JP2001127496A - Method for mounting semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To substantially improve connection reliability by mounting semiconductor devices on a printed wiring board, while correcting for warpage or the like of a tape carrier substrate. SOLUTION: When mounted, a suction nozzle VN of a mounter unit for transferring semiconductor devices 1 set approximately to the same size as that of the semiconductor devices 1 to be mounted and a suction unit VN1 for sucking a semiconductor ship CH is placed in the center of the suction nozzle VN, and suction area VA is provided near its outer periphery. The suction part VN1 chucks and fixes the central part of the semiconductor ship CH under vacuum and the suction are VA transfers the semiconductor devices 1, while chucking and fixing the proximity of the outer periphery of the four sides of a tape carrier substrate 2 and mounts them on a printed wiring board P. Since the proximity of the outer periphery of the tape carrier substrate 2 is chucked and fixed by the suction area VA, its warpage is corrected and chips are mounted on the printed wiring board P, while its plurality is being maintained.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device mounting technique, and more particularly, to a CSP (Chip SizePac).
kage), TCP (Tape Carrier Pa)
The present invention relates to a technology that is effective when applied to mounting connection such as a package.

[0002]

2. Description of the Related Art According to studies made by the present inventor, T
In semiconductor devices such as CP type and CSP type, a tape carrier substrate made of an insulating tape on which lead wiring is formed is used as a carrier substrate on which a semiconductor chip is mounted, and a TAB (Tape Automated Bonn) is used.
The pad electrode of the tape carrier substrate and the bonding pad of the semiconductor chip are electrically connected by the ding) technique.

[0003] As an example which describes this type of semiconductor device in detail, there is "1999 Semiconductor Assembly and Inspection Techniques", pages 17 to 20, published by Press Journal on July 27, 1998. Has various BG
A configuration in an A (Ball Grid Array) type semiconductor device is described.

[0004]

However, the present inventor has found that the above-described semiconductor device has the following problems.

That is, in the TCP type semiconductor device, since the tape carrier substrate is deformed and warped due to the weight of the semiconductor device itself or heating during a screening test, etc., reliable connection in mounting on the printed wiring board is required. May not be performed, and there is a problem that the connection reliability of the semiconductor device is reduced.

In the CSP type semiconductor device, a reinforcing frame made of nickel or the like is provided near the outer peripheral portion of the semiconductor chip on the surface of the tape carrier substrate in order to prevent warpage of the tape carrier substrate and facilitate handling during mounting. Glued.

However, stress may concentrate on the tape carrier substrate around the reinforcing frame due to a difference in expansion coefficient between the tape carrier substrate and the reinforcing frame, and the lead wiring may be disconnected. In this case, too. There is a problem that the reliability of the semiconductor device is reduced.

SUMMARY OF THE INVENTION It is an object of the present invention to correct a warpage of a tape carrier substrate and mount the semiconductor device on a printed wiring board while maintaining flatness, thereby greatly improving connection reliability during mounting. It is to provide an implementation method of.

The above and other objects and novel features of the present invention will become apparent from the description of the present specification and the accompanying drawings.

[0010]

SUMMARY OF THE INVENTION Among the inventions disclosed in the present application, the outline of a representative one will be briefly described.
It is as follows.

That is, according to the semiconductor device mounting method of the present invention, there are provided a step of preparing a semiconductor device having a semiconductor chip mounted on a surface of a tape carrier substrate, and a step of soldering to an electrode portion corresponding to an external terminal of the semiconductor device to be mounted. A step of preparing a printed wiring board on which the paste is applied, and correcting the warpage of the tape carrier substrate by suction-fixing the central portion of the semiconductor chip and four corners of the tape carrier substrate, while maintaining flatness. The method includes a step of transporting the semiconductor device and mounting it on a printed wiring board, and a step of reflowing and soldering the printed wiring board on which the semiconductor device is mounted.

