CN104167483B - A kind of LED encapsulation structure and preparation method thereof - Google Patents
A kind of LED encapsulation structure and preparation method thereof Download PDFInfo
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- CN104167483B CN104167483B CN201410413483.8A CN201410413483A CN104167483B CN 104167483 B CN104167483 B CN 104167483B CN 201410413483 A CN201410413483 A CN 201410413483A CN 104167483 B CN104167483 B CN 104167483B
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- 238000002360 preparation method Methods 0.000 title claims abstract description 28
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- 229910052751 metal Inorganic materials 0.000 claims abstract description 70
- 238000000465 moulding Methods 0.000 claims abstract description 57
- 239000004593 Epoxy Substances 0.000 claims abstract description 56
- 239000004033 plastic Substances 0.000 claims abstract description 54
- 239000003292 glue Substances 0.000 claims abstract description 23
- 230000002093 peripheral effect Effects 0.000 claims abstract description 15
- 239000000206 moulding compound Substances 0.000 claims abstract description 8
- 238000010438 heat treatment Methods 0.000 claims abstract description 6
- 238000009413 insulation Methods 0.000 claims abstract description 6
- 238000007789 sealing Methods 0.000 claims abstract description 4
- 238000005452 bending Methods 0.000 claims description 17
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 5
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- 239000001301 oxygen Substances 0.000 claims description 5
- 238000012545 processing Methods 0.000 claims description 4
- 238000007493 shaping process Methods 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 7
- 238000005056 compaction Methods 0.000 abstract 1
- 239000000463 material Substances 0.000 description 10
- 239000000047 product Substances 0.000 description 8
- 238000011161 development Methods 0.000 description 7
- 239000004568 cement Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 238000012360 testing method Methods 0.000 description 5
- 229920006375 polyphtalamide Polymers 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
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- 239000007924 injection Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 239000011265 semifinished product Substances 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
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- 239000004954 Polyphthalamide Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
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- 230000001070 adhesive effect Effects 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
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- 229920006336 epoxy molding compound Polymers 0.000 description 1
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- RCHKEJKUUXXBSM-UHFFFAOYSA-N n-benzyl-2-(3-formylindol-1-yl)acetamide Chemical compound C12=CC=CC=C2C(C=O)=CN1CC(=O)NCC1=CC=CC=C1 RCHKEJKUUXXBSM-UHFFFAOYSA-N 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses a kind of LED encapsulation structure and preparation method thereof, during preparation, comprise the following steps：1) LED support is prepared, LED support includes being provided with bowl-shape inner chamber on shell and the metal pins being connected on shell, shell；2) LED chip is fixed on bowl-shape intracavity bottom；3) bonding LED chip；4) LED support is fitted into the inner chamber of the mould of heating and thermal insulation, compaction mold realizes sealing；5) epoxy molding plastic is injected by the hole for injecting glue of mould, makes the bowl-shape inner chamber of shell is inner and outer to enclose filling and be enclosed with epoxy molding plastic, cured epoxy moulding compound；6) mould is opened, LED support is taken out, the metal pins of LED support is handled, the epoxy molding plastic of metal pins and housing peripheral is contacted, LED encapsulation structure is made.LED encapsulation structure of the present invention and preparation method thereof, is easy to flexibly production various shapes structure and the LED encapsulation structure of sizes, and the electric leakage of obtained LED encapsulation structure, dead lamp situation improve, and homogeneity of product is preferable.
Description
【Technical field】
The present invention relates to light emitting diode, more particularly to a kind of LED encapsulation structure and preparation method thereof.
