JP6761690B2 - Column member mounting device, column member mounting method - Google Patents

Description

The present invention relates to a columnar member mounting device and a columnar member mounting method.

When electrically bonding a semiconductor substrate and a substrate such as a circuit board, it is known that a plurality of solder bumps formed on the semiconductor substrate are melted and bonded to the circuit board (for example, Patent Documents). 1). However, in Patent Document 1, when a semiconductor substrate and a circuit board are joined using a solder bump as a bonding material, the solder bump is crushed and expands in the radial direction, and the distance between adjacent solder bumps is shortened. It may not be possible to support the mounting of the board on which the process progresses (see FIG. 8 (A)). Therefore, Patent Document 2 discloses a semiconductor substrate in which copper (Cu) pillars are formed and a solder layer is formed and bonded as a bonding material to the circuit board (see, for example, Patent Document 2). The copper pillar disclosed in Patent Document 2 is suitable for miniaturization because the diameter does not change when the semiconductor substrate and the circuit board are joined (see FIG. 8B). However, since the copper pillars are formed into columns on the semiconductor substrate by electric field plating or the like, it takes a long time to form the copper pillars, and the productivity cannot be said to be good. Further, recently, it is known that a columnar member (conductor pin) formed of a metal such as copper is used as a joining member instead of a copper pillar formed on a semiconductor substrate.

However, since the length of the columnar member (conductor pin) in the longitudinal direction is long with respect to the diameter (the aspect ratio is large), it is difficult to arrange and mount the columnar member on the semiconductor substrate. Patent Document 3 discloses a method for joining conductor pins in which conductor pins are arranged and mounted on a semiconductor substrate.

Japanese Unexamined Patent Publication No. 5-243232 Japanese Unexamined Patent Publication No. 2014-157906 JP-A-2002-314291

In the method of joining the conductor pin (columnar member) described in Patent Document 3, first, the jig pallet, the pin stand jig and the insertion guide jig are arranged in an overlapping manner, and the conductor pin is dropped from above the insertion guide jig. , The jig pallet is vibrated so that the pin stand jig slides between the jig pallet and the insertion guide jig, and the conductor pin is arranged in the pin hole of the pin stand jig. Then, the jig pallet, the pin stand jig, and the insertion guide jig are stacked and turned upside down, and the conductor pins are joined in a state where they are erected on the printed wiring board. Such a method of joining conductor pins has a problem that the surface of the conductor pins is easily scratched and poor joining is likely to occur because the conductor pins are supplied to the pin holes by applying vibration to the jig pallet. In addition, the conductor pins overlap due to vibration, or the conductor pins are unevenly supplied to a part of the insertion guide jig, so it takes time to erect all the conductor pins, and productivity is good. I can't say.

The present invention has been made in view of the above problems, and an object of the present invention is a columnar member capable of efficiently mounting a small columnar member having a large aspect ratio without damaging a semiconductor substrate or the like. It is intended to provide a mounting device and a method for mounting a columnar member.

In order to solve the above-mentioned problems, the columnar member mounting device according to the present invention is a columnar member mounting device for arranging columnar members at predetermined positions on a substrate, and has a plurality of openings and is arranged on the substrate. It has a mask for arranging columnar members and a brush squeegee arranged above the mask for arranging columnar members, and the columnar members supplied on the mask for arranging columnar members are introduced into the opening by the brush squeegee, and flux is applied. The columnar members are arranged at predetermined positions on the substrate, the brush squeegee has a binding linear member implanted in the mounting portion, and the binding linear member places the columnar members in the opening of the mask for arranging the columnar members. It is composed of an inner binding linear member having a function to be introduced and an outer binding linear member having a function of preventing the columnar member from deviating to the outside of the brush squeegee, and by moving the binding linear member while rotating. It is characterized in that the columnar member supplied on the columnar member arrangement mask is guided to the opening .

Further, in addition to the above invention, it is preferable to have an inspection device for inspecting the arrangement state of the columnar members on the substrate.

Further, in addition to the above invention, it is preferable that the binding linear member is doubly formed in the radial direction of the rotation locus of the brush squeegee.

Further, in addition to the above invention, the binding linear member is preferably an aggregate of thin twisted yarns having conductivity and flexibility.

