CN106098913A - A kind of improve the white light LEDs trial method than testing efficiency - Google Patents
A kind of improve the white light LEDs trial method than testing efficiency Download PDFInfo
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- CN106098913A CN106098913A CN201610495801.9A CN201610495801A CN106098913A CN 106098913 A CN106098913 A CN 106098913A CN 201610495801 A CN201610495801 A CN 201610495801A CN 106098913 A CN106098913 A CN 106098913A
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- white light
- light leds
- led chip
- support
- testing efficiency
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2601—Apparatus or methods therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0095—Post-treatment of devices, e.g. annealing, recrystallisation or short-circuit elimination
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
Abstract
The invention discloses and a kind of improve the white light LEDs trial method than testing efficiency, including step: LED chip be fixed in the bowl of cantilever tip with glue；Welding lead between LED chip and support, makes LED chip electrically connect with support；The fluorescent glue configured is coated in LED chip；With insulant, positive pole pin and the negative pin of support are fixed, and described positive pole pin and negative pin are cut from support；The LED semi-finished product obtained are carried out photochromic test.After coating fluorescent glue, by insulant, positive pole pin and the negative pin of support are fixed, the most directly carry out photochromic test, in test fluorescent glue, fluorescent material is the most suitable with the proportioning of glue, eliminate follow-up sealing operation, save time and cost, improve the production efficiency of white light LEDs product.
Description
Technical field
The present invention relates to LED and manufacture field, particularly relate to a kind of improve the white light LEDs trial side than testing efficiency
Method.
Background technology
Existing plug-in unit white light LEDs product, generally uses and yellow fluorescent powder is coated in the method system on blue-light LED chip
Form, first yellow fluorescent powder and silica gel are mixed, by point gum machine point in LED chip, due to fluorescent powder grain
Deposition, during a powder craft, the ratio regular meeting of silica gel and yellow fluorescent powder is constantly occurring change, same some glue
The white light LED part that amount is pointed out can produce bigger aberration, has a strong impact on the quality of product.Therefore, need to be in batch production every time
Before, or during batch production, the ratio of fluorescent material and silica gel is tested, obtains satisfactory ratio (proportioning)
Afterwards, could produce in batches in this ratio.
When ratio (that is, trial is than test) testing fluorescent material and silica gel, it is common that taking fraction material produces,
After covering whole technological process of productions (die bond > bonding wire--> some powder---> sealing-----> cutting), i.e. produce few
After part LED finished product, just carry out photochromic test, the parameters requirement the most up to specification of test LED finished product, only surveying
Try qualified after, the ratio this time used could be used to produce in batches.Such a trial than test process, cost time
Between the longest, production efficiency that line is produced in impact, and Material Cost is the highest.
Therefore, prior art has yet to be improved and developed.
Summary of the invention
In view of above-mentioned the deficiencies in the prior art, it is an object of the invention to provide a kind of white light LEDs trial that improves than test
The method of efficiency, can effectively improve the production efficiency of white light LEDs product.
Technical scheme is as follows:
A kind of improving the white light LEDs trial method than testing efficiency, described method comprises the steps:
A, with glue, LED chip is fixed in the bowl of cantilever tip；
B, between LED chip and support welding lead, make LED chip electrically connect with support；
C, the fluorescent glue configured is coated in LED chip；
D, with insulant, positive pole pin and the negative pin of support are fixed, and by described positive pole pin and negative pin from support
In cut；
E, the LED semi-finished product obtaining step D carry out photochromic test.
Described raising white light LEDs trial ratio is in the method for testing efficiency, and described step A-E is used for white light LEDs production line
Initial workpiece test.
Described raising white light LEDs trial ratio, in the method for testing efficiency, after described step C, also includes step C1, solidification
Described fluorescent glue.
Described raising white light LEDs trial ratio, in the method for testing efficiency, after described step E, further comprises the steps of:
After the detection of LED semi-finished product that F, step D obtain is qualified, start batch production, repeat step A-C；
After LED chip and electrode are sealed and solidify by G, use covering silica gel, complete the encapsulation of LED chip.
Described raising white light LEDs trial ratio is in the method for testing efficiency, and described insulant has been insulation and fixation
Epoxy resin.
Described raising white light LEDs trial ratio is in the method for testing efficiency, and described insulant is insulating cement.
Beneficial effect: provide a kind of in the present invention and improve the white light LEDs trial method than testing efficiency, including step: use
LED chip is fixed in the bowl of cantilever tip by glue；Welding lead between LED chip and support, makes LED chip and props up
Frame electrically connects；The fluorescent glue configured is coated in LED chip；With insulant by solid to positive pole pin and the negative pin of support
Fixed, and described positive pole pin and negative pin are cut from support；The LED semi-finished product obtained are carried out photochromic test.It is being coated with
After covering fluorescent glue, by insulant, positive pole pin and the negative pin of support are fixed, the most directly carry out photochromic test, test
In fluorescent glue, fluorescent material is the most suitable with the proportioning of glue, eliminates follow-up sealing operation, saves time and cost, improves
The production efficiency of white light LEDs product.
