JP3898401B2 - Parts supply device - Google Patents

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JP3898401B2
JP3898401B2 JP33769799A JP33769799A JP3898401B2 JP 3898401 B2 JP3898401 B2 JP 3898401B2 JP 33769799 A JP33769799 A JP 33769799A JP 33769799 A JP33769799 A JP 33769799A JP 3898401 B2 JP3898401 B2 JP 3898401B2
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mounting
component
inspection
take
straight line
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JP2001150255A (en
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健一 武藤
徹 後藤
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株式会社日立ハイテクインスツルメンツ
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【0001】
【発明の属する技術分野】
本発明は、部品供給装置に関し、更に言えば、実装基板に実装する各種部品を供給する部品供給装置の配置効率向上を図る技術に関する。
【0002】
【従来の技術】
以下、従来の部品供給装置について説明する。尚、説明の便宜上、以下の説明では実装基板に各種部品を実装する部品実装装置に搭載された基板供給装置を例にして説明する。
【0003】
従来の部品供給装置として、例えば、図3に示すように多数の部品を収納した部品群(例えば、半導体ウエハ等)31を複数個(本実施形態では4個)載置し、X方向移動及びY方向移動並びにθ回転可能な載置台32と、前記載置台32上の複数個の部品群31内から所望部品を取出し、検査台33上に移載する取出し機構34と、前記検査台33上の部品状態を検査する検査機構35と、前記検査機構35による検査終了後の部品を取出し、実装基板36上に実装する実装機構37とから成る部品供給ユニットを複数体備えることで、部品実装効率を高めていた。
【0004】
【発明が解決しようとする課題】
しかしながら、上述した構成の部品供給装置において、前記載置台32が取出し機構34による部品の取出し位置に合わせてX方向移動及びY方向移動並びにθ回転するため、その中心Tを基準にした移動範囲(図3に載置台32外周部を取り囲むように二点鎖線で示した範囲)及び所定間隔を存して隣り合う載置台32同士を配置する必要があり、この部品供給ユニットが装置スペースの比較的広い範囲を占めていた。
【0005】
特に、近年、多品種の部品実装装置の要求仕様が高度化し、装置が大型化している。そのため、部品供給ユニット配置方式の改善を図ることで、配置効率を高めたいという要望があった。
【0006】
更に言えば、上記部品供給ユニット配置方式の改善により、実装基板の搬送距離の短縮化が図れれば、搬送時間短縮に有利なものとなる。
【0007】
【課題を解決するための手段】
そこで、本発明の部品供給装置は上記課題に鑑みなされたもので、図1に示すように多数のベアチップを収納したウエハ11を複数個載置し、X方向移動及びY方向移動並びにθ回転可能な載置台10と、前記載置台10上のウエハ11内から所望のベアチップを取出し、各ベアチップを対応する検査台16上に移載する取出し機構15と、前記検査台16上のベアチップ状態を検査する検査機構20と、前記検査機構20による検査終了後のベアチップを取出し、実装基板2上に実装する実装機構21とから成る部品供給ユニットを複数体備え、隣り合う取出し機構15の部品取出し位置間隔が、隣り合う載置台10同士のθ回転中心の間隔よりも常に狭くなるように配置したことで、隣り合う実装ステーション同士の間隔が短くなるので、実装基板2の搬送距離の短縮化が可能になる。
【0008】
また、前記載置台10上の部品取出しポイント及び実装基板2上の実装ポイントが、それぞれ前後関係を有する形で直線上に配置され、この直線から当該載置台10のθ回転中心を所定量ずらし、かつ隣り合う載置台10同士を近づけることで、図3に示すように前記載置台32,取出し機構及び実装基板が、それぞれ前後関係を有する形で直線上に配置され、当該載置台のθ回転中心がその直線上にある構成のものに比して実装ステーション同士の間隔が短くなるので、実装基板2の搬送距離の短縮化が可能になる。
【0009】
更に、図1に示すように前記載置台10上に4個(あるいは6個)のウエハ11が載置され、例えば、当該載置台10,取出し機構15及び実装基板2が、それぞれ前後関係を有する形で直線上にあり、この直線から載置台10のθ回転中心と取出し機構15の部品取出し位置とを結ぶ直線を所定角度(45°あるいは60°)ずらした場合において、取出し機構15による取出しから実装基板2への実装作業中に取出したベアチップを90°(あるいは120°)回転させることで、載置台10上に載置する際のウエハ11内のベアチップの向きと、当該ベアチップを実装基板2に実装する際の実装機構21の移動方向とを合わせることができる。
【0010】
更に、図1に示すように前記載置台10上に4個(あるいは6個)のウエハ11が載置され、例えば、当該載置台10,取出し機構15及び実装基板2が、それぞれ前後関係を有する形で直線上にあり、この直線から載置台10のθ回転中心と取出し機構15の部品取出し位置とを結ぶ直線を45°(あるいは60°)ずらした場合において、取出し機構15による取出しから実装基板2への実装作業中に取出したベアチップを90°(あるいは120°)回転させることで、載置台10上に載置する際のウエハ11内のベアチップの向きと、当該ベアチップを実装基板2に実装する際の実装機構21の移動方向とを合わせることができる。
【0011】
【発明の実施の形態】
以下、本発明の部品供給装置に係る一実施形態について図面を参照しながら説明する。
【0012】
図1及び図2は本発明が適用される部品供給装置の平面図及びその側面図である。
【0013】
図において、1は部品供給装置本体で、この本体1には不図示の供給ストッカから供給され、各種部品が実装される実装基板2を載置した作業用パレット3を実装ステーションに搬送し、実装作業が終了した実装基板2を下流に搬送する搬送機構4が構成されている。尚、前記作業用パレット3に載置される実装基板2は1枚でも、また複数枚でも構わない。
【0014】
