JP2014053613A - Carrier jig for substrate transfer - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a carrier jig for substrate transfer which can prevent warpage in transferring a laminar printed circuit board.SOLUTION: The carrier jig for substrate transfer comprises: a base plate 10 having many vacuum holes 11 formed for vacuum suction of a substrate; and a plurality of guide parts 20 which support both side faces in a transfer direction of a substrate placed on the base plate, have variable height, are formed orthogonally to the transfer direction of the substrate, and have resilience in the vertical direction with a plate spring.

Description

  The present invention relates to a carrier jig for board transfer, and more particularly to a carrier jig for board transfer that can prevent warping during transfer of a thin printed circuit board.

  In general, a printed circuit board (PCB) is the most basic component used in electronic communication devices and the like. Recently, electronic products have recently been downsized, thinned, densified, and packaged. Along with the trend of miniaturization and miniaturization due to personalization and personal portability, multiple layers of printed circuit boards are also formed on a printed circuit board, miniaturization of circuit patterns is miniaturized, miniaturization, and packaging are simultaneously promoted. ing.

  Therefore, in order to form a fine pattern of a printed circuit board and improve reliability and design density, the raw material is changed and the structure is changed to a composite structure of the circuit layer, and the component is also changed to DIP (Dual In). The mounting density is increasing by changing from the -Line Package) type to the SMT (Surface Mount Technology) type.

  The printed circuit board includes a circuit pattern for electrically connecting a large number of electronic components to each other, and includes a bump electrically connected to the circuit pattern. Here, the electronic component is electrically connected to the bump and mounted on the printed circuit board, whereby the electronic component and the circuit pattern are electrically connected to each other.

  At this time, the bumps can be formed by a flat printing method. Here, according to the bump forming method by the lithographic printing method, first, after aligning a thin metal mask of several tens of μm on the printed circuit board, a conductive solder paste is disposed on the upper surface of the metal mask. Thereafter, as the squeegee moves in a pressure-bonded manner on the upper part of the metal mask, the solder paste is filled in the opening of the metal mask, whereby bumps can be formed on the printed circuit board.

  As described above, in order to transfer a printed circuit board that requires circuit pattern printing and bump formation processes, edges other than the processing surface on which the circuit pattern is processed are supported by the conveyor belt or roller. The printed circuit board is transferred by the rotation.

  However, the thin plate-like printed circuit board has a problem that the printed circuit board is damaged or warped due to its thin thickness, and cannot be transferred in direct contact with the conveyor belt or roller.

  Therefore, conventionally, a carrier has been used to assist the transfer of the printed circuit board. However, when the printed circuit board is placed on a plate-like carrier and the printed circuit board is fixed using an adhesive tape, There was a limit in automation due to desorption and problems such as residue of adhesive tape remained.

  In addition, when a fixing device is used to fix the printed circuit board, a space is formed between the metal mask and the processing surface (printing surface) of the printed circuit board by the fixing device during the printing process, and there is a problem that processing defects occur. Therefore, there is a limit that a fixing device having a shape thicker than the printed circuit board cannot be provided.

Korean Published Patent No. 10-2010-0059310 Korean Published Patent No. 10-2011-0086202

  The present invention derived to solve the above problems can prevent the printed circuit board from moving during the manufacturing process of the printed circuit board, and can reduce the occurrence of defects such as breakage or warpage, It is an object of the present invention to provide a carrier jig for transporting a substrate that can prevent secondary contamination due to an adhesive tape.

  It is another object of the present invention to provide a carrier jig for board transfer that can be automated with respect to the manufacture of a printed circuit board and can reduce the lead time during production of the printed circuit board.

  Furthermore, it aims at providing the carrier jig | tool for board | substrate transfer which can be applied to the manufacturing process of the printed circuit board which has various thickness.

  A carrier jig for transporting a substrate according to an embodiment of the present invention for achieving the above object supports a base plate on which a substrate is placed and both side surfaces of the substrate placed on the base plate in the transport direction. And a guide portion whose height is variable.

  Here, a plurality of vacuum holes for vacuum-adsorbing the substrate may be formed in the base plate.

  The base plate may be formed with a guide groove in which the guide portion is accommodated.

  Meanwhile, a plurality of the guide portions may be formed to be orthogonal to the substrate transfer direction.

