KR101577026B1

KR101577026B1 - Assembly and transfer apparatus of substrate zig for solder reflow

Info

Publication number: KR101577026B1
Application number: KR1020140008157A
Authority: KR
Inventors: 이진종; 김동민
Original assignee: 아메스산업(주)
Priority date: 2014-01-23
Filing date: 2014-01-23
Publication date: 2015-12-11
Also published as: KR20150087937A

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate jig for assembling and transferring substrate jigs for solder reflow, and more particularly, to a substrate jig for flip chip mounting, a board (jig) for preventing warpage comprising a magnet base and a jig cover So that warpage of the substrate due to high temperature melting and hardening can be suppressed and thus the substrate for solder reflow can be mounted with the miniaturized solder ball size, To a jig assembly and transfer device.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to an assembly and transfer apparatus for substrate jig for solder reflow,

The demand for the integration of semiconductor devices and the reduction in size and weight of the housed devices has been gradually increased in terms of development of information communication and effective overcoming of equipment complexity and accordingly, , A packaged semiconductor is generally used.

In the packaging, a chip is mounted on a substrate on which an external terminal is formed, and further completed through a molding operation. Here, the external terminal is a terminal formed on a substrate that electrically connects a substrate and a chip, and can be classified into wire bonding (flip chip bonding) or flip chip bonding have.

In general, the wire bonding method is a method in which a chip is placed on a substrate on which leads are formed and an external terminal is connected to an electrode pattern of a semiconductor chip using fine wires. The flip chip bonding method is a method in which Sn / Pb And a solder ball is formed on the protrusion of the substrate. The solder ball is electrically connected to the substrate when the chip is mounted on the substrate.

On the other hand, in the case of the flip chip bonding, a device in which a chip having a solder ball is turned upside down and a flip surface is oriented toward the substrate is a technology capable of realizing the smallest type of semiconductor packaging.

However, in the case of the flip chip bonding technique as described above, the solder reflow process is performed at a high temperature (approximately 300 ° C). In this case, when the curing process is completed by the solder reflow process, warpage Resulting in poor solder ball mounting.

In addition, with the recent miniaturization of the packaging, it is expected that the size of the solder ball in which the flip chip bonding is performed is reduced to 60 탆. However, when the warp page occurs up to 8 mm, mounting of the solder ball of 60 탆 in size is almost impossible.

Therefore, in order to mount the miniaturized solder ball size, a substrate jig capable of suppressing the warpage of the substrate and equipment for assembling such a substrate jig are in desperate need.

Korean Registered Patent No. 10-0625009 (Registered on September 11, 2006)

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and it is an object of the present invention to easily assemble and assemble a warp page prevention board jig including a substrate (PCB) before flip chip mounting, a magnet base and a jig cover So that the warpage of the substrate due to the high temperature melting and curing can be suppressed and thus the solder reflow can be implemented with the miniaturized solder ball size. And to provide a substrate jig assembling and transferring apparatus.

It is another object of the present invention to provide a substrate for a solder ripple which is a fully automated assembly and transfer process of a magnet base, a jig cover and a substrate supported thereon, which are components of the substrate jig, And to provide a jig assembly and transfer device.

According to an aspect of the present invention, there is provided a substrate jig assembling and transferring apparatus for a solder reflow, comprising: a substrate transferring unit for transferring a substrate having a plurality of pads formed thereon; A substrate jig transfer unit for transferring a substrate jig comprising a plate-shaped magnet base having a plurality of magnets formed on an upper surface thereof, and a jig cover having a plurality of pad holes corresponding to the respective pads; A substrate and a substrate jig assembly unit for assembling the substrate supplied through the substrate transfer unit and the substrate jig supplied through the substrate jig transfer unit; And an assembled substrate transfer unit for transferring the substrate assembled through the substrate and substrate jig assembling unit to the solder reflow process.