Further, in addition to the above invention, the flux is preferably applied by a screen printing method using a flux printing mask arranged above the substrate and having a plurality of openings and a resin squeegee.

The columnar member mounting method of the present invention is a method of mounting a columnar member at a predetermined position on a substrate, in which a mask for flux printing is placed on the upper surface of the substrate and the flux is printed at a predetermined position on the substrate, and the flux A step of arranging a columnar member arrangement mask having an opening above the substrate coated with the above, a step of supplying a columnar member on the columnar member arrangement mask, and a columnarity supplied on the columnar member arrangement mask. The process of introducing the member into the opening by a brush squeegee having a binding linear member implanted in the mounting portion, which is arranged above the columnar member arrangement mask, and the flux is applied from the opening of the columnar member arrangement mask. The binding linear member includes a step of arranging the columnar members at a predetermined position on the substrate and a step of inspecting the arrangement state of the columnar members, and the binding linear member has a function of introducing the columnar members into the opening of the mask for arranging the columnar members. It is characterized in that it is composed of an inner binding linear member having an inner binding linear member and an outer binding linear member having a function of preventing the columnar member from deviating to the outside of the brush squeegee.

It is a top view which shows the schematic whole structure of the columnar member mounting apparatus which concerns on embodiment of this invention. It is a figure explaining the schematic structure of the columnar member transfer part which concerns on embodiment of this invention. It is explanatory drawing which shows the action of the columnar member transfer part which concerns on embodiment of this invention. It is a perspective view which shows an example of the semiconductor substrate which the columnar member which concerns on embodiment of this invention is arranged and mounted. It is a flowchart which shows the main process of the columnar member mounting method which concerns on embodiment of this invention. It is explanatory drawing which shows the flux printing process which concerns on embodiment of this invention. It is a figure which showed the shape of the other plurality of examples of the columnar member which concerns on embodiment of this invention. It is explanatory drawing which shows the mounting example of the semiconductor substrate and the circuit board using the columnar member which concerns on the prior art and the Embodiment of this invention.

Hereinafter, the columnar member mounting device 1 and the columnar member mounting method according to the embodiment of the present invention will be described with reference to the drawings. Before explaining the embodiment of the present invention, the above-described prior art (Patent Document 1 and Patent Document 2) and the mounting embodiment using the columnar member 12 will be described with reference to FIG.

FIG. 8 is an explanatory view showing a mounting example of a semiconductor substrate (wafer or the like) 5 and a circuit board 50 using the columnar members of the prior art and the present embodiment, and (A) uses a solder bump 51 as a bonding material. (B) uses a copper pillar 52 formed on the semiconductor substrate 5, and (C) uses a columnar member 12 formed of copper or the like. As shown in FIG. 8A, the solder bump 51 is formed on the semiconductor substrate 5 and has a substantially spherical shape having a diameter B0 represented by a two-dot chain line in the drawing. When the semiconductor substrate 5 is mounted on the circuit board 50, the solder bumps 51 are melted and sink in the height (thickness) direction, and the diameter expands to B1 in the radial direction. Since the pitch P between adjacent solder bumps 51 does not change, the distance D0 between the solder bumps 51 before mounting is reduced to the distance D1 after mounting. Therefore, when the pitch P is further reduced, the bulge of the solder bump 51 becomes disadvantageous. In the figure, the semiconductor substrate 5 is formed with the electrodes 16, and the circuit board 50 is formed with the electrodes 53.

As shown in FIG. 8B, the copper pillar 52 is formed by depositing copper on a UBM (under bump metal) 54 laminated and formed on an electrode 16 formed on a semiconductor substrate 5 by electric field plating. To. An insulating layer 55 is formed around the copper pillar 52 on the semiconductor substrate 5. A solder layer 56 is formed at the tip of the copper pillar 52 on the circuit board 50 side, and the solder layer 56 is used as a bonding material on the circuit board 50 side. Even if the pitch P between the adjacent copper pillars 52 is the same as the solder bump 51 (see FIG. 8A), the diameter of the copper pillars 52 does not change due to mounting, so that the distance D2 between the copper pillars 52 after mounting is It does not change. That is, if the pitch P is the same as in the case of the solder bump 51, D2> D1. Therefore, at least the difference can reduce the pitch P and contribute to miniaturization. However, there is a problem that it takes a lot of time and a dedicated device to form the copper pillar 52.

