CN105870043A - Device for preventing lead frame from warping - Google Patents
Device for preventing lead frame from warping Download PDFInfo
- Publication number
- CN105870043A CN105870043A CN201610429636.7A CN201610429636A CN105870043A CN 105870043 A CN105870043 A CN 105870043A CN 201610429636 A CN201610429636 A CN 201610429636A CN 105870043 A CN105870043 A CN 105870043A
- Authority
- CN
- China
- Prior art keywords
- lead frame
- unit
- preventing
- heating
- accommodating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
The invention discloses a device for preventing a lead frame from warping. The device comprises a circuit unit, a heating unit and an accommodating unit, wherein the circuit unit comprises a temperature setting module and an electrification switch circuit module; the heating unit comprises a heating device; the accommodating unit is used for accommodating the lead frame; the circuit unit is connected with the heating unit; the accommodating unit is arranged on the heating unit. The device has the advantages of small size, simple structure, delicate design, easiness in operation, low cost and the like. By adopting the device, a series of deviations generated in subsequent operation are reduced, the quality defects of finial packaged products are overcome, and defective products are reduced.
Description
Technical field
The present invention relates to semiconductor applications, particularly to a kind of for preventing the device of lead frame warpage.
Background technology
Lead frame, as the chip carrier of integrated circuit, is that one realizes chip by means of bonding material
Internal circuit exit and the electric connection of outer lead, form the key structure part of conductive loops, be collection
Become the basic material that circuit industry is important.Lead frame is generally in square bar shaped, and its up or down is provided with some
The identical lead frame unit of array arrangement.
Plastic packaging is to utilize epoxy molding compound that the matrix completing wire bonding is carried out injection molding encapsulating, real
The mechanical protection of existing packaging body.During epoxy molding compound thawing is re-solidified, lead frame
Warpage in various degree would generally be formed by thermal stress effect, cause the out-of-flatness of base plate for packaging, therefore,
Subsequent job can produce a series of deviation, causes the mass defect of final encapsulating products, produces bad
Product.
Summary of the invention
The present invention provides a kind of device for preventing lead frame warpage, to solve of the prior art drawing
Wire frame owing to being caused the irregular problem of base plate for packaging by thermal stress effect, it is to avoid finally encapsulates product
The mass defect of product.
Technical scheme is as follows:
A kind of for preventing the device of lead frame warpage, including circuit unit, heating unit and accommodating list
Unit, described circuit unit includes that temperature arranges module and power-on switch circuit module, described heating list
Unit includes heater, and described accommodating unit is for accommodating described lead frame；
Described circuit unit is connected with heating unit, and described accommodating unit is arranged on described heating
Above unit.
The most preferably, described heating unit is arranged on above described circuit unit.
The most preferably, described heater is heating rod.
The most preferably, it is digital display screen that described temperature arranges module, is used for arranging temperature, showing
Show the temperature of setting and currently practical temperature.
The most preferably, described accommodating unit includes basal plane, is arranged on the both sides of described basal plane both sides
Beam, it is positioned at two and half grooves bottom two curb girders.
The most preferably, the distance between two half described grooves is more than the short of described lead frame
The length on limit.
The most preferably, the distance between two half described grooves is 3-5mm.
The most preferably, described accommodating unit also includes being arranged on described basal plane rear end and with described two
The end wall that curb girder is connected.
Compared with prior art, beneficial effects of the present invention is as follows:
The a kind of of the present invention has volume little for preventing the device of lead frame warpage, simple in construction,
Deft design, easily operates, low cost and other advantages, according to the actual needs design temperature, accommodating unit
Under the effect of heater so that the epoxy molding compound deliquescing on lead frame, then by deliquescing
Lead frame take out, and compressed with two pieces of cast iron casting pressing plates, flattened under pressure, from
And reduce the warpage of leadframe strip, therefore, The present invention reduces a series of of subsequent job generation
Deviation, it is to avoid the mass defect of final encapsulating products, decreases the appearance of defective products.
Certainly, the arbitrary product implementing the present invention it is not absolutely required to reach all the above excellent simultaneously
Point.
Accompanying drawing explanation
Fig. 1 is a kind of for preventing the structural representation of the device of lead frame warpage of the present invention；
Fig. 2 is a kind of for preventing the A-A ' of the accommodating unit of the device of lead frame warpage of the present invention
Sectional view.
Detailed description of the invention
Below in conjunction with specific embodiment, the present invention is expanded on further.It should be understood that these embodiments are only used
In the explanation present invention, rather than limit protection scope of the present invention.Art technology in actual applications
Improvement that personnel make according to the present invention and adjustment, still fall within protection scope of the present invention.
In order to better illustrate the present invention, below with accompanying drawing, the present invention is described in detail.
As shown in Figure 1 a kind of for preventing the device of lead frame warpage, including circuit unit 1, heating
Unit 2 and accommodating unit 3, described circuit unit 1 controls, including temperature for the circuit realizing device
Arranging module 4 and power-on switch circuit module (not indicating in figure), described heating unit 2 includes heating
Device (does not indicates in figure), and described accommodating unit 3 is for accommodating described lead frame；Described electricity
Road unit 1 is connected with heating unit 2, concrete, and described heating unit 2 is arranged on described electricity
Above road unit 1, described accommodating unit 3 is arranged on above described heating unit 2.This
Bright is a kind of for preventing the device of lead frame warpage, and the exterior material of device is metal material, can
Think ferrum.
Described heater (not indicating in figure) is heating rod.
