CN211555697U - Soft multi-core group ceramic capacitor - Google Patents
Soft multi-core group ceramic capacitor Download PDFInfo
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- CN211555697U CN211555697U CN202020293496.7U CN202020293496U CN211555697U CN 211555697 U CN211555697 U CN 211555697U CN 202020293496 U CN202020293496 U CN 202020293496U CN 211555697 U CN211555697 U CN 211555697U
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- ceramic capacitor
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Abstract
The utility model provides a software multicore group ceramic capacitor, including frame, welding a plurality of ceramic capacitor chip on the frame, coating at the insulating layer on capacitor chip surface, set up at the encapsulation glue film on insulating layer surface and the protective layer of coating on encapsulation glue film surface, the encapsulation glue film is semi-solid state of congealing. The utility model discloses can design welding frame and chip quantity according to customer's demand, the product appearance is richened to reverse design again, shortens the research and development cycle greatly, and volume production fast just has extremely strong shock resistance and environmental suitability.
Description
Technical Field
The utility model relates to a software multicore group ceramic capacitor.
Background
The traditional soft multi-core group ceramic capacitor is generally subjected to die pressing packaging through a packaging die, and the development period of the die pressing packaging die is long (generally 6-12 months), and the cost is high, so that when a chip is designed, a welding frame in the capacitor, the number of ceramic capacitor chips and the arrangement of the chips on the welding frame can be designed only according to the external dimension specification of the existing die pressing packaging die, and thus the defects of single external structure of a product and long design and development period are caused.
SUMMERY OF THE UTILITY MODEL
The utility model aims at prior art not enough, provide a many core groups of software ceramic capacitor, can be according to customer's demand design welded frame and chip quantity, the product appearance is richened to reverse design product appearance again, shortens the research and development cycle greatly, and volume production fast just has extremely strong shock resistance and environmental suitability.
The utility model discloses a following technical scheme realizes:
the utility model provides a software multicore group ceramic capacitor, includes the frame, welds a plurality of ceramic capacitor chips on the frame, coats the insulating layer on capacitor chip surface, sets up the encapsulation glue film on the insulating layer surface and coats the protective layer on encapsulation glue film surface, and the encapsulation glue film is semi-solid state of congealing.
Furthermore, the frame comprises two pins which are oppositely arranged at intervals, two chip bonding pads which are respectively arranged at the upper ends of the two pins and are oppositely and horizontally arranged, two pin bonding pads which are respectively arranged at the lower ends of the two pins and are oppositely and horizontally arranged, and stress holes which are respectively arranged on the two pins, wherein the pins sequentially penetrate out of the insulating layer, the packaging adhesive layer and the protective layer.
Further, the chip bonding pad includes the diaphragm that sets up on the pin and the welding part of setting at the diaphragm tip, and the welding part width is greater than the diaphragm width.
Further, the packaging adhesive comprises silica gel.
Further, the protective layer is made of protective glue.
Further, the insulating layer is made of insulating glue.
The utility model discloses following beneficial effect has:
1. the utility model can design the frame and the ceramic capacitor chip quantity according to the demand of the client, and weld the ceramic capacitor chip patch on the frame, thus obtaining the internal structure of the capacitor, the designer can design the product appearance by using the graphic design software according to the external structure, namely design the corresponding packaging mold, and print out the designed packaging mold by 3D printing technology, then coat the insulating layer on the surface of the welded capacitor chip, the insulating layer has the functions of insulation, moisture protection, corrosion protection and buffering, then put the frame and the ceramic capacitor chip into the packaging mold, and introduce the packaging glue to solidify to form the packaging glue layer, the packaging glue layer is in a semi-solidified state after solidification, has the functions of high temperature resistance, self-healing, moisture protection, corrosion protection, shock resistance and temperature impact resistance, and can be different according to the use occasions of the product, choose the encapsulation that corresponds to glue for use and encapsulate the product, after the product drawing of patterns, at encapsulation glue film surface coating protective layer, the protective layer has insulation, dampproofing, anticorrosion, cushioning effect, play the guard action to the encapsulation glue film, it is visible, the utility model discloses be completely different with the production method of current software multicore group ceramic capacitor, need not to use the compression mold and carry out the mould pressing, but design the optimum encapsulation mould according to actual conditions, and combine 3D printing technique to obtain the encapsulation mould fast, neither receive the restriction of mould, the outward appearance of product has been richened again, still shorten the research and development cycle greatly, and reduce the design degree of difficulty, can quick volume production, and be half solidification state because of the encapsulation glue film, improved the mechanical properties of product, have extremely strong shock resistance and environmental suitability.
2. The utility model discloses a frame has the chip pad be used for welding ceramic capacitor chip, be used for with PCB board welded pin pad and be used for reducing the stress hole of the stress impact of condenser in the product use, both sides all can weld about the chip pad, further improved the utility model discloses a reliability.
Drawings
The present invention will be described in further detail with reference to the accompanying drawings.
Fig. 1 is a schematic structural diagram of the soft multi-core ceramic capacitor of the present invention (a half of the insulating layer, the encapsulating adhesive layer and the protective layer are removed).
Fig. 2 is an exploded view of fig. 1.