FIG. 8C is an example in which a columnar member 12 made of a metal having high conductivity such as copper is used for joining the semiconductor substrate 5 and the circuit board 50. Since the columnar member 12 does not deform in the same manner as the copper pillar 52 at the time of mounting, the distance between the columnar members 12 is D2 if the diameter and pitch P are the same as those of the copper pillar 52, and the pitch between the electrodes of the semiconductor substrate 5 is set. Can be miniaturized. An electrode 16 is formed on the semiconductor substrate, an electrode 53 is formed on the circuit board 50, and the semiconductor substrate 5 and the circuit board 50 are connected by a columnar member 12. Since the columnar member 12 can be formed by machining or the like, it can be easily manufactured in large quantities in a shorter time than the formation of the copper pillar 52. However, it has been difficult to arrange and mount the fine columnar members 12 at predetermined positions on the semiconductor substrate 5 by a method as described in the prior art (see Patent Document 3). Therefore, the mounting device and mounting method of the columnar member 12 according to the present invention on the semiconductor substrate 5 will be described below. The substrate as the mounting target member on which the columnar member 12 is mounted includes a semiconductor substrate (wafer, etc.) 5 and a circuit board 50, and can be mounted on either of them. However, in the following description, the semiconductor A structure in which the columnar member 12 is mounted on the substrate 5 will be described as an example.

(Overall configuration of columnar member mounting device 1)
FIG. 1 is a plan view showing a schematic overall configuration of the columnar member mounting device 1. As shown in FIG. 1, the columnar member mounting device 1 includes a flux printing device 2 and a columnar member transfer device 3. Further, the columnar member mounting device 1 has a substrate transfer robot 7 that transfers the semiconductor substrate 5 from the loader / unloader 4 to the pre-aligner 6, and the substrate transfer robot 7 transfers the semiconductor substrate from the pre-aligner 6 to the pressing device 8. 5 is transported. The pre-aligner 6 roughly adjusts the XY coordinate position of the semiconductor substrate 5. The semiconductor substrate 5 whose position has been corrected by rough adjustment is placed on the stage 9 by the substrate transfer robot 7. The semiconductor substrate 5 mounted on the stage 9 is pressed by the pressing device 8 from above toward the stage 9 side to correct the warp and is sucked into the stage 9 under reduced pressure. The stage 9 is position-adjusted in the Y-axis direction on the Y-axis rail 10, moves on the X-axis rail 11 with the semiconductor substrate 5 mounted, and is stopped at a predetermined position of the flux printing device 2. The horizontal direction shown in FIG. 1 is the X-axis, the vertical direction shown is the Y-axis, and the height direction (thickness direction) is the Z-axis.

As shown in FIG. 6A, the flux printing apparatus 2 prints and applies the flux 35 from the opening 45 of the flux printing mask 15 to a predetermined position on the electrode 16 of the semiconductor substrate 5. The semiconductor substrate 5 coated with the flux 35 is conveyed to the columnar member transfer device 3 in a state of being placed on the stage 9. The columnar member transfer device 3 includes an X-axis drive device 17, a Y-axis drive device 18, and a Z-axis drive device 19, and moves the columnar member transfer device 3 in the X-axis direction, the Y-axis direction, and the Z-axis direction. Is possible. The Y-axis rail 10 and the X-axis rail 11 have a Z-axis and a θ-axis (not shown), and the opening 45 of the flux printing mask 15 (FIG. 6A) is driven by driving the Z-axis and the θ-axis. (See), the lower surface of each opening 34 (see FIG. 2) of the columnar member arranging mask 20 and the PAD portion (electrode portion on which the columnar member should be mounted) of the semiconductor substrate 5 are combined to perform flux printing and transfer to the semiconductor substrate 5. The columnar members 12 of the above are arranged.

