JP2018018985A - Columnar member mounting apparatus and columnar member mounting method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a columnar member mounting apparatus and a columnar member mounting method capable of efficiently mounting a minute columnar member without scratching a semiconductor substrate or the like.SOLUTION: A columnar member mounting apparatus 1 includes: a columnar member arrangement mask 20 having a plurality of openings 34 and arranged on a semiconductor substrate 5; and a brush squeegee 28 disposed above the columnar member arrangement mask 20. Columnar members 12 supplied onto the columnar member arrangement mask 20 are introduced into the openings 34 by the brush squeegee 28. The columnar members 12 are arranged at predetermined positions on the semiconductor substrate 5 coated with a flux 35.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a columnar member mounting apparatus and a columnar member mounting method.

  When electrically bonding a semiconductor substrate and a substrate such as a circuit substrate, a method is known in which a plurality of solder bumps formed on the semiconductor substrate are melted and bonded to the circuit substrate (for example, Patent Documents). 1). However, in Patent Document 1, when bonding a semiconductor substrate and a circuit board using a solder bump as a bonding material, the solder bump is crushed and expanded in the radial direction, and the distance between adjacent solder bumps is reduced. In some cases, it may not be possible to cope with the mounting of the substrate that advances (see FIG. 8A). Therefore, Patent Document 2 discloses a technique in which a copper (Cu) pillar is formed on a semiconductor substrate and a solder layer is formed and bonded as a bonding material to the circuit board (for example, see Patent Document 2). The copper pillar disclosed in Patent Document 2 is suitable for miniaturization because the diameter does not change when the semiconductor substrate and the circuit board are joined (see FIG. 8B). However, since the copper pillar is formed in a columnar shape on the semiconductor substrate by electroplating or the like, it takes a long time to form, and it cannot be said that the productivity is good. In addition, recently, a member having a columnar member (conductor pin) formed of a metal such as copper instead of a copper pillar formed on a semiconductor substrate as a bonding member is known.

  However, since the length of the columnar member (conductor pin) in the longitudinal direction is long with respect to the diameter (the aspect ratio is large), it is difficult to arrange and mount the columnar members on the semiconductor substrate. Patent Document 3 discloses a method for joining conductor pins in which conductor pins are arranged and mounted on a semiconductor substrate.

JP-A-5-243232 JP 2014-157906 A JP 2002-314291 A

  In the method for joining conductor pins (columnar members) described in Patent Document 3, first, a jig pallet, a pin stand jig and an insertion guide jig are arranged in an overlapping manner, and the conductor pins are dropped from above the insertion guide jig. The jig pallet is vibrated so that the pin stand jig slides between the jig pallet and the insertion guide jig, and the conductor pins are arranged in the pin holes of the pin stand jig. Then, the jig pallet, the pin stand jig and the insertion guide jig are overlapped and turned upside down, and the conductor pins are joined to the printed wiring board in a standing state. In such a method for joining the conductor pins, since the conductor pins are supplied to the pin holes by applying vibration to the jig pallet, there is a problem that the surface of the conductor pins is likely to be damaged and poor joining is likely to occur. In addition, it takes time to erect all the conductor pins by overlapping the conductor pins due to vibration or being supplied to a part of the insertion guide jig, and the productivity is good. I can't say that.

  The present invention has been made in view of the above problems, and its object is to provide a columnar member that can efficiently mount a columnar member having a large aspect ratio without damaging a semiconductor substrate or the like. It is intended to provide a mounting device and a columnar member mounting method.

  In order to solve the above-mentioned problems, a columnar member mounting apparatus according to the present invention is a columnar member mounting apparatus that arranges columnar members at predetermined positions on a substrate, and has a plurality of openings and is disposed on the substrate. An alignment mask and a brush squeegee disposed above the columnar member arrangement mask are provided. The columnar member supplied onto the columnar member arrangement mask is introduced into the opening by the brush squeegee, and flux is applied. The columnar members are arranged at predetermined positions on the substrate.

  In addition to the above invention, it is preferable to have an inspection apparatus for inspecting the arrangement of the columnar members on the substrate.

  Further, in addition to the above invention, the brush squeegee has a binding linear member implanted in the attachment member, and is supplied onto the columnar member arrangement mask by moving the binding linear member while rotating. It is preferable to guide the columnar member to the opening.

