JPH08139096A - Electronic component, mounting of electronic component and electronic component mounting device - Google Patents

Abstract

PURPOSE: To make it possible to mount an electronic component on a substrate simply and with high accuracy by a method wherein a single or plurality of dummy bumps of a melting point lower than that of first bumps is or are formed on a prescribed region on one surface which has a plurality of first bumps. CONSTITUTION: In a bare chip 14, a metal film 70 of a size of 1/10 to 1/4 or so of the size of a circuit surface 14A is formed on a passivation film on the center part, which comprises the upper part of a circuit, of the circuit surface 14A. A dummy bump 73 consisting of a solder layer of a melting point smaller than that of chip side bumps 72 for bonding, which are respectively formed on electrodes 71, is formed on this film 70 in the same height as that of the chip side bumps 72. As a result, a metal film 74 of the same area as that of the film 70 on the side of the bare chip 14 is formed on a region, which opposes to the film 70 on the bare chip 14, on one surface of an insulating substrate 12. A dummy bump 77 of the same composition as that of the chip side dummy bump 73 is formed on this film 74 in the same height as that of substrate side bumps 76 for bonding, which are respectively formed on electrodes 75 on the substrate 12.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component, a method for mounting the electronic component, and a mounting device for the electronic component, and is suitable for application to, for example, a bare chip and a mounting method and a mounting device for mounting the bare chip on an insulating substrate. It is a thing.

[0002]

2. Description of the Related Art Conventionally, as one of chip-shaped electronic components to be mounted on a substrate, a wafer on which a plurality of semiconductor integrated circuits (hereinafter referred to as IC circuits) are formed is formed into individual chips for each IC circuit. There is a so-called bare chip formed by cutting and separating.

Usually, in the bare chip, bonding bumps (hereinafter referred to as chip side bumps) provided on each electrode of the circuit surface of the bare chip are provided on each corresponding electrode of the substrate. FIG. 12 shows that the chip side bumps and the substrate side bumps are melted by reflow or the like and joined after they are aligned and brought into contact with the bumps for manufacturing (hereinafter referred to as substrate side bumps). So that each electrode 2 and substrate 3 on the bare chip 1 side
The respective electrodes on the side are connected to each other via bumps 5 formed by fusing the chip-side bumps and the board-side bumps, and mounted on the substrate (hereinafter, this method is referred to as a first mounting method).

In addition to the first mounting method, a metal film (hereinafter referred to as a chip-side metal film) is formed on the circuit surface 1A of the bare chip 1 as shown in FIG. ) 10 is formed and the chip side metal film 1 is formed.
A metal film (hereinafter, referred to as a substrate-side metal film) 11 having substantially the same area as the chip-side metal film 10 is formed on the pattern surface 3A of the substrate 3 facing 0, and each of the chip-side metal films 10 is formed.
And a method of connecting (mounting) the bare chip 1 on the substrate 3 by connecting the substrate-side metal film 11 with the solder 12 having substantially the same melting point (hereinafter, this method is referred to as a second mounting method). is there. According to this second mounting method, when the bare chip 1 is mounted on the substrate 3, the stress applied to the bare chip 1 due to the difference in thermal expansion coefficient between the bare chip 1 and the substrate 3 is applied to the chip side metal film. Since it can be absorbed to some extent in the solder 12 between the substrate 10 and the substrate-side metal film 11, there is an advantage that the stress can be prevented from concentrating in the vicinity of the electrode 2 of the bare chip 1.

[0005]

However, in the first and second conventional mounting methods as described above, when the bare chip 1 is mounted on the substrate 3, each chip side bump and the corresponding substrate side bump are separated from each other. There has been a problem that highly accurate alignment using X-rays or the like is required to ensure the connection. Further, in such an alignment work, each chip-side bump and the corresponding substrate-side bump are aligned one set or a plurality of sets, so that the bare chip 1 is mounted on the substrate 3 without causing misalignment. Therefore, a long working time is required, and accordingly, there is a problem that the mounting tact time per 11 bare chips is reduced.

Further, in the above-mentioned first and second mounting methods, after aligning the respective bump-side bumps and the corresponding board-side bumps, when they are joined by reflow or the like,
The chip side bumps and the substrate side bumps may be misaligned due to the influence of hot air generated in the reflow furnace.