Accompanying drawing explanation
Fig. 1 is the raising white light LEDs trial of the present invention method flow diagram than the method for testing efficiency.
Fig. 2 is raising white light LEDs trial ratio of the present invention in the method for testing efficiency, the structure chart of support.
Fig. 3 is raising white light LEDs trial ratio of the present invention in the method for testing efficiency, the structure chart of the bowl of support.
Fig. 4 is raising white light LEDs trial ratio of the present invention in the method for testing efficiency, the structure chart of LED semi-finished product.
Fig. 5 is raising white light LEDs trial ratio of the present invention in the method for testing efficiency, the structure chart of LED finished product.
Detailed description of the invention
The present invention provides a kind of and improves the white light LEDs trial method than testing efficiency, for making the purpose of the present invention, technical side
Case and effect are clearer, clear and definite, and the present invention is described in more detail below.Should be appreciated that concrete reality described herein
Execute example only in order to explain the present invention, be not intended to limit the present invention.
Referring to Fig. 1, Fig. 1 is the raising white light LEDs trial of the present invention flow chart than the method for testing efficiency.Such as figure
Shown in 1, described raising white light LEDs trial includes than the method for testing efficiency:
S10, die bond: with glue, LED chip 20 is fixed in the bowl 110 on support 10 top, as shown in Figures 2 and 3.
S20, bonding wire: welding lead 30 between LED chip 20 and support 10, make LED chip 20 electrically connect with support 10.
Preferably, described wire 30 is gold thread.
S30, some powder: the fluorescent glue configured is coated in LED chip.Concrete, fluorescent material and silica gel (also can be adopted
With epoxy glue) carry out configuration mix and blend by predetermined ratio, obtain fluorescent glue, fluorescent glue is injected in the bowl 110 of support.
After step S30, also include step S31, baking: solidify described fluorescent glue by baking.
S40, with insulant 40, positive pole pin 120 and the negative pin 130 of support 10 are fixed, and by described positive pole pin
120 and negative pin 130 cut from support 10, make positive pole pin 120 and negative pin 130 separate, be unlikely to short circuit, obtain
Semi-finished product as shown in Figure 4.The both positive and negative polarity of support is secured so that the semi-finished product shown in Fig. 4 can be direct by insulant 40
Carry out photochromic test, and without LED chip being carried out sealing, save substantial amounts of time and glue, improve production efficiency, joint
Save production cost.In the present embodiment, described insulant 40 has been the epoxy resin of insulation and fixation, uses the shape dripping glue
Formula fixes both positive and negative polarity, and operation simple effects is good, and described epoxy resin speed is baked 10 ~ 15min and can be dried, and spends the time little.Enter
One step, described epoxy resin is insulating cement.Certainly, in other embodiments, described insulant 40 can also is that the non-of insulation
Metal (non-conductive class) fixture, fixes both positive and negative polarity by holder, it is also possible to realize the effect of the present invention.
S50, the LED semi-finished product obtaining step S40 carry out photochromic test.Concrete, due in step s 40 to support
10 have carried out cutting, obtain the semi-finished product shown in Fig. 4, i.e. obtain positive pole pin 120 LED separate with negative pin 130 half and become
Product.Owing to being used only as test, it is not necessary to enter the cutting operation producing line, the artificial cutting of tester, actually also save
The time of cutting operation, improve production efficiency.LED semi-finished product are carried out photochromic test, every optics of test LED semi-finished product
Parameter (such as brightness, wavelength or chromaticity coordinates etc.) and electrical parameter (the forward test event such as voltage, open circuit, short circuit), according to survey
Test result judges whether qualified, if test passes, then the predetermined ratio of explanation fluorescent material and silica gel meets the requirements, and trial is than test
Complete.Described step S10-S50 initial workpiece on white light LEDs production line is tested and/or sampling observation test, in other words, passes through
After above-mentioned steps, having obtained the predetermined ratio of satisfactory fluorescent material and silica gel, completed initial workpiece test, producing line can be carried out
Batch production, the process that this process is more traditional saves sealing operation, greatly improves production efficiency.
Further, after described step S50, further comprise the steps of:
After the detection of LED semi-finished product that S60, step S40 obtain is qualified, start batch production, repeat step S10-S30.
S70, sealing: after LED chip and electrode being sealed and solidified with covering silica gel, complete the encapsulation of LED chip.Described
Step S70 specifically includes:
S710, viscose glue: after having configured glue, evacuation, to bowl 110 viscose glue.Utilize viscose glue, it would be possible to be easily generated when encapsulating
Cup in bubble remove in advance.
