TWI661523B - Device for mounting columnar member and method for mounting columnar member - Google Patents

Abstract

Provided are a columnar member mounting device and a columnar member mounting method capable of mounting a columnar member at a predetermined position on a substrate.

The columnar member mounting device (1) of the present invention, which mounts a columnar member (12) in a predetermined position on a substrate (5), includes a columnar member transfer cover (21), and is disposed on the substrate ( 5), and has a plurality of mask openings (34) corresponding to a predetermined position of the substrate (5); a brush scraper (28) for arranging a columnar member is arranged on a mask (21) for transferring a columnar member ), The columnar member (12) is transferred to the mask opening (34) while being rotated and moved; and the vibration excitation devices (22) and (23) are arranged on the columnar member with a brush scraper (28). ) When being driven, vibration is applied to the columnar member transfer cover (21). The columnar member mounting device (1) and the columnar member mounting method are: while applying vibration to the columnar member transfer cover (21), the columnar member ( 12) Mounted on the substrate (5).

Description

Device for mounting columnar member and method for mounting columnar member

The present invention relates to a columnar member mounting device and a columnar member mounting method.

Conventionally, when electrically bonding a semiconductor substrate and a circuit substrate, a device in which a plurality of solder bumps formed on the semiconductor substrate are melted between the semiconductor substrate and the circuit substrate to be bonded (for example, refer to Patent Document 1). However, in Patent Document 1, when a solder bump is used as a bonding material to bond a semiconductor substrate and a circuit board, the solder bump expands in a radial direction after being rolled, thereby shortening adjacent solder bumps. The distance between the blocks makes it impossible to adapt to the trend of miniaturized substrate mounting. Therefore, Patent Document 2 discloses a method of forming a copper pillar (Cu pillar) on a semiconductor substrate as a bonding material with a circuit substrate, and performing bonding by forming a solder layer. The copper pillar disclosed in Patent Document 2 is suitable for mounting work for miniaturization because the diameter does not change when the semiconductor substrate and the circuit substrate are bonded. However, since a copper pillar is formed into a column shape by electroplating on a semiconductor substrate, it takes a lot of time and it is difficult to say that it has good productivity. In addition, in recent years, columnar members (conductor pins) made of metal such as copper have appeared in the industry instead of copper pillars formed on semiconductor substrates as bonding materials.

However, since the length of the columnar member (conductor pin) in the longitudinal direction is very long (the aspect ratio is relatively large) relative to its diameter, it is difficult to mount the columnar member on a semiconductor substrate. on. Patent Document 3 discloses a method of mounting a columnar member on a semiconductor substrate. In the columnar member mounting method described in Patent Document 3, first, a jig palette, a pin erecting jig, and an insertion guide jig are superimposed, and the columnar member is dropped from above the insertion guide jig to make the jig The panel vibrates to cause the pin erecting jig to slide between the jig panel and the insertion guide jig, thereby disposing the columnar member in the pin erecting jig. Then, in a state where the jig panel, the pin standing jig, and the insertion guide jig are superposed, they are turned upside down, and they are joined to the printed wiring board while the columnar member is standing.

Prior art literature

JP-A-5-243232

JP 2014-157906

JP 2002-314291

However, in the columnar member mounting method described in Patent Document 3, since the columnar member is dropped into the pin hole by applying vibration to the jig panel, the vibration may cause the columnar members to overlap with each other or be biased to be inserted. A part of the jig is guided, which makes it difficult to mount the columnar member at a predetermined position on the substrate.

Therefore, in order to solve the above-mentioned problems, an object of the present invention is to provide a columnar member mounting device and a columnar member mounting method capable of mounting columnar members at predetermined positions on a substrate.

1. The columnar member mounting device of the present invention, wherein the columnar member is erected and mounted on a predetermined position of the substrate, and includes a columnar member transfer mask disposed on the substrate. And a plurality of mask openings corresponding to a predetermined position of the substrate; a brush-squeegee for arranging a columnar member is disposed above the mask for transferring a columnar member, Rotating and moving the columnar member into the mask opening portion; and an excitation device for shifting the mask for the columnar member when the columnar member arrangement brush blade is driven Apply vibration.

According to the columnar member mounting device of the present invention, when the columnar member is transferred to the mask opening portion of the columnar member transfer mask by the columnar member arrangement brush blade, the columnar member transfer cover is used. By applying vibration to the cover, it is possible to mount the columnar member at a predetermined position on the substrate, no more or less.

2. In the columnar member mounting device of the present invention, it is desirable that the excitation device is capable of moving along the columnar member in association with the movement of the columnar member arrangement brush and scraper. The upper end surface of the moving.

In this way, if the excitation device is linked to the movement of the brush member for arranging the columnar member, vibration can be applied to the mask for transferring the columnar member in the vicinity of the rotation position of the brush for arranging the columnar member. The columnar member is mounted at a predetermined position on the substrate, no more or less.

3. In the columnar member mounting device of the present invention, it is desirable that the plurality of excitation devices are arranged so that the columnar member arrangement brush blade is sandwiched between the vibration excitation devices.

As long as a plurality of excitation devices are arranged near the brush scraper for arranging the columnar member, almost the same vibration can be applied to the position of the columnar member arrangement target of the columnar member transfer mask, and the columnar member can be efficiently moved. The members are mounted on a predetermined position of the substrate, no more or less.

4. In the column-shaped member mounting device of the present invention, it is desirable that the vibration frequency of the excitation device is 100 Hz to 40 kHz.

Although the vibration frequency of the excitation device can be adjusted according to the size and shape of the columnar member, as long as it is appropriately adjusted in the range of 100Hz to 40kHz, the columnar member can be transferred to a mask for columnar member transfer. Appropriate vibration is applied to mount the columnar member at a predetermined position on the substrate.

5. In the columnar member mounting device of the present invention, it is desirable that the vibration frequency of the vibration excitation device is 10 kHz to 40 kHz.

As described above, although the vibration frequency of the excitation device can be appropriately adjusted within the range of 100 Hz to 40 kHz, the columnar member can be vibrated and transferred to the substrate. However, if the vibration frequency of the excitation device is further set In the range of 10kHz to 40kHz, the mounted output of the columnar member can be increased by more than 80%, so that the columnar member can be transferred to the substrate more efficiently.