また、前記搬送機構4の構成としては、種々の構成が考えられるが、本実施形態では前記作業用パレット3を載置した状態で、搬送ガイド5にガイドされながら水平移動可能なスライド機構6を有する構成を採用しているが、その他に例えば、コンベアによる搬送方式、あるいは竿送り方式等でも良い。
【0015】
更に、本実施形態では部品実装効率の向上を図るため、後述する部品供給ユニットを複数(例えば、2体)用意し、これに対応する作業用パレット3(実装基板2)を複数個(2個)ずつ実装ステーションに搬送している。
【0016】
10は多数の部品を収納した部品群(本実施形態ではダイシングされた半導体ウエハで、以下ウエハと称し、このウエハ11から取出される部品をベアチップと称す。)11を複数個(例えば、4個)載置し、X方向移動及びY方向移動並びにθ回転可能な載置台で、隣り合う形で2体配置されている。尚、図1に載置台10外周部を取り囲むように二点鎖線で示した範囲が、中心Tを基準にした当該載置台10の移動範囲である。
【0017】
15は前記載置台10上のウエハ11内から所望のベアチップを取出し、検査台16上に移載する取出し機構で、90°水平回転及び上下移動可能なピックアップアーム17を有し、当該ピックアップアーム17で前記ウエハ11上のベアチップを吸着取出した後に、支点を介してピックアップアーム17を90°回転させて、前記検査台16上にベアチップを移載する。
【0018】
20は前記検査台16上に移載されたベアチップの状態(姿勢及び欠け等)を検査する検査機構で、当該検査台16上方に位置させた不図示の認識カメラにより当該ベアチップの姿勢及び欠け状態等を認識する。
【0019】
21は検査終了後のベアチップを取出し、実装基板2上に実装する実装機構で、前記検査機構20による検査ステーションから実装ステーションまで水平移動及び上下移動可能並びにθ回転可能なボンディングヘッド22を有し、当該ボンディングヘッド22で前記検査台16上のベアチップを吸着取出した後に、実装基板2上の実装ポイントまで水平移動して行き、そのポイントで下動して当該ベアチップをボンディングする。
【0020】
これらの載置台10,取出し機構15,検査機構20及び実装機構21とで部品供給ユニットが構成され、当該部品供給ユニットが隣り合うようにして、前記搬送機構4に並設されている。
【0021】
また、載置台10上の部品取出しポイント,検査機構20による検査ポイント及び実装基板2上の実装ポイントは、それぞれ前後関係を有する形で直線上に配置され、当該載置台10のθ回転中心Tが、その直線上よりも隣り合う載置台10同士が離間する方向に所定量(例えば、直線上から45°)ずれた(隣り合う取出し機構15同士の部品取出し位置間隔が、隣り合う載置台10同士のθ回転中心Tの間隔よりも狭くなる)位置に設定されている。
【0022】
このような配置構成を採用することで本発明では、従来(図3に示す配置構成)のような前記載置台31上の部品取出しポイント,検査機構35による検査ポイント及び実装基板36上の実装ポイントが、それぞれ前後関係を有する形で直線上に配置され、当該載置台31のθ回転中心Tがその直線上にある構成のものに比して、載置台10同士の間隔(隣り合う実装基板2上の実装ポイント同士の間隔A<A’)及び載置台10の移動範囲(B<B’)を狭くすることができる。従って、実装基板2の搬送距離の短縮化が図れる。
【0023】
また、前述したように載置台10上に4個のウエハ11が載置され、例えば、載置台10のθ回転中心が当該載置台10上の取出し機構15による取出しポイント,検査機構16による検査ポイント及び実装基板2上の実装機構21による実装ポイントを結ぶ直線上から45°ずれた位置に配置した場合において、前記取出し機構15のピックアップアーム17によりベアチップを取出した後に、当該ピックアップアーム17を90°回転させることで、ベアチップを90°回転させて実装基板2に実装させるため、載置台10上にウエハ11を載置する際のウエハ11内のベアチップの向きと、実装基板2にベアチップを実装する際の実装機構21の移動方向(実装方向)とを合わせることができるため、作業者による載置台10へのウエハ11の装着ミス発生を抑止できる。
【0024】
尚、本実施形態では載置台10上に4個のウエハ11を載置し、載置台10のθ回転中心が当該載置台10上の取出し機構15による取出しポイント,検査機構20による検査ポイント及び実装基板2上の実装機構21による実装ポイントを結ぶ直線上から45°ずらした位置に配置する構成について説明したが、本発明はこれに限定されるものではなく、図示した説明は省略するが、例えば、載置台10上に6個のウエハ11を載置し、載置台10のθ回転中心が当該載置台10上の取出し機構15による取出しポイント,検査機構20による検査ポイント及び実装基板2上の実装機構21による実装ポイントを結ぶ直線上から60°ずらした位置に配置する構成とすることで、本発明の特徴である部品供給ユニットの配置効率向上を可能にすると共に、前記取出し機構15のピックアップアーム17によりベアチップを取出した後に、当該ピックアップアーム17を120°回転させることで、ベアチップを120°回転させて実装基板2に実装するようにすれば、同じく載置台10上にウエハ11を載置する際のウエハ11内のベアチップの向きと、実装基板2にベアチップを実装する際の実装機構21の移動方向(実装方向)とを合わせることができるため、作業者による載置台10へのウエハ11の装着ミス発生を抑止できる。
【0025】
以下、部品供給動作について図面を参照しながら説明する。
【0026】
先ず、作業者は載置台10上にウエハ11を4枚載置する。このとき、前述したようにウエハ11内のベアチップの向きは、実装基板2に当該ベアチップを実装する際の実装機構21の移動方向に合せて装着すれば良いため、装着ミスが起こり難くくなる(図1に部品の向きを⇒で示してある。)。
【0027】
そして、前述したようにして載置台10上にウエハ11を4枚装着した後、作業者は部品実装作業を開始させる。
【0028】
部品実装作業が開始されると、載置台10がX方向移動及びY方向移動並びにθ回転(載置台10外周部を取り囲むように二点鎖線で示した範囲が、中心Tを基準にした当該載置台10の移動範囲である。)して、所望のベアチップ上方に取出し機構15のピックアップアーム17が位置される(図1及び図2参照)。
【0029】
次に、当該ピックアップアーム17が所定量下動して所望のベアチップを吸着取出しする。尚、この吸着取出し時には、図示しないがウエハ裏面からベアチップを突き上げて吸着取出しし易くする突き上げ機構が準備されている。
【0030】
続いて、ピックアップアーム17で前記ウエハ11上のベアチップを吸着取出した後に、支点を介して当該ピックアップアーム17を90°回転させて、前記検査台16上にベアチップを移載する。このとき、ウエハ11上のベアチップ向きと検査台16上のベアチップ向きとが同じ向きになる。ここで、前記検査台16上に移載されたベアチップ状態(姿勢及び欠け等)が、検査機構20により認識される。