  Moreover, in addition to the said invention, it is preferable that the binding linear member is comprised double in the radial direction of the rotation locus | trajectory of a brush squeegee.

  Moreover, in addition to the said invention, it is preferable that a binding linear member is an aggregate | assembly of the thin twisted yarn provided with the softness | flexibility which has electroconductivity.

  In addition to the above invention, the flux is preferably applied by a screen printing method using a flux printing mask disposed above the substrate and having a plurality of openings, and a resin squeegee.

  The columnar member mounting method of the present invention is a method of mounting a columnar member at a predetermined position on a substrate, in which a flux printing mask is disposed on the upper surface of the substrate, the flux is printed on the substrate, and the flux is printed. A step of disposing a columnar member arrangement mask above the substrate, a step of supplying the columnar member on the columnar member arrangement mask, and a predetermined position of the semiconductor substrate on which the flux is printed from the opening of the columnar member arrangement mask A step of dropping and arranging the columnar members, and a step of inspecting the arrangement state of the columnar members.

It is a top view which shows the schematic whole structure of the columnar member mounting apparatus which concerns on embodiment of this invention. It is a figure explaining schematic structure of the columnar member transfer part concerning an embodiment of the invention. It is explanatory drawing showing the effect | action of the columnar member transfer part which concerns on embodiment of this invention. 1 is a perspective view showing an example of a semiconductor substrate on which columnar members according to an embodiment of the present invention are arranged and mounted. It is a flowchart which shows the main processes of the columnar member mounting method which concerns on embodiment of this invention. It is explanatory drawing which shows the flux printing process which concerns on embodiment of this invention. It is a figure showing the shape of other examples of the columnar member concerning an embodiment of the invention. It is explanatory drawing which shows the mounting example of the semiconductor substrate and circuit board using the columnar member which concerns on a prior art and embodiment of this invention.

  Hereinafter, a columnar member mounting apparatus 1 and a columnar member mounting method according to an embodiment of the present invention will be described with reference to the drawings. Before describing the embodiment of the present invention, a mounting form using the above-described conventional technology (Patent Document 1, Patent Document 2) and the columnar member 12 will be described with reference to FIG.

  FIG. 8 is an explanatory view showing a mounting example of the semiconductor substrate (wafer or the like) 5 and the circuit board 50 using the columnar member of the prior art and the present embodiment, and (A) uses solder bumps 51 as a bonding material. 1 and (B) use a copper pillar 52 formed on the semiconductor substrate 5, and (C) uses a columnar member 12 formed of copper or the like. As shown in FIG. 8A, the solder bump 51 has a substantially spherical shape with a diameter B0 shown by a two-dot chain line in the figure before being mounted on the semiconductor substrate 5. When the semiconductor substrate 5 is mounted on the circuit board 50, the solder bump 51 is melted and sinks in the height (thickness) direction, and the diameter expands to B1 in the radial direction. Since the pitch P between the adjacent solder bumps 51 does not change, the distance D0 between the solder bumps 51 before mounting is reduced to the distance D1 after mounting. Therefore, when the pitch P is further reduced, the swelling of the solder bumps 51 is disadvantageous. In the figure, an electrode 16 is formed on the semiconductor substrate 5, and an electrode 53 is formed on the circuit substrate 50.

  As shown in FIG. 8B, the copper pillar 52 is formed by depositing copper on the UBM (under bump metal) 54 laminated on the electrode 16 formed on the semiconductor substrate 5 by electroplating. The An insulating layer 55 is formed around the copper pillar 52 on the semiconductor substrate 5. A solder layer 56 is formed at the tip of the copper pillar 52 on the circuit board 50 side, and the solder layer 56 is used as a bonding material on the circuit board 50 side. Even if the pitch P between the adjacent copper pillars 52 is the same as that of the solder bumps 51 (see FIG. 8A), the diameter of the copper pillars 52 due to mounting does not change, so the distance D2 between the copper pillars 52 after mounting is It does not change. That is, if the pitch P is the same as that in the case of the solder bump 51, D2> D1, so at least the difference can reduce the pitch P and contribute to miniaturization. However, there is a problem that a long time and a dedicated device are required to form the copper pillar 52.