6. In the columnar member mounting device of the present invention, it is desirable that the amplitude of the vibration of the excitation device is set to 0.1 μm to 10 μm.

Although the amplitude of the vibration of the excitation device can be adjusted according to the size and shape of the columnar member, as long as it is appropriately adjusted within the range of 0.1 μm to 10 μm, it can prevent the columnar member from jumping or not vibrating In this case, the columnar member is mounted at a predetermined position on the substrate without any problem.

7. In the columnar member mounting device of the present invention, it is desirable that the amplitude of the vibration of the excitation device is set to 0.1 μm to 0.3 μm.

As described above, it is possible to transfer the vibration device to the substrate as long as the amplitude of the vibration of the excitation device is set in the range of 0.1 μm to 10 μm. However, if the amplitude is too large, it may cause the columnar member to jump up, hit the columnar member transfer mask, and cause damage to the columnar member and the columnar member transfer mask. Therefore, by further setting the amplitude of the vibration of the excitation device in the range of 0.1 μm to 0.3 μm, it is possible to suppress damage to the columnar member and the mask for transferring the columnar member.

8. In the column-shaped member mounting device of the present invention, it is desirable that the vibration device is an ultrasonic vibration device, the vibration device includes an excitation unit, and has a function for transferring the column-shaped member. The distance between the shield and the excitation unit is adjusted in the excitation unit lifting mechanism unit within a range of 0 mm to 1 mm.

By using an ultrasonic vibration device as the excitation device, it is possible to apply vibration to the columnar member transfer mask regardless of whether the excitation portion is in contact with the columnar member transfer mask, and it is only necessary to apply the column By appropriately adjusting the distance between the mask-like member transfer cover and the excitation portion within a range of 0 mm to 1 mm, it is possible to apply appropriate vibration to the column-like member transfer cover.

9. In the column-shaped member mounting device of the present invention, it is desirable that the excitation device is an ultrasonic vibration device and includes an excitation unit, and the excitation unit further includes a device for transferring the columnar member. An elastic member that offsets the dead weight of the excitation unit while the end surface on one side of the shield is always in contact with the shield for transferring the columnar member.

The elastic member is a member that generates an upward pull of the excitation portion, and is, for example, a spring or the like. By using the elastic member to counteract the self-weight of the excitation unit, it is possible to reduce the load caused by the vibration of the excitation unit itself, and to stably vibrate the columnar member transfer mask at a predetermined frequency and amplitude.

10. In the columnar member mounting device of the present invention, it is desirable that the columnar member arranging brush blade includes a thin twisted assembly having conductivity and flexibility, and A clustered linear member that moves while rotating on the surface of the columnar member transfer mask, and the clustered linear member is applied to the columnar member transfer mask during the transfer operation of the columnar member. 5g / cm ² ~ 10g / cm ² contact pressure.

In this way, it is possible to suppress the mixing of the columnar member between the columnar member transfer mask and the clustered linear member by the vibration of the columnar member transfer mask. Even if a columnar member is occasionally mixed between the mask for transferring a columnar member and the cluster linear member, the contact pressure of the cluster linear member is extremely small, such as 5 g / cm ² to 10 g / cm ² . The transfer can be performed in a good condition without causing damage to the columnar member such as wounds and dents. In addition, since the clustered linear member has a moderate flexibility and has been kept in contact with the surface of the columnar member transfer mask with small vibrations, it is possible to suppress the columnar member from being leaked to the outside.

11. The method for mounting a columnar member according to the present invention, wherein the columnar member is erected and mounted on a predetermined position of a substrate, and comprises a printing step of placing a mask for solder printing on an upper end surface of the substrate, and Solder printing at a predetermined position on the substrate; and an arranging step in which a columnar member transfer mask is disposed above the substrate on which the solder is printed, and then the column is provided on the columnar member transfer mask. And rotating the columnar member arranging brush and squeegee while applying vibration to the columnar member transfer mask to arrange the columns at predetermined positions on the substrate on which the solder is printed. Like member.

According to the columnar member mounting method of the present invention, when the columnar member is transferred to the mask opening portion of the columnar member transfer mask by the columnar member arrangement brush blade, the columnar member transfer cover is used. By applying vibration to the cover, it is possible to mount the columnar member at a predetermined position on the substrate, no more or less.

1‧‧‧Columnar member mounting device

2‧‧‧solder printing device

3, 3A‧‧‧ columnar member transfer device

4‧‧‧ substrate storage

5‧‧‧ substrate (wafer)

5a‧‧‧concave

6‧‧‧ pre-aligner

7‧‧‧ robot

8‧‧‧ substrate correction device

9‧‧‧ platform

10‧‧‧Y-axis guide

11‧‧‧X-axis guide

12‧‧‧ columnar member

15, 21‧‧‧ Mask for solder printing

15a, 34‧‧‧ Mask opening (mask for solder printing)

16‧‧‧ electrode

17‧‧‧X-axis drive

18‧‧‧Y-axis drive

19‧‧‧Z-axis drive

20‧‧‧Cleaning device

21‧‧‧Mask for transferring columnar members

22, 23‧‧‧ Excitation device

24‧‧‧ Scraper

25‧‧‧Columnar member transfer section

26‧‧‧Inspection device

27‧‧‧Column member passage

28‧‧‧ Brush scraper for arranging columnar members

29‧‧‧Drive

30‧‧‧Mounting Department

31, 32, 33‧‧‧ bunched linear members

34‧‧‧Mask opening (mask for columnar member transfer)

35‧‧‧Solder

36‧‧‧ Mouth

37‧‧‧ Hole

40‧‧‧Attraction channel

41‧‧‧ base

42‧‧‧Vacuum suction channel

45‧‧‧Excitation Department

45a‧‧‧face

46‧‧‧Excitation Department Lifting Mechanism Department

51‧‧‧ electrode formation area

52‧‧‧Integrated Circuit

52a‧‧‧semiconductor chip

53‧‧‧cut line

55‧‧‧coil spring

FIG. 1 is a plan view showing a schematic configuration of the columnar member mounting device 1 according to the embodiment.

FIG. 2 is an explanatory diagram of a printing step of the solder 35 by the solder printing device 2 used in the columnar member mounting device 1.

FIG. 3 is an explanatory diagram of a schematic configuration of a columnar member transfer portion 25 used in the columnar member mounting device 1.