【0031】
最後に、検査終了後のベアチップを実装機構21のボンディングヘッド22で取出し、当該ボンディングヘッド22を介してベアチップを実装基板2上の実装ポイントにボンディングする。尚、このとき前記検査機構20による認識の結果、姿勢(位置)ずれがあるベアチップに対しては、ボンディングヘッド22で吸着後、当該ヘッド22を所望角度θ回転させることでその姿勢(位置)ずれを修正し、実装基板2上に実装する。また、欠け等の不良品に対しては、実装作業を一旦中断し、異常報知等して作業者に連絡する。
【0032】
以下、同様の作業が繰り返される。このとき、所望のベアチップが順次選択され、実装されていくことになるが、本発明では載置台10上の部品取出しポイント,検査機構20による検査ポイント及び実装基板2上の実装ポイントを、それぞれ前後関係を有する形で直線上に配置し、当該載置台10のθ回転中心Tを、その直線上よりも隣り合う載置台10同士が離間する方向に所定量(例えば、直線上から45°)ずらし(隣り合う取出し機構15同士の部品取出し位置間隔が、隣り合う載置台10同士のθ回転中心Tの間隔よりも狭くなるように配置した)ことで、従来(図3に示す配置構成)のような前記載置台31上の部品取出しポイント,検査機構35による検査ポイント及び実装基板36上の実装ポイントが、それぞれ前後関係を有する形で直線上に配置され、当該載置台31のθ回転中心Tがその直線上にある構成のものに比して、載置台10同士の間隔(隣り合う実装基板2上の実装ポイント同士の間隔A<A’)及び載置台10の移動範囲(B<B’)を狭くすることができる。従って、実装基板2の搬送距離の短縮化が図れ、実装基板2の搬送にかかる時間を短縮でき、作業性が向上する。
【0033】
【発明の効果】
本発明によれば、隣り合う取出し機構の部品取出し位置間隔が、隣り合う載置台のθ回転中心の間隔よりも常に狭くなるように配置され、また、載置台上の部品取出しポイント及び実装基板上の実装ポイントを、それぞれ前後関係を有する形で直線上に配置し、当該載置台のθ回転中心を、その直線上よりも隣り合う載置台同士が常に離間する方向に所定量ずらしたことで、従来のような載置台,取出し機構及び実装基板が、それぞれ前後関係を有する形で直線上に配置され、当該載置台のθ回転中心がその直線上にある構成のものに比して、載置台同士の間隔(隣り合う実装基板上の実装ポイント同士の間隔)及び載置台が移動する際の移動範囲を狭くすることができる。従って、上記した配置構成を採用することで、実装基板の搬送距離の短縮化が図れ、基板搬送にかかる時間の短縮化による搬送効率の向上が図れる。
【0034】
また、載置台上に複数個の部品群を載置し、載置台上の部品取出しポイント及び実装基板上の実装ポイントを結ぶ直線上から前記載置台のθ回転中心と前記取出し機構の部品取出し位置とを結ぶ直線が所定角度ずれている場合には、取出し機構により部品を取出した後に、当該ベアチップを所定角度回転させて実装基板上に実装することで、載置台上にウエハを載置する際のベアチップの向きと、実装基板に部品を実装するための実装機構の移動方向(実装方向)とを合わせることができるため、作業者による載置台へのウエハの装着ミス発生を抑止できる。
【図面の簡単な説明】
【図1】本発明の一実施形態の部品供給装置を示す平面図である。
【図2】本発明の一実施形態の部品供給装置を示す側面図である。
【図3】従来の部品供給装置を示す平面図である。
【符号の説明】
1 部品供給装置本体
2 実装基板
4 搬送機構
10 載置台
11 半導体ウエハ
15 取出し機構
16 検査台
20 検査機構
21 実装機構
[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a component supply apparatus, and more particularly to a technique for improving the arrangement efficiency of a component supply apparatus that supplies various components to be mounted on a mounting board.
[0002]
[Prior art]
Hereinafter, a conventional component supply apparatus will be described. For convenience of explanation, the following explanation will be made by taking as an example a board supply device mounted on a component mounting apparatus for mounting various components on a mounting board.
[0003]
As a conventional parts supply apparatus, for example, as shown in FIG. 3, a plurality of parts groups (for example, four semiconductor wafers) 31 containing a large number of parts (for example, four pieces in this embodiment) are placed and moved in the X direction. A mounting table 32 that can be moved in the Y direction and rotated by θ, a take-out mechanism 34 that takes out a desired part from a plurality of component groups 31 on the mounting table 32 and transfers it to the inspection table 33, and the inspection table 33 The component mounting efficiency is improved by providing a plurality of component supply units each including an inspection mechanism 35 for inspecting the component state of the component and a mounting mechanism 37 for taking out the component after the inspection by the inspection mechanism 35 and mounting it on the mounting substrate 36. Was raised.