Further, a method of mounting a semiconductor device according to the present invention
A step of preparing a semiconductor device having a semiconductor chip mounted on the surface of a tape carrier substrate, a step of preparing a printed wiring board having solder paste applied to electrodes corresponding to external terminals of the semiconductor device to be mounted, and The central portion of the chip and the peripheral portion of at least two opposing sides of the tape carrier substrate are suction-fixed to correct the warpage of the tape carrier substrate, transport the semiconductor device while maintaining flatness, and mount the semiconductor device on the printed wiring board. And reflow the printed wiring board on which the semiconductor device is mounted,
And a step of soldering.

Further, according to the method of mounting a semiconductor device of the present invention, there is provided a step of preparing a semiconductor device having a semiconductor chip mounted on a surface of a tape carrier substrate, and a step of soldering an electrode portion corresponding to an external terminal of the mounted semiconductor device. A step of preparing a printed wiring board on which the paste is applied, and correcting the warpage of the tape carrier substrate by suction-fixing the central portion of the semiconductor chip and the four sides of the tape carrier substrate, and fabricating the semiconductor device while maintaining flatness. The method includes a step of transporting and mounting on a printed wiring board, and a step of reflowing and soldering the printed wiring board on which the semiconductor device is mounted.

As described above, the warpage of the tape carrier substrate of the semiconductor device can be corrected and the semiconductor device can be mounted on the printed wiring board while maintaining the flatness, so that the connection reliability can be greatly improved.

[0015]

Embodiments of the present invention will be described below in detail with reference to the drawings.

(Embodiment 1) FIG. 1 is a sectional view of a semiconductor device mounted on a printed wiring board according to Embodiment 1 of the present invention, and FIG. FIG. 3 is a plan view of a semiconductor device to be mounted.
FIG. 4A is a configuration explanatory view of a mounter device according to Embodiment 1 of the present invention, and FIG. 4A is an external perspective view of a suction nozzle provided in the mounter device according to Embodiment 1 of the present invention;
FIG. 5 is a plan view of the suction nozzle, FIG. 5 is an explanatory view of a mounting process of the semiconductor device according to the first embodiment of the present invention, and FIG.
FIG. 7 is an explanatory view of the semiconductor device mounting process following FIG. 5, FIG. 7 is an explanatory view of the semiconductor device mounting process following FIG. 6, and FIG. 8 is a flowchart of the semiconductor device mounting process according to the first embodiment of the present invention. is there.

In the first embodiment, the semiconductor device 1 is made of a tape BGA which is a kind of a surface mount type CSP. As shown in FIGS. 1 and 2, the semiconductor device 1 is provided with a tape carrier substrate 2 which is a tape-shaped flexible wiring substrate.

In the tape carrier substrate 2, for example, wiring leads 3 are formed on the back surface of an insulating tape film 2a made of polyimide or the like via an adhesive. The tip of the wiring lead 3 is an inner lead 3a. These inner leads 3a are connected to bonding pads BP of a semiconductor chip CH mounted in a device hole 4 located at the center of the tape carrier substrate 2.

A resin 5 made of epoxy or the like is applied to the side surface and the main surface of the semiconductor chip CH mounted on the tape carrier substrate 2 and sealed. A circular substrate electrode 6 is formed on the back surface of the tape carrier substrate 2, and a solder resist 7 is formed on the back surface other than the substrate electrode 6.

Bumps (external terminals) 8 are formed on the substrate electrode 6, and these bumps 8 are formed of so-called solder balls, which are spherical solders, and are used instead of leads for external drawing of the semiconductor device 1. Then, it is mounted on a printed wiring board P on which electronic components and the like are mounted.

Next, a technique for mounting the semiconductor device 1 on a printed wiring board will be described with reference to FIGS.

