lines 53 to become respective semiconductor integrated circuit chips. This dicing step is performed after the substrate (wafer) 5 on which the columnar member 12 is mounted is reflowed by a reflow device or at the end of the mounting step.

The electrode 16 is an electrode that has been rewired. The gap of the rewiring electrode 16 is approximately 50 μm to 400 μm. Fig. 6 is a view for explaining the arrangement of the electrode 16 formed on the substrate (wafer) 5 and the electrode forming region 51 on which the electrode 16 is formed, the electrode size and distribution shown in the drawing, and the shape of the electrode forming region 51 and The objects are different and not similar.

The substrate (wafer) 5 has a diameter of 300 mm, 200 mm, or the like. The arrangement of the electrodes 16 formed on the electrode formation region 51 surrounded by the dotted line is referred to as an electrode pattern. The pattern of the mask opening portion 34 formed on the columnar member transfer mask 21 is similar to the electrode pattern formed on the substrate (wafer) 5.

Column member mounting method

Next, a method of mounting the columnar member will be described with reference to FIGS. 7 and 8.

Fig. 7 is a flow chart showing the steps of the main steps of the columnar member mounting method. Figure 8 is an explanatory diagram of the main steps. First, the substrate 5 is placed on the stage 9 from the substrate stocker 4 by the substrate transfer robot 7 (step S10). Next, after the substrate 5 is corrected by the substrate correcting device 8, the substrate 5 is transported to the solder printing device 2. Fig. 8(a) shows the substrate 5 after being transported to the solder printing apparatus 2. A metal electrode 16 is formed on the bottom of the recess 5a provided on the substrate 5.

Next, a solder printing mask 15 is provided, and the solder 35 is printed on the substrate 5 by the solder printing device 2 (step S20). Fig. 8(b) shows a state in which the solder 35 is printed on the substrate 5. The solder 35 spreads on the metal electrode 16 by surface tension and is filled into the recess 5a. Then, the substrate 5 is transported to the columnar member transfer device 3, and the columnar member transfer mask 21 is provided, and a predetermined amount of the columnar member 12 is supplied to the columnar member transfer mask 21 while being excited. The devices 22 and 23 apply vibration to the columnar member transfer mask 21, and drive the columnar member array brush blade 28 to introduce the columnar member 12 into the mask opening portion 34 of the columnar member transfer mask 21. This is arranged on the metal electrode 16 (step S30).

Fig. 8(c) shows a state in which the columnar members 12 are arranged on the substrate 5. The solder 35 flows in the concave portion 5a to the bottom surface and the side surface of the columnar member 12 and supports the columnar member 12 by the adhesive force. After the arrangement of the columnar members, the substrate 5 is transported to the inspection device 26, and the arrangement state of the columnar members 12 is inspected (step S40). When the columnar members 12 are arranged without much more (GO), the columnar member mounting device 1 performs the stripping, and proceeds to the reflow step to fix the columnar member 12 to the substrate 5 (step S50). ). Then, the substrate 5 on which the columnar member 12 is mounted is cleaned (step S60). After the above steps, the substrate 5 on which the columnar member 12 is mounted is completed.

When the arrangement state of the columnar members 12 is checked (step S40), if it is determined that the columnar members 12 are excessive or too small (NG), the repair operation (step S45) is performed, and then the reflow step is performed. (Step S50). When the columnar member 12 is too small, the columnar member 12 is added to the substrate 5, and when the columnar member 12 is excessive, the excess columnar member 12 is removed. In the inspection step (step S40), the substrate 5 having the columnar member mounted at a predetermined output or more can be directly conveyed to the reflow step (step S50), and the substrate 5 having a predetermined throughput cannot be preliminarily subjected to the column. The shape member is stored in an excessively small number of positions, and then, after being trimmed by another repair machine, is returned to the normal conveyance path and then proceeds to the reflow step (step S50). Further, it is also possible to automatically stop the operation when the substrate 5 that does not reach the predetermined throughput is continuously generated, and issue an instruction such as an operator call. When the inspection step (step S40) is performed, when it is judged as NG, the substrate 5 can be returned to the columnar member transfer device 3, and the aligning step is performed here (step S30). It is also possible to connect the columnar member mounting device 1 with the repairing device, the reflow device, and the cleaning device.