[0004]
[Problems to be solved by the invention]
However, in the component supply apparatus having the above-described configuration, since the mounting table 32 moves in the X direction, the Y direction, and θ in accordance with the component extraction position by the extraction mechanism 34, the movement range based on the center T ( It is necessary to arrange the mounting bases 32 adjacent to each other with a predetermined interval between the mounting base 32 and the part supply unit. It occupied a wide range.
[0005]
In particular, in recent years, the required specifications of various types of component mounting apparatuses have been advanced, and the apparatuses have become larger. Therefore, there has been a demand for improving the arrangement efficiency by improving the component supply unit arrangement method.
[0006]
Furthermore, if the component supply unit arrangement method is improved to reduce the transport distance of the mounting substrate, it is advantageous for shortening the transport time.
[0007]
[Means for Solving the Problems]
Accordingly, the component supply apparatus of the present invention has been made in view of the above problems. As shown in FIG. 1, a plurality of wafers 11 containing a large number of bare chips are placed, and X-direction movement, Y-direction movement, and θ rotation are possible. A mounting table 10, a take-out mechanism 15 for taking out a desired bare chip from the wafer 11 on the mounting table 10, and transferring each bare chip onto the corresponding inspection table 16, and inspecting the bare chip state on the inspection table 16 And a plurality of component supply units each including a mounting mechanism 21 for taking out a bare chip after completion of the inspection by the inspection mechanism 20 and mounting it on the mounting substrate 2. However, since it is arranged so as to be always narrower than the interval between the θ rotation centers of the adjacent mounting tables 10, the interval between the adjacent mounting stations is shortened. The transport distance of the mounting substrate 2 can be shortened.
[0008]
Further, the component pick-up point on the mounting table 10 and the mounting point on the mounting board 2 are arranged on a straight line in a form having a front-rear relationship, and the θ rotation center of the mounting table 10 is shifted from the straight line by a predetermined amount, Further, by bringing the adjacent mounting tables 10 close to each other, as shown in FIG. 3, the mounting table 32, the take-out mechanism, and the mounting substrate are arranged on a straight line in a form having a front-rear relationship, and the θ rotation center of the mounting table Since the interval between the mounting stations is shorter than that of the configuration with the straight line, the transport distance of the mounting substrate 2 can be shortened.