The present invention has been made in view of the above points, and is intended to propose an electronic component, an electronic component mounting method, and an electronic component mounting apparatus which can be mounted on a substrate simply and accurately. .

[0008]

In order to solve such a problem, in the first invention, a plurality of first bumps (72) are formed on one surface (14A), and each first bump (7) is formed.
Substrate (12) by bonding the respective 2) to the corresponding second bumps (76) formed on the substrate (12).
In the electronic component mounted on (1), a single or a plurality of dummy bumps (73) having a melting point lower than that of the first bumps (72) are formed in a predetermined area of the one surface (14A).

Further, in the second invention, one surface (14
A) a plurality of first bumps (72) are formed, each first bump
In the method of mounting an electronic component, the bumps (72) of (1) are mounted on the substrate (12) by being bonded to the corresponding second bumps (76) formed on the substrate (12), respectively.
The first part is provided on a predetermined area of one surface (14A) of the electronic component (14).
The first dummy bump (73) having a melting point lower than that of the bump (72), and the first dummy bump () when mounting the electronic component (14) on the substrate (12). 73), a second step of forming a second dummy bump (77) having a melting point lower than that of the second bump (76) on a predetermined region of the substrate (12), and an electronic component ( The third step 14) of aligning and bonding the first dummy bump and the second dummy bump of the substrate and the fourth step of bonding the first and second bumps are provided.

Further, in the third invention, one surface (14
A) a plurality of first bumps (72) are formed, each first bump
In the mounting device of the electronic component, which is mounted on the substrate (12) by respectively bonding the bumps (72) of the above to the corresponding second bumps (76) formed on the substrate (12),
Substrate holding means (13) for positioning and holding the substrate (12)
And the electronic component (14) on the substrate (12) positioned and held by the substrate holding means (13).
4) a first dummy bump (7) having a melting point lower than that of the first bump (72) formed in a predetermined area on the one surface (14A).
3) and a second bump (7) formed in a predetermined region of the substrate (12) facing the first dummy bump (73).
6) The electronic component placement means (17) which is placed in alignment with the second dummy bump (77) having a melting point lower than that of 6) and the first and second dummy bumps (73), (77) are heated and melted. After the bonding, the first and second bumps (72) and (76) are heated and melted to be bonded by a heating means (18).

[0011]

The first dummy bump (7) having a melting point lower than that of the first bump (72) is formed on the one surface (14A) of the electronic component (14) on which the first bump (72) for bonding is formed.
3) is formed, and the first bonding bump formed on the substrate (12) is formed on a region of the substrate (12) facing the first dummy bump (73) when the electronic component (14) is mounted. A second dummy bump (77) having a melting point lower than that of the second bump (76) is formed, and this second electronic bump (1) is formed.
When the first and second dummy bumps (73) and (77) are melted after the substrate 4 is aligned and placed on the substrate 12, the electronic component 14 has the first and second dummy bumps 73 and 77. The so-called self-alignment effect works due to the surface tension of the metal formed by melting the dummy bumps (73) and (77).

Therefore, at this time, if the electronic component (14) is not placed at an accurate position, the self-alignment effect automatically corrects the position of the electronic component (14). Therefore, after that, the first and second bumps (72) and (76) are heated and melted to be joined together, thereby eliminating the need for highly accurate alignment using, for example, X-rays, and the electron during reflow. The electronic component (14) can be mounted on the substrate (12) so that the positional deviation of the component can be suppressed and the mounting tact time per bare chip can be significantly improved.

[0013]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described in detail below with reference to the drawings.

In FIGS. 1 and 2, reference numeral 10 denotes an automatic electronic component mounting apparatus as a whole, which is provided at the center of the inside of the housing 11.
A board transfer section 13 for transferring the insulating board 12 is disposed, a component storage section 15 for storing a plurality of bare chips 14 at the back of the housing 11, and a bare chip 14 taken out from the component storage section 15 and placed inside the housing 11. Parts supply tool 16 to convey
And a tool driving robot 17 for sucking and holding the bear chip 14 transferred to the inside of the housing 11 by the component supply tool 16 above the board transfer unit 13 inside the housing 11, and the tool. The drive robot 17 is provided with an air controller 18 for supplying negative pressure or high temperature air as required.