As described above, the columnar member mounting device 1 mounts the columnar member 12 at a predetermined position of the substrate 5, and includes a columnar member transfer mask 21 which is disposed on the substrate 5 and has a regulation with the substrate 5. a plurality of mask openings 34 corresponding to the positions; the columnar member arranging brush 28 is disposed above the columnar member transfer mask 21, and the columnar member 12 is transferred to the mask opening while rotating and moving. In the portion 34 and the excitation devices 22 and 23, when the columnar member arranging brush 28 is driven, vibration is applied to the columnar member transfer mask 21.

When the columnar member 12 is transferred to the mask opening portion 34 of the columnar member transfer mask 21 by the columnar member arranging brush blade 28, the columnar member mounting device 1 is used for excitation. When the devices 22 and 23 apply vibration to the columnar member transfer mask 21, the columnar member 12 can be mounted on a predetermined position of the substrate 5 without much.

Further, the excitation devices 22 and 23 are movable along the upper end surface of the columnar member transfer mask 21 in conjunction with the movement of the columnar member array squeegee 28. In this manner, if the excitation devices 22 and 23 are interlocked with the movement of the columnar member arranging brush 28, the column member can be transferred to the vicinity of the rotational position of the columnar member squeegee 28. When the vibration is applied to the 21, the columnar member 12 is mounted on the predetermined position of the substrate 5 in a small amount.

Further, the excitation devices 22 and 23 are disposed with the columnar member arranging brush holder 28 interposed therebetween. When the excitation devices 22 and 23 are disposed in the vicinity of the columnar member arranging brush 28, almost the same vibration can be applied to the columnar member arrangement target position of the columnar member transfer mask 21, thereby efficiently The columnar member 12 is mounted on a predetermined position of the substrate 5 without much. Further, the excitation device is not limited to two, and three or four or more may be arranged, or only one may be arranged.

Further, the vibration frequency of the excitation devices 22 and 23 used in the columnar member mounting device 1 is 100 Hz to 40 kHz. Although the vibration frequency of the excitation devices 22 and 23 can be adjusted according to the size and shape of the columnar member 12, the columnar member can be transferred to the columnar member by appropriately adjusting it in the range of 100 Hz to 40 kHz. The transfer mask 21 applies appropriate vibration to mount the columnar member 12 at a predetermined position on the substrate 5 without much.

Further, if the amplitude of the vibration of the excitation devices 22 and 23 is appropriately adjusted within the range of 0.1 μm to 10 μm, it is possible to prevent the columnar member 12 from jumping or not vibrating, and the columnar member 12 is not much. A lot of ground is mounted on a predetermined position of the substrate 5.

In addition, the excitation devices 22 and 23 used in the columnar member mounting device 1 are ultrasonic vibration devices, and the excitation devices 22 and 23 have the excitation unit 45, and the columnar member transfer mask 21 can be excited. The distance between the portions 45 is adjusted to the excitation portion elevating mechanism portion 46 in the range of 0 mm to 1 mm. By using the ultrasonic vibration device as the excitation devices 22 and 23, the columnar member transfer mask 21 can be applied regardless of whether or not the excitation unit 45 comes into contact with the columnar member transfer mask 21. By appropriately adjusting the distance between the columnar member transfer mask 21 and the excitation unit 45 in the range of 0 mm to 1 mm, it is possible to apply appropriate vibration to the columnar member transfer mask 21.

Further, the columnar member mounting method includes a printing step (step S20), a solder printing mask 15 is disposed on the upper end surface of the substrate 5, and solder 35 is printed at a predetermined position of the substrate 5; In the step (step S30), after the columnar member transfer mask 21 is placed above the substrate 5 on which the solder 35 is printed, the columnar member 12 is provided on the columnar member transfer mask 21, and the columnar member is transferred to the columnar member. When the vibration is applied by the mask 21, the columnar member array is rotated and moved by the brush blade 28, and the columnar member 12 is arranged at a predetermined position of the substrate 5 on which the solder 35 is printed.