[0009]
Further, as shown in FIG. 1, four (or six) wafers 11 are mounted on the mounting table 10 described above. For example, the mounting table 10 , the take-out mechanism 15, and the mounting substrate 2 have a longitudinal relationship. When the straight line connecting the θ rotation center of the mounting table 10 and the component take-out position of the take-out mechanism 15 is shifted from the straight line by a predetermined angle (45 ° or 60 °) , the take-out mechanism 15 By rotating the bare chip taken out during the mounting operation on the mounting substrate 2 by 90 ° (or 120 °), the orientation of the bare chip in the wafer 11 when mounting on the mounting table 10 and the bare chip are mounted on the mounting substrate 2. It is possible to match the moving direction of the mounting mechanism 21 at the time of mounting.
[0010]
Further, as shown in FIG. 1, four (or six) wafers 11 are mounted on the mounting table 10 described above. For example, the mounting table 10 , the take-out mechanism 15, and the mounting substrate 2 have a longitudinal relationship. When the straight line connecting the θ rotation center of the mounting table 10 and the component take-out position of the take-out mechanism 15 is shifted from this straight line by 45 ° (or 60 °), the take-out by the take-out mechanism 15 is changed to the mounting board. By rotating the bare chip taken out during mounting operation 2 on the mounting table 10 by rotating the bare chip by 90 ° (or 120 °), the bare chip is mounted on the mounting substrate 2 and mounted on the mounting substrate 2. It is possible to match the moving direction of the mounting mechanism 21 at the time.
[0011]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, an embodiment according to a component supply apparatus of the present invention will be described with reference to the drawings.
[0012]
1 and 2 are a plan view and a side view of a component supply apparatus to which the present invention is applied.
[0013]
In the figure, reference numeral 1 denotes a component supply apparatus main body. This main body 1 is supplied from a supply stocker (not shown), and a work pallet 3 on which a mounting substrate 2 on which various components are mounted is placed is transported to a mounting station for mounting. A transport mechanism 4 is configured to transport the mounted substrate 2 for which work has been completed downstream. The mounting substrate 2 placed on the work pallet 3 may be one or more.
[0014]
The transport mechanism 4 may have various configurations. In the present embodiment, the slide mechanism 6 that can move horizontally while being guided by the transport guide 5 while the work pallet 3 is placed thereon. However, for example, a conveyance method using a conveyor or a saddle feeding method may be used.
[0015]
Furthermore, in this embodiment, in order to improve the component mounting efficiency, a plurality of (for example, two) component supply units described later are prepared, and a plurality (two) of work pallets 3 (mounting substrates 2) corresponding thereto are prepared. ) Are transported to the mounting station one by one.
[0016]
Reference numeral 10 denotes a component group (a diced semiconductor wafer in the present embodiment, hereinafter referred to as a wafer, and a component taken out from the wafer 11 is referred to as a bare chip) 11 (for example, four). 2) Two mounting tables that are placed next to each other and are capable of X-direction movement, Y-direction movement, and θ rotation. A range indicated by a two-dot chain line so as to surround the outer periphery of the mounting table 10 in FIG. 1 is a movement range of the mounting table 10 with respect to the center T.
[0017]
Reference numeral 15 denotes a take-out mechanism for taking out a desired bare chip from the wafer 11 on the mounting table 10 and transferring it onto the inspection table 16. The pick-up arm 17 has a pick-up arm 17 that can be rotated 90 ° horizontally and moved up and down. Then, after the bare chip on the wafer 11 is sucked and taken out, the pickup arm 17 is rotated by 90 ° through the fulcrum, and the bare chip is transferred onto the inspection table 16.
[0018]
20 is an inspection mechanism for inspecting the state (posture, chipping, etc.) of the bare chip transferred on the inspection table 16, and the posture and chipping state of the bare chip by a recognition camera (not shown) positioned above the inspection table 16. Recognize etc.
[0019]
21 is a mounting mechanism that takes out the bare chip after the inspection and mounts it on the mounting substrate 2, and has a bonding head 22 that can move horizontally and vertically from the inspection station to the mounting station by the inspection mechanism 20 and can rotate θ. After the bare chip on the inspection table 16 is sucked and taken out by the bonding head 22, it moves horizontally to the mounting point on the mounting substrate 2 and moves downward at that point to bond the bare chip.
[0020]
The mounting table 10, the take-out mechanism 15, the inspection mechanism 20, and the mounting mechanism 21 constitute a component supply unit, and the component supply units are arranged side by side so as to be adjacent to each other.
[0021]
Also, the component pick-up point on the mounting table 10, the inspection point by the inspection mechanism 20, and the mounting point on the mounting board 2 are arranged on a straight line in a form having a front-rear relationship, and the θ rotation center T of the mounting table 10 is , The parts removal position interval between the adjacent take-out mechanisms 15 is shifted by a predetermined amount (for example, 45 ° from the straight line) in the direction in which the adjacent placement bases 10 are separated from each other. Is set to a position that is narrower than the interval between the θ rotation centers T).
[0022]
By adopting such an arrangement configuration, in the present invention, as in the prior art (the arrangement configuration shown in FIG. 3), the component pick-up point on the mounting table 31, the inspection point by the inspection mechanism 35, and the mounting point on the mounting substrate 36. Are arranged on a straight line in a form having a front-rear relationship, and the interval between the mounting bases 10 (adjacent mounting substrates 2) is compared with a structure in which the θ rotation center T of the mounting base 31 is on the straight line. The distance A <A ′) between the upper mounting points and the movement range (B <B ′) of the mounting table 10 can be narrowed. Therefore, the conveyance distance of the mounting substrate 2 can be shortened.