As shown in FIG. 2, the columnar member 12 dropped and supplied from the columnar member measuring device (not shown) to the columnar member transfer portion 25 is surrounded by the binding linear member 31 so as not to deviate from the columnar member transfer portion 25. There is. By moving the columnar member transfer portion 25, the columnar member 12 is transferred from the opening 34 (see FIG. 2) of the columnar member arrangement mask 20 to a place on the semiconductor substrate 5 where the flux 35 is applied and mounted in an array. Will be done. The semiconductor substrate 5 on which the columnar member 12 is mounted is conveyed to the inspection device 26, inspected by an image recognition camera (not shown) for the arrangement state of the columnar member 12, and discharged to the loader / unloader 4. The pre-aligner 6 does not pass during the return process. In the columnar member mounting device 1 described above, the configuration in which the columnar member 12 is mounted on the semiconductor substrate 5 has been described, but the columnar member 12 can be mounted on the circuit board 50 side. As the columnar member 12, for example, there is a fine-sized member having a diameter of several tens of μm and a length of 100 μm and a large aspect ratio. The mounting of the columnar member 12 on the semiconductor substrate 5 will be described later with reference to FIGS. 2 to 7.

(Structure and action of columnar member transfer unit 25)
FIG. 2 is a diagram illustrating a schematic configuration of a columnar member transfer portion 25. The columnar member transfer unit 25 has a rotatable brush squeegee 28 attached to the X-axis drive device 17. The brush squeegee 28 has a binding linear member 31 implanted in a mounting portion 30 fixed to the squeegee rotation drive device 29. The binding linear member 31 has a double structure (double concentric circles) in the radial direction of the rotation locus of the brush squeegee 28, and is composed of an inner binding linear member 32 and an outer binding linear member 33. ing. Both the inner binding linear member 32 and the outer binding linear member 33 are so-called brushes having a divergent shape from the mounting portion 30 toward the columnar member arrangement mask 20. In FIG. 2, the binding linear member 31 is shown in a simplified manner.

The inner binding linear member 32 mainly has a function of introducing the columnar member 12 into the opening 34 of the columnar member arranging mask 20, and the outer binding linear member 33 mainly introduces the columnar member 12 into the brush squeegee 28. It has a function of not deviating to the outside, that is, not deviating to the outside of the outer binding linear member 33. Further, the outer binding linear member 33 has a function of introducing the columnar member 12 between the outer binding linear member 32 and the inner binding linear member 32 into the opening 34 and returning it to the inside of the inner binding linear member 32. For example, if the brush squeegee 28 is rotated in the direction of the arrow to introduce the columnar member 12 into the opening 34, the columnar member 12 is rotated in the opposite direction of the arrow so as to return the columnar member 12 to the inside of the inner binding linear member 32. It is possible to make it work.

As shown in FIG. 2, the semiconductor substrate 5 is placed on the upper surface of the stage 9, and the columnar member arrangement mask 20 is arranged on the upper surface of the semiconductor substrate 5. A gap E is provided between the semiconductor substrate 5 and the columnar member arrangement mask 20. Flux 35 (see FIG. 3) is applied to the position where the opening 34 is arranged. The binding linear members 32 and 33 are thin twisted yarn aggregates having conductivity and flexibility, and rotate and move in the X-axis direction and the Y-axis direction so as to sweep the surface of the columnar member arrangement mask 20. In the meantime, the columnar member 12 is introduced into the opening 34 provided in the columnar member arrangement mask 20. Therefore, the columnar member 12 is not damaged.

Further, since the binding linear members 32 and 33 have conductivity, dust and the like due to static electricity are not adsorbed, and mounting with a high degree of cleanliness can be performed. Although the illustration is simplified in FIG. 2, the outer binding linear member 33 is arranged more densely than the inner binding linear member 32. The columnar member 12 shown in FIG. 2 exemplifies a simple cylindrical shape, but as the shape of the columnar member 12, for example, various shapes can be adapted as shown in FIG. 7. In such a case, the columnar member 12 may come out of the inner binding linear member 32 due to the anisotropy of rolling due to a large size, specific gravity, aspect ratio, or the position of the center of gravity. However, by providing the outer binding linear member 33, the columnar member 12 does not deviate to the outside of the outer binding linear member 33. Next, the operation of the columnar member transfer unit 25 will be described with reference to FIG.

