JP2010040709A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2010040709A5 JP2010040709A5 JP2008200850A JP2008200850A JP2010040709A5 JP 2010040709 A5 JP2010040709 A5 JP 2010040709A5 JP 2008200850 A JP2008200850 A JP 2008200850A JP 2008200850 A JP2008200850 A JP 2008200850A JP 2010040709 A5 JP2010040709 A5 JP 2010040709A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- manufacturing
- intermediates
- mounting
- adhesive material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims 20
- 239000000543 intermediate Substances 0.000 claims 10
- 238000004519 manufacturing process Methods 0.000 claims 6
- 239000000853 adhesive Substances 0.000 claims 4
- 230000001070 adhesive Effects 0.000 claims 4
- 238000001514 detection method Methods 0.000 claims 4
- 238000003780 insertion Methods 0.000 claims 4
- 239000000463 material Substances 0.000 claims 4
- 238000000034 method Methods 0.000 claims 2
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 230000000875 corresponding Effects 0.000 claims 1
- 230000004907 flux Effects 0.000 claims 1
- 238000005755 formation reaction Methods 0.000 claims 1
- BQCADISMDOOEFD-UHFFFAOYSA-N silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 1
- 229910052709 silver Inorganic materials 0.000 claims 1
- 239000004332 silver Substances 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 claims 1
Claims (4)
Ｍ個（Ｍは整数）の前記基板領域を有した多数個取り基板を１個または前記Ｍより少ないＮ個（Ｎは整数）の基板領域を有した複数の基板中間体に切断する切断工程と、
複数の前記基板中間体をテーブル上に搭載する搭載工程と、
前記テーブル上に載置された前記基板中間体の位置検出を行う検出工程と、
前記位置検出の結果に基づき、前記基板中間体に含まれるパッドに対応する複数のボール挿通孔を有する導電性ボール供給部材を、前記パッドと前記ボール挿通孔とが対向するよう前記基板中間体に装着する装着工程と、
前記ボール挿通孔を介して前記基板中間体のパッドに前記導電性ボールを供給する供給工程とを有し、
複数の前記基板中間体毎に、少なくとも前記搭載工程、前記装着工程、及び前記供給工程を繰り返し実施する基板の製造方法であって、
前記導電性ボール供給部材の前記ボール挿通孔の形成領域に隣接する位置に、前記パッドへの搭載物との干渉を防止する逃げ部を形成したことを特徴とする基板の製造方法。 A method for manufacturing a substrate in which bumps are formed by supplying conductive balls to a plurality of pads formed in a substrate region and then performing a reflow process,
A cutting step of cutting a multi-piece substrate having M (M is an integer) substrate regions into one or a plurality of substrate intermediates having N (N is an integer) substrate regions smaller than M; ,
A mounting step of mounting a plurality of the substrate intermediates on a table;
A detection step of detecting the position of the substrate intermediate placed on the table;
Based on the result of the position detection, a conductive ball supply member having a plurality of ball insertion holes corresponding to the pads included in the substrate intermediate is attached to the substrate intermediate so that the pads and the ball insertion holes face each other. A mounting process for mounting;
Supplying the conductive ball to the pad of the substrate intermediate through the ball insertion hole,
For each of the plurality of substrate intermediates, at least the mounting step, the mounting step, and the supplying step, wherein the substrate manufacturing method repeats ,
A method for manufacturing a substrate , wherein a relief portion for preventing interference with an object mounted on the pad is formed at a position adjacent to a formation region of the ball insertion hole of the conductive ball supply member .
前記装着工程では、複数の前記基板中間体の位置が一括検出された検出結果に基づき、個々の前記基板中間体に前記導電性ボール供給部材が装着される請求項１記載の基板の製造方法。 In the detection step, the positions of the plurality of substrate intermediates placed on the table are collectively detected,
The substrate manufacturing method according to claim 1, wherein in the mounting step, the conductive ball supply member is mounted on each of the substrate intermediates based on a detection result obtained by collectively detecting the positions of the plurality of substrate intermediates.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008200850A JP5121621B2 (en) | 2008-08-04 | 2008-08-04 | Substrate manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008200850A JP5121621B2 (en) | 2008-08-04 | 2008-08-04 | Substrate manufacturing method |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2010040709A JP2010040709A (en) | 2010-02-18 |
| JP2010040709A5 true JP2010040709A5 (en) | 2011-07-21 |
| JP5121621B2 JP5121621B2 (en) | 2013-01-16 |
Family
ID=42012955
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008200850A Expired - Fee Related JP5121621B2 (en) | 2008-08-04 | 2008-08-04 | Substrate manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5121621B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012069739A (en) * | 2010-09-24 | 2012-04-05 | Shinko Electric Ind Co Ltd | Manufacturing method of wiring board |
| JP6605397B2 (en) * | 2016-06-03 | 2019-11-13 | 新光電気工業株式会社 | Conductive ball mounting device |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3635161B2 (en) * | 1996-08-30 | 2005-04-06 | 新日本製鐵株式会社 | Micro ball array substrate and bump forming method |
| JP3402172B2 (en) * | 1998-01-05 | 2003-04-28 | 松下電器産業株式会社 | Apparatus and method for mounting conductive ball |
| JP2008041751A (en) * | 2006-08-02 | 2008-02-21 | Hitachi Metals Ltd | Transfer mask for loading heterogeneous kinds of balls |
-
2008
- 2008-08-04 JP JP2008200850A patent/JP5121621B2/en not_active Expired - Fee Related
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TW200633089A (en) | Conductive bump structure of circuit board and method for fabricating the same | |
| WO2008140019A1 (en) | Method and apparatus for mounting solder ball | |
| JP2011023574A5 (en) | ||
| WO2012087556A3 (en) | Device packaging with substrates having embedded lines and metal defined pads | |
| TW200623432A (en) | BGA package substrate and method of fabricating same | |
| MY151533A (en) | Substrate and process for semiconductor flip chip package | |
| WO2010104744A3 (en) | Electronic devices formed of two or more substrates bonded together, electronic systems comprising electronic devices and methods of making electronic devices | |
| TW200742005A (en) | A method for manufacturing a coreless package substrate | |
| JP2013004865A5 (en) | ||
| JP2011515862A5 (en) | ||
| EP2866257A3 (en) | Printed circuit board and manufacturing method thereof and semiconductor pacakge using the same | |
| TW200742004A (en) | A method for manufacturing a coreless package substrate | |
| TW200620513A (en) | Method of connecting a semiconductor package to a printed wiring board | |
| JP2013131669A5 (en) | ||
| JP2012089724A5 (en) | Semiconductor device manufacturing method | |
| EP2750186A3 (en) | Package structure and package method | |
| TWI446844B (en) | Printed circuit board and method for manufacturing a rinted circuit board | |
| TW200742003A (en) | A method for manufacturing a coreless package substrate | |
| JP2008124077A5 (en) | ||
| EP2019575A3 (en) | Conductor ball mounting apparatus, conductor ball mounting method, mask used for mounting conductor ball, and mask manufacturing method | |
| JP2006517348A5 (en) | ||
| JP2010225822A5 (en) | ||
| JP2010040709A5 (en) | ||
| JP2009218435A5 (en) | ||
| JP2009044128A5 (en) |