  A plurality of the guide portions may be formed along the edge of the substrate.

  Here, the guide part may be formed of a leaf spring having a restoring force in the vertical direction.

  At this time, the guide part may include a long hole formed along the length direction thereof.

  The guide part may further include a coupling member that is inserted into the elongated hole and coupled to the base plate.

  Here, the coupling member may be formed of any one of a bolt and a pin.

  At the same time, the substrate may be a thin plate-like flexible printed circuit board.

  As described above, according to the carrier jig for substrate transfer according to the embodiment of the present invention, the printed circuit board is fixed and transferred through the carrier jig in which the guide portion for fixing the printed circuit board is formed. Thus, the printed circuit board can be prevented from moving during the manufacturing process of the printed circuit board, the occurrence of defects such as breakage or warpage can be reduced, and the secondary contamination due to the residue of the adhesive tape can be prevented. is there.

  In addition, according to the present invention, by fixing the printed circuit board with the guide portion, it is possible to eliminate the manual process such as the attachment and detachment of the adhesive tape and to automate the production of the printed circuit board and reduce the lead time. Therefore, there is an advantage that productivity can be improved.

  Furthermore, according to the present invention, since the height of the guide portion for fixing the printed circuit board can be changed according to the pressure applied to the guide portion by the mask, it can be used regardless of the variation in the thickness of the printed circuit board. There is an advantage that it can be applied to the manufacturing process of printed circuit boards having various thicknesses.

It is a perspective view which shows the carrier jig | tool for the board | substrate transfer by embodiment of this invention. FIG. 2 is a partially exploded perspective view showing a coupling between a guide portion and a base plate in FIG. 1. It is a top view which shows the shape by which the board | substrate was mounted in the carrier jig | tool of FIG. It is a partial exploded perspective view which shows the other form of a guide part. It is a top view which shows the other form of a carrier jig | tool. It is a side view which shows the printing process using the carrier jig | tool for board | substrate transfer by embodiment of this invention. It is a side view which shows the printing process using the carrier jig | tool for board | substrate transfer by embodiment of this invention.

  Hereinafter, specific embodiments of the present invention will be described with reference to the drawings. However, this is only an example, and the present invention is not limited to this.

  In describing the present invention, when it is determined that a specific description of a known technique related to the present invention may obscure the gist of the present invention, a detailed description thereof will be omitted. The terms described below are defined in consideration of the function in the present invention, and this can be changed depending on the intention or practice of the user or operator. Therefore, the definition should be based on the contents throughout this specification.

  The technical idea of the present invention is determined by the scope of the claims, and the following embodiments are merely one means for efficiently explaining the technical idea of the present invention to those who have ordinary knowledge in the technical field to which the present invention belongs. Absent.

  Hereinafter, an embodiment of a carrier jig for transferring a substrate according to the present invention will be described in detail with reference to FIGS. 1 to 6b.

  FIG. 1 is a perspective view showing a carrier jig for transferring a substrate according to an embodiment of the present invention, FIG. 2 is a partially exploded perspective view showing the coupling of a guide part and a base plate of FIG. 1, and FIG. It is a top view which shows the shape by which the board | substrate was mounted in 1 carrier jig | tool.

  1 to 3, a carrier jig for transferring a substrate according to an embodiment of the present invention is for assisting the transfer of the substrate B during a printing process using the mask M. The substrate B can be formed so as to be transferred together with the substrate B in a fixed state, and the substrate B fixed to the carrier jig 1 can be a thin thin plate-like flexible printed circuit board.

  A carrier jig for transferring a substrate according to an embodiment of the present invention supports a base plate 10 on which a substrate B is placed and both side surfaces in the transfer direction of the substrate B placed on the base plate 10. And a guide portion 20 having a variable length.

  The base plate 10 is a substrate on which the substrate B is placed, and may be formed in a plate shape having a predetermined thickness, and may be formed in a rectangular shape corresponding to the shape of the substrate B. However, it is not limited to this.

  Here, the base plate 10 may be formed larger than the substrate B to be placed, and may be formed of a material having high heat resistance and strength, light weight, and almost no chemical property change. preferable.

  For example, it can be formed of a metal or an alloy.