FIG. 3 is an explanatory diagram showing the operation of the columnar member transfer unit 25. Note that FIG. 3 is a simplified representation of a part of the columnar member transfer portion 25. A plurality of electrodes 16 are formed on the semiconductor substrate 5 mounted on the stage 9, and a flux 35 is applied to the upper surface of the electrodes 16. A mask 20 for arranging columnar members is arranged above the semiconductor substrate 5. A large number of columnar members 12 are randomly supplied to the upper surface of the columnar member arrangement mask 20. The columnar member 12 is weighed by the columnar member weighing device, and a certain amount (a certain number) falls down the columnar member passage 27 and is supplied onto the columnar member arrangement mask 20. The brush squeegee 28 can be moved in the X-axis direction and the Y-axis direction by the X-axis drive device 17 and the Y-axis drive device 18 (see FIG. 1) on the columnar member arrangement mask 20, and is Z by the Z-axis drive device 19. It can be moved in the axial direction. By moving the brush squeegee 28 in the X-axis and Y-axis directions while rotating at a predetermined height position, the columnar member array mask 20 is swept on the surface by the inner binding linear member 32 and the outer binding linear member 33. While moving in this way, the columnar member 12 is dropped into the opening 34 provided in the columnar member arrangement mask 20. Since the flux 35 is applied to the semiconductor substrate 5 at a predetermined position, the columnar member 12 maintains its posture when dropped by utilizing the viscosity of the flux 35.

The inner binding linear member 32 and the outer binding linear member 33 lightly reduce the columnar member 12 so that the position and posture of the columnar member 12 can be maintained by the flux 35 after the columnar member 12 has fallen into the opening 34. You may push it downwards. In order to do so, it is preferable that the thickness of the columnar member array mask 20 is set to an appropriate dimension with respect to the length in the longitudinal direction of the columnar member 12 (hereinafter, referred to as "total length"). Further, as the flux 35, it is preferable to select a flux 35 having a viscosity capable of maintaining the posture until the step of joining and curing the columnar member 12 after mounting it on the semiconductor substrate 5.

When the columnar member 12 is a cylinder, the size of the opening 34 provided in the columnar member arrangement mask 20 is such that the guide port 40 on the supply side of the columnar member 12 is larger than the maximum diameter of the columnar member 12, and the columnar member 12 Is smaller than the total length of. Further, the diameter of the opening 34 on the semiconductor substrate 5 side is a position-determining hole 41 having a size capable of defining the position of the columnar member 12 within the application range of the flux 35. The guide port portion 40 and the position defining hole portion 41 are connected by a tapered hole. If the opening 34 has such a shape, the columnar member 12 can be smoothly dropped into the opening 34, and the flux 35 can be accurately arranged and mounted at a predetermined position in the coating range. The shape of the opening 34 is set according to the shape of the columnar member 12.

FIG. 4 is a perspective view showing an example of a semiconductor substrate 5 in which a plurality of columnar members 12 are arranged and mounted. As shown in FIG. 4, on the semiconductor substrate 5, columnar members 12 are arranged at predetermined positions on the flux 35, that is, on the electrodes 16. The posture of the columnar member 12 is maintained by the viscosity of the flux 35. After that, the arrangement state of the columnar members 12 is inspected by the inspection device 26 (see FIG. 1), and the column members 12 are discharged to the loader / unloader 4. The semiconductor substrate 5 on which the columnar member 12 is mounted is transported to, for example, a reflow device, and the semiconductor substrate 5 and the columnar member 12 are joined and fixed. Next, a columnar member mounting method using the columnar member mounting device 1 will be described with reference to FIGS. 1 to 6.

(Column member mounting method)
FIG. 5 is a flowchart showing a main process of the columnar member mounting method, and FIG. 6 is an explanatory diagram showing a flux printing process. First, the semiconductor substrate 5 is set on the stage 9 (step S1). Subsequently, the position of the semiconductor substrate 5 is recognized by an image recognition camera (not shown) (step S2). Next, the semiconductor substrate 5 is transferred to the flux printing apparatus 2 (see FIG. 1) in a state of being placed on the stage 9. In the flux printing apparatus 2, the flux printing mask 15 is set on the semiconductor substrate 5, and the positions of the semiconductor substrate 5 and the flux printing mask 15 are aligned (step S3). That is, the positions of the electrodes 16 of the semiconductor substrate 5 and the positions of the openings 45 of the flux printing mask 15 are aligned. The flux printing mask 15 prints the flux 35 in a state of being in close contact with the semiconductor substrate 5 (step S4). The flux 35 is printed and applied on the electrode 16 of the semiconductor substrate 5 by a so-called screen printing method using a flux printing mask 15 having an opening 45 and a resin squeegee 46. After printing, a part of the flux 35 in the opening 35 is transferred to the semiconductor substrate 5 at the plate release (separating the flux printing mask 15 from the semiconductor substrate 5). The thickness of the transferred flux 35 is determined by the viscosity of the flux 35, the size of the opening 35, the speed of plate release, and the like. The flux printing mask 15 is a metal mask such as SUS (called a stencil mask). By flux printing, the flux 35 is applied on the electrode 16 of the semiconductor substrate 5 with a predetermined area and thickness. After the flux printing, the semiconductor substrate 5 is transferred to the columnar member transfer device 3 in a state of being placed on the stage 9.