[0023]
Further, as described above, four wafers 11 are mounted on the mounting table 10. For example, the θ rotation center of the mounting table 10 is an extraction point by the extraction mechanism 15 on the mounting table 10 and an inspection point by the inspection mechanism 16. When the bare chip is taken out by the pick-up arm 17 of the take-out mechanism 15 when the pick-up arm 17 is arranged at a position shifted by 45 ° from the straight line connecting the mounting points by the mounting mechanism 21 on the mounting substrate 2, the pick-up arm 17 is moved by 90 °. By rotating, the bare chip is rotated by 90 ° and mounted on the mounting substrate 2, and therefore, the orientation of the bare chip in the wafer 11 when mounting the wafer 11 on the mounting table 10 and the mounting of the bare chip on the mounting substrate 2. Since the movement direction (mounting direction) of the mounting mechanism 21 at the time can be matched, the wafer on the mounting table 10 by the operator 1 can suppress the mounting miss occurrence.
[0024]
In the present embodiment, four wafers 11 are mounted on the mounting table 10, and the θ rotation center of the mounting table 10 is an extraction point by the extraction mechanism 15 on the mounting table 10, an inspection point by the inspection mechanism 20, and mounting. Although the configuration in which the mounting mechanism 21 on the substrate 2 is disposed at a position shifted by 45 ° from the straight line connecting the mounting points has been described, the present invention is not limited to this, and the illustrated description is omitted. The six wafers 11 are placed on the mounting table 10, and the θ rotation center of the mounting table 10 is the extraction point by the extraction mechanism 15 on the mounting table 10, the inspection point by the inspection mechanism 20, and the mounting on the mounting substrate 2. By arranging at a position shifted by 60 ° from the straight line connecting the mounting points by the mechanism 21, it is possible to improve the arrangement efficiency of the component supply unit, which is a feature of the present invention. In addition, if the bare chip is taken out by the pickup arm 17 of the take-out mechanism 15 and then the pickup arm 17 is rotated by 120 °, the bare chip is rotated by 120 ° and mounted on the mounting substrate 2. Since the orientation of the bare chip in the wafer 11 when mounting the wafer 11 on the mounting table 10 and the moving direction (mounting direction) of the mounting mechanism 21 when mounting the bare chip on the mounting substrate 2 can be matched. It is possible to prevent a mistake in mounting the wafer 11 on the mounting table 10 by a person.
[0025]
Hereinafter, the component supply operation will be described with reference to the drawings.
[0026]
First, the operator places four wafers 11 on the placing table 10. At this time, as described above, the orientation of the bare chip in the wafer 11 may be mounted in accordance with the moving direction of the mounting mechanism 21 when mounting the bare chip on the mounting substrate 2, so that mounting errors are less likely to occur ( In Fig. 1, the orientation of the parts is indicated by ⇒.)
[0027]
Then, after mounting four wafers 11 on the mounting table 10 as described above, the worker starts a component mounting operation.
[0028]
When the component mounting operation is started, the mounting table 10 moves in the X direction, the Y direction, and the θ rotation (the range indicated by the two-dot chain line so as to surround the outer periphery of the mounting table 10 is based on the center T. Thus, the pickup arm 17 of the take-out mechanism 15 is positioned above the desired bare chip (see FIGS. 1 and 2).
[0029]
Next, the pick-up arm 17 moves down by a predetermined amount to pick up a desired bare chip. Although not shown in the drawing, a push-up mechanism is prepared to push up the bare chip from the back surface of the wafer to facilitate the suction and take-out.
[0030]
Subsequently, after the bare chip on the wafer 11 is sucked and taken out by the pickup arm 17, the pickup arm 17 is rotated by 90 ° via the fulcrum, and the bare chip is transferred onto the inspection table 16. At this time, the direction of the bare chip on the wafer 11 is the same as the direction of the bare chip on the inspection table 16. Here, the inspection chip 20 recognizes the bare chip state (posture, chipping, etc.) transferred on the inspection table 16.
[0031]
Finally, the bare chip after the inspection is taken out by the bonding head 22 of the mounting mechanism 21, and the bare chip is bonded to the mounting point on the mounting substrate 2 through the bonding head 22. At this time, as a result of recognition by the inspection mechanism 20, a bare chip having a posture (position) deviation is adsorbed by the bonding head 22, and then the posture (position) deviation is caused by rotating the head 22 by a desired angle θ. Is mounted on the mounting board 2. In addition, for defective products such as chips, the mounting operation is temporarily interrupted, and an operator is notified of abnormalities.