According to the above-described columnar member mounting method, when the columnar member 12 is transferred to the mask opening portion 34 of the columnar member transfer mask 21 by the columnar member arranging brush blade 28, the columnar shape is used. By applying vibration to the member transfer mask 21, the columnar member 12 can be mounted on a predetermined position of the substrate 5 without much.

In addition, when the configuration of the columnar member transfer device 3 described in FIG. 3 is taken as an example, the configuration of the columnar member arranging brush blade 28 and the excitation devices 22 and 23 can be replaced. Hereinafter, the second example will be described with reference to FIG.

FIG. 9 is an explanatory view showing a schematic configuration of a columnar member mounting device 3A according to a second example. The differences between the first example and the first example (see FIG. 3) will be described below, and the same portions and members as those in FIG. 3 will be denoted by the same reference numerals as those in FIG. 3. As shown in FIG. 9, the columnar member arranging brush blade 28 has a bundled linear member 33 that is implanted in the mounting portion 30 fixed to the blade rotation driving device 29. The bundled linear member 33 is formed along the rotation locus of the columnar member arranging brush blade 28. The bundled linear member 33 shown in Fig. 9 corresponds to the outer bundled linear member 33 shown in Fig. 3, and the inner bundled linear member 32 is omitted. Further, in Fig. 9, the bundled linear member 33 is shown in a simplified manner.

The bundled linear member 33 is a thin twisted wire assembly having conductivity and flexibility, and is swung over the surface of the columnar member transfer mask 21 and moved in the X-axis direction and the Y-axis direction. The columnar member 12 is introduced into the mask opening portion 34. In this case, during the transfer operation of the cylindrical member 12, the linear cluster of column-shaped member 33 the transfer member 21 is applied with a mask 5g / cm contact pressure of ² ~ 10g / cm ² in.

Thus, since during the transfer operation of the cylindrical member 12, the linear cluster of column-shaped member 33 the transfer member 21 with a contact pressure applied to the mask ^{5g / cm 2 ~ 10g / cm} 2 , and therefore does not interfere with the pillar The vibration of the mask 21 for component transfer. Further, it is possible to prevent the columnar member 12 from being mixed between the columnar member transfer mask 21 and the bundled linear member 33, thereby suppressing damage or deformation of the columnar member 12 and the columnar member transfer mask 21. Even if the columnar member 12 is occasionally mixed between the columnar member transfer mask 21 and the bundled linear member 33, the contact pressure pressed by the bundled linear member 33 is extremely small as 5 g/cm ² to 10 g/cm ² . Since the pressure is applied, it is possible to perform the transfer in a good state without causing damage to the columnar member 12 such as a wound or a dent. In addition, since the bundled linear member 33 has moderate flexibility and is always in contact with the surface of the columnar member for transferring the minute vibrations, it is possible to prevent the columnar member 12 from being left outside.

As shown in Fig. 9, the excitation devices 22 and 23 are disposed on both sides of the columnar member transfer portion 25. Each of the excitation devices 22 and 23 has an excitation unit 45, and the end surface 45a of the excitation unit 45 on the side of the columnar member transfer mask 21 is in contact with the columnar member transfer mask 21 to transfer the columnar member. The mask 21 vibrates. The excitation unit 45 has a coil spring 55 as an example of an elastic member.

The force applied by the excitation unit 45 to the columnar member transfer mask 21 is derived from the self-weight of the excitation unit 45 and the pressing force of the excitation unit lifting and lowering mechanism unit 46. The coil spring 55 keeps the end surface 45a of the excitation unit 45 in contact with the columnar member transfer mask 21, and applies a force that cancels the direction of the self-weight of the excitation unit 45 in synchronization with the vibration.