Here, the substrate transfer unit may include a substrate magazine conveyor for transferring a substrate magazine on which a plurality of substrates are stacked and supplied in a magazine form; A magazine port for clamping the transferred substrate magazine; A magazine locker for opening the locking of the substrate magazine; A substrate pusher for pushing each substrate loaded on an open substrate magazine and supplying the substrate to a substrate conveyor; A substrate conveyor for sequentially transferring a substrate supplied through the substrate pusher; And a Y-axis feeder installed at an end of the substrate conveyor and feeding the transferred substrate to the substrate and substrate jig assembling unit.

The substrate jig transfer unit may include a substrate jig magazine conveyor for transferring a substrate jig magazine on which a plurality of assembly substrate jigs are stacked and supplied in a magazine form; A substrate jig magazine port for clamping the transferred substrate jig magazine; A substrate jig magazine locker for opening the locking of the substrate magazine; And a substrate jig pusher for pushing each substrate jig loaded on the open substrate jig magazine and supplying the substrate jig pusher to the substrate and substrate jig assembling unit.

The substrate and substrate jig assembling unit may further include: a substrate jig separating and assembling means for separating and joining the coupled substrate jig up and down; And a substrate mounting means for mounting a substrate transferred through the substrate transfer unit on the magnet base separated through the substrate jig separating and engaging means.

In addition, the substrate jig separating and engaging means may include: a support table for supporting the magnet base from a lower portion thereof; And adsorption means for adsorbing the jig cover assembled on the magnet base supported by the support object.

The apparatus may further include an assembled substrate inspection unit for inspecting the assembled substrate to which the substrate jig is coupled through the substrate and substrate jig assembling unit.

According to the assembling and transferring apparatus of the substrate jig for solder reflow according to the present invention, the substrate (PCB) before the flip chip mounting, the substrate jig including the magnet base and the jig cover are easily assembled and transferred, It is possible to suppress the warpage of the substrate up to 8 mm due to melting and curing at a high temperature (about 300 ° C), and as a result, It is possible to mount the miniaturized solder ball size (60 m) according to the present invention.

In addition, there is also an effect that the process of loading the magnet base, the jig cover, and the substrate supported thereon, which are components of the substrate jig, which is the support of the substrate for suppressing warpage generation of the substrate, can be fully automated.

1A and 1B are a schematic exploded view and a combined perspective view of a substrate jig for solder reflow according to the present invention.
2 is a block diagram of an assembling and transferring apparatus for a substrate jig for solder reflow according to the present invention.
3 is a plan view of the assembly and transfer device of the substrate jig for solder reflow according to the present invention.

The present invention may be embodied in many other forms without departing from its spirit or essential characteristics. Accordingly, the embodiments of the present invention are to be considered in all respects as merely illustrative and not restrictive.

The terms first, second, etc. may be used to describe various components, but the components should not be limited by the terms.

The terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be referred to as a second component, and similarly, the second component may also be referred to as a first component.

It is to be understood that when an element is referred to as being "connected" or "connected" to another element, it may be directly connected or connected to the other element, .

On the other hand, when an element is referred to as being "directly connected" or "directly connected" to another element, it should be understood that there are no other elements in between.

The terminology used in this application is used only to describe a specific embodiment and is not intended to limit the invention. The singular expressions include plural expressions unless the context clearly dictates otherwise.

In the present application, the terms "comprises", "having", "having", and the like are intended to specify the presence of stated features, integers, steps, operations, components, Steps, operations, elements, components, or combinations of elements, numbers, steps, operations, components, parts, or combinations thereof.

Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs.

Terms such as those defined in commonly used dictionaries are to be interpreted as having a meaning consistent with the contextual meaning of the related art and are to be interpreted as either ideal or overly formal in the sense of the present application Do not.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art can easily carry out the present invention.

2 is a block diagram of an assembling and transferring apparatus for a substrate jig for solder reflow according to the present invention, and FIG. 3 is a cross-sectional view of the substrate jig for solder reflow according to the present invention. Are a plan view and a perspective view of the assembling and transferring apparatus of the substrate jig for solder reflow according to the present invention, and will be described for the sake of convenience.

