CN103398797B - Thermistor temperature sensor and preparation method thereof - Google Patents
Thermistor temperature sensor and preparation method thereof Download PDFInfo
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- CN103398797B CN103398797B CN201310360235.7A CN201310360235A CN103398797B CN 103398797 B CN103398797 B CN 103398797B CN 201310360235 A CN201310360235 A CN 201310360235A CN 103398797 B CN103398797 B CN 103398797B
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Abstract
The invention belongs to heat sensitive chip product technical field, concrete open a kind of thermistor temperature sensor and preparation method thereof.This thermistor temperature sensor, including LED support, the head side of described LED support is provided with recess, fix heat sensitive chip after this recess is by elargol gluing and solidifying, being connected with electrode wires between above the opposite side of described heat sensitive chip and LED support head, the head of described LED support, the periphery of heat sensitive chip are coated with epoxy resin enclosed housing.The preparation method of this thermistor temperature sensor, is to be connected to electrode wires in heat sensitive chip by bonding method.This thermistor temperature sensor automaticity is high, and good product consistency, packaging effect is good, can effectively meet the reliability of product, sealing, the demand of the properties such as quick response.
Description
Technical field
The invention belongs to heat sensitive chip product technical field, particularly to a kind of thermistor temperature sensor and making thereof
Method.
Background technology
With the development of electronic technology, electronic devices and components will be towards high-performance, miniaturization, chip type, the side of filming
To development.Electronic devices and components pin standardized designs there is incomparable superiority: ultrahigh in efficiency easy for installation, electrode exists
In epoxy packages layer-reliability is higher.
At present, by heat sensitive chip as core component, thermistor and the TEMP of different packing forms composition are taked
Device is widely used in various temperature sensing, temperature-compensating, temperature-control circuit, and it plays in circuit by the variables transformations of temperature
Become the central role of required electronic signal.
By the extensive application of thermistor, for meeting the market demand, this requires that producer need to carry out mass, standard metaplasia
Produce thermistor, do not require nothing more than thermistor high accuracy, highly reliable, quickly respond, also simultaneously require height protection, i.e. improve encapsulation
Sealing.
In prior art, the preparation method of thermistor is as follows: as it is shown in figure 1,
1st, heat sensitive chip 1 ' is prepared；
2nd, by heat sensitive chip 1 after tin stove wicking welding lead 2 '；
3rd, it is placed in the heat sensitive chip 1 ' of welding lead 2 ' in epoxy encapsulation groove, epoxy resin enclosed to be formed
Layer 3'；
4th, in oil groove, the test that heat sensitive chip 1 carries out the electric parameters such as resistance is carried out.
There is following weak point in the thermistor that the preparation method of above-mentioned prior art is made:
Firstth, easy failure welding: with two lead-in wire clamp heat sensitive chip put into wicking in tin stove when, because of the difference of tin furnace temperature
With the difference of wicking time, and the difference of tin quality, can cause and connect tin at heat sensitive chip position, form short circuit, directly produce
Performance is bad；
Secondth, easily encapsulation is bad: be to be stained with the heat sensitive chip 1 ' after welding lead in epoxy encapsulation groove during encapsulation
Upper epoxy resin, then solidify with certain condition of cure.Because during welding, heat sensitive chip 1 ' can tilt, or epoxy resin glues
The difference of denseness, causes encapsulating product packaging head size dimension out uneven, inconsistent so that product packaging effect difference,
The qualification rate of product is substantially reduced.
Content of the invention
It is an object of the invention to overcome the deficiencies in the prior art, concrete open a kind of thermistor temperature sensor and system thereof
Making method, this thermistor temperature sensor automaticity is high, and good product consistency, packaging effect is good, can effectively meet
The reliability of product, sealing, the demand of the properties such as quick response.