When the transfer operation of the columnar member 12 is performed, the excitation unit 45 is always in contact with the columnar member transfer mask 21, and the coil spring 55 is used to cancel the self-weight of the excitation unit 45, thereby reducing the excitation. The load due to the vibration of the vibrating portion 45 itself causes the columnar member transfer mask 21 to stably vibrate at a predetermined frequency and amplitude.

Experimental example

In the experiment, it was found that the mounting (transfer) operation of the columnar member 12 requires the excitation devices 22 and 23 (that is, the columnar member transfer mask 21) to have an appropriate vibration frequency f and an amplitude Z (half amplitude Z0). This will be described with reference to Figs. 10 and 11 . Further, in the experimental example described below, an experimental result obtained by mounting a columnar member 12 made of copper having a diameter of 150 μm and a length of 200 μm on a wafer 5 having a diameter of 200 mm is shown.

In order to allow the columnar member 12 to vibrate in a moving manner, it is necessary to apply an acceleration greater than the gravitational acceleration G to the columnar member 12. In other words, the acceleration of the shield member 21 Z0 (2πf) 2 is transferred to the columnar member when the columnar member transfer mask 21 is raised or lowered. Once the acceleration value exceeds the gravitational acceleration G (9.8 m/sec ² ), the columnar member 12 leaves the columnar member transfer mask 21. In other words, when the columnar member transfer mask 21 is turned from falling to falling or from falling to rising, the columnar member 12 is jumped.

That is, when Z0(2πf)2>G is satisfied, the columnar member 12 vibrates individually to be easily transferred into the mask opening portion 34. Here Z0 is the excitation frequency. Therefore, the acceleration applied to the columnar member transfer mask 21 is governed by the amplitude Z0 and the excitation frequency f, and when the amplitude Z0 is too large, it vibrates at a low excitation frequency f, and once the amplitude Z0 is too small, The high excitation frequency f vibrates. The columnar member 12 is easily vibrated or not affected by the weight of the columnar member 12 itself.

Fig. 10 is a graph showing the relationship between the excitation frequency f obtained by the experiment and the loading (transfer) of the columnar member 12. In the figure, the horizontal axis represents the excitation frequency (kHz), and the vertical axis represents the mounted output (%). In the experiment, the amplitude Z0 was set to 0.15 μm to 0.3 μm, and the excitation frequency f was measured for each of the excitation frequencies of 0.01 kHz, 0.1 kHz, 1 kHz, 10 kHz, 20 kHz, and 40 kHz. The vibration application time at each of the above excitation frequencies is fixed. In the acceleration calculation formula described above, since the excitation frequency f is affected by the squared amount, the mounted output with respect to the excitation frequency f is measured. In addition, the method of carrying out the production yield will be described with reference to FIG.

As shown in Fig. 10, when the excitation frequency f is 1 kHz or less, the mounted output is 10% to 20%, and when the excitation frequency f exceeds 0.1 kHz, the mounted output rises sharply, and is 80% at 10 kHz. It is 85% at 20kHz and 90% at 40kHz. It is conceivable that if the excitation frequency f is set to 40 kHz or more, the mounting yield can be further increased. However, considering the size of the excitation unit 45 and the amount of heat generation, the excitation frequency f is set to 40 kHz. should. Further, in Fig. 10, it is shown that when the excitation frequency f is 10 kHz or less, the mounting yield is at a low level, but it has been confirmed that the mounting yield can be increased by increasing the excitation time.

The transfer of the columnar member 12 can be achieved when the amplitude Z0 is in the range of 0.1 μm to 10 μm. Further, if the amplitude Z0 is increased, the amount of jumping of the columnar member 12 is increased to make the transfer easier. However, this is restricted by the conditions such as the output capability of the excitation devices 22 and 23 and the rigidity (larger size). In addition, since the amount of jump of the columnar member 12 is too large, damage may occur to the columnar member transfer mask 21 and the columnar member 12, or deformation may occur, so that the amplitude Z0 is estimated from the experimental results. It is preferably in the range of 0.1 μm to 0.3 μm.