【Background technology】
Existing LED encapsulation structure is mainly adopting surface mounted LED (SMD-LED).The packaged type of adopting surface mounted LED has support filling
Envelope type.The LED encapsulation structure of support embedding type includes support, as shown in figure 1, being the structural representation of support, support includes outer
Shell 100 and copper sheet pin 200.The material of shell 100 is PPA plastic cement materials, is provided with die bond in plastic cement bowl cavity, bowl cavity
LED encapsulation structure is obtained after LED chip, point liquid-state epoxy resin curing molding are installed.This kind of LED encapsulation structure, is easily produced
The fatal hidden danger such as electric leakage, dead lamp.In addition, in bowl cavity dispensing plane " recessed cup " occur because of the number of glue amount " convex
Cup " is bad, and product lighting angle, brightness are affected, it is impossible to accomplish consistent.And during this kind of LED encapsulation structure preparation, pass through point
Adhesive curing is molded so that the construction profile of product is compared with fixed single, it is impossible to be flexibly applied to a variety of application scenarios.And existing preparation
During LED encapsulation structure, the LED encapsulation structure of sizes is such as prepared, can only prepare the support of sizes size, and support
Development cost it is especially big, cause produce sizes structure LED encapsulation structure when, production cost is very high.
【The content of the invention】
The technical problems to be solved by the invention are：Above-mentioned the deficiencies in the prior art are made up, a kind of LED encapsulation structure is proposed
And preparation method thereof, it is easy to flexibly production various shapes structure and the LED encapsulation structure of sizes, and obtained LED is sealed
Assembling structure electric leakage, dead lamp situation improve, and homogeneity of product is preferable.
The technical problem of the present invention is solved by following technical scheme：
A kind of preparation method of LED encapsulation structure, comprises the following steps：1) LED support is prepared, the LED support includes
Bowl-shape inner chamber is provided with the metal pins of shell and connection on the housing, the shell；2) LED chip is fixed on institute
State bowl-shape intracavity bottom；3) LED chip described in bonding, makes the LED chip be electrically connected with the metal pins；4) will be described
LED support is fitted into the inner chamber of the mould of heating and thermal insulation, compresses the mould and realizes sealing；5) hole for injecting glue of the mould is passed through
Epoxy molding plastic is injected, makes the bowl-shape inner chamber of the shell is inner and outer to enclose filling and be enclosed with epoxy molding plastic, solidifies the ring
Oxygen moulding compound；6) mould is opened, the LED support is taken out, the metal pins of the LED support is handled, makes the metal pins
Contacted with the epoxy molding plastic of the housing peripheral, LED encapsulation structure is made.
A kind of LED encapsulation structure, including LED support and LED chip, the LED support include shell and are connected to described
Metal pins on shell；Bowl-shape inner chamber is set on the shell, and the LED chip is arranged on the bowl-shape intracavity bottom, institute
State LED chip to electrically connect with the metal pins, the bowl-shape inner chamber of the shell is inner and outer to enclose filling and be enclosed with epoxy mold
Material, the metal pins bending and the epoxy molding plastic of the housing peripheral contact.
The beneficial effect that the present invention is compared with the prior art is：
LED encapsulation structure of the present invention and preparation method thereof, is obtained using mould injecting glue curing molding, controls filling out for injecting glue
Fill space, make the bowl-shape inner chamber of the casing part of LED support it is inner and outer enclose filling be enclosed with epoxy molding plastic, LED support
Metal pins bending and the epoxy molding plastic of housing peripheral contact.So, experimental verification obtains the LED encapsulation of the present invention
The humidity resistance of structure is better than existing LED encapsulation structure, can effectively prevent moisture, moisture from penetrating into LED by component junction
The work of LED chip in the internal influence shell 100 of encapsulating structure, so as to be effectively improved electric leakage, dead lamp situation.Pass through the present invention
Preparation method made from LED encapsulation structure, by mould injecting glue, product shape uniformity is good, thus emission uniformity preferably,
And by adjusting mold cavity structure shape, the production of the LED encapsulation structure of various shapes can be flexibly realized, and lower mould can
It is flexibly economical to share.And the LED encapsulation structure of the present invention, a kind of LED support is shared, changes the size of mould, you can system
Obtain the LED encapsulation structure of a variety of dimensional structures, while it is desirable to the development cost of mould, but mould development cost is well below LED
Stent development cost so that the production cost for preparing the LED encapsulation structure of sizes is substantially reduced.