FIG. 4 is an explanatory diagram of the transfer operation of the columnar member 12 by the columnar member transfer section 25 used in the columnar member mounting device 1.

FIG. 5 is a perspective view showing an example of a substrate 5 according to the embodiment in which a plurality of columnar members 12 are arranged and mounted.

FIG. 6 is a plan view showing an example when the substrate 5 in the embodiment is a wafer.

FIG. 7 is an explanatory diagram showing a step flow of main steps of the method for mounting a columnar member according to the embodiment.

FIG. 8 is an explanatory diagram showing the main steps of the columnar member mounting method according to the embodiment.

FIG. 9 is an explanatory diagram showing a schematic configuration of a columnar member mounting device 3A according to a second example.

FIG. 10 is a graph showing the relationship between the excitation frequency f obtained by experiments and the yield of the columnar member 12 (transfer).

FIG. 11 is an explanatory diagram showing an example of the evaluation result of the installed yield.

Hereinafter, a columnar member mounting device 1 according to an embodiment of the present invention and a columnar member mounting method using the columnar member mounting device 1 will be described with reference to FIGS. 1 to 8.

Structure and operation of columnar member mounting device 1

FIG. 1 is a plan view showing a schematic configuration of the columnar member mounting device 1 according to the embodiment. The columnar member mounting device 1 includes a substrate stocker 4 that stores a substrate 5 on which a columnar member 12 (see FIGS. 3 and 4) should be mounted; and the substrate 5 is transported from the substrate holder 4 to a pre-alignment. Prealigner 6 and further transfers substrate 5 from prealigner 6 to substrate transfer robot 7 of stage 9; solder printing device 2 that prints solder 35 (see FIG. 2) on substrate 5; And a columnar member transfer device 3 for transferring the columnar member 12 to the substrate 5 on which the solder 35 is printed. The columnar member mounting device 1 further includes an inspection device 26 for inspecting the mounted state of the columnar member 12, and a cleaning device 20 for removing excess solder 35 attached to the back surface of the solder printing mask 15.

The substrate 5 is a plate-like or film-like member used for wiring after fixing electronic components, and includes electronic components including integrated circuits, and also includes wafers such as silicon semiconductor substrates and compound semiconductor substrates, and glass substrates. The solder 35 is used to join the columnar member 12 and the substrate 5. The material of the columnar member 12 is copper or a copper-based alloy. The solder 35 is selected from solders having a high adhesion component so that the transferred columnar member 12 does not move or fall over.

The substrate storage 4 is composed of a load port (Unillustrated Load Port) and an unload port (when the target substrate is a wafer, it is sometimes referred to as a load port). The transfer robot 7 takes out the substrate 5 from the load port. Conveyed to pre-aligner 6. When the substrate 5 is a wafer, the pre-aligner 6 is used to correct the position of the center of gravity of the substrate 5 and the notch direction formed on the outer periphery of the substrate 5 to the platform 9, and then transfer the substrate 5 to the platform 9, and then , The transport robot 7 returns to the standby position. The substrate 5 placed on the stage 9 is decompressed and adsorbed on the stage 9 and the substrate 5 is pressed by the substrate correction device 8 to correct the warpage of the substrate. The stage 9 performs position adjustment in the Y-axis direction on the Y-axis guide 10, and moves on the X-axis guide 11 with the substrate 5 mounted thereon to be conveyed to a predetermined position of the solder printing apparatus 2. Here, the horizontal direction in FIG. 1 is taken as the X axis, the vertical direction is taken as the Y axis, and the height direction (thickness direction) is taken as the Z axis.

The stage 9 can be moved in the XY plane and the Z direction by the X-axis guide 11, the Y-axis guide 10, the Z table (not shown), and the θ table (not shown), so that the substrate 5 can be conveyed to Below the solder printing device 2 and the columnar member transfer device 3. The stage 9 is reciprocated along the X-axis guide 11 between the substrate correction device 8, the solder printing device 2, and the columnar member transfer device 3, so that the substrate 5 is transported to each predetermined position.

After the stage 9 on which the substrate 5 is placed is moved below the solder printing device 2 along the X-axis guide 11, the solder 35 is printed on the substrate 5 using the solder printing mask 15. If the solder 35 has been previously printed on the substrate 5 elsewhere or in other steps, this printing step may be skipped. The cleaning device 20 uses a cleaning sheet or a roller containing a solvent to remove excess solder 35 attached to the back surface of the solder printing mask 15. The cleaning device 20 may blow or vacuum suction the excess solder 35 attached to the back surface of the solder printing mask 15 with an air gun. The step of printing the solder 35 on the substrate 5 will be specifically described with reference to FIG. 2. When the substrate 5 on which the solder 35 is printed is placed on the stage 9, it moves below the columnar member transfer device 3 along the X-axis guide 11.

The columnar member transfer device 3 includes an X-axis drive device 17, a Y-axis drive device 18, and a Z-axis drive device 19, and can move the columnar member transfer portion 25 in the X-axis direction, the Y-axis direction, and the Z-axis direction. In addition, Z-axis and θ-axis (not shown) exist on the Y-axis guide 10 and the X-axis guide 11, and drive by the Z-axis and θ-axis enables the mask opening 15a of the mask 15 for solder printing to be driven. (Refer to FIG. 2), the mask opening 34 (refer to FIG. 3) of the columnar member transfer mask 21, and the position of the metal electrode 16 of the substrate 5, solder printing and mounting of the columnar member on the substrate 5 12.

The X-axis driving device 17 is provided with excitation devices 22 and 23 that sandwich the columnar member transfer portion 25 on both sides. The excitation devices 22 and 23 move in conjunction with the movement of the columnar member transfer portion 25, apply a Z-direction vibration to the columnar member transfer cover 21, and a brush scraper plate 28 for columnar member arrangement described later (see (Figure 3) The columnar member 12 is transferred to the opening portion 34 of the columnar member transfer mask 21 in cooperation. The configuration and transfer operation of the columnar member transfer unit 25 will be described with reference to FIGS. 3 and 4.

The substrate 5 on which the columnar member 12 is mounted passes through the solder printing device 2 and the substrate correction device 8 and is then transported to the inspection device 26 and inspected by an image recognition camera (not shown). The aligned state is then discharged into the substrate holder. During the return journey, the pre-aligner 6 is not routed.