First, as shown in FIGS. 1A and 1B, a substrate jig 2 for a solder reflow according to the present invention for mounting and reflowing a substrate while supporting the substrate 10 A magnet base 20, and a jig cover 30.

The magnet base 20 and the jig cover 30 are assembled together when the substrate jig 2 for solder reflow according to the present invention is assembled and supplied to the transfer device 100.

The magnet base 20 has a substantially rectangular plate shape and a plurality of magnets 21 in the form of a matrix are formed on the upper surface of the magnet base 20 so as to form a row and a column so that the substrate 10 can be fixed by magnetic force .

The jig cover 30 also has a substantially rectangular plate shape and a plurality of rectangular pad holes 31 corresponding to the pads 11 of the substrate 10 are formed.

Since the substrate 10 assembled by the magnet base 20 and the jig cover 30 is put into the solder reflow process as a subsequent process, melting and curing at a high temperature (about 300 ° C.) It is possible to suppress the warpage of the generated substrate.

2, the assembling and transferring apparatus 100 for the substrate jig 2 for solder reflow according to the present invention is a device for transferring a substrate 10 on which a plurality of pads 11 are formed A substrate transfer unit (110); A wafer base plate jig (not shown) made up of a plate-shaped magnet base 30 having a plurality of magnets 21 formed on an upper surface thereof and a jig cover 30 having a plurality of pad holes 31 corresponding to the respective pads 11 2) for transferring the substrate jig; A substrate and jig assembling unit 130 for assembling the substrate 10 supplied through the substrate transfer unit 110 and the substrate jig 2 supplied through the substrate jig transfer unit 120; And an assembled substrate transfer unit 140 for transferring the substrate assembled through the substrate and substrate jig assembling unit 130 to the solder reflow process.

The substrate transfer unit 110 transfers a substrate 20 having a plurality of pads 21 formed thereon in a magazine form and transfers the substrate 20 and a substrate to the substrate jig assembling unit 130 Role.

3, the substrate transfer unit 110 is disposed at one side (rear left side) of the assembling and transferring apparatus 100 of the substrate jig for solder reflow according to the present invention, A substrate magazine conveyor 111 for conveying a substrate magazine (not given a reference numeral) to which the substrate magazines 20 are loaded and supplied in a magazine form, a magazine port 112 for clamping the transferred substrate magazines, A magazine locker 113 for opening locking and a substrate pusher 114 for pushing each substrate 20 loaded on the open substrate magazine to the substrate conveyor 115, A substrate conveyor 115 for sequentially transferring the substrate 20 supplied through the substrate pusher 114 and a substrate 20 mounted on the end of the substrate conveyor 115 for transferring the substrate 20 and the substrate 20, The Y-axis feeder 116 that feeds the assembly unit 130 The lure is.

The substrate jig transfer unit 120 includes a plate-shaped magnet base 30 having a plurality of magnets 31 formed on its upper surface, a plurality of pad holes 41 corresponding to the respective pads 21 of the substrate 20, The substrate jig 2 in a state in which the jig cover 40 in which the jig cover 40 is formed is received in a magazine form and the substrate jig 2 is supplied to the substrate and substrate jig assembling unit 130 .

3, the substrate jig transfer unit 120 is disposed on the other side (rear-right side) of the transfer device 100 and the assembly of the substrate jig 2 for solder reflow according to the present invention A substrate jig magazine conveyor 121 for conveying a substrate jig magazine (not numbered) to which a plurality of substrate jigs 2 are loaded and supplied in a magazine form, a substrate for clamping the conveyed substrate jig magazine, A substrate jig magazine locker 123 for opening the locking of the substrate magazine and a substrate jig 2 loaded on the opened substrate jig magazine are pushed to the substrate And a substrate jig pusher 124 for supplying the substrate jig to the substrate jig assembling unit 130.

The substrate and substrate jig assembling unit 130 serves to assemble the substrate 10 and the substrate jig 2 supplied thereto.