It is digital display screen that described temperature arranges module 4, for showing that the temperature of setting, display set
Temperature and currently practical temperature.
As in figure 2 it is shown, described accommodating unit 3 includes basal plane 7, is arranged on the two of described basal plane 7 both sides
Curb girder 6 and be positioned at two and half grooves 8 bottom two curb girders 6.Described accommodating unit 3 also includes being arranged on
Described basal plane 7 rear end the end wall 9 being connected with described two curb girders 6.
Distance between two half described grooves 8 is more than the length of the minor face of described lead frame.
Distance between two half described grooves 8 is 3-5mm.
During use, power interface 5 is energized, by rectangular lead frame along the depression of described curb girder 6
Pushing in described accommodating unit 3, set certain temperature according to actual needs, accommodating unit 3 is adding
Under the effect of thermal, the temperature of basal plane 7 is raised so that the epoxy resin on lead frame inserted
Plastic packaging material deliquescing, then takes out the lead frame of deliquescing, finally (does not marks in figure with two pieces of cast iron casting pressing plates
Show) compressed, flattened under pressure, thus reduced the warpage of leadframe strip.
Present invention disclosed above preferred embodiment is only intended to help to illustrate the present invention.Preferred embodiment is also
There is no all of details of detailed descriptionthe, be not intended to the detailed description of the invention that this invention is only described yet.Obviously,
According to the content of this specification, can make many modifications and variations.This specification is chosen and specifically describes this
A little embodiments, are to preferably explain the principle of the present invention and actual application, so that affiliated technology neck
Field technique personnel can be best understood by and utilize the present invention.The present invention is only by claims and whole model thereof
Enclose the restriction with equivalent.
Claims (8)
1. the device being used for preventing lead frame warpage, it is characterised in that include that circuit unit, heating are single
Unit and accommodating unit, described circuit unit includes that temperature arranges module and power-on switch circuit module,
Described heating unit includes heater, and described accommodating unit is for accommodating described lead frame；
Described circuit unit is connected with heating unit, and described accommodating unit is arranged on described heating list
Above Yuan.
It is the most according to claim 1 a kind of for preventing the device of lead frame warpage, it is characterised in that
Described heating unit is arranged on above described circuit unit.
It is the most according to claim 1 a kind of for preventing the device of lead frame warpage, it is characterised in that
Described heater is heating rod.
It is the most according to claim 1 a kind of for preventing the device of lead frame warpage, it is characterised in that
It is digital display screen that described temperature arranges module.
It is the most according to claim 1 a kind of for preventing the device of lead frame warpage, it is characterised in that
Described accommodating unit includes basal plane, two curb girders being arranged on described basal plane both sides and is positioned at two curb girders
Two and half grooves of bottom.
It is the most according to claim 5 a kind of for preventing the device of lead frame warpage, it is characterised in that
Distance between two half described grooves is more than the length of the minor face of described lead frame.
7. a kind of for preventing the device of lead frame warpage according to described in claim 5 or 6, its feature exists
In, the distance between two half described grooves is 3-5mm.
It is the most according to claim 5 a kind of for preventing the device of lead frame warpage, it is characterised in that
Described accommodating unit also includes the end being arranged on described basal plane rear end and being connected with described two curb girders
Wall.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610429636.7A CN105870043A (en) | 2016-06-16 | 2016-06-16 | Device for preventing lead frame from warping |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610429636.7A CN105870043A (en) | 2016-06-16 | 2016-06-16 | Device for preventing lead frame from warping |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105870043A true CN105870043A (en) | 2016-08-17 |
Family
ID=56649771
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610429636.7A Pending CN105870043A (en) | 2016-06-16 | 2016-06-16 | Device for preventing lead frame from warping |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105870043A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6013541A (en) * | 1996-06-20 | 2000-01-11 | Advanced Systems Automation Limited | Method and apparatus for reducing warpage in semiconductor packages |
| US20100096735A1 (en) * | 2006-12-21 | 2010-04-22 | Rokko Technology Pte Ltd. | Clamping assembly |
| CN102853940A (en) * | 2012-09-07 | 2013-01-02 | 顺德工业(江苏)有限公司 | High-temperature tester for lead frame |
| KR20150087937A (en) * | 2014-01-23 | 2015-07-31 | 아메스산업(주) | Assembly and transfer apparatus of substrate zig for solder reflow |
| CN205723470U (en) * | 2016-06-16 | 2016-11-23 | 苏州工业职业技术学院 | A kind of for preventing the device of lead frame warpage |
-
2016
- 2016-06-16 CN CN201610429636.7A patent/CN105870043A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6013541A (en) * | 1996-06-20 | 2000-01-11 | Advanced Systems Automation Limited | Method and apparatus for reducing warpage in semiconductor packages |
| US20100096735A1 (en) * | 2006-12-21 | 2010-04-22 | Rokko Technology Pte Ltd. | Clamping assembly |
| CN102853940A (en) * | 2012-09-07 | 2013-01-02 | 顺德工业(江苏)有限公司 | High-temperature tester for lead frame |
| KR20150087937A (en) * | 2014-01-23 | 2015-07-31 | 아메스산업(주) | Assembly and transfer apparatus of substrate zig for solder reflow |
| CN205723470U (en) * | 2016-06-16 | 2016-11-23 | 苏州工业职业技术学院 | A kind of for preventing the device of lead frame warpage |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20160817 |
|
| WD01 | Invention patent application deemed withdrawn after publication |