[0032]
Thereafter, the same operation is repeated. At this time, a desired bare chip is sequentially selected and mounted. In the present invention, the component pick-up point on the mounting table 10, the inspection point by the inspection mechanism 20, and the mounting point on the mounting substrate 2 are respectively set back and forth. The θ rotation center T of the mounting table 10 is shifted by a predetermined amount (for example, 45 ° from the straight line) in the direction in which the adjacent mounting tables 10 are separated from each other. (As shown in FIG. 3), the component pickup position interval between the adjacent pickup mechanisms 15 is arranged to be narrower than the interval between the θ rotation centers T of the adjacent mounting tables 10. The component pick-up point on the mounting table 31, the inspection point by the inspection mechanism 35, and the mounting point on the mounting board 36 are arranged on a straight line in a form having a front-rear relationship. Compared to the configuration in which the θ rotation center T of the mounting table 31 is on the straight line, the distance between the mounting tables 10 (the distance A <A ′ between the mounting points on the adjacent mounting substrates 2) and the mounting table 10. The moving range (B <B ′) can be narrowed. Accordingly, the transport distance of the mounting substrate 2 can be shortened, the time required for transporting the mounting substrate 2 can be shortened, and workability is improved.
[0033]
【The invention's effect】
According to the present invention, the component take-out position interval between adjacent take-out mechanisms is always arranged to be narrower than the interval between the θ rotation centers of the adjacent stand, and the component take-off point on the mount and the mounting board The mounting points are arranged on a straight line in the form of a front-rear relationship, and the θ rotation center of the mounting table is shifted by a predetermined amount in a direction in which adjacent mounting tables are always separated from each other on the straight line, The mounting table, the take-out mechanism, and the mounting substrate as in the past are arranged on a straight line in a form having a front-rear relationship, and the mounting table is compared with a configuration in which the θ rotation center of the mounting table is on the straight line. The distance between each other (the distance between the mounting points on adjacent mounting boards) and the moving range when the mounting table moves can be narrowed. Therefore, by adopting the arrangement configuration described above, the transport distance of the mounting substrate can be shortened, and the transport efficiency can be improved by shortening the time required for transporting the substrate.
[0034]
Also, a plurality of component groups are mounted on the mounting table, and the θ rotation center of the mounting table and the component extraction position of the extraction mechanism from the straight line connecting the component extraction point on the mounting table and the mounting point on the mounting board When the wafer is placed on the mounting table by removing the component by the take-out mechanism and then rotating the bare chip by a predetermined angle and mounting it on the mounting substrate. Since the orientation of the bare chip and the moving direction (mounting direction) of the mounting mechanism for mounting the component on the mounting substrate can be matched, it is possible to prevent mistakes in mounting the wafer on the mounting table by the operator.
[Brief description of the drawings]
FIG. 1 is a plan view showing a component supply apparatus according to an embodiment of the present invention.
FIG. 2 is a side view showing a component supply apparatus according to an embodiment of the present invention.
FIG. 3 is a plan view showing a conventional component supply apparatus.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Component supply apparatus main body 2 Mounting board | substrate 4 Conveyance mechanism 10 Mounting stand 11 Semiconductor wafer 15 Taking out mechanism 16 Inspection stand 20 Inspection mechanism 21 Mounting mechanism

Claims (7)

  1. 実装基板上に実装される各種部品を供給する部品供給装置において、
    多数の部品を収納した部品群を複数個載置し、X方向移動及びY方向移動並びにθ回転可能な載置台と、
    前記載置台上の複数個の部品群内から所望の部品を取出し、実装基板上に実装する実装機構とから成る部品供給ユニットを複数体備え、
    隣り合う取出し機構の部品取出し位置間隔が、隣り合う載置台のθ回転中心の間隔よりも常に狭くなるように配置されていることを特徴とする部品供給装置。
    In a component supply device that supplies various components mounted on a mounting board,
    A plurality of component groups storing a large number of components, a mounting table capable of X-direction movement, Y-direction movement, and θ rotation;
    A plurality of component supply units including a mounting mechanism that takes out a desired component from a plurality of component groups on the mounting table and mounts it on a mounting board,
    A component supply device characterized in that the component extraction position interval between adjacent extraction mechanisms is always narrower than the interval between the θ rotation centers of adjacent mounting tables .
  2. 実装基板上に実装される各種部品を供給する部品供給装置において、
    多数の部品を収納した部品群を複数個載置し、X方向移動及びY方向移動並びにθ回転可能な載置台と、
    前記載置台上の複数個の部品群内から所望の部品を取出し、検査台上に移載する取出し機構と、
    前記検査台上の部品状態を検査する検査機構と、
    前記検査機構による検査終了後の部品を取出し、実装基板上に実装する実装機構とから成る部品供給ユニットを複数体備え、
    隣り合う取出し機構の部品取出し位置間隔が、隣り合う載置台のθ回転中心の間隔よりも常に狭くなるように配置されていることを特徴とする部品供給装置。
    In a component supply device that supplies various components mounted on a mounting board,
    A plurality of component groups storing a large number of components, a mounting table capable of X-direction movement, Y-direction movement, and θ rotation;
    A take-out mechanism for taking out a desired part from a plurality of parts on the mounting table and transferring it to the inspection table;
    An inspection mechanism for inspecting a component state on the inspection table;
    A plurality of component supply units including a mounting mechanism that takes out a component after completion of inspection by the inspection mechanism and mounts it on a mounting substrate,
    A component supply device characterized in that the component extraction position interval between adjacent extraction mechanisms is always narrower than the interval between the θ rotation centers of adjacent mounting tables .