  FIG. 8C shows an example in which a metal columnar member 12 having high conductivity such as copper is used for bonding the semiconductor substrate 5 and the circuit substrate 50. Since the columnar members 12 are not deformed in the same manner as the copper pillars 52 at the time of mounting, the distance between the columnar members 12 is D2 when the diameter and the pitch P are the same as the copper pillars 52, and the pitch between the electrodes of the semiconductor substrate 5 is Can be refined. The electrode 16 is formed on the semiconductor substrate, the electrode 53 is formed on the circuit substrate 50, and the semiconductor substrate 5 and the circuit substrate 50 are connected by the columnar member 12. Since the columnar member 12 can be formed by machining or the like, it can be easily manufactured in a large amount in a short time compared to the formation of the copper pillar 52. However, it is difficult to array and mount the fine columnar members 12 at predetermined positions on the semiconductor substrate 5 by a method such as the above-described prior art (see Patent Document 3). Therefore, hereinafter, a mounting apparatus and mounting method for mounting the columnar member 12 on the semiconductor substrate 5 according to the present invention will be described. As a substrate as a mounting target member on which the columnar member 12 is mounted, there is a semiconductor substrate (wafer or the like) 5 or a circuit substrate 50, which can be mounted on either of them. A structure in which the columnar member 12 is mounted on the substrate 5 will be described as an example.

(Whole structure of the columnar member mounting apparatus 1)
FIG. 1 is a plan view showing a schematic overall configuration of the columnar member mounting apparatus 1. As shown in FIG. 1, the columnar member mounting device 1 includes a flux printing device 2 and a columnar member transfer device 3. Further, the columnar member mounting apparatus 1 has a substrate transfer robot 7 for transferring the semiconductor substrate 5 from the loader / unloader 4 to the pre-aligner 6, and the substrate transfer robot 7 transfers the semiconductor substrate from the pre-aligner 6 to the pressing device 8. 5 is conveyed. The pre-aligner 6 roughly adjusts the XY coordinate position of the semiconductor substrate 5. The semiconductor substrate 5 whose position has been corrected by the coarse adjustment is placed on the stage 9 by the substrate transfer robot 7. The semiconductor substrate 5 placed on the stage 9 is sucked into the stage 9 while being pressed by the pressing device 8 from above to the stage 9 side to correct the warp. The stage 9 is adjusted in the Y-axis direction on the Y-axis rail 10, moved on the X-axis rail 11 with the semiconductor substrate 5 placed thereon, and stopped at a predetermined position of the flux printing apparatus 2. The horizontal direction shown in FIG. 1 is the X axis, the vertical direction is the Y axis, and the height direction (thickness direction) is the Z axis.

  The flux printing apparatus 2 prints and applies the flux 35 to a predetermined position on the electrode 16 of the semiconductor substrate 5 from the opening 45 of the flux printing mask 15 as shown in FIG. The semiconductor substrate 5 coated with the flux 35 is transported to the columnar member transfer device 3 while being placed on the stage 9. The columnar member transfer device 3 includes an X-axis drive device 17, a Y-axis drive device 18, and a Z-axis drive device 19, and moves the columnar member transfer device 3 in the X-axis direction, the Y-axis direction, and the Z-axis direction. Is possible. Note that there are a Z-axis and a θ-axis (not shown) on the Y-axis rail 10 and the X-axis rail 11, and an opening 45 (see FIG. 6A) of the flux printing mask 15 by driving the Z-axis and the θ-axis. See FIG. 2), the bottom surface of each of the openings 34 (see FIG. 2) of the columnar member arrangement mask 20 and the PAD portion (electrode portion on which the columnar member is to be mounted) of the semiconductor substrate 5 are combined. The columnar members 12 are arranged.