First, the solder paste H is applied to the land of the printed wiring board P on which the semiconductor device 1 as a product is mounted.
P is applied (Step S101). Here, an adhesive for temporarily fixing the semiconductor device 1 may be applied to the surface of the printed wiring board after the application of the solder paste HP in the step S101.

Then, the semiconductor device 1 stored in the feeder of the mounter device MM is moved by the suction nozzle VN and mounted at a predetermined position on the printed wiring board P as shown in FIG. The suction nozzle VN provided in the mounter device MM is, as shown in FIGS.
The size is almost the same as that of the semiconductor device 1 to be mounted.

A suction portion VN1 for sucking the semiconductor chip CH is provided at the center of the suction nozzle VN, and a suction area VA is provided near the outer periphery of the suction nozzle VN.

As shown in FIG. 5, the mounter device MM
After moving the suction nozzle VN so that the suction part VN1 is located at the center of the semiconductor chip CH of the semiconductor device 1, the suction nozzle VN is lowered.

The suction part VN1 of the suction nozzle VN evacuates and fixes the semiconductor chip CH of the semiconductor device 1 by suction. Similarly, the suction area VA is suction-fixed by evacuating the outer periphery of the four sides of the tape carrier substrate 2 of the semiconductor device 1 (step S102).

The semiconductor device 1 suction-fixed by the suction nozzle VN is, as shown in FIG.
(Step S103), as shown in FIG.
The bump 8 of the semiconductor device 1 is mounted on a predetermined position on the printed wiring board P, and the land formed on the printed wiring board P is overlapped (Step S104).

At this time, the semiconductor device 1 is suction-fixed in the vicinity of the outer peripheral portion of the tape carrier substrate 2 of the semiconductor device 1 by the suction area VA, so that the warpage of the tape carrier substrate 2 is corrected while being placed on the printed wiring board P. Will be implemented.

Therefore, in the semiconductor device 1, a frame-like reinforcing material made of copper, nickel, or the like for maintaining the flatness of the tape carrier substrate can be omitted in the vicinity of the outer peripheral portion of the semiconductor chip CH.

Then, the printed wiring board P on which the semiconductor device 1 and the like are mounted is reflowed and soldered as shown in FIG. 7 (step S105), and is mounted on the printed wiring board P. .

Thus, according to the first embodiment, the semiconductor device 1 can be mounted on the printed wiring board P while correcting the warpage of the tape carrier substrate 2 of the semiconductor device 1 and maintaining the flatness. The manufacturing yield at the time of mounting the semiconductor device 1 and the connection reliability can be greatly improved.

In addition, since the semiconductor device 1 does not require a reinforcing member for maintaining the flatness of the tape carrier substrate 2, the cost of the semiconductor device 1 can be reduced.

(Embodiment 2) FIG. 9 is a sectional view of a semiconductor device mounted on a printed wiring board according to Embodiment 2 of the present invention, and FIG. 10 is a mounting of the semiconductor device according to Embodiment 2 of the present invention. FIG. 11 is an explanatory view of the semiconductor device mounting process following FIG. 10; FIG. 12 is an explanatory view of the semiconductor device mounting process following FIG. 11;

In the second embodiment, the semiconductor device 1a
However, as shown in FIG. 9, it is made of TCP, which is a kind of surface mount package. The semiconductor device 1a includes a tape carrier substrate 9 which is a tape-shaped flexible wiring substrate.
Is provided.

The tape carrier substrate 9 has a structure in which, for example, a semiconductor chip CH is mounted on a tape carrier in which copper foil wirings 11 serving as leads are repeatedly formed on the upper surface of a film 10 made of polyimide.

A bonding pad BP, which is an electrode, is disposed on the main surface of the semiconductor chip CH. One end of the wiring 11 formed on the tape carrier substrate 9 serves as an inner lead 11a to form the bonding pad BP. Each is electrically connected.