In order to overcome above-mentioned technical purpose, the present invention is realized by techniques below scheme:
A kind of thermistor temperature sensor of the present invention, including LED support, the head side of described LED support
Being provided with recess, fixing heat sensitive chip after this recess is by elargol gluing and solidifying, described heat sensitive chip is another with LED support head
Being connected with electrode wires between above side, the head of described LED support, the periphery of heat sensitive chip are coated with epoxy resin enclosed shell
Body.
The invention also discloses the preparation method of a kind of thermistor temperature sensor, it comprises the concrete steps that:
(1) prepare heat sensitive chip and LED support is stand-by；
(2) on LED support, heat sensitive chip is fixed；
(3) it is connected to electrode wires in heat sensitive chip by bonding method；
(4) heat sensitive chip after bonding, the head of LED support, electrode wires are packaged by epoxy resin；
(5) solidifying: certain condition of cure makes epoxy resin fully solidify, raising epoxy resin is bonding strong with support
Degree, to protect heat sensitive chip, the condition of cure of this solidification process specifically: first carry out the solidification of 2 hours at 100 DEG C, then again
Continue at 120 DEG C, carry out the solidification of 4 hours.
(6) rib cutting: use rib cutting to cut off company's muscle of LED support, in order to test the performance of single thermistor；
(7) test, inspection: the performance parameter of test thermistor, inspection appearance and size, simultaneously according to customer requirement to heat
Quick resistance sorts.
As the improvement further of above-mentioned technology, in above-mentioned steps (1), the preparation of heat sensitive chip and LED support includes
Following steps:
A. some heat sensitive chip are arranged and be positioned on the heat sensitive chip support plate posting stickiness pad pasting；
B. heat sensitive chip is checked: whether have mechanical damage and pit pockmark by microscopy inspection heat sensitive chip surface；Electrode
Whether pattern is complete, and whether measurement chip size and electrode size meet technological requirement；
C. use Ultrasonic Cleaning LED support, and dry；
D. spread sheet, uses spread sheet machine or the manual mode expanded to expand the stickiness pad pasting cohering chip, makes temperature-sensitive
The spacing of chip strengthens.
As the improvement further of above-mentioned technology, described in above-mentioned steps (2), on LED support, fix heat sensitive chip bag
Include:
A. automatic dispensing machine elargol on the recess point that the head side of LED support is provided with is used；
B. using automatic assembling machine to pick up heat sensitive chip from chip support plate, correspondence is attached to elargol on LED support point
Position；
C. solidify: solidification makes elargol solidify, fixing heat sensitive chip.Concrete condition of cure is: the temperature control of elargol solidification
Make at 150 DEG C～160 DEG C, 2 hours hardening times.
In the present invention, the described bonding method of above-mentioned steps (3) is for using aluminium wire pressure welding method or gold wire ball welding method by electrode wires
It is connected in heat sensitive chip carry out bonding, and increase ultrasonic energy realizes heat sensitive chip and electrode wires on the basis of hot pressing
The process connecting between framework.
The first, described aluminium wire pressure welding method comprises the following steps:
First, one end of aluminium wire is pressed on heat sensitive chip electrode position the first point；
Then, aluminium wire is moved to, above the opposite side of corresponding LED support head, after pressing second point, pull apart aluminium wire.
The second, described gold wire ball welding method comprises the following steps:
First, a spherical solder joint is burnt in heat sensitive chip electrode position；
Then, one end of spun gold is pressed on the spherical solder joint of this heat sensitive chip electrode position the first point；
Finally, then by spun gold move the opposite side top position of corresponding LED support head to, after pressing second point, pull apart gold
Silk.