  As shown in FIG. 2, the columnar member 12 dropped and supplied from the columnar member weighing device (not shown) to the columnar member transfer unit 25 is surrounded by a binding linear member 31 so as not to deviate from the columnar member transfer unit 25. Yes. The columnar member 12 is transferred to the place where the flux 35 is applied on the semiconductor substrate 5 from the opening 34 (see FIG. 2) of the columnar member arrangement mask 20 by moving the columnar member transfer portion 25. Is done. The semiconductor substrate 5 on which the columnar members 12 are mounted is transported to the inspection device 26, the arrangement state of the columnar members 12 is inspected by an image recognition camera (not shown), and is discharged to the loader / unloader 4. In the return stroke, the pre-aligner 6 does not pass. In the columnar member mounting apparatus 1 described above, the configuration in which the columnar member 12 is mounted on the semiconductor substrate 5 has been described. However, the columnar member 12 may be mounted on the circuit board 50 side. As the columnar member 12, for example, there is a fine size member having a large aspect ratio with a diameter of several tens of μm and a length of 100 μm. The mounting of the columnar member 12 on the semiconductor substrate 5 will be described later with reference to FIGS.

(Configuration and operation of the columnar member transfer portion 25)
FIG. 2 is a diagram illustrating a schematic configuration of the columnar member transfer unit 25. The columnar member transfer portion 25 has a rotatable brush squeegee 28 attached to the X-axis drive device 17. The brush squeegee 28 includes a binding linear member 31 that is implanted in an attachment portion 30 that is fixed to the squeegee rotation drive device 29. The binding linear member 31 has a double structure (double concentric circles) in the radial direction of the rotation trajectory of the brush squeegee 28, and includes an inner binding linear member 32 and an outer binding linear member 33. ing. Both the inner binding linear member 32 and the outer binding linear member 33 are so-called brushes that are widened toward the columnar member arrangement mask 20 from the attachment portion 30. In FIG. 2, the binding linear member 31 is simplified.

  The inner binding linear member 32 mainly has a function of introducing the columnar member 12 into the opening 34 of the columnar member arrangement mask 20, and the outer binding linear member 33 mainly controls the columnar member 12 of the brush squeegee 28. It has a function that does not deviate outward, that is, does not deviate outwardly from the outer bound linear member 33. Further, the outer binding linear member 33 has a function of returning the columnar member 12 between the outer binding linear member 32 and the inner binding linear member 32 to the inner binding linear member 32 while introducing the columnar member 12 into the opening 34. For example, if the brush squeegee 28 is rotated in the direction of the arrow to introduce the columnar member 12 into the opening 34, the columnar member 12 is returned to the inner side of the inner binding wire member 32 by rotating in the opposite direction of the arrow. It is possible to make it work.

  As shown in FIG. 2, the semiconductor substrate 5 is placed on the upper surface of the stage 9, and a columnar member arrangement mask 20 is arranged on the upper surface of the semiconductor substrate 5. A gap E is provided between the semiconductor substrate 5 and the columnar member arrangement mask 20. In addition, the flux 35 (refer FIG. 3) is apply | coated to the position where the opening part 34 is arrange | positioned. The binding linear members 32 and 33 are thin twisted yarn assemblies having a conductive flexibility, and rotate and move in the X axis direction and the Y axis direction so as to sweep the surface of the columnar member arrangement mask 20. In the meantime, the columnar member 12 is introduced into the opening 34 provided in the columnar member arrangement mask 20. Therefore, the columnar member 12 is not damaged.

  Further, since the binding wire members 32 and 33 have conductivity, they do not adsorb dust due to static electricity, and can be mounted with a high degree of cleanliness. Although the illustration is simplified in FIG. 2, the outer binding linear members 33 are arranged more densely than the inner binding linear members 32. The columnar member 12 illustrated in FIG. 2 exemplifies a simple columnar shape, but various shapes can be adapted as the shape of the columnar member 12, for example, as illustrated in FIG. 7. In such a case, the columnar member 12 may come out of the inner bound linear member 32 due to rolling anisotropy due to a large size, specific gravity, aspect ratio (aspect ratio), or center of gravity position. However, by providing the outer binding linear member 33, the columnar member 12 does not deviate outside the outer binding linear member 33. Next, the effect | action of the columnar member transfer part 25 is demonstrated, referring FIG.