Further, the other end of the wiring 11 is an outer lead (external terminal) 11b, and is electrically connected to a land provided on a printed wiring board P on which electronic components and the like are mounted. The semiconductor chip CH and the inner leads 11a are sealed with a resin 12 of, for example, epoxy to form a package, and the individual outer leads 11b protruding from the package are bent in a substantially crank shape.

Next, a technique for mounting the semiconductor device 1a on the printed wiring board P will be described. This semiconductor device 1a
Are the same as those in the flowchart of the first embodiment.

First, a solder paste HP is applied to the land of the printed wiring board P on which the semiconductor device 1a as a product is mounted. In the process of step S201, an adhesive for temporarily fixing the semiconductor device 1a may be applied to the surface of the printed wiring board after the application of the solder paste HP.

Then, the semiconductor device 1a is mounted at a predetermined position on the printed wiring board P by the mounter device MM (FIG. 3). The suction nozzle VN (FIGS. 4A and 4B) provided in the mounter MM has the same shape as in the first embodiment.

The suction portion VN of the suction nozzle VN
1. The suction area VA is moved to the center of the semiconductor chip CH and the vicinity of the outer periphery of the tape carrier substrate 2 as shown in FIG. Are fixed by adsorption.

As shown in FIG. 11, the semiconductor device 1a sucked and fixed by the suction nozzle VN is conveyed to the printed wiring board P, mounted at a predetermined position on the printed wiring board P, and has outer leads 11b of the semiconductor device 1a.
And the land formed on the printed wiring board P are polymerized.

At the time of mounting, the vicinity of the outer peripheral portion of the tape carrier substrate 2 of the semiconductor device 1 is fixed by the suction by the suction region VA.
Are mounted on the printed wiring board P while correcting the warpage of the tape carrier board 2. Then, the printed wiring board P on which the semiconductor device 1a and the like are mounted is reflowed and soldered as shown in FIG.

Thus, according to the present embodiment, the semiconductor device 1 is securely mounted on the printed wiring board P while maintaining the flatness by correcting the warpage of the tape carrier substrate 2 of the semiconductor device 1a by the suction nozzle VN. Therefore, the manufacturing yield and the connection reliability at the time of mounting the semiconductor device 1a can be greatly improved.

As described above, the invention made by the inventor has been specifically described based on the embodiments of the invention. However, the invention is not limited to the above embodiments, and various modifications may be made without departing from the gist of the invention. Needless to say, it can be changed.

In the first and second embodiments, the suction area VA of the suction nozzle VN has a shape in which the vicinity of the outer periphery of four sides of the tape carrier substrate 2 of the semiconductor device 1 is fixed by suction. The shape of the VA may be any shape that can correct the warpage of the tape carrier substrate 2 when the tape carrier substrate 2 is attracted and maintain the flatness.

For example, as shown in FIG. 13, the suction area VA of the suction nozzle VN has a shape in which only two opposing sides of the tape carrier substrate are suction-fixed, and FIG.
As shown in (1), even if the tape carrier substrate has a shape in which the four corners are suction-fixed, it is possible to correct the warpage of the tape carrier substrate and securely mount the tape carrier substrate on the printed wiring board while maintaining the flatness.

[0048]

Advantageous effects obtained by typical ones of the inventions disclosed by the present application will be briefly described as follows.
It is as follows.

(1) According to the present invention, the semiconductor device can be mounted on the printed wiring board while correcting the warpage of the tape carrier substrate and maintaining the flatness, so that the connection reliability can be greatly improved. .

(2) Further, in the present invention, a reinforcing material for maintaining the flatness of the tape carrier substrate provided in the CSP semiconductor device is not required, so that the cost of the semiconductor device can be reduced.

(3) Further, in the present invention, the production yield at the time of mounting the semiconductor device can be improved, and the quality of the product can be improved.

[Brief description of the drawings]

FIG. 1 is a sectional view of a semiconductor device mounted on a printed wiring board according to a first embodiment of the present invention.