Compared with prior art, the invention has the beneficial effects as follows:
(1) the thermistor profile of the present invention can reach uniform, consistent, can obtain easily than prior art making
Thermistor more preferably standard profile, has wide variety of prospect；
(2) thermistor preparation method of the present invention standardization, major part operation uses automation equipment to produce, behaviour
It is convenient to make, and can reduce human factor and cause product bad；
(3) present invention uses automation equipment bonding lead, can be with the minute sized heat sensitive chip of bonding, to meet temperature-sensitive
The demand that resistance quickly responds；
(4) present invention uses automation equipment bonding lead, can efficiently reduce the generation of failure welding phenomenon, effectively
Ground guarantees the quality of thermistor temperature sensor；
(4) present invention uses automation equipment encapsulation thermistor, can avoid encapsulating bad, reach profile uniformly, consistent,
Improve sealing, the water proofing property of product.
Brief description
With specific embodiment, the present invention is described in detail below in conjunction with the accompanying drawings:
Fig. 1 a-1d is the preparation method schematic diagram of thermistor in prior art；
Fig. 2 is thermistor temperature sensor structural representation of the present invention；
Fig. 3 a-Fig. 3 g is thermistor Making programme structural representation of the present invention.
Detailed description of the invention
As in figure 2 it is shown, a kind of thermistor temperature sensor of the present invention, including LED support 1, described LED support
The head side 11 of 1 is provided with recess 111, fixes heat sensitive chip 3, described temperature-sensitive after this recess 11 is by elargol 2 gluing and solidifying
It is connected with electrode wires 4, the head of described LED support 1, temperature-sensitive core between above the opposite side 12 of chip 3 and LED support 1 head
The periphery of piece 3 is coated with epoxy resin enclosed housing 5.
The preparation method of detailed description below thermistor temperature sensor of the present invention, as shown in figure Fig. 3 a-Fig. 3 g,
It comprises the concrete steps that:
(1) prepare heat sensitive chip and LED support be stand-by, specifically:
A. as shown in Figure 3 a, it some heat sensitive chip 3 are arranged is positioned over the heat sensitive chip support plate 7 posting stickiness pad pasting 6
On；
B. as shown in Figure 3 a, heat sensitive chip 3 is checked: whether have mechanical damage and fiber crops by microscopy inspection heat sensitive chip surface
Point pockmark, whether electrode pattern is complete, and whether size and the electrode size of measurement heat sensitive chip 3 meet technological requirement；
C. as shown in Figure 3 b, use Ultrasonic Cleaning LED support 1, and dry；
D. as shown in Figure 3 c, spread sheet: use spread sheet machine or the manual mode expanded to the stickiness pad pasting cohering heat sensitive chip 3
6 expand, and make the spacing of heat sensitive chip 3 strengthen.
(2) on LED support 1, heat sensitive chip 3 is fixed, specifically:
A. as shown in Figure 3 d, use automatic dispensing machine LED support 1 head side 11 recess 111 on elargol 2；
B. using automatic assembling machine to pick up heat sensitive chip 3 from chip support plate 7, correspondence is attached to the upper silver of LED support 1
The position of glue 2；
C. as shown in Figure 3 e, solidify: solidification makes elargol 2 solidify, fixing heat sensitive chip 3.
The temperature of described elargol solidification controls at 150 DEG C～160 DEG C, 2 hours hardening times.Curing oven must not do it again
His purposes use, prevents from polluting.
(3) as illustrated in figure 3f, being connected in heat sensitive chip 4 by bonding method by electrode wires 4, this bonding method specifically can be adopted
By aluminium wire pressure welding method or gold wire ball welding method, electrode wires is connected to carry out in heat sensitive chip bonding, and increases on the basis of hot pressing
Add ultrasonic energy to realize the process connecting between heat sensitive chip and electrode wires framework.
Wherein, the first, described aluminium wire pressure welding method comprises the following steps:
First, one end of aluminium wire (being electrode wires 4) is pressed the first point on heat sensitive chip 3 electrode position；
Then, aluminium wire is moved to above the opposite side 12 of corresponding LED support 1 head；
Finally, aluminium wire is pulled apart after pressing second point.