  FIG. 3 is an explanatory diagram illustrating the operation of the columnar member transfer unit 25. FIG. 3 shows a part of the columnar member transfer portion 25 in a simplified manner. A plurality of electrodes 16 are formed on the semiconductor substrate 5 placed on the stage 9, and a flux 35 is applied to the upper surface of the electrodes 16. A columnar member arrangement mask 20 is disposed above the semiconductor substrate 5. A large number of columnar members 12 are randomly supplied to the upper surface of the columnar member array mask 20. The columnar members 12 are weighed by the columnar member weighing device, and a certain amount (a certain number) falls through the columnar member passages 27 and is supplied onto the columnar member arrangement mask 20. The brush squeegee 28 is movable on the columnar member arrangement mask 20 in the X-axis direction and the Y-axis direction by the X-axis drive device 17 and the Y-axis drive device 18 (see FIG. 1). It can move in the axial direction. By moving the brush squeegee 28 in the X-axis and Y-axis directions while rotating at a predetermined height position, the surface of the columnar member arrangement mask 20 is swept by the inner binding linear member 32 and the outer binding linear member 33. The columnar member 12 is dropped into the opening 34 provided in the columnar member arrangement mask 20 while moving in this manner. Since the flux 35 is applied to the semiconductor substrate 5 at a predetermined position, the columnar member 12 maintains the posture when it is dropped by using the viscosity of the flux 35.

  The inner binding linear member 32 and the outer binding linear member 33 lighten the columnar member 12 so that the position and posture of the columnar member 12 can be maintained by the flux 35 after the columnar member 12 falls into the opening 34. You may make it push downward. In order to do so, it is preferable that the thickness of the columnar member arrangement mask 20 is set to an appropriate dimension with respect to the length in the longitudinal direction of the columnar member 12 (hereinafter referred to as “full length”). Further, as the flux 35, it is preferable to select a flux having a viscosity capable of maintaining the posture until the step of bonding and hardening after mounting the columnar member 12 on the semiconductor substrate 5.

  When the columnar member 12 is a cylinder, the size of the opening 34 provided in the columnar member array mask 20 is larger than the maximum diameter of the columnar member 12 at the guide port portion 40 on the supply side of the columnar member 12. Is less than the total length. Further, the diameter of the opening 34 on the semiconductor substrate 5 side is a position defining hole 41 having a size capable of defining the position of the columnar member 12 within the application range of the flux 35. The guide port 40 and the position defining hole 41 are connected by a tapered hole. If the opening 34 has such a shape, the columnar member 12 can be smoothly dropped into the opening 34 and can be accurately arranged and mounted at a predetermined position in the application range of the flux 35. The shape of the opening 34 is set according to the shape of the columnar member 12.

  FIG. 4 is a perspective view showing an example of the semiconductor substrate 5 on which a plurality of columnar members 12 are arranged and mounted. As shown in FIG. 4, the columnar members 12 are arranged on the semiconductor substrate 5 at predetermined positions on the flux 35, that is, on the electrodes 16. The posture of the columnar member 12 is maintained by the viscosity of the flux 35. Thereafter, the arrangement state of the columnar members 12 is inspected by the inspection device 26 (see FIG. 1) and discharged to the loader / unloader 4. The semiconductor substrate 5 on which the columnar member 12 is mounted is conveyed to, for example, a reflow apparatus, and the semiconductor substrate 5 and the columnar member 12 are bonded and fixed. Next, a columnar member mounting method using the columnar member mounting apparatus 1 will be described with reference to FIGS.

(Columnar mounting method)
FIG. 5 is a flowchart showing the main steps of the columnar member mounting method, and FIG. 6 is an explanatory view showing the flux printing step. First, the semiconductor substrate 5 is set on the stage 9 (step S1). Subsequently, the position of the semiconductor substrate 5 is recognized by an image recognition camera (not shown) (step S2). Next, the semiconductor substrate 5 is transported to the flux printing apparatus 2 (see FIG. 1) while being placed on the stage 9. In the flux printing apparatus 2, the flux printing mask 15 is set on the semiconductor substrate 5, and the positions of the semiconductor substrate 5 and the flux printing mask 15 are aligned (step S3). That is, the position of the electrode 16 of the semiconductor substrate 5 is aligned with the position of the opening 45 of the flux printing mask 15. The flux printing mask 15 prints the flux 35 in close contact with the semiconductor substrate 5 (step S4). The flux 35 is printed and applied onto the electrode 16 of the semiconductor substrate 5 by a so-called screen printing method using a flux printing mask 15 having an opening 45 and a resin squeegee 46. After printing, a part of the flux 35 in the opening 35 is transferred to the semiconductor substrate 5 to separate the plate (separate the flux printing mask 15 from the semiconductor substrate 5). The thickness of the transferred flux 35 is determined by the viscosity of the flux 35, the size of the opening 35, the speed of separating the plate, and the like. The flux printing mask 15 is a metal mask such as SUS (referred to as a stencil mask). By flux printing, the flux 35 is applied onto the electrode 16 of the semiconductor substrate 5 with a predetermined area and thickness. After the flux printing, the semiconductor substrate 5 is transported to the columnar member transfer device 3 while being placed on the stage 9.