3, the substrate and substrate jig assembling unit 130 is disposed approximately at the center of the assembling and transferring apparatus 100 of the substrate jig for solder reflow according to the present invention.

The substrate and substrate jig assembling unit 130 includes a substrate jig separating and assembling means 131 for separating and coupling the combined substrate jig 2 up and down and a substrate jig separating and engaging means 131 (132) for placing the substrate (10) transferred through the substrate transfer unit (110) on the magnet base (20) separated through the substrate transfer unit (110).

The substrate jig separating and engaging means 131 includes a support base 131-1 for supporting the magnet base 20 from the lower side thereof and a support base 131-1 for supporting the magnet base 20 on the magnet base 20 supported on the support base 131-1 And adsorption means 131-2 for adsorbing the assembled jig cover 30.

That is, the substrate jig 2 is supplied to the substrate and substrate jig assembling unit 130 in a state where the magnet base 20 and the jig cover 30 are assembled. In order to assemble the substrate 10 into the substrate jig, It is necessary to separate the substrate jig so that the automated adsorption means 131-2 in a state in which the magnet base 20 is supported on the support 131-1 of the substrate jig separating and coupling means 131 So that the jig cover 30 is separated from the magnet base 20.

After the prepared substrate 10 is placed between the magnet base 20 and the jig cover 30 in the state where the magnet base 20 and the jig cover 30 are separated from each other in this manner, the substrate seating means 132, such as a transfer arm, And the jig cover 30 adsorbed through the suction means 131-2 of the substrate jig separating and engaging means 131 is attached to the upper surface of the substrate 10 attached on the magnet base And the pads 11 are exposed to the outside through a plurality of pad holes 31 for device mounting and solder reflow process later.

The assembling and transferring apparatus 100 for a substrate jig for a solder reflow according to the present invention includes a substrate jig assembling unit 130 for inspecting an assembly state of the assembled substrate 1, And an assembled substrate inspection unit 150 for inspection.

The assembled substrate transfer unit 140 transfers the assembled substrate 1, which has been inspected through the assembled substrate inspection unit 150, to the solder reflow process.

Although the assembled substrate transfer unit 140 is preferably a conveyor type, it does not limit the kind thereof.

As described above, the assembled substrate 1 assembled through the assembling and transferring apparatus 100 of the substrate jig for solder reflow according to the present invention can be mounted and reflowed through the assembled substrate transferring unit 140, (reflow) process.

The device mounting process and the reflow process will be described in more detail as follows.

The assembled substrate 1 is assembled through the magnet base 20 and the jig cover 30 and the assembled substrate is inspected through the assembled substrate inspection unit 150. If there is no abnormality, .

That is, the solder (not shown) is picked to each of the pads 11 exposed on the assembled substrate 1. Then, an element (not shown) corresponding to the position of the pad 11 on which the solder is placed is mounted to complete the surface mounting.

Subsequently, the solder buried on each pad 11 is melted at a high temperature of about 300 DEG C by a heating operation so that the elements and each pad 11 are mutually fused and the substrate 10 and the element are electrically bonded )do.

In this state, the solder is cooled and cured to complete the soldering between the element and the substrate. Here, since the substrate 10 is assembled and fixedly supported by the magnet base 20 and the jig cover 30, it is possible to prevent solder ball reflowing due to high temperature solder ball melting and curing, thereby preventing warpage.

Such device mounting and solder reflow processes and equipment are well-known technologies and will not be described further.

The present invention may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, It belongs to the scope of right.

