CN101237017A - LED supporter processing method for LED nude core test - Google Patents
LED supporter processing method for LED nude core test Download PDFInfo
- Publication number
- CN101237017A CN101237017A CNA2008100828721A CN200810082872A CN101237017A CN 101237017 A CN101237017 A CN 101237017A CN A2008100828721 A CNA2008100828721 A CN A2008100828721A CN 200810082872 A CN200810082872 A CN 200810082872A CN 101237017 A CN101237017 A CN 101237017A
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- Prior art keywords
- led
- technology
- heart yearn
- test
- support
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Links
- 238000012360 testing method Methods 0.000 title claims abstract description 30
- 238000003672 processing method Methods 0.000 title claims description 6
- 238000005516 engineering process Methods 0.000 claims abstract description 17
- 238000000034 method Methods 0.000 claims abstract description 14
- 239000003822 epoxy resin Substances 0.000 claims abstract description 9
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 9
- 210000003205 muscle Anatomy 0.000 claims description 16
- 239000007787 solid Substances 0.000 claims description 5
- 238000011160 research Methods 0.000 abstract description 5
- 238000012545 processing Methods 0.000 abstract description 3
- 238000004519 manufacturing process Methods 0.000 abstract 2
- 238000009966 trimming Methods 0.000 abstract 2
- 210000002435 tendon Anatomy 0.000 abstract 1
- 238000005520 cutting process Methods 0.000 description 6
- 238000012216 screening Methods 0.000 description 5
- 238000005538 encapsulation Methods 0.000 description 4
- 239000003292 glue Substances 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 230000005622 photoelectricity Effects 0.000 description 2
- 229920000742 Cotton Polymers 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 230000003595 spectral effect Effects 0.000 description 1
- 238000012353 t test Methods 0.000 description 1
Images
Abstract
The invention relates to an LED manufacturing technology which discloses a method for processing an LED rack for an LED bare core test and comprises a die attach and die bonding technology, a reeling and forming technology following the die attach and die bonding technology and a trimming technology; the reeling and forming technology comprises the following steps of: reeling a core wire between an upper rack tendon and a bowl cup, connecting a first electrode-pin with a second electrode-pin of each rack unit by the core wire and connecting the rack units in series, then applying epoxy resin on the core wire for curing and forming; and then carrying out the trimming technology. Compared with the prior art and with regards to the parameters of a LED chip, the LED manufacturing technology can be used to conduct a photoelectric test on an LED light with a bare core; therefore, the related parameters of the LED chip obtained are more accurate, which facilitates the research on LED chips.
Description
Technical field
The present invention relates to the processing technology thereof of LED, particularly relate to the packaging and testing method in the LED processing and making process.
Background technology
Prior art such as China Patent No. are 200620018317, name is called the patent of " the bowl cup structure of led support ".The led support of this technology record comprises two electrode pins of muscle and carrier unit under muscle on the support, the support.Be provided with the bowl cup that is used to place led chip on an electrode pin, muscle connects two electrode pins on the support.
Be similar to the prior art of above-mentioned led support, to the test of LED lamp, be earlier with the LED naked core with the epoxy encapsulation finished product, then finished product is tested.Test can adopt as China Patent No. be 200310115661, name is called the mode that the patent of " improve the measurability of encapsulated integrated circuit and reduce the method and system of testing time " puts down in writing and carries out.
To with above-mentioned led support being the test of the LED lamp that processes of basis, because its test process is to finish after the LED encapsulation, can't test naked core, the relevant parameter of naked core can't be known.To testing the parameter that draws through the naked core after the encapsulation, because the interference of the peripheral epoxy resin of naked core, luminous flux, luminous power, luminous intensity, spatial light intensity distribute, relative spectral power distributes and relevant parameter test value such as colourity and naked core actual value differ bigger.Test mode after led chip is encapsulated like this can not reflect LED naked core true horizon, is unfavorable for the research to the LED naked core.For example, in order to test the testing fatigue of led chip light decay, need to improve the electrical current of chip, can quick aging under the heat of led chip with the epoxy resin of Chip Packaging, thus influenced the integration test result.