  In the columnar member transfer apparatus 3, the columnar member arrangement mask 20 is set on the semiconductor substrate 5, and the positions of the semiconductor substrate 5 and the columnar member arrangement mask 20 are aligned (step S5). That is, the position of the electrode 16 on the semiconductor substrate 5 is aligned with the position of the opening 34 of the columnar member arrangement mask 20. Then, as shown in FIG. 2, a certain amount of the columnar members 12 are supplied from the columnar member weighing device onto the columnar member arrangement mask 20 (step S6). The columnar member arrangement mask 20 is a metal mask such as SUS. The columnar member 12 is supplied into the inner bound linear member 32.

  Next, the brush squeegee 28 is rotated and moved in the X-axis and Y-axis directions to drop the columnar members 12 onto the semiconductor substrate 5 and arrange them (step S7). The columnar member 12 is dropped into the opening 34 provided in the columnar member arrangement mask 20 by the inner bound linear member 32 and reaches the application portion of the flux 35. At this time, the columnar member 12 may come out of the inner bound linear member 32, but does not deviate from the outer bound linear member 33 to the outside. The outer binding linear member 33 also has a function of returning the columnar member 12 to the inside of the inner binding linear member 32 by rotating. After the columnar members 12 are arranged on the semiconductor substrate 5 (see FIG. 4), the semiconductor substrate 5 is set on the stage 9 and conveyed to the inspection device 26, and the arrangement state of the columnar members 12 is inspected (step S8). This inspection is performed by an image recognition camera and an image processing unit (both not shown) provided in the inspection apparatus 26. The inspection result is sent to a control unit (not shown). When the inspection process is completed, the semiconductor substrate 5 is discharged to the loader / unloader 4, and the semiconductor substrate 5 and the columnar member 12 are bonded and fixed by a reflow apparatus or the like.

  In addition, as the material of the columnar member 12 described in the above embodiment, it is possible to use copper, copper alloy, or copper plated with solder. Moreover, although the columnar member 12 described above is exemplified as a simple columnar shape, it can be applied to various shapes and sizes depending on the application, and each has a large aspect ratio. FIG. 7 illustrates a columnar member having a shape other than the column of the columnar member 12 as an example.

  FIG. 7 is a diagram showing the shapes of other examples of the columnar member 12. The columnar member 12 shown in FIG. 7A has a trapezoidal shape as viewed from the side, in which a conical main body is cut by a surface 12B parallel to the bottom surface 12A. The columnar member 12 shown in FIG. 7B has a substantially drum shape in which the central portion in the longitudinal direction becomes the constricted portion 12C. The columnar member 12 shown in FIG. 7C is a hexagonal column, but may be a polygonal column such as a triangular column, a quadrangular column, or a pentagonal column. Furthermore, the columnar member 12 shown in FIG. 7D is provided with a flange 12D at one end of a cylinder. The scissors 12D may be provided at the other end or at both ends. Moreover, the planar shape of the ridge 12D may be a polygon, and the shapes shown in FIGS. 7A to 7D may be combined. The shape of the columnar member shown in FIG. 7 is one example, and various shapes can be selected as the shape and size depending on the mounting target member, the place of use, or the method of use.

  The columnar member mounting apparatus 1 described above includes a columnar member array mask 20 having a plurality of openings 34 and disposed on a semiconductor substrate 5 as a substrate, and a brush disposed above the columnar member array mask 20. The columnar member 12 having the squeegee 28 and supplied onto the columnar member arrangement mask 20 is introduced into the opening 34 by the brush squeegee 28 and is disposed at a predetermined position of the semiconductor substrate 5 to which the flux 35 is applied. Array.