1: (substrate jig) assembled substrate 2: substrate jig
10: PCB 11: multiple pads
20: Magnet base 21: Magnet
30: jig cover 31: multiple square pad holes
100: Assembling and transferring a substrate jig for solder reflow according to the present invention
110: substrate transfer unit
111: Substrate magazine conveyor
113: substrate magazine locker
114: substrate pusher 115: substrate conveyor
116: Y-axis feeder
120: substrate jig transfer unit
121: substrate jig magazine conveyor 122: substrate jig magazine port
123: substrate jig magazine locker
124: substrate jig pusher
130: substrate and substrate jig assembly unit
131: Substrate jig separation and coupling means 131-1:
131-2: absorption means 132: substrate seating means
140: Assembled substrate transfer unit 150: Assembled substrate inspection unit

Claims

delete

A substrate transfer unit for transferring a substrate on which a plurality of pads are formed;
A substrate jig transfer unit for transferring a substrate jig comprising a plate-shaped magnet base having a plurality of magnets formed on an upper surface thereof, and a jig cover having a plurality of pad holes corresponding to the respective pads;
A substrate and a substrate jig assembly unit for assembling the substrate supplied through the substrate transfer unit and the substrate jig supplied through the substrate jig transfer unit; And
And an assembled substrate transfer unit for transferring the substrate assembled through the substrate and substrate jig assembling unit to the solder reflow process,
Wherein the substrate transfer unit comprises:
A substrate magazine conveyer for conveying a substrate magazine on which a plurality of substrates are stacked and supplied in a magazine form;
A magazine port for clamping the transferred substrate magazine;
A magazine locker for opening the locking of the substrate magazine;
A substrate pusher for pushing each substrate loaded on an open substrate magazine and supplying the substrate to a substrate conveyor;
A substrate conveyor for sequentially transferring a substrate supplied through the substrate pusher; And
And a Y-axis feeder installed at an end of the substrate conveyor and feeding the transferred substrate to the substrate and the substrate jig assembling unit.

A substrate transfer unit for transferring a substrate on which a plurality of pads are formed;
A substrate jig transfer unit for transferring a substrate jig comprising a plate-shaped magnet base having a plurality of magnets formed on an upper surface thereof, and a jig cover having a plurality of pad holes corresponding to the respective pads;
A substrate and a substrate jig assembly unit for assembling the substrate supplied through the substrate transfer unit and the substrate jig supplied through the substrate jig transfer unit; And
And an assembled substrate transfer unit for transferring the substrate assembled through the substrate and substrate jig assembling unit to the solder reflow process,
Wherein the substrate jig transfer unit comprises:
A substrate jig magazine conveyor for conveying a substrate jig magazine on which a plurality of assembly substrate jigs are stacked and supplied in a magazine form;
A substrate jig magazine port for clamping the transferred substrate jig magazine;
A substrate jig magazine locker for opening the locking of the substrate magazine; And
And a substrate jig pusher for pushing each substrate jig loaded on the opened substrate jig magazine and supplying the substrate jig pusher to the substrate and substrate jig assembling unit.

A substrate transfer unit for transferring a substrate on which a plurality of pads are formed;
A substrate jig transfer unit for transferring a substrate jig comprising a plate-shaped magnet base having a plurality of magnets formed on an upper surface thereof, and a jig cover having a plurality of pad holes corresponding to the respective pads;
A substrate and a substrate jig assembly unit for assembling the substrate supplied through the substrate transfer unit and the substrate jig supplied through the substrate jig transfer unit; And
And an assembled substrate transfer unit for transferring the substrate assembled through the substrate and substrate jig assembling unit to the solder reflow process,
The substrate and substrate jig assembly unit comprises:
A substrate jig separating and engaging means for separating and engaging the coupled substrate jig up and down; And
And a substrate mounting means for mounting a substrate transferred through the substrate transfer unit onto the magnet base separated through the substrate jig separating and coupling means. .

5. The method of claim 4,
The substrate jig separating and engaging means comprises:
A support table for supporting the magnet base at a lower portion thereof; And
And a sucking means for sucking a jig cover assembled on the magnet base supported by the support object. &Lt; RTI ID = 0.0 > 8. < / RTI >

6. The method according to any one of claims 2 to 5,
Further comprising an assembled substrate inspection unit for inspecting an assembled substrate to which the substrate jig is coupled through the substrate and substrate jig assembling unit.