Summary of the invention
Technical problem to be solved by this invention is: the led support processing method that provides a kind of LED nude core test to use, this method can be implemented in the photoelectricity test of the LED lamp under the naked core state, to obtain the relevant parameter of led chip more accurately, help the research of led chip.
For solving the problems of the technologies described above, the present invention adopts following technical scheme: the led support processing method that a kind of LED nude core test is used comprises solid brilliant bonding wire craft and cuts muscle technology that setting process winds the line after carrying out described solid brilliant bonding wire craft; Described coiling setting process comprises: between muscle on the support and the bowl cup around on heart yearn, with heart yearn the first electrode pin of carrier unit and the second electrode pin are coupled together and simultaneously each carrier unit to be serially connected, on heart yearn, stamp epoxy resin then, make the heart yearn solidifying and setting; And then cut muscle technology.
Beneficial effect of the present invention is as follows:
Heart yearn through overcuring has certain rigidity, can replace traditional mode of solidifying two electrode pins with epoxy encapsulation.Preliminary screening meet the photoelectric parameter requirement have the led support unit testing product of naked core the time, need to cut off the last rib between two electrode pins of led support unit and cut off being connected between the second electrode pin and the following rib, i.e. a cutting process.Behind a cutting process, the hard heart yearn can make whole string naked core keep original shape and the relation of position each other, the support that to put in order string band naked core again inserts in the suitable testing apparatus and detects screening, and the led support unit of the band naked core that photoelectric parameter is not up to standard is wiped out.And then the led support of satisfactory band naked core is cut into the unit individuality tests.Compared to existing technology, for test led chip parameter, the present invention can carry out the photoelectricity test of LED lamp under the naked core state, and therefore the relevant parameter of the led chip that obtains is more accurate, helps the research of led chip.
Description of drawings
Fig. 1 is the structure diagram that the present invention relates to product.
Fig. 2 is the process chart of the inventive method.
Embodiment
The invention provides the led support processing method that a kind of LED nude core test is used.
The product embodiments structure that the present invention relates to is as follows, referring to shown in Figure 1.A general led support is provided with the carrier unit that 20 (shown in the figure 4, all the other slightly) connect together, and links together by muscle 2 under muscle on the support 1 and the support between the carrier unit.
Single carrier unit mainly by bowl cup 3, the first electrode pin 4 and the second electrode pin 5 that are used for supporting bowl cup 3 constitute.Be equipped with led chip (being naked core) 6 in bowl cup 3, led chip 6 is enclosed in the bowl cup 3 admittedly by epoxy resin.Lead 7 connects the second electrode pin 5 and led chip 6.Muscle 1 couples together a plurality of carrier units on the support, and connects the first electrode pin 4 and the second electrode pin 5.
A heart yearn 8 is wrapped between the first electrode pin 4 and the second electrode pin 5, and all 20 carrier units are serially connected, and heart yearn 8 is located on bowl cup 3 and the support position between the muscle 1.Be coated with the curing glue 9 that is used to solidify heart yearn on the heart yearn 8.Solidify glue and be preferably epoxy resin, also can be the glue class of other materials such as silica gel.Heart yearn 8 is preferably cotton thread.
The technological process of the inventive method is as follows, referring to Fig. 2.
At first solid brilliant bonding wire is about to led chip 6 usefulness elargol and is fixed in the bowl cup 3, solidifies elargol.Lead 7 is welded on the led chip 6 and the second electrode pin 5, the led chip 6 and the second electrode pin 5 are coupled together.
Coiling typing then is about to heart yearn 8 and is entangled between the electrode pin on the carrier unit, and with each carrier unit string together, and then is putting epoxy resin on the heart yearn 8, and the heart yearn that again point is had epoxy resin is the constant temperature cured regularly, makes heart yearn 8 typings.