  The columnar member mounting apparatus 1 configured as described above defines the mounting posture of the columnar member 12 by introducing a plurality of columnar members 12 that are conductor pins into the openings 34 provided in the columnar member arrangement mask 20. However, batch mounting on the semiconductor substrate 5 is possible. In addition, since the flux 35 is used as the temporary fixing material of the columnar member 12, the position and the posture are maintained, so that it can be directly connected to the reflow after mounting, so that high productivity can be realized. Further, compared to the conventional method of forming the copper pillars 52 on the semiconductor substrate 5 by electroplating, the columnar members 12 can be manufactured in large quantities in a short time by machining or the like, and the copper pillars 52 are formed. The apparatus cost and the manufacturing cost can be reduced without requiring a dedicated apparatus. Furthermore, it can be said that this is an environment-friendly apparatus and method since no processing liquid is generated in the process of forming the columnar member 12 and the process of mounting it on the semiconductor substrate 5.

  Moreover, since the columnar member mounting apparatus 1 has the inspection device 26 for inspecting the arrangement state of the columnar members 12 on the semiconductor substrate 5 which is a substrate, it is possible to detect defects such as a defect or an alignment defect of the columnar members 12. , Can improve the mounting quality.

  The brush squeegee 28 has a binding linear member 31 implanted in the mounting portion 30, and the columnar shape supplied onto the columnar member arrangement mask 20 by moving the binding linear member 31 while rotating. The member 12 is guided to the opening 34. The binding linear member 31 is a brush having flexibility. Therefore, compared to the method of vibrating the columnar member 12 as in the prior art, there is no risk of scratching the columnar member 12 or scratching the solder plating as the bonding material applied to the surface of the columnar member 12.

  Further, the binding linear member 31 that is a brush is doubled in the radial direction of the rotation locus of the brush squeegee 28. That is, the binding linear member 31 includes an inner binding linear member 32 that mainly guides the columnar member 12 to the opening 34 and an outer binding linear member 33 that does not cause the columnar member 12 to deviate outside the brush squeegee 28. Has a double structure. As described above, if the binding linear member 31 has a double structure, generation of excess columnar members due to deviation from the outer binding linear members 33, or missing due to insufficient columnar members (missing / mounted on the semiconductor substrate 5). The columnar member 12 can be mounted stably.

  Moreover, the binding linear member 31 is an aggregate of thin twisted yarns having flexibility having conductivity. The bundling linear member 31 (the outer bundling linear member 32 and the inner bundling linear member 33) configured as described above is an aggregate of thin twisted yarns having flexibility, and thus damages the columnar member 12. I will not let you. Further, since the binding linear member 31 has conductivity, it can be mounted with a high degree of cleanness without attracting dust and the like due to static electricity.

  Further, the flux 35 is applied by a screen printing method using a resin squeegee 46 and a flux printing mask 15 disposed above the semiconductor substrate 5 as a substrate and having a plurality of openings. In this way, the flux 35 can be applied at an accurate position and an accurate amount (range and thickness) on the semiconductor substrate 5. Since the flux printing mask 15 is a metal mask called a stencil mask, it has durability and can maintain the flux application quality.

  Further, in the columnar member mounting method according to the present embodiment, a flux printing mask 15 is disposed on the upper surface of the semiconductor substrate 5 as a substrate, and the flux 35 is printed at a predetermined position on the semiconductor substrate 5. The step of disposing the columnar member arrangement mask 20 above the coated semiconductor substrate 5, the step of supplying the columnar member 12 onto the columnar member arrangement mask 20, and the flux from the opening 34 of the columnar member arrangement mask 20. A step of introducing and arranging the columnar members 12 at a predetermined position of the semiconductor substrate 5 coated with 35 and a step of inspecting the arrangement state of the columnar members 12.