Fig. 11 is an explanatory diagram showing an example of the evaluation result of the output. As shown in FIG. 11, the wafer 5 is an aggregate of a semiconductor integrated circuit (semiconductor chip) 52. In the example shown in Fig. 11, the number of semiconductor chips 52 is 89, and the number of semiconductor chips 52a that have failed to be mounted is 10. Therefore, the output is 10/89 = 88.8 (%). In addition, in the eleventh figure, the number shown in the frame of the semiconductor chip 52a which has failed to be mounted represents the number of mounting failures on one semiconductor chip 52a (the number of columnar members 12 is too large or too small). In the experimental example, the number of the columnar members 12 mounted in one chip was 400. Therefore, the above-mentioned carrying capacity also represents the output of the chip. The semiconductor chip 52a that has failed to be mounted is excessively or excessively corrected in the columnar member transfer device 3 or 3A, or is excessively or excessively corrected by a repair device (not shown).

As described above, in the columnar member mounting apparatus 1, by setting the vibration frequency (excitation frequency) f of the excitation devices 22 and 23 to 10 kHz to 40 kHz, the output of the columnar member 12 can be maintained at 80% or more, the columnar member is efficiently mounted on the substrate.

Further, in the columnar member mounting apparatus 1, by setting the amplitude of the vibration of the excitation devices 22 and 23 to be in the range of 0.1 μm to 0.3 μm, it is possible to efficiently transfer the columnar member 12 to the substrate (wafer) 5 efficiently. Further, it is possible to suppress damage to the columnar member transfer mask 21 and the columnar member 12.

The present invention is not limited to the above-described embodiments, and various modifications and improvements can be made thereto without departing from the scope of the invention. For example, in the above-described embodiment, the columnar member transfer mask 21 is vibrated by the excitation devices 22 and 23. However, the columnar member arrangement brush blade 28 may be used as the excitation device. In part, the columnar member 12 is transferred by vibrating the columnar member arrangement with the brush blade 28. Further, the columnar member transfer mask 21 can be vibrated by the vibration of the brush member 28 for arranging the columnar members.

1‧‧‧ Column-shaped member mounting device

2‧‧‧Solder printing device

3, 3A‧‧‧ column member transfer device

4‧‧‧Substrate depositor

5‧‧‧Substrate (wafer)

5a‧‧‧ recess

6‧‧‧ Pre-aligner

7‧‧‧ Robot

8‧‧‧Substrate correction device

9‧‧‧ platform

10‧‧‧Y-axis guide

11‧‧‧X-axis guide

12‧‧‧ Columnar members

15, 21‧‧‧Matte for solder printing

15a, 34‧‧‧mask opening (mask for solder printing)

16‧‧‧Electrode

17‧‧‧X-axis drive

18‧‧‧Y-axis drive

19‧‧‧Z-axis drive

20‧‧‧ cleaning device

21‧‧‧Shape for transfer of columnar members

22, 23‧‧‧ excitation device

24‧‧‧Scraper

25‧‧‧ Column-shaped member transfer

26‧‧‧Checking device

28‧‧‧Church scraper for columnar member arrangement

29‧‧‧ drive

30‧‧‧Installation Department

31, 32, 33‧‧‧ bundled linear members

34‧‧‧Mask opening (mask for column member transfer)

35‧‧‧ solder

36‧‧‧ mouth

37‧‧‧ Hole Department

40‧‧‧Attraction channel

41‧‧‧ base

42‧‧‧vacuum suction channel

45‧‧‧Exciting Department

45a‧‧‧ end face

46‧‧‧Exciting Department Lifting Mechanism Department

51‧‧‧Electrode forming region

52‧‧‧Integrated circuit

52a‧‧‧Semiconductor chip

53‧‧‧ cutting line

55‧‧‧ coil spring

FIG. 1 is a plan view showing a schematic configuration of a columnar member mounting device 1 according to an embodiment.

FIG. 2 is an explanatory diagram of a printing process of the solder 35 by the solder printing device 2 used in the columnar member mounting device 1.