In practice, the substrate transfer unit 13 includes a substrate fixing table 21 supported by a substrate fixing table elevating device 20 so as to be vertically movable.
First and second substrate passage rails 22A and 22B having a substantially U-shaped vertical cross section are provided above the recesses 22AX and 22B.
It is formed by arranging X to face each other in parallel with the left-right direction (hereinafter, referred to as X direction) indicated by an arrow x. In this case, the first and second board passage rails 22A, 2
2B is configured to be freely movable in the longitudinal direction by a drive mechanism (not shown). Thus, the insulating substrate 12 supplied from a substrate supply device (not shown) is connected to one end and the other end of the insulating substrate 12. 22A of concave parts
It is designed to be supported and conveyed by X and 22BX.

A reference pin (not shown) is planted at a predetermined position on the upper surface of the substrate fixing base 21. As a result, in the substrate transfer unit 13, the first and second substrate passage rails 22
The insulating substrate 12 is transported to a predetermined position in the housing 11 (hereinafter, this position is referred to as a processing position) by A and 22B,
When stopped, the board fixing base elevating device 20 raises the board fixing base 21 and inserts the above-described reference pins into the through holes 12 </ b> A formed at the predetermined positions of the insulating board 12 to cause the insulating board 12 to move. Can be positioned and held at this processing position.

In the component storage section 15, as is apparent from FIG. 2, a vertical direction indicated by an arrow z (hereinafter, this will be referred to as Z
A plurality of trays 30 are arranged on each tray 30 such that a plurality of trays 14 are arranged in a matrix with their circuit faces facing upward. In this case, the parts storage section 15
Then, the bear chip 14 mounted on the uppermost tray 30
When all the components are transported to the inside of the housing 11 by the component supply tool 16, the tray 30 is transported in the X direction and is stocked in an empty trace storage section (not shown). It is adapted to be pushed up in the Z direction, so that the bare chip 14 can be sequentially supplied to the component supply tool 16.

As shown in FIGS. 1 to 3, the component supply tool 16 is provided at the position of the opening 11A formed on the rear surface of the housing 11,
Along with the lower end surface 11AX of the opening 11A, it is movable in the X direction, and the front-back direction indicated by an arrow y within a predetermined range with the vicinity of the lower end surface 11AX of the opening 11A as an axis (hereinafter, referred to as Y direction). Has a base portion 31 rotatably disposed therein, an arm portion 32 that can be pulled out and stored at the tip of the base portion 31, and a suction nozzle 33 is disposed at the tip of the arm portion 32. There is. In this case, the suction nozzle 33 is connected to a negative pressure source (not shown), and thus the tip portion 33A can suck and hold the bare chip 14.

Therefore, the component supply tool 16 sucks and holds the bare chip 14 placed on the uppermost tray 30 of the component storage portion 15 at the tip portion 33AX of the suction nozzle 33, and then opens the opening 11A of the housing 11. By rotating toward the inner side of the housing 11 via the tool chip, the bare chip 14 with the circuit surface facing downward is driven by the tool driving robot 17 (FIG. 1).
To be able to supply. As is apparent from FIG. 1, the tool driving robot 17 has a Y-axis unit 41 movably mounted in the Y-direction on a base portion 40 fixedly arranged inside the housing 11, and a Y-axis unit 41 with respect to the Y-axis unit 41. And an Z-axis unit 43 fixedly mounted on the X-axis unit 42. The Z-axis unit 43 has an image recognition device such as a camera on the front surface thereof. The device 44 is integrally attached.

A component mounting tool 46 is attached to the lower end of the Z-axis unit 43 via a support shaft 45 which is movable in the Z direction by a drive mechanism (not shown). Axis unit 42, Y
The inside of the housing 11 can be freely moved within the movable range of the shaft unit 41 and the support shaft 45.

As shown in FIG. 4, the component mounting tool 46 has a chip cover 50 formed of a pressure-resistant glass in the shape of a flat square cup with the opening 50A facing downward, and the chip cover 50. Is formed such that the planar shape of the inner upper surface 50A is slightly larger than the planar shape of the bare chip 14 (FIG. 2) in both vertical and horizontal dimensions, and the internal height is selected deeper than the height of the bare chip 14. . As a result, the chip cover 50 has a uniform gap between the inner upper surface 50A of the bare chip 14 and the upper surface of the bare chip 14, which is placed at the mounting position of the insulating substrate 12, and the chip cover 50 has a uniform gap. The inner peripheral surface 50B and the outer peripheral surface of the bare chip 14 can be covered so as to form a uniform gap. Further, a through hole 50C is formed in the center of the inner upper surface 50A of the chip cover 50, and a cylindrical air supply / exhaust tool 51 is loosely inserted and arranged in the through hole 50C.