Printing of solder 35

FIG. 2 is an explanatory diagram of a printing step of the solder 35 by the solder printing device 2 used in the columnar member mounting device 1. Each part is shown enlarged, for example. A recessed portion 5a is penetrated at a position on the substrate 5 where the columnar member 12 should be mounted, and a metal electrode is formed at the bottom of the recessed portion 5a. Pole 16. The printing blade 24 moves along the upper end surface of the solder printing mask 15 from the left side to the right side in the figure. The printing blade 24 is made of a flexible resin material so as not to damage the surface of the solder printing mask 15. An opening portion 15 a is formed on the mask 15 for solder printing corresponding to the position where the recessed portion 5 a of the substrate 5 is formed.

In FIG. 2, the position of the leftmost mask opening 15a is referred to as position (a), the position of the middle mask opening 15a is referred to as position (b), and the position of the rightmost mask opening 15a is referred to as position. (c). The position (a) indicates the solder 35 behind the printing blade 24 to cover the opening 15a. At this time, the solder 35 does not leave the surface of the solder printing mask 15. The recess 5 a included in the substrate 5 is in contact with the metal electrode 16. The position (b) shows the state before the printing blade 24 prints the solder 35 on the substrate 5 from the mask opening 15a.

The position (c) indicates the mask opening 15a for printing the next solder paste. After the squeegee operation is completed, the printing mask 15 is removed, the solder paste 35 is separated from the mask opening portion 15 a, and transferred to the bottom of the opening of the substrate 5 to complete the printing of the solder paste 35. FIG. 8 (b) shows the state of the solder paste 35 after the printing is completed. At the position (c), a small amount of the residue of the solder paste 35 remaining at the time of the previous solder paste printing adheres to the inner peripheral surface of the mask opening 15a in a small amount. Therefore, when the excess solder paste is larger than the reference amount, the excess solder paste is cleaned and removed by the cleaning device 20.

Configuration and transfer operation of the columnar member transfer portion 25

FIG. 3 is an explanatory diagram of a schematic configuration of a columnar member transfer portion 25 used in the columnar member mounting device 1. The columnar member transfer section 25 includes a rotatable columnar member arranging brush blade 28 mounted on the X-axis drive device 17. The columnar member arranging brush blade 28 includes a clustered linear member 31 that is implanted in a mounting portion 30 fixed to the blade rotation driving device 29. The clustered linear member 31 has a double structure (double concentric circles) in the radial direction of the rotation trajectory of the columnar member arrangement brush blade 28, and is composed of the clustered linear member 32 on the inside and the clustered linear member 33 on the outside. . The inner bundled linear members 32 and Each of the outer bundle linear members 33 is a brush having a divergent shape from the mounting portion 30 to the columnar member transfer mask 21. In Fig. 3, the clustered linear member 31 is shown in a simplified manner.

The main function of the inner cluster linear member 32 is to introduce the columnar member 12 into the mask opening 34 of the column member transfer mask 21, while the main function of the outer cluster linear member 33 is to prevent the columnar member. 12 is separated from the outside of the columnar member arrangement brush blade 28, that is, the columnar member 12 is not allowed to be separated from the outside of the bundled linear member 33 on the outside. In addition, the outer bundled linear member 33 further includes a columnar member 12 located between the outer bundled linear member 33 and the inner bundled linear member 32. The columnar member 12 is introduced back into the inner bundled linear member 32 while being introduced into the mask opening 34. Functions. For example, if the columnar member alignment brush blade 28 is rotated in the direction of the arrow and the columnar member 12 is introduced into the mask opening 34, the columnar member alignment brush blade 28 can be rotated in the direction opposite to the arrow to make the column The shaped member 12 returns to the inside of the bundled linear member 32.

The clustered linear member 31 is a thin twisted assembly having electrical conductivity and flexibility, and rotates across the surface of the columnar member transfer mask 21 and moves in the X-axis direction and the Y-axis direction. During this period, the columnar member 12 is introduced into the mask opening portion 34. Therefore, it does not cause damage to the columnar member 12.

In addition, since the clustered linear member 31 is conductive, dust is not adhered by static electricity, and it is possible to mount with high cleanliness. In addition, although simplified in FIG. 3, the outer bundled linear members 33 are denser in arrangement than the inner bundled linear members 32.

The platform 9 on which the substrate 5 is placed is provided with a suction channel 40 penetrating in the thickness direction. The suction channel 40 communicates with the vacuum suction channel 42 provided on the base portion 41 and vacuum suctions the substrate 5 to the platform 9.

Vibration excitation devices 22 and 23 are arranged on both sides of the columnar member transfer portion 25. The excitation devices 22 and 23 each include an excitation unit 45, and the excitation unit 45 is in contact with the columnar member transfer cover 21. The excitation devices 22 and 23 further include adjusting the distance between the cylindrical member transfer cover 21 and the excitation portion 45 to 0 mm to The excitation unit lift mechanism portion 46 in a range of 1 mm. The vibration excitation devices 22 and 23 are ultrasonic vibration devices. When the columnar member 12 is transferred by the columnar member arrangement brush blade 28, the columnar member transfer cover 21 is vibrated. As long as the excitation devices 22 and 23 are ultrasonic vibration devices, it is possible to apply vibration to the columnar member transfer cover 21 when the distance between the excitation unit 45 and the columnar member transfer cover 21 is less than 1 mm. In addition, it is preferable to set the vibration frequency of the excitation devices 22 and 23 (excitation section 45) in a range of 100 Hz to 40 kHz, and set the amplitude to 0.1 μm to 10 μm. By appropriately selecting the vibration conditions in this way, it is possible to cooperate with the columnar member arrangement brush blade 28 so that the columnar members 12 are arranged in a predetermined position on the substrate 5 in a sufficient number. In addition to the ultrasonic vibration device, a mechanism that converts the rotation of the motor into a vibration, a mechanism that continuously operates using a cylinder, a magnetostrictive oscillator, or a voice coil motor can be used as the excitation device.