  3. 実装基板上に実装される各種部品を供給する部品供給装置において、
    多数の部品を収納した部品群を複数個載置し、X方向移動及びY方向移動並びにθ回転可能な載置台と、
    前記載置台上の複数個の部品群内から所望の部品を取出し、実装基板上に実装する実装機構とから成る部品供給ユニットを複数体備え、
    前記載置台上の部品取出しポイント及び実装基板上の実装ポイントが、それぞれ間隔を存して直線上に配置され、当該載置台のθ回転中心が、隣り合う載置台が離間する方向に前記直線上から常に離れて位置していることを特徴とする部品供給装置。
    In a component supply device that supplies various components mounted on a mounting board,
    A plurality of component groups storing a large number of components, a mounting table capable of X-direction movement, Y-direction movement, and θ rotation;
    A plurality of component supply units including a mounting mechanism that takes out a desired component from a plurality of component groups on the mounting table and mounts it on a mounting board,
    The component pick-up points on the mounting table and the mounting points on the mounting board are arranged on a straight line with an interval, and the θ rotation center of the mounting table is on the straight line in the direction in which the adjacent mounting tables are separated from each other. A component supply device characterized in that the component supply device is always located away from the device.
  4. 実装基板上に実装される各種部品を供給する部品供給装置において、
    多数の部品を収納した部品群を複数個載置し、X方向移動及びY方向移動並びにθ回転可能な載置台と、
    前記載置台上の複数個の部品群内から所望の部品を取出し、検査台上に移載する取出し機構と、
    前記検査台上の部品状態を検査する検査機構と、
    前記検査機構による検査終了後の部品を取出し、実装基板上に実装する実装機構とから成る部品供給ユニットを複数体備え、
    前記載置台上の部品取出しポイント及び実装基板上の実装ポイントが、それぞれ間隔を存して直線上に配置され、当該載置台のθ回転中心が、隣り合う載置台が離間する方向に前記直線上から常に離れて位置していることを特徴とする部品供給装置。
    In a component supply device that supplies various components mounted on a mounting board,
    A plurality of component groups storing a large number of components, a mounting table capable of X-direction movement, Y-direction movement, and θ rotation;
    A take-out mechanism for taking out a desired part from a plurality of parts on the mounting table and transferring it to the inspection table;
    An inspection mechanism for inspecting a component state on the inspection table;
    A plurality of component supply units including a mounting mechanism that takes out a component after completion of inspection by the inspection mechanism and mounts it on a mounting substrate,
    The component pick-up points on the mounting table and the mounting points on the mounting board are arranged on a straight line with an interval, and the θ rotation center of the mounting table is on the straight line in the direction in which the adjacent mounting tables are separated from each other. A component supply device characterized in that the component supply device is always located away from the device.
  5. 前記載置台のθ回転中心が、前記載置台上の部品取出しポイント及び実装基板上の実装ポイントがそれぞれ配置された直線から離れて位置し、前記直線から前記載置台のθ回転中心と前記取出し機構の部品取出し位置とを結ぶ直線が所定角度ずれていることを特徴とする請求項3あるいは請求項4に記載の部品供給装置。The θ rotation center of the mounting table is positioned away from the straight line on which the component take-out point on the mounting table and the mounting point on the mounting board are respectively arranged , and the θ rotation center of the mounting table and the take-out mechanism from the straight line. 5. The component supply apparatus according to claim 3, wherein a straight line connecting the component take-out positions is deviated by a predetermined angle.
  6. 前記載置台のθ回転中心が、前記載置台上の部品取出しポイント及び実装基板上の実装ポイントがそれぞれ配置された直線から離れて位置し、前記直線から前記載置台のθ回転中心と前記取出し機構の部品取出し位置とを結ぶ直線が角度45°,60°ずれていることを特徴とする請求項3あるいは請求項4あるいは請求項5に記載の部品供給装置。The θ rotation center of the mounting table is positioned away from the straight line on which the component take-out point on the mounting table and the mounting point on the mounting board are respectively arranged , and the θ rotation center of the mounting table and the take-out mechanism from the straight line. 6. The component supply device according to claim 3, wherein the straight line connecting the component take-out positions is shifted by 45 ° and 60 °.
  7. 前記取出し機構が、載置台上の部品取出し位置から前記検査台上の部品移載位置まで水平回転可能に構成されていることを特徴とする請求項2あるいは請求項4に記載の部品供給装置。  5. The component supply apparatus according to claim 2, wherein the take-out mechanism is configured to be horizontally rotatable from a component take-out position on the mounting table to a component transfer position on the inspection table.
JP33769799A 1999-11-29 1999-11-29 Parts supply device Expired - Fee Related JP3898401B2 (en)

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