【Brief description of the drawings】
Fig. 1 is the structural representation of support in the prior art in embedding type LED encapsulation structure；
Fig. 2 to Fig. 8 is the preparation technology flow chart of the LED encapsulation structure of the specific embodiment of the invention one；
Fig. 9 is the structural representation after a kind of improvement profile of the LED encapsulation structure of the specific embodiment of the invention one；
Figure 10 is the structural representation after another improvement profile of the LED encapsulation structure of the specific embodiment of the invention one
Figure 11 is that LED support is put into the state in mould when LED encapsulation structure is prepared in the specific embodiment of the invention two
Schematic diagram；
Figure 12 is the structural representation of obtained LED encapsulation structure in the specific embodiment of the invention two.
【Embodiment】
With reference to embodiment and compare accompanying drawing the present invention is described in further details.
It is the preparation technology flow chart of the LED encapsulation structure of present embodiment as shown in Fig. 2~8, including following step
Suddenly：
1) LED support is prepared, the LED support includes the metal pins of shell and connection on the housing, described outer
Bowl-shape inner chamber is provided with shell.
As shown in Fig. 2 the structural representation of the LED support for preparation, top figure a is overlooking the structure diagram, lower section figure b
For vertical direction schematic cross-sectional view.LED support includes being provided with shell 1 and the metal pins 2 being connected on shell 1, shell 1
Bowl-shape inner chamber 10.The material of shell 1 can be PPA plastic cement materials.The material of metal pins 2 can be copper product.
2) LED chip is fixed on the bowl-shape intracavity bottom.As shown in figure 3, top figure a is overlooking the structure diagram,
Lower section figure b is vertical direction schematic cross-sectional view.Tri- kinds of LED chips 3 of R, G, B are fixed on to the bottom of the bowl-shape inner chamber 10 of LED support
Portion, so that the fixation of tri- kinds of LED chips of R, G, B is completed in the bowl of LED support 1, namely die bond.
3) bonding (bonding) LED chip, makes LED chip be electrically connected with metal pins.As shown in figure 4, top figure a is
Overlooking the structure diagram, lower section figure b is vertical direction schematic cross-sectional view.For the welding lead 4 of LED chip 3, LED chip 3 is completed
Bonding (bonding), realizes the electrical connection between the electrode of LED chip 3 and metal pins.
4) by step 3) obtained LED support is fitted into the inner chamber of the mould of heating and thermal insulation, compress the mould realize it is close
Envelope.
5) epoxy molding plastic is injected by the hole for injecting glue of the mould, inner and outer enclose in bowl-shape inner chamber of the shell is filled out
Fill and be enclosed with epoxy molding plastic, solidify the epoxy molding plastic.
6) open mould, take out the LED support, handle the metal pins of the LED support, make the metal pins with
The epoxy molding plastic of the housing peripheral contacts, and LED encapsulation structure is made
In present embodiment, step 1) in the metal pins of LED support that prepare be horizontality, carry out step 4)
To step 6) when, as shown in Fig. 5 to 8.LED support that is solid, welding is fitted into the molding dies cavities of insulation, loads LED
It is horizontality that metal pins 2 are kept during support.Molding moulds include mold 5 and lower mould 6, mold 5 and lower mould
6 clamp the end of the metal pins 2 in horizontality, make shell 1 hanging in the inner chamber of mould, close upper/lower die compression
Realize sealing.2 hole for injecting glue k1, k2 are offered on mould respectively, epoxy molding plastic 7, the full mould of filling are injected by 2 hole for injecting glue
Have inner chamber room so that the bowl-shape inner chamber of shell 1 it is inner and outer enclose filling be enclosed with epoxy molding plastic 7, herein it be stressed that
Not only intracavitary is filled with epoxy molding plastic in the bowl of shell 1, and the periphery of shell 1 is also all enclosed with epoxy molding plastic.Ring
Oxygen moulding compound 7 (Epoxy Molding Compound, abbreviation EMC) be by epoxy resin be matrix resin, with high-performance pnenolic aldehyde
Resin is curing agent, and it is filler to add silicon powder etc., and adds the powdery moulding compound of a variety of additive mixtures.Epoxy mold
Expect to be in solid-state under normal temperature, the pre-heat treatment is heated to form liquid at 130-160 DEG C before injection, is then injected into mould, note
, can curing molding after general 3-5min by curing process after entering.Mould is opened, semi-finished product support is taken out, outside draw is completed
Pin bending and threshing, the epoxy mold that the direction bending where making metal pins 2 towards shell 1 is wrapped up with the bottom periphery of shell 1
Material contacts, and the surface welded LED encapsulating structure of single is made.If batch production plurality of LEDs encapsulating structure, injecting glue it
Connected together between preceding multiple LED supports by connecting portion.During mould injecting glue, mould clamps connecting portion.After the completion of injecting glue,
Connecting portion is cut off, connecting portion is removed, then bends metal pins, that is, obtain the surface welded LED encapsulating structure of single.