The air supply / exhaust tool 51 can be freely stroked in the Z direction based on a driving force given by a motor (not shown), and its upper end is connected to the air controller 18 via a pipe 52 (FIG. 1). Thus, the bare chip 14 can be suction-held at its tip. Therefore, the tool drive robot 17 (Fig. 1)
Then, the bare chip 14, which has been transported into the housing 11 by the component supply tool 16 (FIGS. 1 to 3), is suction-held by the component mounting tool 46 and transported between the component supply tool 16 and the insulating substrate 12. Thus, the bare chip 14 can be supplied onto a predetermined mounting position of the insulating substrate 12.

Therefore, as is clear from FIG. 4, a packing 60 having a uniform thickness made of an elastic material such as rubber is attached to the tip of the air supply / exhaust tool 51 of the component mounting tool 46, and thus the bare chip is installed. It is designed not to damage the bare chip 14 when the 14 is sucked. Further, a packing 61 having a uniform thickness made of an elastic material such as rubber is provided on the inner upper surface 50A of the chip cover 50 so as to avoid the through hole 50C. The inner upper surface 50A is not scratched.

Further, at the lower end portion of the chip cover 50, a packing 62 made of a rubber material and having a uniform thickness is arranged so as to cover the entire circumference of the opening 50A, and thus suction and hold by the air supply / exhaust tool 51. The bare chip 14 is attached to the insulating substrate 1
When the chip cover 50 is mounted on the second mounting position, the inside of the chip cover 50 can be sealed by pressing the chip cover 50 against the insulating substrate 12. This is because when the bare chip 14 is mounted on the insulating substrate 12, the air controller 18 (FIG. 1) is driven thereafter to supply high temperature air for reflow into the inside of the chip cover 50 via the air supply / exhaust tool 51. Therefore, the tool driving robot 17 (FIG. 1) can prevent the hot air inside the chip cover 50 from leaking to the outside of the chip cover 50 at this time.

On the other hand, in the bear chip 14, FIG.
As shown in (A) and (B), a metal film 70 having a size of about 1/10 to 1/4 of the circuit surface 14A is formed on the passivation in the central portion of the circuit surface 14A including the circuit. , Dummy bumps made of solder (e.g., eutectic solder) having a lower melting point than the chip-side bumps 72 for bonding formed on the electrodes 71 on the metal film 70 (hereinafter referred to as chip-side dummy bumps). ) 7
3 is formed at the same height as the chip-side bump 72.
Therefore, as shown in FIGS. 6A and 6B, a metal film 74 having the same area as the metal film 70 on the bare chip 14 side is formed on the region of the insulating substrate 12 facing the metal film 70 of the bare chip 14. The insulating substrate 12 is formed on the metal film 74.
Dummy bumps 77 (hereinafter, referred to as substrate-side dummy bumps) 77 having the same composition as the chip-side dummy bumps 73 and the same height as the substrate-side bumps 76 for bonding formed on the respective electrodes 75 are formed.

In the above-described structure, in the automatic component mounting apparatus 10 shown in FIGS. 1 and 2, during operation, first, the first and second board passage rails 22A and 22B of the board transfer section 13 are firstly provided.
The insulating substrate 12 supplied from the substrate supply unit to the housing 11
The substrate is transported to the above-described processing position, and then the substrate fixing base elevating device 20 is driven to raise the substrate fixing base 21, whereby the reference pins arranged on the substrate fixing base 21 are insulated. The reference holes 12A of 12 are fitted and inserted. As a result, the insulating substrate 12 is fixedly held in a state of being positioned at the processing position. Subsequently, the component supply tool 16 is driven to suck and hold one bear chip 14 placed on the uppermost tray 30 of the component storage unit 15, and thereafter the component supply tool 16 rotates toward the housing 11 side. The bare chip 14 is transported into the housing 11.