The excitation devices 22 and 23 are mounted on the X driving device 17 and can move in the Y-axis direction in association with the movement of the brush member 28 for arranging the columnar members by the Y driving device 18. The distance between the excitation device 22 and the excitation device 23 is fixed. In addition, the excitation devices 22 and 23 can be moved in the X-axis direction in synchronization with each other, and the excitation devices 22 and 23 can be independently moved in the X-axis direction and aligned with the columnar members. The distance between the brush scrapers 28 is kept constant. However, the moving range of the excitation devices 22 and 23 is set outside the range in which the columnar member 12 is mounted on the substrate 5. The transfer operation of the columnar member 12 will be described in detail with reference to FIG. 4.

FIG. 4 is an explanatory diagram of the transfer operation of the columnar member 12 by the columnar member transfer section 25. In the figure, a part of the columnar member transfer portion 25 is simplified and shown. A plurality of ”metal electrodes 16 are formed on the substrate 5 placed on the stage 9, and solder 35 is printed and coated on the upper end surface of the metal electrode 16. A columnar member transfer mask 21 is disposed above the substrate 5. The plurality of columnar members 12 are randomly provided from the columnar member channel 27 to the upper end surface of the columnar member transfer mask 21. The columnar member 12 is fixed in a fixed amount by a columnar member measuring device (not shown). (Or a fixed amount) is dropped and provided on the columnar member transfer mask 21. The columnar member arrangement brush scraper 28 extends along the top of the columnar member transfer mask 21 while The end surface rotates while moving in a vortex shape, and the inner cluster linear member 32 and the outer cluster linear member 33 sweep across the surface of the columnar member transfer mask 21 to transfer the columnar member 12 to the installation. In the mask opening portion 34 on the columnar member transfer mask 21. Since the solder 35 is applied at a predetermined position on the substrate 5, the position and posture of the columnar member 12 during the transfer using the viscosity of the solder 35 are maintained.

After the inner cluster linear member 32 and the outer cluster linear member 33 are transferred to the mask opening 34, the columnar member 12 can be gently pressed downward to enable it to be soldered. 35 to maintain the position and posture of the columnar member 12. In order to achieve such an object, it is preferable to set the thickness of the columnar member transfer mask 21 to a suitable length with respect to the length in the longitudinal direction of the columnar member array brush blade 28. In addition, it is preferable that the solder 35 has a viscosity so that the posture of the columnar member 12 can be maintained after the columnar member 12 is mounted on the substrate 5 until the bonding and reflow step is performed.

When the columnar member 12 is a cylinder, the size of the guide opening portion 36 on the side where the columnar member 12 is provided on the mask opening 34 provided on the columnar member transfer mask 21 is larger than that of the columnar member 12 The diameter is larger and smaller than the length of the columnar member 12. The diameter of the mask opening portion 34 on the substrate 5 side is a size of the position regulating hole portion 37 that can regulate the position of the columnar member 12 within the application range of the solder paste 35. In addition, the guide opening portion 36 and the position regulation hole portion 37 are connected in a tapered hole. By providing the mask opening portion 34 in this shape, it is possible to smoothly drop the columnar member 12 into the mask opening portion 34 together with the effect of vibrating the columnar member transfer mask 21, so that the solder 35 It is arranged and mounted correctly at a predetermined position in the coating range of. The shape of the mask opening 34 is provided in accordance with the shape of the columnar member 12.

FIG. 5 is a perspective view showing an example of a substrate 5 in which a plurality of columnar members 12 are arranged and mounted. On the substrate 5, the columnar member 12 is disposed on the solder 35, that is, at a predetermined position on the metal electrode 16. The columnar member 12 maintains its posture by the viscosity of the solder 35. Then, the arrangement state of the columnar members 12 is inspected by the inspection device 26 (refer to FIG. 1), and is discharged into the substrate holder 4. Equipped with The semiconductor substrate 5 of the columnar member 12 is transported to a reflow device, for example, so that the substrate 5 and the columnar member 12 are bonded and fixed.

FIG. 6 is an example plan view when the substrate 5 is a wafer, wherein FIG. 6 (a) is a plan view of the wafer 5, and FIG. 6 (b) is an electrode formation area surrounded by a dotted line A on the way to FIG. 6 (a) (Semiconductor Integrated Circuit Area) A partially enlarged view of 51. The four sides of the semiconductor integrated circuit 52 are surrounded by cutting lines 53 provided between a group of metal electrodes 16 and are cut according to the cutting lines 53 to become individual semiconductor integrated circuit chips. This dicing step is performed after the substrate (wafer) 5 on which the columnar member 12 is mounted is reflowed by a reflow device or at the end of the mounting step.

The electrode 16 is an electrode after rewiring. The gap of the rewired electrode 16 is approximately 50 μm to 400 μm. FIG. 6 is a diagram for explaining the arrangement of the electrode 16 formed on the substrate (wafer) 5 and the electrode formation region 51 on which the electrode 16 is formed. The size and distribution of the electrodes shown in the figure and the shape and shape of the electrode formation region 51 are shown in FIG. They are different and not similar.

The diameter of the substrate (wafer) 5 is 300 mm, 200 mm, or the like. The arrangement of the electrodes 16 formed on the polygonal electrode formation region 51 surrounded by a dotted line is referred to as an electrode pattern. The pattern of the mask opening portion 34 formed on the columnar member transfer mask 21 is similar to the electrode pattern formed on the substrate (wafer) 5.

Method for mounting columnar member

Next, a method for mounting a columnar member will be described with reference to FIGS. 7 and 8.

FIG. 7 is a flowchart illustrating the main steps of the method for mounting a columnar member. Fig. 8 is an explanatory diagram of main steps. First, the substrate 5 is set on the stage 9 from the substrate holder 4 by the substrate transfer robot 7 (step S10). Next, after the substrate 5 is corrected by the substrate correction device 8, the substrate 5 is transported to the solder printing device 2. FIG. 8 (a) shows the substrate 5 after being transported to the solder printing apparatus 2. A metal electrode 16 is formed on the bottom of the recessed portion 5 a provided on the substrate 5.

Next, a solder printing mask 15 is provided, and the solder 35 is printed on the substrate 5 by the solder printing device 2 (step S20). FIG. 8 (b) shows a state where the solder 35 is printed on the substrate 5. The solder 35 is spread on the metal electrode 16 by the surface tension, and is filled in the recess 5 a. Next, the substrate 5 is transferred to the columnar member transfer device 3, and a columnar member transfer cover 21 is provided, and a predetermined amount of the columnar member 12 is provided on the columnar member transfer cover 21 while being excited. The devices 22 and 23 apply vibration to the columnar member transfer mask 21 and drive the columnar member alignment brush blade 28 to introduce the columnar member 12 into the mask opening 34 of the columnar member transfer mask 21 to thereby This is arranged on the metal electrode 16 (step S30).