  According to the above-described columnar member mounting method, the plurality of columnar members 12 that are conductor pins are introduced into the openings 34 provided in the columnar member disposition mask 20, so that the mounting posture of the columnar member 12 is defined while the semiconductor is defined. High-productivity can be realized because batch mounting on the substrate 5 is possible, and since flux is used as a temporary fixing material for the columnar member 12, it can be directly connected to reflow after mounting. Since a processing liquid or the like is not generated in a series of steps of mounting on the semiconductor substrate 5, an environment-friendly columnar member mounting method can be realized.

  It should be noted that the present invention is not limited to the above-described embodiment, but includes modifications and improvements as long as the object of the present invention can be achieved. In the embodiment described above, the columnar member 12 is mounted on the semiconductor substrate 5 so as to be planted. For example, in the semiconductor substrate 5, the lower layer wiring and the upper layer wiring are three-dimensionally formed by the columnar member 12. It is possible to achieve high-density mounting by providing a so-called via function of connecting the front electrode and the rear electrode of the circuit board 50. Further, by connecting semiconductor substrates and circuit boards arranged in a plurality of layers in a three-dimensional manner using columnar members, it is possible to adapt to the production of high-density three-dimensional circuit elements.

  Further, the columnar member mounting apparatus 1 described above has been described by exemplifying the case where the columnar member 12 is a conductor pin that joins the semiconductor substrate 5 and the circuit board 50. However, the present invention is not limited thereto, and for example, a columnar member having a large aspect ratio. This technical idea can also be applied to an apparatus for mounting a member on a mounting object other than a substrate or inserting the member into a hole provided in the mounting object.

DESCRIPTION OF SYMBOLS 1 ... Columnar member mounting apparatus 2 ... Flux printing apparatus 3 ... Columnar member transfer apparatus 5 ... Semiconductor substrate (board | substrate)
DESCRIPTION OF SYMBOLS 12 ... Columnar member 15 ... Mask for flux printing 20 ... Mask for columnar member arrangement 26 ... Inspection apparatus 28 ... Brush squeegee 30 ... Mounting part (brush squeegee)
31 ... Bundling linear member 32 ... Inner binding linear member 33 ... Outer binding linear member 34 ... Opening (columnar member arrangement mask)
35 ... Flux 40 ... Induction port (opening)
41 ... Position defining hole (opening)
46 ... Resin squeegee

Claims (7)

A columnar member mounting apparatus for arranging columnar members at predetermined positions on a substrate,
A columnar member arrangement mask having a plurality of openings and disposed on the substrate;
A brush squeegee disposed above the columnar member arrangement mask;
Have
The columnar member supplied on the columnar member array mask is introduced into the opening by the brush squeegee, and the columnar member is arranged at a predetermined position of the substrate to which a flux is applied,
The columnar member mounting apparatus characterized by the above-mentioned. In the columnar member mounting apparatus according to claim 1,
Having an inspection device for inspecting the arrangement of the columnar members on the substrate;
The columnar member mounting apparatus characterized by the above-mentioned. In the columnar member mounting apparatus according to claim 1,
The brush squeegee has a binding wire-like member implanted in the attachment portion,
Guiding the columnar member supplied on the columnar member arrangement mask to the opening by moving the binding linear member while rotating;
The columnar member mounting apparatus characterized by the above-mentioned. In the columnar member mounting apparatus according to claim 3,
The bundling linear member is doubled in the radial direction of the rotation trajectory of the brush squeegee,
The columnar member mounting apparatus characterized by the above-mentioned. In the columnar member mounting apparatus according to claim 4,
The binding linear member is an aggregate of thin twisted yarns having flexibility having conductivity,
The columnar member mounting apparatus characterized by the above-mentioned. In the columnar member mounting apparatus according to claim 1,
The flux is applied by a screen printing method using a flux printing mask disposed above the substrate and having a plurality of openings, and a resin squeegee.
The columnar member mounting apparatus characterized by the above-mentioned. A method of mounting a columnar member at a predetermined position on a substrate,
Placing a flux printing mask on the upper surface of the substrate and printing the flux at a predetermined position on the substrate;
A step of arranging a columnar member arrangement mask above the substrate on which the flux is applied;
Supplying the columnar member on the columnar member array mask;
Introducing and arranging the columnar members at predetermined positions of the substrate to which the flux is applied from the openings of the columnar member arranging mask;
Inspecting the arrangement of the columnar members;
including,
A columnar member mounting method characterized by that.

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