FIG. 2 is a plan view of the semiconductor device mounted on the printed wiring board according to the first embodiment of the present invention;

FIG. 3 is a configuration explanatory diagram of the mounter device according to the first embodiment of the present invention.

FIG. 4A is an external perspective view of a suction nozzle provided in the mounter device according to Embodiment 1 of the present invention, and FIG.
FIG. 3 is a plan view of the suction nozzle.

FIG. 5 is an explanatory diagram of a mounting step of the semiconductor device according to the first embodiment of the present invention;

FIG. 6 is an explanatory view of the mounting step of the semiconductor device following FIG. 5;

FIG. 7 is an explanatory diagram of the mounting step of the semiconductor device following FIG. 6;

FIG. 8 is a flowchart of a mounting process of the semiconductor device according to the first embodiment of the present invention;

FIG. 9 is a sectional view of a semiconductor device mounted on a printed wiring board according to Embodiment 2 of the present invention;

FIG. 10 is an explanatory diagram of a mounting step of the semiconductor device according to the second embodiment of the present invention;

FIG. 11 is an explanatory view of the mounting step of the semiconductor device following FIG. 10;

FIG. 12 is an explanatory diagram of the mounting step of the semiconductor device following FIG. 11;

FIG. 13 is a plan view showing an example of a suction nozzle provided in a mounter device according to another embodiment of the present invention.

FIG. 14 is a plan view showing another example of a suction nozzle provided in a mounter device according to another embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1, 1a Semiconductor device 2 Tape carrier board 2a Insulation tape film 3 Wiring lead 3a Inner lead 4 Device hole 5 Resin 6 Board electrode 7 Solder resist 8 Bump (external terminal) 9 Tape carrier board 10 Film 11 Wiring 11a Inner lead 11b Outer lead ( External terminals) 12 Resin MM Mounter device VN suction nozzle VN1 suction part VA suction area CH semiconductor chip BP bonding pad P printed wiring board HP solder paste

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 5E313 AA03 AA11 AA12 CC03 EE24 EE50 5E319 AA03 AC01 BB05 CC48 GG15 GG20

Claims (3)

[Claims] A step of preparing a semiconductor device having a semiconductor chip mounted on a surface of a tape carrier substrate; and a step of preparing a printed wiring board having solder paste applied to electrode portions corresponding to external terminals of the semiconductor device to be mounted. Preparing, correcting the warpage of the tape carrier substrate by suction-fixing the four corners of the center portion of the semiconductor chip and the tape carrier substrate, and transporting the semiconductor device while maintaining flatness; A method of mounting a semiconductor device, comprising: a step of mounting on the printed wiring board; and a step of reflowing and soldering the printed wiring board on which the semiconductor device is mounted. 2. A step of preparing a semiconductor device having a semiconductor chip mounted on a surface of a tape carrier substrate, and a step of preparing a printed wiring board having a solder paste applied to electrode portions corresponding to external terminals of the semiconductor device to be mounted. A step of preparing; and correcting the warpage of the tape carrier substrate by suction-fixing a central portion of the semiconductor chip and a peripheral portion of at least two opposite sides of the tape carrier substrate, and maintaining the flatness. And mounting the semiconductor device on the printed wiring board; and reflowing and soldering the printed wiring board on which the semiconductor device is mounted. A step of preparing a semiconductor device having a semiconductor chip mounted on a surface of a tape carrier substrate; and a step of preparing a printed wiring board having solder paste applied to electrode portions corresponding to external terminals of the semiconductor device to be mounted. Preparing, correcting the warpage of the tape carrier substrate by suction-fixing the central portion of the semiconductor chip, and four sides of the tape carrier substrate, transporting the semiconductor device while maintaining flatness, and performing the printing. A method of mounting a semiconductor device, comprising: a step of mounting on a wiring board; and a step of reflowing and soldering a printed wiring board on which the semiconductor device is mounted.