In the columnar member transfer device 3, the columnar member arrangement mask 20 is set on the semiconductor substrate 5, and the positions of the semiconductor substrate 5 and the columnar member arrangement mask 20 are aligned (step S5). That is, the positions of the electrodes 16 of the semiconductor substrate 5 and the positions of the openings 34 of the columnar member arrangement mask 20 are aligned. Then, as shown in FIG. 2, a fixed amount of the columnar member 12 is supplied onto the columnar member arrangement mask 20 from the columnar member measuring device (step S6). The columnar member arrangement mask 20 is a metal mask such as SUS. The columnar member 12 is supplied into the inner binding linear member 32.

Next, the brush squeegee 28 is moved in the X-axis and Y-axis directions while rotating, and the columnar member 12 is dropped onto the semiconductor substrate 5 and arranged (step S7). The columnar member 12 is dropped into the opening 34 provided in the columnar member arrangement mask 20 by the inner binding linear member 32 and reaches the application portion of the flux 35. At this time, the columnar member 12 may come out to the outside of the inner binding linear member 32, but does not deviate to the outside from the outer binding linear member 33. The outer binding linear member 33 also has a function of returning the columnar member 12 to the inside of the inner binding linear member 32 by rotating. After arranging the columnar members 12 on the semiconductor substrate 5 (see FIG. 4), the columnar members 12 are conveyed to the inspection device 26 with the semiconductor substrate 5 set on the stage 9 to inspect the arrangement state of the columnar members 12 (step S8). This inspection is performed by an image recognition camera and an image processing unit (both not shown) provided in the inspection device 26. The inspection result is sent to a control unit (not shown). When the inspection process is completed, the semiconductor substrate 5 is discharged to the loader / unloader 4, and the semiconductor substrate 5 and the columnar member 12 are joined and fixed by a reflow device or the like.

As the material of the columnar member 12 described in the above embodiment, copper, a copper alloy, or copper plated with solder can be used. Further, although the columnar member 12 described above exemplifies a member having a simple cylindrical shape, it can be applied to various shapes and sizes depending on the application, and all of them have a large aspect ratio. In FIG. 7, a columnar member having a shape other than the columnar shape of the columnar member 12 will be described as an example.

FIG. 7 is a diagram showing the shapes of other plurality of examples of the columnar member 12. The columnar member 12 shown in FIG. 7A has a side view trapezoidal shape as if a conical main body is cut by a surface 12B parallel to the bottom surface 12A. The columnar member 12 shown in FIG. 7B has a substantially drum shape in which the central portion in the longitudinal direction is the constricted portion 12C. The columnar member 12 shown in FIG. 7C is a hexagonal prism, but is not limited to a polygonal prism such as a triangular prism, a tetragonal prism, or a pentagonal prism. Further, the columnar member 12 shown in FIG. 7 (D) has a collar 12D provided at one end of the columnar. The collar 12D may be provided at the other end, or may be provided at both ends. Further, the planar shape of the collar 12D may be polygonal, and the shapes shown in FIGS. 7 (A) to 7 (D) may be combined. The shape of the columnar member shown in FIG. 7 is an example, and various shapes can be arbitrarily selected for the shape and size depending on the member to be mounted, the place of use, and the method of use.

The columnar member mounting device 1 described above includes a columnar member arrangement mask 20 having a plurality of openings 34 and arranged on the semiconductor substrate 5 which is a substrate, and a brush arranged above the columnar member arrangement mask 20. The columnar member 12 having the squeegee 28 and supplied on the columnar member arranging mask 20 is introduced into the opening 34 by the brush squeegee 28, and the columnar member 12 is placed at a predetermined position on the semiconductor substrate 5 coated with the flux 35. Are arranged.