Or, using the mode of the second gold wire ball welding method, described gold wire ball welding method comprises the following steps:
First, a spherical solder joint is burnt in heat sensitive chip 3 electrode position；
Then, one end of spun gold (being electrode wires 4) is pressed first on the spherical solder joint of this heat sensitive chip 3 electrode position
Point；
Finally, then by spun gold move opposite side 12 top position of corresponding LED support 1 head to, pull after pressing second point
Disconnected spun gold, pressure welding is the key link in LED encapsulation technology, and in technique, main needs monitoring is pressure welding spun gold looping shape,
Solder joint shape, pulling force.
(4) as shown in figure 3g, head, the electrode wires 4 of heat sensitive chip the 3rd, the LED support 1 after above-mentioned bonding is passed through
Epoxy resin is packaged an epoxy resin enclosed housing 5 of formation.The packaged type of thermistor mainly has a glue, embedding, mould
Pressing three kinds, wherein using embedding mode to encapsulate, the process of its embedding is first to inject liquid epoxy in thermistor shaping mold cavity
Resin, is inserted into the LED support 1 of the good heat sensitive chip 3 of bonding, put into baking oven by epoxy resin cure (seeing below step 5) after,
Again heat sensitive chip 3 is deviate from from die cavity and be i.e. molded.
(5) solidify: certain condition of cure makes epoxy resin fully solidify, improve epoxy resin bonding with LED support 1
Intensity, to protect heat sensitive chip 3.Its condition of cure is specifically: first carries out the solidification of 2 hours at 100 DEG C, is then further continued for
120 DEG C of solidifications carrying out 4 hours.It can allow epoxy resin fully solidify, and carries out heat ageing to LED support simultaneously, and effectively carries
High epoxy and the adhesive strength of LED support.
(6) rib cutting: use rib cutting to cut off company's muscle of LED support 1, in order to test the performance of single thermistor 10；
(7) test, inspection: the performance parameter of test thermistor 10, inspection appearance and size, simultaneously according to customer requirement pair
Thermistor sorts.
The invention is not limited in above-mentioned embodiment, every various change to the present invention or modification are without departing from the present invention
Spirit and scope, if these are changed and within the scope of modification belongs to claim and the equivalent technologies of the present invention, then this
Bright also implying that comprises these changes and modification.
Claims (6)
1. a thermistor temperature sensor, it is characterised in that: including LED support, the head side of described LED support is provided with
Recess, fixes heat sensitive chip, the opposite side of described heat sensitive chip and LED support head after this recess is by elargol gluing and solidifying
Being connected with electrode wires between Shang Fang, the head of described LED support, the periphery of heat sensitive chip are coated with epoxy resin enclosed housing.
2. a preparation method for thermistor temperature sensor according to claim 1, it comprises the concrete steps that:
(1) prepare heat sensitive chip and LED support be stand-by:
A. some heat sensitive chip are arranged and be positioned on the heat sensitive chip support plate posting stickiness pad pasting；
B. heat sensitive chip is checked: whether have mechanical damage and pit pockmark by microscopy inspection heat sensitive chip surface；Electrode pattern
Whether complete, and whether measurement chip size and electrode size meet technological requirement；
C. use Ultrasonic Cleaning LED support, and dry；
D. spread sheet, uses spread sheet machine or the manual mode expanded to expand the stickiness pad pasting cohering chip, makes heat sensitive chip
Spacing strengthen；
(2) on LED support, fix the recess that heat sensitive chip: a. uses automatic dispensing machine to be provided with in the head side of LED support
Elargol on point；
B. using automatic assembling machine to pick up heat sensitive chip from chip support plate, correspondence is attached to the position of elargol on LED support point
Put；
C. solidify: make elargol solidify, fixing heat sensitive chip；
(3) being connected in heat sensitive chip by bonding method by electrode wires, described bonding method uses aluminium wire pressure welding method or gold wire ball
Electrode wires is connected in heat sensitive chip carry out bonding by welding method, and increase ultrasonic energy realizes temperature-sensitive on the basis of hot pressing
The process connecting between chip and electrode wires framework；
(4) heat sensitive chip after bonding, the head of LED support, electrode wires are packaged by epoxy resin；
(5) solidify: certain condition of cure makes epoxy resin fully solidify, improve the adhesive strength of epoxy resin and support, with
Protection heat sensitive chip；
(6) rib cutting: use rib cutting to cut off company's muscle of LED support, in order to test the performance of single thermistor；
(7) test, inspection: the performance parameter of test thermistor, inspection appearance and size, simultaneously according to customer requirement to temperature-sensitive electricity
Resistance sorts.