Fig. 8 is the schematic diagram of obtained LED encapsulation structure in the specific embodiment of the invention, including LED support and LED
Chip, LED support includes shell 1 and the metal pins 2 being connected on shell 1.The material of shell 1 can be polyphthalamide
Resin PPA.Metal pins 2 can be silver-plated copper sheet.Bowl-shape inner chamber is set on shell 1, and LED chip is arranged on bowl-shape interior bottom of chamber
Portion, specifically, can be fixed on bowl-shape intracavity bottom by conductive silver glue.LED chip is electrically connected with metal pins 2, the bowl of shell 1
Shape inner chamber is inner and outer to enclose filling and is enclosed with epoxy molding plastic 7, and the bending of metal pins 2 epoxy molding plastic 7 peripheral with shell 1 connects
Touch together.The ring that the direction bending of metal pins 2 towards shell 1 is wrapped up with the bottom periphery of shell 1 in present embodiment
Oxygen moulding compound 7 contacts.
The cyclic test of " pressure cook red ink+thermal shock " is set, the LED encapsulation structure of present embodiment is verified
Humidity resistance.Experiment condition is：Using high pressure accelerated testing cabinet, red ink and water ratio 1：1, pressure is 1Kg/cm2, the time
60min；Cold shock testing condition：Using low temperature impact test box, -40 DEG C ± 2 DEG C (30min) ← → 100 DEG C ± 2 DEG C
(30min), the LED encapsulation structure for measuring present embodiment is resistant to the loop test of 35~40 bouts, and traditional
LED encapsulation structure is only resistant to the loop test of 12~16 bouts or so, shows the LED encapsulation structure of present embodiment
Humidity resistance it is more excellent.
LED encapsulation structure in present embodiment, for existing LED encapsulation structure, existing LED envelopes
Assembling structure, resin glue is only potted in intracavitary in bowl by dispensing mode, and metal pins contact knot with the PPA plastic cement of shell
Close, and in present embodiment, housing peripheral wraps up one layer of integrally formed epoxy molding plastic, metal pins and outer collarette entirely
Oxygen moulding compound is contacted, may be poor due to the combination stability of metal pins and plastic cement, and metal pins and peripheral epoxy mold
The combination stability of material is higher, thus humidity resistance be better than existing structure LED encapsulation structure, so as to effectively prevent moisture,
Moisture penetrates into the work of LED chip in the inside of LED encapsulation structure, influence shell by the junction of metal pins and shell,
So as to be effectively improved electric leakage, dead lamp situation.By LED encapsulation structure made from the preparation method of the present invention, by mould injecting glue,
Product shape uniformity is good, so that emission uniformity is preferably, and by adjusting mold cavity structure shape, can flexibly realize many
The production of the LED encapsulation structure of profile is planted, and lower mould can be shared, it is flexibly economical.In addition, present embodiment
When preparation method prepares sizes structure, such as the 3.0 × 3.0 of standard, 3.5 × 2.8,3.5 × 3.5 and 4.0 × 4.0 4
When planting size, only the mould of a kind of LED support and four kinds of sizes is needed to can be prepared by.During relative to four kinds of sizes of existing preparation, need
Four kinds of corresponding LED supports of size are developed, and the development cost of support is significantly larger than the development cost of mould, therefore, this tool
The preparation method of body embodiment is in terms of the LED encapsulation structure for preparing sizes, and cost-effective reduction is particularly suitable for reality
Popularization and application.
Preferably, after the shape of adjustment mold cavity structure, can be made as shown in Figure 9 and Figure 10 two kinds are improved
LED encapsulation structure.It is raised arc convex lens structures 9 at the top of the LED encapsulation structure of two improvements, epoxy molding plastic.Fig. 9
Shown arc convex lens structures 9, using concentrating light principles, realize optically focused, so as to lift the luminosity of LED encapsulation structure.