The columnar member mounting device 1 configured in this way defines the mounting posture of the columnar member 12 by introducing a plurality of columnar members 12 which are conductor pins into the opening 34 provided in the mask 20 for arranging the columnar members. At the same time, it can be mounted on the semiconductor substrate 5 all at once. Moreover, since the flux 35 is used as the temporary fixing material for the columnar member 12, the position and posture are maintained, and since it can be directly connected to the reflow after mounting, high productivity can be realized. Further, as compared with the conventional method of forming the copper pillar 52 on the semiconductor substrate 5 by electroplating, the columnar member 12 can be mass-produced in a short time by machining or the like, and moreover, the copper pillar 52 is formed. Equipment costs and manufacturing costs can be reduced without the need for dedicated equipment. Further, it can be said that it is an environment-friendly device and method because no processing liquid or the like is generated in the process of forming the columnar member 12 or the process of mounting it on the semiconductor substrate 5.

Further, since the columnar member mounting device 1 has an inspection device 26 for inspecting the arrangement state of the columnar members 12 on the semiconductor substrate 5 which is a substrate, defects such as defects and arrangement defects of the columnar members 12 can be detected. , The mounting quality can be improved.

Further, the brush squeegee 28 has a binding linear member 31 implanted in the mounting portion 30, and the columnar members supplied on the columnar member arranging mask 20 by moving the binding linear member 31 while rotating. The member 12 is guided to the opening 34. The binding linear member 31 is a flexible brush. Therefore, as compared with the method of vibrating the columnar member 12 as in the prior art, there is no possibility of damaging the columnar member 12 or damaging the solder plating as the bonding material applied to the surface of the columnar member 12.

Further, the binding linear member 31 which is a brush is doubly formed in the radial direction of the rotation locus of the brush squeegee 28. That is, the binding linear member 31 is mainly composed of an inner binding linear member 32 that guides the columnar member 12 to the opening 34 and an outer binding linear member 33 that mainly prevents the columnar member 12 from deviating from the brush squeegee 28. It has a double structure. In this way, if the binding linear member 31 has a double structure, excess columnar members are generated due to deviation from the outer binding linear member 33, and missing (mounted on the Missing / semiconductor substrate 5) due to insufficient columnar members. It is possible to stably mount the columnar member 12 by eliminating defects such as (insufficient number of columnar members 12).

Further, the binding linear member 31 is an aggregate of thin twisted yarns having conductivity and flexibility. Since the binding linear member 31 (the outer binding linear member 32 and the inner binding linear member 33) configured in this way is an aggregate of thin twisted yarns having flexibility, the columnar member 12 is damaged. I won't let you. Further, since the binding linear member 31 has conductivity, dust and the like due to static electricity are not adsorbed, and mounting with a high degree of cleanliness can be performed.

Further, the flux 35 is applied by a screen printing method using a flux printing mask 15 arranged above the semiconductor substrate 5 which is a substrate and having a plurality of openings, and a resin squeegee 46. In this way, the flux 35 can be applied at an accurate position and an accurate amount (range and thickness) on the semiconductor substrate 5. Since the flux printing mask 15 is a metal mask called a stencil mask, it has durability and can maintain the flux coating quality.

Further, the columnar member mounting method according to the present embodiment includes a step of arranging a flux printing mask 15 on the upper surface of the semiconductor substrate 5 which is a substrate and printing the flux 35 at a predetermined position of the semiconductor substrate 5, and the flux 35. A step of arranging the columnar member arranging mask 20 above the coated semiconductor substrate 5, a step of supplying the columnar member 12 on the columnar member arranging mask 20, and a flux from the opening 34 of the columnar member arranging mask 20. This includes a step of introducing and arranging the columnar members 12 at predetermined positions of the semiconductor substrate 5 coated with 35, and a step of inspecting the arrangement state of the columnar members 12.

According to the above-mentioned columnar member mounting method, by introducing a plurality of columnar members 12 which are conductor pins into the openings 34 provided in the columnar member arranging mask 20, the semiconductor while defining the mounting posture of the columnar members 12. Since it can be mounted on the substrate 5 all at once and flux is used as a temporary fixing material for the columnar member 12, it can be directly connected to the reflow after mounting, so that high productivity can be realized. Since no processing liquid or the like is generated in a series of steps of mounting on the semiconductor substrate 5, an environment-friendly columnar member mounting method can be realized.