S720, spray release agent: on the mould bar for the colloid shape producing LED, spray release agent.
S730, encapsulating: the resin glue after deaeration being completed is fed in the die cavity of mould bar.
S740, slotting support: support is inserted in described die cavity, short roasting pre-hardening.
S750, from mould: long roasting makes resin glue harden, and from mould.
S760, support is carried out cutting, obtain final finished product, as shown in Figure 5.
It should be appreciated that the application of the present invention is not limited to above-mentioned citing, for those of ordinary skills, can
To be improved according to the above description or to convert, all these modifications and variations all should belong to the guarantor of claims of the present invention
Protect scope.
Claims (6)
1. one kind is improved the white light LEDs trial method than testing efficiency, it is characterised in that described method comprises the steps:
A, with glue, LED chip is fixed in the bowl of cantilever tip；
B, between LED chip and support welding lead, make LED chip electrically connect with support；
C, the fluorescent glue configured is coated in LED chip；
D, with insulant, positive pole pin and the negative pin of support are fixed, and by described positive pole pin and negative pin from support
In cut；
E, the LED semi-finished product obtaining step D carry out photochromic test.
Improve the white light LEDs trial method than testing efficiency the most according to claim 1, it is characterised in that described step A-E
Initial workpiece test on white light LEDs production line.
Improve white light LEDs trial the most according to claim 2 than the method for testing efficiency, it is characterised in that described step C it
After, also include step C1, solidify described fluorescent glue.
Improve white light LEDs trial the most according to claim 3 than the method for testing efficiency, it is characterised in that described step E it
After, further comprise the steps of:
After the detection of LED semi-finished product that F, step D obtain is qualified, start batch production, repeat step A-C；
After LED chip and electrode are sealed and solidify by G, use covering silica gel, complete the encapsulation of LED chip.
Improve the white light LEDs trial method than testing efficiency the most according to claim 1, it is characterised in that described insulant
For playing the epoxy resin of insulation and fixation.
Improve the white light LEDs trial method than testing efficiency the most according to claim 1, it is characterised in that described insulant
For insulating cement.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610495801.9A CN106098913B (en) | 2016-06-29 | 2016-06-29 | A method of white light LEDs trial is improved than testing efficiency |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610495801.9A CN106098913B (en) | 2016-06-29 | 2016-06-29 | A method of white light LEDs trial is improved than testing efficiency |
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| Publication Number | Publication Date |
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| CN106098913A true CN106098913A (en) | 2016-11-09 |
| CN106098913B CN106098913B (en) | 2019-04-02 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107768503A (en) * | 2017-10-25 | 2018-03-06 | 江苏稳润光电科技有限公司 | A kind of Lamp white lights product encapsulating structure |
| CN107944208A (en) * | 2017-11-10 | 2018-04-20 | 江苏稳润光电科技有限公司 | A kind of computational methods of white light led fluorescent glues proportioning |
| CN112924840A (en) * | 2021-02-26 | 2021-06-08 | 航天科工防御技术研究试验中心 | Light-emitting diode failure positioning method |
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| JP2007314626A (en) * | 2006-05-24 | 2007-12-06 | Mitsubishi Chemicals Corp | Phosphor-containing composition, light emitting device, illuminating device and image display |
| CN101237017A (en) * | 2008-02-29 | 2008-08-06 | 晶能光电（江西）有限公司 | LED supporter processing method for LED nude core test |
| CN103441206A (en) * | 2013-08-22 | 2013-12-11 | 中山市光圣半导体科技有限责任公司 | Method for improving color consistency of white-light LED devices |
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2016
- 2016-06-29 CN CN201610495801.9A patent/CN106098913B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007314626A (en) * | 2006-05-24 | 2007-12-06 | Mitsubishi Chemicals Corp | Phosphor-containing composition, light emitting device, illuminating device and image display |
| CN101237017A (en) * | 2008-02-29 | 2008-08-06 | 晶能光电（江西）有限公司 | LED supporter processing method for LED nude core test |
| CN103441206A (en) * | 2013-08-22 | 2013-12-11 | 中山市光圣半导体科技有限责任公司 | Method for improving color consistency of white-light LED devices |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107768503A (en) * | 2017-10-25 | 2018-03-06 | 江苏稳润光电科技有限公司 | A kind of Lamp white lights product encapsulating structure |
| CN107944208A (en) * | 2017-11-10 | 2018-04-20 | 江苏稳润光电科技有限公司 | A kind of computational methods of white light led fluorescent glues proportioning |
| CN112924840A (en) * | 2021-02-26 | 2021-06-08 | 航天科工防御技术研究试验中心 | Light-emitting diode failure positioning method |
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| Publication number | Publication date |
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| CN106098913B (en) | 2019-04-02 |
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