FIG. 3 is an explanatory view showing a schematic configuration of a columnar member transfer portion 25 used in the columnar member mounting device 1.

FIG. 4 is an explanatory view of the transfer operation of the columnar member 12 by the columnar member transfer portion 25 used in the columnar member mounting device 1.

Fig. 5 is a perspective view showing an example of a substrate 5 in which a plurality of columnar members 12 are arranged and arranged in the embodiment.

Fig. 6 is a plan view showing an example when the substrate 5 in the embodiment is a wafer.

Fig. 7 is a flow chart for explaining the main steps of the method of mounting the columnar member according to the embodiment.

Fig. 8 is an explanatory view showing main steps of a method of mounting a columnar member according to the embodiment.

FIG. 9 is an explanatory view showing a schematic configuration of a columnar member mounting device 3A according to a second example.

Fig. 10 is a graph showing the relationship between the excitation frequency f obtained by experiments and the loading (transfer) of the columnar member 12.

Fig. 11 is an explanatory diagram showing an example of the evaluation result of the output.

Claims (11)

A columnar member mounting device for arranging a columnar member at a predetermined position on a substrate, comprising: a columnar member transfer mask, disposed on the substrate, and having a plurality of positions corresponding to a predetermined position of the substrate a mask opening portion; a columnar member arranging brush, disposed above the column member transfer mask, and rotating and moving the column member into the mask opening; and exciting When the columnar member arrangement brush blade is driven, the device applies vibration to the columnar member transfer mask. The columnar member mounting device according to the first aspect of the invention, wherein the excitation device can be coupled to the upper end surface of the column for transferring the columnar member in conjunction with the movement of the columnar member arranging blade mobile. The columnar member mounting apparatus according to the first or second aspect of the invention, wherein the excitation device is disposed in plural, and the columnar member arrangement squeegee is interposed therebetween. The columnar member mounting device according to any one of the first to third aspect, wherein the vibrating device has a vibration frequency of 100 Hz to 40 kHz. The columnar member mounting device according to the fourth aspect of the invention, wherein the vibrating device has a vibration frequency of 10 kHz to 40 kHz. The columnar member mounting device according to any one of the first to fifth aspect, wherein the amplitude of the vibration of the excitation device is set to be 0.1 μm to 10 μm. The columnar member mounting device according to the sixth aspect of the invention, wherein the amplitude of the vibration of the excitation device is set to be 0.1 μm to 0.3 μm. The columnar member mounting device according to any one of the items of the present invention, wherein the excitation device is an ultrasonic vibration device having an excitation unit and capable of The excitation unit elevating mechanism portion in the range of 0 mm to 1 mm is adjusted so that the distance between the columnar member transfer mask and the excitation unit is adjusted. The columnar member mounting device according to any one of the first to eighth aspect, wherein the excitation device is an ultrasonic vibration device and includes an excitation unit, wherein the excitation unit further includes: The end surface of the columnar member transfer mask is always in contact with the columnar member transfer mask, and the elastic member of the excitation portion is offset. The columnar member mounting device according to any one of the first aspect of the present invention, wherein the columnar member arranging brush has a fine twist line assembly having conductivity and flexibility. a bundled linear member that is configured to move while rotating on the surface of the columnar member transfer mask, and the bundled linear member is transferred to the columnar member during the transfer operation of the columnar member The mask is applied with a contact pressure of 5 g/cm ² to 10 g/cm ² . A columnar member mounting method in which a columnar member is erected at a predetermined position on a substrate, comprising: a printing step of disposing a mask for solder printing on an upper end surface of the substrate, and performing a predetermined position on the substrate Solder printing; and an arranging step of disposing a columnar member transfer mask above the substrate on which the solder is printed, and then providing the columnar member on the columnar member transfer mask, and the columnar member In the transfer mask, vibration is applied, and the columnar member array is rotated by the brush blade and moved to arrange the columnar member at a predetermined position of the substrate on which the solder is printed.