The present invention is not limited to the above-described embodiment, and modifications, improvements, and the like within the range in which the object of the present invention can be achieved are included in the present invention. In the above-described embodiment, the columnar member 12 is mounted on the semiconductor substrate 5 so as to be planted. For example, in the semiconductor substrate 5, the lower layer wiring and the upper layer wiring are three-dimensionally mounted by the columnar member 12. High-density mounting is possible by providing a so-called via function of connecting the front electrode and the back electrode on the circuit board 50. Further, by three-dimensionally connecting semiconductor substrates and circuit boards arranged in a plurality of layers with columnar members, it is possible to adapt to the manufacture of high-density three-dimensional circuit elements.

Further, the columnar member mounting device 1 described above has been described by way of example in the case where the columnar member 12 is a conductor pin for joining the semiconductor substrate 5 and the circuit board 50, but the present invention is not limited to this, and for example, a columnar member having a large aspect ratio. This technical idea can also be applied to a device for mounting a member on a mounting object other than a substrate or inserting a member into a hole provided in the mounting target.

1 ... Columnar member mounting device 2 ... Flux printing device 3 ... Columnar member transfer device 5 ... Semiconductor substrate (board)
12 ... Columnar member 15 ... Flux printing mask 20 ... Columnar member arrangement mask 26 ... Inspection device 28 ... Brush squeegee 30 ... Mounting part (brush squeegee)
31 ... Bundling linear member 32 ... Inner binding linear member 33 ... Outer binding linear member 34 ... Opening (mask for columnar member arrangement)
35 ... Flux 40 ... Induction port (opening)
41 ... Positioning hole (opening)
46 ... Resin squeegee

Claims (6)

A columnar member mounting device that arranges columnar members at predetermined positions on a substrate.
A mask for arranging columnar members having a plurality of openings and arranged on the substrate,
A brush squeegee arranged above the columnar member arrangement mask and
Have,
The columnar member supplied on the columnar member arranging mask is introduced into the opening by the brush squeegee, and the columnar member is arranged at a predetermined position on the substrate to which flux is applied.
The brush squeegee has a binding linear member implanted in the mounting portion.
The binding linear member includes an inner binding linear member having a function of introducing the columnar member into the opening of the mask for arranging the columnar member, and an outer binding having a function of preventing the columnar member from deviating to the outside of the brush squeegee. Consists of linear members
By moving the binding linear member while rotating, the columnar member supplied on the columnar member arrangement mask is guided to the opening.
A columnar member mounting device characterized by this. In the columnar member mounting device according to claim 1,
It has an inspection device for inspecting the arrangement state of the columnar members on the substrate.
A columnar member mounting device characterized by this. In the columnar member mounting device according to claim 1,
The binding linear member is doubly formed in the radial direction of the rotation locus of the brush squeegee.
A columnar member mounting device characterized by this. In the columnar member mounting device according to claim 3,
The binding linear member is an aggregate of thin twisted yarns having conductivity and flexibility.
A columnar member mounting device characterized by this. In the columnar member mounting device according to claim 1,
The flux is applied by a screen printing method using a flux printing mask arranged above the substrate and having a plurality of openings and a resin squeegee.
A columnar member mounting device characterized by this. This is a method of mounting a columnar member at a predetermined position on a substrate.
A step of arranging a flux printing mask on the upper surface of the substrate and printing the flux at a predetermined position on the substrate.
A step of arranging a mask for arranging columnar members having an opening above the substrate coated with the flux, and
A step of supplying the columnar member on the columnar member arrangement mask and
The columnar member supplied on the columnar member arrangement mask is introduced into the opening by a brush squeegee having a binding linear member arranged above the columnar member arrangement mask and implanted in the mounting portion. Process and
A step of arranging the columnar members at a predetermined position on the substrate to which the flux is applied from the opening of the columnar member arranging mask.
Including the step of inspecting the arrangement state of the columnar members.
The binding linear member includes an inner binding linear member having a function of introducing the columnar member into the opening of the mask for arranging the columnar member, and an outer binding having a function of preventing the columnar member from deviating to the outside of the brush squeegee. It is composed of linear members,
A method of mounting a columnar member, which is characterized in that.

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