Next, the tool driving robot 17 is driven to move the component mounting tool 46 to a position above the bare chip 14 which has been conveyed into the housing 11 by the component supply tool 16, and thereafter the air controller 18 is driven. The component mounting tool 46 sucks and holds the bear chip 14. As the tool driving robot 17 is driven again, as shown in FIG.
6 is moved to a predetermined position above the insulating substrate 12 which is positioned and held by the substrate transport unit 13. At this time, the tool driving robot 17 has the center portion of the board-side dummy bump 77 on the insulating substrate 12 recognized by the image recognition device 44 (FIG. 1) and the chip-side dummy bump 73 of the bare chip 14 held by the component mounting tool 46 by suction. The component mounting tool 46 is moved so that the central portion of the component mounting tool 46 faces.

Then, the tool driving robot 17 is driven to lower the component mounting tool 46 to press the packing 62 attached to the lower end of the chip cover 50 against the upper surface of the insulating substrate 12, and then supply and exhaust the tool. By driving the drive motor 51 to lower the supply / exhaust tool 51, as shown in FIG.
The chip side dummy bumps 73 of No. 4 are brought into contact with the substrate side dummy bumps 77 of the insulating substrate 12.

Subsequently, the drive motor of the air supply / exhaust tool 51 is driven to raise the air supply / exhaust tool 51 as shown in FIG. 9, and thereafter, the air controller 18 (FIG. 1).
Is driven to melt the chip-side bumps 72 and the substrate-side bumps 76 for bonding from the lower end of the air supply / exhaust tool 51, and the chip-side dummy bumps 73 and the substrate-side dummy bumps 77 melt (for example, 183 [°]). By discharging high-temperature air (about) into the chip cover 50, only the chip-side dummy bumps 73 and the substrate-side dummy bumps 77 are melted and bonded.

Incidentally, when the bare chip 14 is aligned and placed on the insulating substrate 12, a displacement occurs between the central portion of the chip side dummy bump 73 and the central portion of the substrate side dummy bump 77 as shown in FIG. However, this positional deviation is automatically corrected by the self-alignment effect of the solder when the chip side dummy bump 73 and the substrate side dummy bump 77 are melted. Then, the air controller 18 (FIG. 1) is driven again to discharge high temperature air from the lower end of the air supply / exhaust tool 51 of the component mounting tool 46 into the chip cover 50 at a temperature at which the chip side bumps 72 and the board side bumps 76 are melted. As a result, the chip-side bumps 72 and the substrate-side bumps 76 are melted and joined.

As a result, as shown in FIG. 11, the metal plate 70 of the bare chip 14 is replaced by the chip side dummy bumps 73 (see FIG. 7).
To FIG. 10) and the dummy bumps 77 on the substrate side (see FIGS. 7 to 1).
0) are connected to the metal plate 74 of the insulating substrate 12 via the bumps 80, and each electrode 71 of the bare chip 14 is connected to the corresponding electrode 75 of the insulating substrate 12 on the chip side bump 73 (FIGS. 7 to 7). 10) and the bumps 77 on the substrate side (see FIG. 7).
To FIG. 10) are bonded via the bumps 81 formed by bonding, and thus the bare chip 14 is mounted on the insulating substrate 12.

Next, the tool driving robot 17 shown in FIG.
Is driven to separate the component mounting tool 46 from the insulating substrate 12, and at the same time, the substrate fixing base lifting device 20 of the substrate transfer unit 13 is driven.
Drives to lower the substrate fixing base 21 to release the positioning and holding, and then the first and second substrate passage rails 22A and 22B are driven to send the insulating substrate 12 to the subsequent line. Further, the automatic component inspection apparatus 10 thereafter sequentially repeats the same operation. Thereby, with respect to the insulating substrate 12 to be processed which is sequentially supplied from the substrate supply unit,
The bare chips 14 are sequentially mounted on predetermined positions of the insulating substrate 12.

According to the above-mentioned structure, as shown in FIGS. 7 to 10, a dummy bump (chip side dummy bump 73) having a melting point lower than that of the original chip side bump 72 for bonding is provided on the bare chip 14. A dummy bump (substrate-side dummy bump 77) having the same composition as the chip-side dummy bump 73, which is formed at the same height as the bump 72 and has a lower melting point than the original substrate-side bump 76 for bonding, is formed on the insulating substrate 12. The bump 14 is formed at the same height as that of the bump 76, and after the bare chip 14 is aligned and placed on a predetermined position of the insulating substrate 12, the bumps 50 on the substrate side for bonding are provided inside the chip cover 50 of the component mounting tool 46 that covers the bare chip 14. 76 and the chip-side bump 72 do not melt, and the chip-side dummy bump 73 and the substrate-side dummy bump 77 do not melt. The chip-side dummy bumps 73 and the substrate-side dummy bumps 77 are melt-bonded by supplying high-temperature air, and thereafter the board-side bumps 76 and the chip-side bumps 72 for bonding use high-temperature air having a melting temperature. By supplying the substrate-side bumps 76 and the chip-side bumps 72 to melt-bond them to mount the bare chips 14 on the insulating substrate 12, when the bare chips 14 and the insulating substrate 12 are aligned with each other. The generated positional deviation can be automatically corrected by the self-alignment effect of the solder, and thus it is possible to realize an automatic component mounting apparatus capable of mounting the bare chip 14 on the insulating substrate 12 to be processed simply and accurately.