Again all, Preliminary screening meets the led support unit testing product that have naked core of photoelectric parameter requirement, at this moment, need to cut off the last rib between two electrode pins of led support unit and cut off being connected between the second electrode pin and the following rib, two electrode pins are separated, heart yearn insulate, and does not need cutting, i.e. a cutting process.
Screening again, hard heart yearn 8 can make whole string naked core keep original shape and the relation of position each other, behind a cutting process, the support that will put in order string band naked core again inserts in the suitable testing apparatus and detects screening, and the led support unit of the band naked core that photoelectric parameter is not up to standard is wiped out.
Two cut then, the led support of satisfactory band naked core is carried out two cutting process, be about to that muscle cuts off under the support, the led support unit is cut into single individuality, carry out nude core test again.
The carrier unit tested as sample, can be encapsulated sample as required, continue test then, for the research use.
Identifier declaration among Fig. 1: muscle 2 under muscle 1, the support on the support, bowl cup 3, the first electrode pin 4, the Two electrode pins 5, led chip 6, lead 7, heart yearn 8, curing glue 9.
Claims (1)
1, the led support processing method used of a kind of LED nude core test comprises solid brilliant bonding wire craft and cuts muscle technology, it is characterized in that:
Setting process winds the line after carrying out described solid brilliant bonding wire craft; Described coiling setting process comprises: between muscle on the support and the bowl cup around on heart yearn, with heart yearn the first electrode pin of carrier unit and the second electrode pin are coupled together and simultaneously each carrier unit to be serially connected, on heart yearn, stamp epoxy resin then, make the heart yearn solidifying and setting; And then cut muscle technology.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008100828721A CN101237017B (en) | 2008-02-29 | 2008-02-29 | LED supporter processing method for LED nude core test, LED supporter unit and supporter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008100828721A CN101237017B (en) | 2008-02-29 | 2008-02-29 | LED supporter processing method for LED nude core test, LED supporter unit and supporter |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101237017A true CN101237017A (en) | 2008-08-06 |
| CN101237017B CN101237017B (en) | 2012-02-08 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2008100828721A Active CN101237017B (en) | 2008-02-29 | 2008-02-29 | LED supporter processing method for LED nude core test, LED supporter unit and supporter |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101237017B (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102326090A (en) * | 2009-02-20 | 2012-01-18 | Qmc株式会社 | LED chip testing device |
| CN102683554A (en) * | 2012-05-29 | 2012-09-19 | 惠州鸿晟光电有限公司 | High-light-effect light source module based on known good die (KGD) design technology and chip testability packaging method of high-light-effect light source module |
| CN103398797A (en) * | 2013-08-16 | 2013-11-20 | 肇庆爱晟电子科技有限公司 | Thermal resistor temperature sensor and manufacturing method thereof |
| CN106098913A (en) * | 2016-06-29 | 2016-11-09 | 深圳市源磊科技有限公司 | A kind of improve the white light LEDs trial method than testing efficiency |
| CN106783823A (en) * | 2017-01-03 | 2017-05-31 | 厦门天微电子有限公司 | A kind of LED lamplight electricity composite packaging method |
| CN107359133A (en) * | 2017-07-27 | 2017-11-17 | 重庆平伟实业股份有限公司 | Diode feeding, flatten, rib cutting integrated shaping machine |
| CN112974668A (en) * | 2021-04-27 | 2021-06-18 | 四川明泰电子科技有限公司 | Semiconductor device bar cutting device |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2914333Y (en) * | 2006-03-28 | 2007-06-20 | 一诠精密工业股份有限公司 | Cup structure of LED supporting frame |
| CN201156548Y (en) * | 2008-02-29 | 2008-11-26 | 晶能光电（江西）有限公司 | LED support unit and LED support |