FIG. 8 (c) shows a state where the columnar members 12 are arranged on the substrate 5. The solder 35 flows to the bottom surface and the side surface of the columnar member 12 in the recessed portion 5 a and supports the columnar member 12 by an adhesive force. After the columnar members are arranged, the substrate 5 is transported to the inspection device 26, and the arrangement state of the columnar members 12 is checked (step S40). In the case where the columnar members 12 are arranged more or less (GO), the material is removed from the columnar member mounting device 1 and the process proceeds to a reflow step to fix the columnar members 12 on the substrate 5 (step S50). ). Then, the substrate 5 on which the columnar member 12 is mounted is cleaned (step S60). After these steps, the substrate 5 on which the columnar member 12 is mounted is completed.

In addition, when the arrangement state of the columnar members 12 is checked (step S40), and it is determined that the columnar members 12 are too many or too few (NG), the repair operation (step S45) is performed before entering the reflow step. (Step S50). When there are too few columnar members 12, the columnar members 12 are added to the substrate 5, and when there are too many columnar members 12, the excess columnar members 12 are removed. In the inspection step (step S40), the substrate 5 on which the columnar member is mounted can be directly transported to the reflow step (step S50), and the substrate 5 that has not reached the predetermined output can be subjected to the column in advance. There are too many and too few positions of the shape member to be memorized, and then after being repaired by another repairing machine, it goes back to the reflow step after going back to the normal conveying route (step S50). In addition, it is possible to automatically stop operation when a substrate 5 that does not reach a predetermined yield is continuously generated, and to call an operator (Operator call), etc. instruction. When the inspection step (step S40) is performed, if it is determined as NG, the substrate 5 may be returned to the columnar member transfer device 3, and the alignment step may be performed here (step S30). It is also possible to connect the columnar member mounting device 1 with a repair device, a reflow device, and a cleaning device.

As described above, the columnar member mounting device 1 mounts the columnar member 12 at a predetermined position on the substrate 5, and includes a columnar member transfer cover 21 disposed on the substrate 5 and having a predetermined specification with the substrate 5. A plurality of mask openings 34 corresponding to the positions; a brush blade 28 for arranging a columnar member is arranged above the columnar member transfer mask 21 and transfers the columnar member 12 to the mask opening while rotating and moving The portion 34 and the excitation devices 22 and 23 apply vibration to the columnar member transfer cover 21 when the columnar member arrangement brush blade 28 is driven.

According to the columnar member mounting device 1 described above, when the columnar member 12 is transferred to the mask opening portion 34 of the columnar member transfer mask 21 by the columnar member arrangement brush blade 28, the use of excitation is performed. When the devices 22 and 23 apply vibration to the columnar member transfer cover 21, the columnar member 12 can be mounted at a predetermined position on the substrate 5 without any problem.

In addition, the vibration excitation devices 22 and 23 can move along the upper end surface of the columnar member transfer mask 21 in association with the movement of the columnar member alignment brush blade 28. In this way, as long as the excitation devices 22 and 23 are linked with the movement of the brush member 28 for arranging the columnar member, the mask for transferring the columnar member can be made near the rotation position of the brush member 28 for arranging the columnar member. 21 applies vibration to mount the columnar member 12 at a predetermined position on the substrate 5 without any problem.

In addition, the vibration excitation devices 22 and 23 sandwich the columnar member array brush blade 28 in the arrangement. As long as the excitation devices 22 and 23 are arranged near the columnar member arranging brush scraper 28, almost the same vibration can be applied to the columnar member arranging target position of the columnar member transfer mask 21, thereby efficiently The columnar member 12 is mounted on a predetermined position of the substrate 5 without any problem. In addition, the vibration excitation device is not limited to two, and three or more vibration devices may be disposed, or only one may be disposed.

The vibration frequency of the excitation devices 22 and 23 used in the columnar member mounting device 1 is 100 Hz to 40 kHz. Although the vibration frequencies of the excitation devices 22 and 23 can be adjusted according to the size and shape of the columnar member 12, as long as it is appropriately adjusted in the range of 100 Hz to 40 kHz, the columnar member can be transferred to the columnar member. Appropriate vibration is applied to the transfer cover 21 so that the columnar member 12 is mounted at a predetermined position on the substrate 5 without any problem.

In addition, as long as the amplitude of the vibrations of the excitation devices 22 and 23 is appropriately adjusted within the range of 0.1 μm to 10 μm, the columnar member 12 can be kept small without the columnar member 12 jumping or not vibrating. It is mounted on a predetermined position of the substrate 5 in many cases.

In addition, the excitation devices 22 and 23 used in the columnar member mounting device 1 are ultrasonic vibration devices. The excitation devices 22 and 23 include an excitation unit 45 and include a cover 21 for transferring a columnar member and an excitation device. The distance between the sections 45 is adjusted in the range of 0 mm to 1 mm of the excitation section lifting mechanism section 46. By using the ultrasonic vibration device as the excitation devices 22 and 23, it is possible to apply the columnar member transfer cover 21 regardless of whether the excitation unit 45 is in contact with the columnar member transfer cover 21 or not. Vibration, and as long as the distance between the columnar member transfer cover 21 and the excitation portion 45 is appropriately adjusted within a range of 0 mm to 1 mm, appropriate vibration can be applied to the columnar member transfer cover 21.

In addition, the columnar member mounting method includes a printing step (step S20), placing a solder printing mask 15 on the upper end surface of the substrate 5, and printing the solder 35 on a predetermined position of the substrate 5; and an arrangement Step (step S30): After the columnar member transfer mask 21 is disposed above the substrate 5 printed with the solder 35, the columnar member 12 is provided on the columnar member transfer mask 21, and the columnar member is transferred while The columnar member 12 is arranged at a predetermined position on the substrate 5 on which the solder 35 is printed by rotating and moving the columnar member arranging brush blade 28 while applying vibration with the mask 21.