Since the alignment of the bare chip 14 and the insulating substrate 12 can be performed only by the simple alignment of the chip side dummy bumps 73 and the substrate side dummy bumps 77, the mounting tact time for each bare chip 14 is improved. be able to.

Further, the surface area of the chip side dummy bump 73 and the substrate side dummy bump 77 is 1/1 of the chip surface area.
Since the size is sufficiently large as about 0 to 1/4, it is possible to minimize the positional deviation between the bare chip 14 and the insulating substrate 12 during reflow. Furthermore, the bare chip mounting can be fully automated.

In the embodiment described above, the present invention is applied to a bare chip 14 of a semiconductor integrated circuit, a mounting method for mounting the bare chip 14 on the insulating substrate 12, and an automatic mounting method for mounting the bare chip 14 on the insulating substrate 12. Although the case where it is applied to the component mounting apparatus 10 has been described, the present invention is not limited to this, other electronic components, a mounting method for mounting the electronic component on a substrate, and the electronic component on a substrate. It can be widely applied to other automatic component mounting apparatuses mounted on the above.

Further, in the above-mentioned embodiment, the case where one chip-side dummy bump 73 and one substrate-side dummy bump 77 are formed on the bare chip 14 and the insulating substrate 12 has been described, but the present invention is not limited to this. Alternatively, a plurality of them may be formed.

Further, in the above-described embodiment, the size of the dummy bumps formed on the bare chip 14 (the chip side dummy bumps 73 and the dummy bumps formed on the insulating substrate 12 (the substrate side dummy bumps 77) is 10 times the surface area of the bare chip 14). Although the case has been described in which the selection is made to be about 1/4 to 1/4, the present invention is not limited to this, and other sizes may be used.

Further, in the above-described embodiment, the case where the position of the bare chip 14 with respect to the insulating substrate 12 is adjusted so that the central portion of the chip side dummy bump 73 and the central portion of the substrate side dummy bump 77 are aligned with each other has been described. However, the present invention is not limited to this, and in addition to this, each chip side bump 7 formed on the bare chip 14 for bonding.
The bare chip 14 may be aligned with the insulating substrate 12 by aligning the bumps 2 with the respective substrate-side bumps 76 for bonding formed on the insulating substrate 12.

[0040]

As described above, according to the present invention, the first dummy bump having a melting point lower than that of the first bump is formed on one surface of the electronic component on which the first bump for bonding is formed, and When this electronic component is mounted, a second dummy bump having a melting point lower than that of the second bonding bump formed on the substrate is formed on a region of the substrate facing the first dummy bump. After aligning and mounting on the substrate, the first and second dummy bumps are melted, and then the first and second bumps are heated and melted to be bonded together. It does not require high-precision alignment using the, and can prevent the displacement of electronic parts during reflow, and can significantly improve the mounting tact time per bare chip. Accuracy can be realized mounting device mounting method and electronic component of the electronic component and the electronic component can be mounted on the substrate.

[Brief description of drawings]

FIG. 1 is a perspective view showing an entire configuration of an automatic component mounting apparatus according to an embodiment with a partial cross section.

FIG. 2 is a schematic perspective view showing a configuration of an automatic component mounting apparatus according to an embodiment.

FIG. 3 is a schematic perspective view showing a configuration of a component supply tool.

FIG. 4 is a cross-sectional view showing a configuration of a component mounting tool.

5A and 5B are a side view and a plan view showing the structure of the bare chip.

6A and 6B are a side view and a plan view showing the configuration of an insulating substrate.

FIG. 7 is a sectional view for explaining the operation of the automatic component mounting apparatus.