11, pins; 12. a transverse plate; 13. welding the part; 14. a pin pad; 15. a stress hole; 2. a ceramic capacitor chip; 3. an insulating layer; 4. packaging the adhesive layer; 5. and a protective layer.
Detailed Description
As shown in fig. 1 and fig. 2, the soft multi-core group ceramic capacitor comprises a frame, four ceramic capacitor chips 2 welded on the frame, an insulating layer 3 coated on the surface of the capacitor chips, a packaging adhesive layer 4 arranged on the surface of the insulating layer 3, and a protective layer 5 coated on the surface of the packaging adhesive layer 4, wherein the frame is provided with two pins 11 arranged at intervals, the pins 11 penetrate out of the insulating layer 3, the packaging adhesive layer 4 and the protective layer 5 in sequence, the packaging adhesive layer 4 is in a semi-solidified state, and the upper side and the lower side of the frame are respectively welded with the two ceramic capacitor chips 2.
The frame further includes two chip pads disposed at the upper ends of the two leads 11 and disposed horizontally opposite to each other, two lead pads 14 disposed at the lower ends of the two leads 11 and disposed horizontally opposite to each other, and stress holes 15 disposed on the two leads 11. The chip bonding pad comprises a transverse plate 12 arranged at the upper end of the pin 11 and a welding part 13 arranged at the end part of the transverse plate 12, wherein the width of the welding part 13 is larger than that of the transverse plate 12, and the width of the transverse plate 12 is the same as that of the pin 11, so that the stress of the pin 11 can be enhanced, and the welding of a ceramic capacitor patch can be more convenient.
In this embodiment, the encapsulation adhesive is a silicone adhesive. The protective layer 5 is made of protective glue. The insulating layer 3 is made of insulating glue.
The production method of the soft multi-core group ceramic capacitor comprises the following steps:
A. welding a plurality of ceramic capacitor chips 2 on the frame;
B. designing a packaging mold according to the welded frame and the structure of the ceramic capacitor chip 2, and printing the packaging mold by a 3D printing technology; the designed packaging die is required to meet the requirement that two pins 11 of the frame can penetrate out of the packaging die during packaging;
C. coating an insulating layer 3 on the surface of the welded capacitor chip;
D. placing the frame and the ceramic capacitor chip 2 processed in the step C into a packaging mold, and introducing packaging glue for curing to form a packaging glue layer 4, wherein the packaging glue layer 4 is in a semi-solidified state;
E. and after demolding, coating a protective layer 5 on the surface of the packaging adhesive layer 4.
The above description is only a preferred embodiment of the present invention, and therefore the scope of the present invention should not be limited thereby, and all equivalent changes and modifications made within the scope of the claims and the specification should be considered within the scope of the present invention.
Claims (6)
1. A soft multi-core group ceramic capacitor is characterized in that: the ceramic capacitor comprises a frame, a plurality of ceramic capacitor chips welded on the frame, an insulating layer coated on the surface of each capacitor chip, a packaging adhesive layer arranged on the surface of the insulating layer and a protective layer coated on the surface of the packaging adhesive layer, wherein the packaging adhesive layer is in a semi-solidified state.
2. The soft multi-core ceramic capacitor as claimed in claim 1, wherein: the frame comprises two pins which are oppositely arranged at intervals, two chip bonding pads which are respectively arranged at the upper ends of the two pins and are oppositely and horizontally arranged, two pin bonding pads which are respectively arranged at the lower ends of the two pins and are oppositely and horizontally arranged, and stress holes which are respectively arranged on the two pins, wherein the pins sequentially penetrate out of the insulating layer, the packaging adhesive layer and the protective layer.
3. The soft multi-core ceramic capacitor as claimed in claim 2, wherein: the chip bonding pad comprises a transverse plate arranged at the upper end of the pin and a welding part arranged at the end part of the transverse plate, and the width of the welding part is larger than that of the transverse plate.
4. A soft multi-core ceramic capacitor as claimed in claim 1, 2 or 3, wherein: the packaging adhesive comprises silica gel.
5. A soft multi-core ceramic capacitor as claimed in claim 1, 2 or 3, wherein: the protective layer is made of protective glue.
6. A soft multi-core ceramic capacitor as claimed in claim 1, 2 or 3, wherein: the insulating layer is made of insulating glue.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020293496.7U CN211555697U (en) | 2020-03-11 | 2020-03-11 | Soft multi-core group ceramic capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020293496.7U CN211555697U (en) | 2020-03-11 | 2020-03-11 | Soft multi-core group ceramic capacitor |
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| Publication Number | Publication Date |
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| CN211555697U true CN211555697U (en) | 2020-09-22 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
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| CN202020293496.7U Active CN211555697U (en) | 2020-03-11 | 2020-03-11 | Soft multi-core group ceramic capacitor |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111243874A (en) * | 2020-03-11 | 2020-06-05 | 福建火炬电子科技股份有限公司 | Soft multi-core-group ceramic capacitor and production method thereof |
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2020
- 2020-03-11 CN CN202020293496.7U patent/CN211555697U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111243874A (en) * | 2020-03-11 | 2020-06-05 | 福建火炬电子科技股份有限公司 | Soft multi-core-group ceramic capacitor and production method thereof |
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