According to this method for mounting a columnar member, when the columnar member 12 is transferred to the mask opening portion 34 of the columnar member transfer mask 21 by the columnar member arrangement brush blade 28, the columnar member Construct When the piece transfer cover 21 is vibrated, it is possible to mount the columnar member 12 on a predetermined position of the substrate 5 without any problem.

In addition, when the configuration of the columnar member transfer device 3 described in FIG. 3 is taken as an example, the configurations of the columnar member array brush blade 28 and the vibration devices 22 and 23 may be replaced. This will be described below as a second example with reference to FIG. 9.

FIG. 9 is an explanatory diagram showing a schematic configuration of a columnar member mounting device 3A according to a second example. Differences between this example and the first example (refer to FIG. 3) will be described below. The same parts and components as those in FIG. 3 are illustrated using the same symbols as in FIG. 3. As shown in FIG. 9, the columnar member arranging brush blade 28 includes a clustered linear member 33 that is implanted in a mounting portion 30 fixed to the blade rotation driving device 29. The clustered linear member 33 is constituted along the rotational trajectory of the columnar member arrangement brush blade 28. The cluster linear member 33 shown in FIG. 9 corresponds to the outer cluster linear member 33 shown in FIG. 3, and the inner cluster linear member 32 is omitted. In addition, in FIG. 9, the clustered linear member 33 is shown in a simplified manner.

The clustered linear member 33 is a thin twisted assembly having electrical conductivity and flexibility, and it rotates across the surface of the columnar member transfer mask 21 and moves in the X-axis direction and the Y-axis direction. , The columnar member 12 is introduced into the mask opening portion 34. In this case, during the transfer operation of the cylindrical member 12, the linear cluster of column-shaped member 33 the transfer member 21 is applied with a mask 5g / cm contact pressure of ² ~ 10g / cm ² in.

In this manner, when the columnar member 12 is transferred, the cluster linear member 33 applies a contact pressure of 5g / cm ² to 10g / cm ² to the columnar member transfer mask 21, so that the columnar member is not hindered. Vibration of the member transfer cover 21. In addition, it is possible to prevent the columnar member 12 from being mixed between the columnar member transfer cover 21 and the bundled linear member 33, and to suppress damage or deformation to the columnar member 12 and the columnar member transfer cover 21. Even if the columnar member 12 is occasionally mixed between the columnar member transfer mask 21 and the cluster linear member 33, the contact pressure pressed by the cluster linear member 33 is extremely small such as 5 g / cm ² to 10 g / cm ² The pressure can be transferred in a good state without causing damage to the columnar member 12 such as wounds and dents. In addition, since the clustered linear member 33 has a moderate flexibility and has been kept in contact with the surface of the columnar member transfer mask 21 with minute vibrations, it is possible to suppress the columnar member 12 from being leaked to the outside.

As shown in FIG. 9, the excitation devices 22 and 23 are disposed on both sides of the columnar member transfer portion 25. The excitation devices 22 and 23 each have an excitation portion 45, and an end surface 45a of the excitation portion 45 on the side of the columnar member transfer cover 21 is in contact with the columnar member transfer cover 21 to transfer the columnar member. The mask 21 vibrates. The excitation unit 45 includes a coil spring 55 as an example of an elastic member.

The force exerted by the excitation unit 45 on the columnar member transfer cover 21 comes from the weight of the excitation unit 45 and the pressing force of the excitation unit elevating mechanism unit 46. The coil spring 55 keeps the end surface 45 a of the excitation unit 45 in contact with the columnar member transfer cover 21 at all times, and applies a force in a direction that cancels the weight of the excitation unit 45 in synchronization with the vibration.

During the transfer operation of the columnar member 12, the excitation portion 45 is kept in contact with the columnar member transfer cover 21 at all times, and the coil spring 55 is used to cancel the weight of the excitation portion 45, thereby reducing the excitation. The load caused by the vibration of the vibrating portion 45 causes the cylindrical member transfer cover 21 to stably vibrate at a predetermined frequency and amplitude.

Experimental example

In the experiment, it has been determined that the mounting (transferring) operation of the columnar member 12 requires the excitation devices 22 and 23 (that is, the mask 21 for transferring the columnar member) to have an appropriate vibration frequency f and an amplitude Z (half amplitude Z0). This point will be described with reference to FIGS. 10 and 11. In addition, the experimental examples described below show experimental results after mounting a columnar member 12 made of copper having a diameter of 150 μm and a length of 200 μm on a wafer 5 having a diameter of 200 mm.

In order to enable the columnar member 12 to vibrate in a transfer manner, it is necessary to apply an acceleration greater than the acceleration G of gravity to the columnar member 12. That is, when the columnar member transfer mask 21 is raised or lowered, the acceleration of the bracket Z0 (2πf) 2 is supported on the columnar member transfer mask 21. When the acceleration value exceeds the gravitational acceleration G (9.8 m / sec ² ), the columnar member 12 leaves the columnar member transfer mask 21. That is, when the columnar member transfer mask 21 changes from rising to falling, or from falling to rising, the columnar member 12 jumps.

That is, when Z0 (2πf) 2> G is satisfied, the columnar member 12 vibrates alone and is easily transferred to the mask opening portion 34. Z0 here is the excitation frequency. Therefore, the acceleration applied to the cylindrical member transfer mask 21 is dominated by the amplitude Z0 and the excitation frequency f. When the amplitude Z0 is too large, it vibrates at a lower excitation frequency f, and when the amplitude Z0 is too small, the acceleration is relatively low. High vibration frequency f. Whether or not the columnar member 12 easily vibrates is not affected by the weight of the columnar member 12 itself.

FIG. 10 is a graph showing the relationship between the excitation frequency f obtained through experiments and the yield of the columnar member 12 (transfer). In the figure, the horizontal axis represents the excitation frequency (kHz), and the vertical axis represents the mounting yield (%). In the experiment, the amplitude Z0 was set to 0.15 μm to 0.3 μm, and the mounting frequency was measured at each excitation frequency of 0.01 kHz, 0.1 kHz, 1 kHz, 10 kHz, 20 kHz, and 40 kHz. The vibration application time at each of the above-mentioned excitation frequencies is fixed. In the acceleration calculation formula described above, since the excitation frequency f has a squared effect, the mounting yield relative to the excitation frequency f is measured. In addition, a method of considering the mounting yield will be described with reference to FIG. 11.