FIG. 8 is a sectional view for explaining the operation of the automatic component mounting apparatus.

FIG. 9 is a sectional view for explaining the operation of the automatic component mounting apparatus.

FIG. 10 is a sectional view for explaining the operation of the automatic component mounting apparatus.

FIG. 11 is a sectional view for explaining the operation of the automatic component mounting apparatus.

FIG. 12 is a sectional view for explaining a conventional mounting method for a bare chip.

FIG. 13 is a sectional view for explaining a conventional mounting method for a bare chip.

[Explanation of symbols]

10 ... Automatic component mounting device, 12 ... Insulating substrate, 13 ...
... Board transfer section, 14 ... Bear chip, 14A ... Circuit surface, 15 ... Component storage section, 16 ... Component supply tool, 1
7: Tool driving robot, 18: Air controller, 50: Chip cover, 51: Air supply / exhaust tool, 7
0, 74 ... Metal film, 71, 75 ... Electrode, 72 ... Chip bump, 73 ... Chip dummy bump, 76 ...
… Board side bumps, 77 …… Board side dummy bumps.

Claims (13)

[Claims] 1. An electronic component mounted on a substrate, wherein a plurality of first bumps are formed on one surface, and each of the first bumps is bonded to a corresponding second bump formed on the substrate. An electronic component comprising a single or a plurality of dummy bumps having a melting point lower than that of the first bumps, the dummy bumps being formed in a predetermined area on the one surface. 2. The electronic component according to claim 1, wherein the predetermined region is a central portion of the one surface. 3. The electronic component according to claim 1, further comprising a metal film formed on the predetermined region of the one surface, wherein the dummy bumps are formed on the metal film. 4. The electronic component according to claim 1, wherein the size of the surface area of the dummy bump is selected to be about 1/10 to 1/4 of the surface area of the entire electronic component. 5. An electronic component mounted on a substrate, wherein a plurality of first bumps are formed on one surface, and each of the first bumps is bonded to a corresponding second bump formed on the substrate. A first step of forming one or a plurality of first dummy bumps having a melting point lower than that of the first bumps on a predetermined region of the one surface of the electronic component, and when mounting the electronic component on the substrate The second area is formed on a predetermined area of the substrate facing the first dummy bump.
Second step of forming one or more second dummy bumps having a melting point lower than that of the bump, and a step of aligning and joining the first dummy bump of the electronic component and the second dummy bump of the substrate. 3. A method of mounting an electronic component, comprising the step 3 and a fourth step of joining the first and second bumps. 6. The predetermined area of the one surface of the electronic component is a central portion of the one surface.
Mounting method of electronic parts described in. 7. The electronic component mounting method according to claim 5, wherein the electronic component is a bare chip. 8. In the third step, before bonding the first dummy bumps of the electronic component and the second dummy bumps of the substrate, the first bumps of the electronic component and the substrate are bonded. The electronic component mounting method according to claim 5, further comprising a fifth step of aligning the second bump with the second bump. 9. The first dummy bump is formed on a first metal film formed on the predetermined region of the one surface of the electronic component, and the second dummy bump is formed on the one surface of the substrate. The electronic component mounting method according to claim 5, wherein the electronic component is formed on the second metal film formed on the predetermined region. 10. The size of the surface area of each of the first and second dummy bumps is set to be 1 of the surface area of the entire electronic component.
The electronic component mounting method according to claim 5, characterized in that the thickness is selected to be about 1/0 to 1/4. 11. A plurality of first bumps are formed on one surface,
Each of the first bumps is replaced with a corresponding second bump formed on the substrate.
In the electronic component mounted on the substrate by being bonded to the bumps, the substrate holding means for positioning and holding the substrate, the electronic component on the substrate positioned and held by the substrate holding means, Lower than a first dummy bump having a melting point lower than that of the first bump formed in a predetermined area of the one surface, and lower than the second bump formed in a predetermined area of the substrate facing the first dummy bump. After the electronic component placement means for aligning and placing the second dummy bump having the melting point and the first and second dummy bumps are joined by heating and melting, the first and second bumps are heated. An electronic component mounting apparatus, comprising: a heating unit that is joined by melting. 12. The electronic component mounting apparatus according to claim 11, wherein the electronic component is a bare chip. 13. The electronic component placement means also performs alignment of the first and second bumps when aligning the first and second dummy bumps. Electronic component mounting device.