3. the preparation method of thermistor temperature sensor according to claim 2, it is characterised in that:
Described aluminium wire pressure welding method comprises the following steps:
First, one end of aluminium wire is pressed on heat sensitive chip electrode position the first point；
Then, aluminium wire is moved to, above the opposite side of corresponding LED support head, after pressing second point, pull apart aluminium wire.
4. the preparation method of thermistor temperature sensor according to claim 2, it is characterised in that:
Described gold wire ball welding method comprises the following steps:
First, a spherical solder joint is burnt in heat sensitive chip electrode position；
Then, one end of spun gold is pressed on the spherical solder joint of this heat sensitive chip electrode position the first point；
Finally, then by spun gold move the opposite side top position of corresponding LED support head to, after pressing second point, pull apart spun gold.
5. the preparation method of thermistor temperature sensor according to claim 2, it is characterised in that: described step (5)
In condition of cure specifically: first carry out the solidification of 2 hours at 100 DEG C, be then further continued for carrying out at 120 DEG C the solidification of 4 hours.
6. the preparation method of thermistor temperature sensor according to claim 2, it is characterised in that:
In the c step of described step (2), concrete condition of cure is: the temperature of elargol solidification controls at 150 DEG C～160 DEG C, solidification
Time 2 h.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201310360235.7A CN103398797B (en) | 2013-08-16 | 2013-08-16 | Thermistor temperature sensor and preparation method thereof |
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| CN201310360235.7A CN103398797B (en) | 2013-08-16 | 2013-08-16 | Thermistor temperature sensor and preparation method thereof |
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| CN103398797A CN103398797A (en) | 2013-11-20 |
| CN103398797B true CN103398797B (en) | 2016-11-09 |
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| DE102016108604A1 (en) * | 2016-05-10 | 2017-11-16 | Epcos Ag | Multi-layer component and method for producing a multilayer component |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101237017A (en) * | 2008-02-29 | 2008-08-06 | 晶能光电（江西）有限公司 | LED supporter processing method for LED nude core test |
| CN101532610A (en) * | 2009-04-17 | 2009-09-16 | 宋国兴 | High-power LED lamp and production process thereof |
| CN102869966A (en) * | 2010-04-28 | 2013-01-09 | 株式会社电装 | Temperature sensor comprising temperature sensing element |
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2013
- 2013-08-16 CN CN201310360235.7A patent/CN103398797B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101237017A (en) * | 2008-02-29 | 2008-08-06 | 晶能光电（江西）有限公司 | LED supporter processing method for LED nude core test |
| CN101532610A (en) * | 2009-04-17 | 2009-09-16 | 宋国兴 | High-power LED lamp and production process thereof |
| CN102869966A (en) * | 2010-04-28 | 2013-01-09 | 株式会社电装 | Temperature sensor comprising temperature sensing element |
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Address after: 526020 Guangdong Province, Zhaoqing city Duanzhou District Mu Gang Industrial Zone of Tangxia town Applicant after: GUANGDONG AISHENG ELECTRONIC TECHNOLOGY CO., LTD. Address before: 526020 Guangdong Province, Zhaoqing city Duanzhou District Mu Gang Industrial Zone of Tangxia town Applicant before: EXSENSE Electronics Technology Co., Ltd. |
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