  The base plate 10 may be formed with a vacuum hole 11 penetrating in a vertical direction from the upper surface to the lower surface.

  At this time, a large number of the vacuum holes 11 can be formed, and can be formed so as to be connected to a pump (not shown) for sucking air so that the substrate B is in close contact with the upper surface of the base plate 10.

  That is, in the process of performing the printing process on the substrate B, the pump sucks air through the vacuum hole 11 so that the thin plate-like substrate B is brought into close contact with the base plate 10 without warping. The substrate B is stopped, or the substrate B that is in close contact with the base plate 10 is separated by jetting air.

  On the other hand, a guide groove 12 for accommodating a guide part 20 to be described later may be formed on the upper surface of the base plate 10.

  At this time, the guide groove 12 may be formed larger than the length of the guide part 20 so that the guide part 20 accommodated therein can move in the length direction inside the guide groove 12.

  The guide unit 20 is for fixing the substrate B placed on the upper surface of the base plate 10, and can be coupled to the upper surface of the base plate 10.

  Here, the guide part 20 may be formed to support the side surface of the substrate B placed on the base plate 10 and to support the lower surface of the mask M during the printing process of the substrate B.

  Further, the guide portion 20 is formed so that its height can be deformed, and can be formed of a leaf spring having a restoring force in the vertical direction, and is formed of any one material of metal or alloy. It is preferred that

  Here, the guide part 20 has a shape of a rectangular plate, and the side part can be formed in a “∧” shape by bending the central part.

  At this time, the guide part 20 may include a long hole 20 a formed along the length direction, and may further include a coupling member 21 inserted into the long hole 20 a and coupled to the base plate 10. .

  In addition, the guide groove 12 of the base plate 10 may be formed with a fastening hole 12a into which the coupling member 21 is inserted and fastened.

  Here, the long hole 20a may be formed on both sides of the guide part 20, or may be formed on only one side of the guide part 20, and a coupling hole (not shown) may be formed on the other side. .

  The coupling member 21 may be formed of any one of a bolt and a pin.

  That is, the guide portion 20 can prevent the guide portion 20 from being detached from the guide groove 12 by the coupling member 21 being inserted into the elongated hole 20a and being fastened to the fastening hole 12a of the guide groove 12. The guide portion 20 can be moved along the guide groove 12 by the length of the long hole 20a while being accommodated in the guide groove 12 by the coupling member 21.

  Therefore, when pressure is applied to the upper portion of the guide portion 20 in the lower direction, the bent portion of the guide portion 20 becomes straight, and the guide portion 20 extends along the guide groove 12 to both sides by the length of the long hole 20a. Therefore, when the height of the guide portion 20 is reduced and the pressure disappears, the height before the pressure is applied is restored by the restoring force of the guide portion 20.

  Referring to FIG. 4, the guide unit 20 may be formed in a rectangular plate shape whose side surface is bent in a bow shape.

  At this time, even in the guide portion 20 bent in an arc shape as described above, the bent guide portion 20 becomes straight when pressure is applied to the upper portion of the guide portion 20 in the lower direction, as described above. Extends along the guide groove 12 to both sides by the length of the long hole 20a, so that the height of the guide portion 20 is reduced, and when the pressure is lost, the height before the pressure is applied is restored by the restoring force of the guide portion 20. Is done.

  On the other hand, the guide portion 20 is formed to support the side surface of the substrate B placed on the base plate 10, and is formed on both sides of the substrate B so as to be orthogonal to the carrier jig transfer direction. Can.

  That is, while the substrate B is transferred, inertia force is applied to the substrate B by the movement operation and stop operation of the carrier jig, but the guide portions 20 are formed on both sides of the substrate B so as to be orthogonal to the carrier jig transfer direction. By supporting both side surfaces of the substrate B, it is possible to prevent the substrate B from being detached from the base plate 10 due to inertial force.

  Referring to FIG. 5, a plurality of the guide portions 20 may be formed along the edge portion of the substrate B placed on the base plate 10.

  At this time, the guide portion 20 supports all the edge portions of the substrate B, and prevents the substrate B from being detached from the base plate 10 by preventing the movement of the substrate B when the carrier jig is transferred. Can do.