As shown in Figure 10, when the excitation frequency f is less than 1kHz, the installed output is 10% to 20%, and when the excitation frequency f exceeds 0.1kHz, the installed output rises sharply, which is 80% at 10kHz. , 85% at 20kHz and 90% at 40kHz. Although it is conceivable that if the excitation frequency f is set to 40 kHz or more, the mounting yield can be further improved, but considering the size of the excitation unit 45 and the heat generation factor, the degree of the excitation frequency f is set to 40 kHz as should. In addition, in Fig. 10, although the mounting yield is low when the excitation frequency f is 10 kHz or less, it has been confirmed that the mounting yield can be increased by increasing the excitation time.

When the amplitude Z0 is in the range of 0.1 μm to 10 μm, the columnar member 12 can be transferred. Furthermore, if the amplitude Z0 is increased, the jump amount of the columnar member 12 becomes large, and the transfer becomes easier. However, this is constrained (enlarged) by conditions such as the output capability and rigidity of the excitation devices 22 and 23. In addition, if the jump amount of the columnar member 12 is too large, the columnar member transfer mask 21 and the columnar member 12 may be damaged or deformed. Therefore, it is estimated from the experimental results that the amplitude Z0 is between A range of 0.1 μm to 0.3 μm is preferable.

FIG. 11 is an explanatory diagram showing an example of the evaluation result of the installed yield. As shown in FIG. 11, the wafer 5 is an aggregate of a semiconductor integrated circuit (semiconductor chip) 52. In the example shown in FIG. 11, the number of semiconductor chips 52 is 89, of which the number of failed semiconductor chips 52 a is 10. Therefore, the production yield is 10/89 = 88.8 (%). In addition, in FIG. 11, the number written in the frame of the failed semiconductor chip 52 a represents the number of failed mountings (the number of columnar members 12 is too large or too small) on one semiconductor chip 52 a. In the experimental example, the number of columnar members 12 mounted in one chip is 400. Therefore, the above-mentioned mounting output also represents the output of the chip. The failed mounting of the semiconductor chip 52a is performed by performing excessive or insufficient correction in the columnar member transfer device 3 or 3A or by using a repairing device (not shown).

As described above, in the columnar member mounting device 1, by setting the vibration frequency (excitation frequency) f of the excitation devices 22 and 23 to 10 kHz to 40 kHz, it is possible to maintain the mounted output of the columnar member 12 at 80% or more, so that the columnar member can be efficiently mounted on the substrate.

In addition, in the columnar member mounting device 1, by setting the amplitude of the vibration of the excitation devices 22 and 23 in the range of 0.1 μm to 0.3 μm, not only the columnar member 12 can be efficiently transferred to the substrate (wafer) 5. In addition, damage to the columnar member transfer mask 21 and the columnar member 12 can be suppressed.

In addition, the present invention is not limited to the above-mentioned embodiments, and various modifications and improvements can be made to the present invention as long as it is within a range that can achieve the object of the present invention. For example, in the above-mentioned embodiment, although the vibrations are applied to the columnar member transfer cover 21 by the excitation devices 22 and 23, However, it is also possible to use the brush blade 28 for arranging the columnar member as a part of the vibration device, and transfer the columnar member 12 by vibrating the brush 28 for arranging the columnar member. In addition, the columnar member transfer cover 21 may be vibrated by the vibration of the columnar member arrangement brush blade 28.

Claims (11)

A columnar member mounting device for vertically mounting a columnar member at a predetermined position on a substrate. The columnar member includes a columnar member transfer mask disposed on the substrate and having a plurality of numbers corresponding to the predetermined position of the substrate. A mask opening; a brush scraper for arranging a columnar member, disposed above the mask for transferring a columnar member, transferring the columnar member to the mask opening while rotating and moving; and excitation A device for applying vibration to the columnar member transfer mask when the columnar member alignment brush blade is driven. The columnar member mounting device according to item 1 of the patent application scope, wherein the excitation device is capable of moving along the upper end surface of the columnar member transfer cover in association with the movement of the columnar member arrangement brush blade. mobile. The columnar member mounting device according to item 1 or 2 of the patent application scope, wherein the plurality of excitation devices are arranged so that the columnar member arrangement is sandwiched by a brush scraper in the arrangement. The columnar member mounting device according to item 1 or item 2 of the scope of patent application, wherein the vibration frequency of the excitation device is 100 Hz to 40 kHz. The column-shaped member mounting device according to item 4 of the scope of patent application, wherein the vibration frequency of the excitation device is 10 kHz to 40 kHz. The columnar member mounting device according to item 1 or 2 of the patent application scope, wherein the vibration amplitude of the excitation device is set to 0.1 μm to 10 μm . The columnar member mounting device according to item 6 of the scope of patent application, wherein the amplitude of vibration of the excitation device is set to 0.1 μm to 0.3 μm . The columnar member mounting device according to item 1 or 2 of the scope of patent application, wherein the excitation device is an ultrasonic vibration device, the excitation device has an excitation unit, and has the ability to transfer the columnar member The distance between the shield and the excitation unit is used to adjust the excitation unit lifting mechanism unit in a range of 0 mm to 1 mm. The columnar member mounting device according to claim 1 or claim 2, wherein the excitation device is an ultrasonic vibration device and has an excitation unit, and the excitation unit further includes: transferring the columnar member An elastic member that offsets the dead weight of the excitation unit while the end surface on one side of the shield is in constant contact with the shield for transferring the columnar member. The columnar member mounting device according to claim 1 or claim 2, wherein the columnar member arranging brush blade includes a thin twisted assembly having conductivity and flexibility. And a clustered linear member that moves while rotating on the surface of the columnar member transfer mask, and when the columnar member transfer operation is performed, 5 g of the clustered member transfer mask is applied to the columnar member transfer mask / cm ² ~ 10g / cm ² contact pressure. A method for mounting a columnar member, in which a columnar member is erected and mounted on a predetermined position of a substrate, includes a printing step, placing a mask for solder printing on an upper end surface of the substrate, and performing the mask on a predetermined position of the substrate. Solder printing; and an arranging step, after disposing a columnar member transfer mask above the substrate on which the solder is printed, providing the columnar member on the columnar member transfer mask, and arranging the columnar member The transfer mask applies vibration, and rotates and moves the columnar member arrangement brush blade to arrange the columnar members at predetermined positions on the substrate on which the solder is printed.