-
2008
- 2008-02-29 CN CN2008100828721A patent/CN101237017B/en active Active
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102326090A (en) * | 2009-02-20 | 2012-01-18 | Qmc株式会社 | LED chip testing device |
| CN102326090B (en) * | 2009-02-20 | 2013-12-11 | Qmc株式会社 | LED chip testing device |
| CN102683554B (en) * | 2012-05-29 | 2016-07-06 | 新疆紫晶光电技术有限公司 | LED light source module and chip measurability method for packing thereof based on KGD design |
| CN102683554A (en) * | 2012-05-29 | 2012-09-19 | 惠州鸿晟光电有限公司 | High-light-effect light source module based on known good die (KGD) design technology and chip testability packaging method of high-light-effect light source module |
| CN103398797B (en) * | 2013-08-16 | 2016-11-09 | 广东爱晟电子科技有限公司 | Thermistor temperature sensor and preparation method thereof |
| CN103398797A (en) * | 2013-08-16 | 2013-11-20 | 肇庆爱晟电子科技有限公司 | Thermal resistor temperature sensor and manufacturing method thereof |
| CN106098913A (en) * | 2016-06-29 | 2016-11-09 | 深圳市源磊科技有限公司 | A kind of improve the white light LEDs trial method than testing efficiency |
| CN106098913B (en) * | 2016-06-29 | 2019-04-02 | 深圳市源磊科技有限公司 | A method of white light LEDs trial is improved than testing efficiency |
| CN106783823A (en) * | 2017-01-03 | 2017-05-31 | 厦门天微电子有限公司 | A kind of LED lamplight electricity composite packaging method |
| CN107359133A (en) * | 2017-07-27 | 2017-11-17 | 重庆平伟实业股份有限公司 | Diode feeding, flatten, rib cutting integrated shaping machine |
| CN107359133B (en) * | 2017-07-27 | 2023-04-14 | 重庆平伟实业股份有限公司 | Diode feeding, flattening, rib cutting and shaping integrated machine |
| CN112974668A (en) * | 2021-04-27 | 2021-06-18 | 四川明泰电子科技有限公司 | Semiconductor device bar cutting device |
| CN112974668B (en) * | 2021-04-27 | 2021-07-23 | 四川明泰电子科技有限公司 | Semiconductor device bar cutting device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101237017B (en) | 2012-02-08 |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Application publication date: 20080806 Assignee: Crystal energy photoelectric (Changzhou) Co., Ltd. Assignor: Lattice Power (Jiangxi) Co., Ltd. Contract record no.: 2012360000083 Denomination of invention: LED supporter processing method for LED nude core test, LED supporter unit and supporter Granted publication date: 20120208 License type: Common License Record date: 20121213 |
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| LICC | Enforcement, change and cancellation of record of contracts on the licence for exploitation of a patent or utility model | ||
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Owner name: JIANGXI LATTICEBRIGHT CORPORATION Free format text: FORMER OWNER: LATTICE POWER (JIANGXI) CORPORATION Effective date: 20140219 |
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Free format text: CORRECT: ADDRESS; FROM: 330029 NANCHANG, JIANGXI PROVINCE TO: 330096 NANCHANG, JIANGXI PROVINCE |
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Effective date of registration: 20140219 Address after: 330096 main building, No. 699, No. 101 North Sihu Road, Nanchang hi tech Zone, Jiangxi Patentee after: Jiangxi Latticebright Corporation Address before: 330029, No. 699 AI Sihu Road, Nanchang hi tech Development Zone, Jiangxi, China Patentee before: Lattice Power (Jiangxi) Co., Ltd. |
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| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 330096 Main Workshop No. 699 101, Aixi Hubei Road, Nanchang High-tech Zone, Jiangxi Province Patentee after: JIANGXI LATTICEPOWER SEMICONDUCTOR Corp. Address before: 330096 Main Workshop No. 699 101, Aixi Hubei Road, Nanchang High-tech Zone, Jiangxi Province Patentee before: JIANGXI LATTICEBRIGHT Corp. |
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| EC01 | Cancellation of recordation of patent licensing contract |
Assignee: LATTICE POWER (CHANGZHOU) Corp. Assignor: LATTICE POWER (JIANGXI) Corp. Contract record no.: 2012360000083 Date of cancellation: 20220228 |
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| EC01 | Cancellation of recordation of patent licensing contract |