  Accordingly, by fixing and transferring the side surface of the substrate B with the guide portion 20, the substrate B can be prevented from moving or separating during the manufacturing process of the substrate B, and the occurrence of defects such as breakage or warpage can be reduced. can do. Further, by not using an adhesive tape for fixing the substrate B, it is possible to prevent secondary contamination due to an adhesive tape residue, and a printed circuit board can be eliminated by eliminating manual work steps such as desorption of the adhesive tape. Since manufacturing can be automated and lead time can be shortened, there is an advantage that productivity can be improved.

  6A and 6B are side views showing a printing process using a carrier jig for transferring a substrate according to an embodiment of the present invention.

  Referring to FIGS. 6 a and 6 b, according to the printed circuit board printing process using the carrier jig configured as described above, first, the side surface of the substrate B is supported by the guide portion 20 on the upper surface of the base plate 10. The substrate B is vacuum-sucked by a large number of vacuum holes 11 formed in the base plate 10 to fix the substrate B to the base plate 10, and then a pattern is formed on the substrate B. A mask M on which is formed is disposed.

  Next, the mask M is adhered to the upper surface of the substrate B, and a pattern is printed on the substrate B.

  Here, when the mask M and the substrate B are brought into close contact with each other, a pressure is applied from the mask M to the guide portion 20, but when the pressure is applied to the guide portion 20, the bent portion becomes straight and the guide portion 20 is guided. It extends along the groove 12 to both sides by the length of the long hole 20a.

  At this time, since the height of the guide portion 20 is reduced to a height corresponding to the thickness of the substrate B, the mask M and the upper surface of the substrate B are brought into close contact with each other, so that the printing plane can be maintained and printing is completed. When the pressure applied to the mask M disappears, the guide portion 20 is restored to the height before being pressurized by the restoring force, and the substrate B is fixed.

  That is, since the height of the guide portion 20 that supports and fixes the side surface of the substrate B is variable according to the pressure applied to the guide portion 20 by the mask M, the movement and separation of the substrate B are prevented during the printing process. At the same time, the printing plane of the substrate B and the mask M are kept in close contact with each other to maintain the printing plane, so that the defect occurrence rate can be reduced and the printing process can be used regardless of the thickness of the substrate B that requires a printing process. There is an advantage that it can be applied to the manufacturing process of printed circuit boards of various thicknesses.

  As described above, the present invention has been described in detail with reference to the representative embodiments. However, those who have ordinary knowledge in the technical field belonging to the present invention can apply the scope of the present invention to the above-described embodiments. It will be understood that various modifications are possible without departing from the above.

  Therefore, the scope of rights of the present invention should not be limited to the above-described embodiments, but should be determined not only by the claims described later but also by the equivalents of the claims.

DESCRIPTION OF SYMBOLS 10 Base plate 11 Vacuum hole 12 Guide groove 12a Fastening hole 20 Guide part 20a Long hole 21 Joining member

Claims (10)

A base plate on which a substrate is placed;
Supporting both side surfaces in the transfer direction of the substrate placed on the base plate, and a guide portion whose height is variable;
A carrier jig for transferring a substrate.   The carrier jig for transporting a substrate according to claim 1, wherein the base plate is formed with a number of vacuum holes for vacuum-sucking the substrate.   The carrier jig for transferring a substrate according to claim 1, wherein a guide groove for accommodating the guide portion is formed in the base plate.   4. The carrier jig for transporting a substrate according to claim 1, wherein a plurality of the guide portions are formed so as to be orthogonal to the transport direction of the substrate. 5.   5. The carrier jig for transporting a substrate according to claim 1, wherein a plurality of the guide portions are formed along an edge portion of the substrate.   The carrier jig for transferring a substrate according to any one of claims 1 to 5, wherein the guide portion is formed of a leaf spring having a restoring force in the vertical direction.   The carrier jig for transferring a substrate according to any one of claims 1 to 6, wherein the guide portion includes a long hole formed along a length direction thereof.   8. The carrier jig for transferring a substrate according to claim 7, wherein the guide part further includes a coupling member inserted into the elongated hole and coupled to the base plate.   The carrier jig for transferring a substrate according to claim 8, wherein the coupling member is formed of any one of a bolt and a pin.   10. The carrier jig for transferring a substrate according to claim 1, wherein the substrate is a thin-plate-like flexible printed circuit board.

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