And Figure 10 contour structures, in addition to the arc convex lens structures 9 at top make it that luminosity is preferable, whole contour structures connect
The profile of direct insertion LED encapsulation structure is bordering on, and it is exactly straight cutting LED profiles that LED outdoor display screens are most widely used now, because
The replaceable straight cutting LED outline packages structures of this product, are more easy to promote the use of, it is easier to by LED retailers received.
It is further preferred that as shown in Fig. 2 the region of the bottom of the shell 1 bowl-shape inner chamber 10 of correspondence offers pod apertures 11, this
Sample, step 5) after injecting glue, the epoxy molding plastic that the periphery of the epoxy molding plastic of filling and shell 1 is wrapped up in bowl-shape inner chamber 10 passes through
Pod apertures 11 are connected, and such epoxy molding plastic is connected inside and outside LED support, can more effectively protect LED encapsulation structure
Internal LED chip, and the setting of pod apertures 11 causes the packing space of epoxy molding plastic during injecting glue to be connection, so also may be used
Effectively to solve to lack in during injecting glue, cavity, air bubble problem.
LED chip 3 includes red LED chip, green LED chip and blue-light LED chip, it is preferable that red LED chip,
Green LED chip and blue-light LED chip are arranged in a row in bowl intracavity bottom successively.It is further preferred that such as Fig. 2 to 4
Shown, the metal pins 2 of LED support are distributed by five pins to be set, wherein, two pins positive pole respectively with red LED chip,
Negative pole is electrically connected, and a pin is electrically connected with the positive pole of green LED chip and blue-light LED chip simultaneously, two other pin point
The negative pole of negative pole, blue-light LED chip not with green LED chip is electrically connected.That is, set gradually from top to bottom in Fig. 4 it is red,
Green, blue led chip, upper left pin and upper right pin correspond to the negative pole R-, positive pole R+, left pin pair of red LED chip respectively
The positive pole G+ of green LED chip, the B+ of blue-light LED chip, the negative pole B- of lower-left pin correspondence blue-light LED chip are answered, bottom right is drawn
The negative pole G- of pin correspondence green LED chip.So, positive relative to existing one three negative four pins distributions are set, during power supply
Positive pole all provides 2.8~3.4V voltage, and the resistance that can be connected in the corresponding circuit of red light negative pole is depressured so that red light
Cathode voltage is in 1.9~2.3V, so that red light normal work.But, although it is easy to control, but due to lossy on resistance, lead
Cause the energy consumption of LED encapsulation structure higher.And during this is preferably provided with, R+ positive poles are made a distinction, G+ and B+ still supplies 2.8 simultaneously
~3.4V voltage, and R+ is then individually controlled there is provided 1.9~2.3V voltages, should without setting resistance decompression directly to meet
With requiring, LED overall power consumption can be reduced.
When being distributed setting by five pins, the metal pins electrically connected with the negative pole of the green LED chip, namely it is right
The area of lower pin is more than the area of other metal pins.In LED encapsulation structure concrete application, the hair of tri- LED chips of R, G, B
Brightness ratio generally 3：6：The luminosity of 1, i.e. green LED chip requires highest, and electric current is maximum, and heating is maximum.Five pins
During structure setting metal pins, the area of the corresponding metal pins of green LED chip negative pole is set larger, radiating can be increased
Effect, so that power consumption is lower.
Embodiment two
The difference of present embodiment and embodiment one is：The metal pins of the LED support of preparation are curved
Folding state, correspondingly, mould clamp position is different when preparing processing.
In the preparation method of present embodiment LED encapsulation structure, preparation process is identical with embodiment one, only
Step 1) in the metal pins of LED support that prepare be bending state, correspondingly step 4) in LED support in mould cavity
In particular state it is slightly different, step 6) in processing it is slightly different.It is following to be described in detail only for difference part.
In present embodiment, step 4 is carried out) when, as shown in figure 11.LED support that is solid, welding is loaded into insulation
In molding dies cavities, metal pins 21 are bending state when loading LED support, and metal pins 2 are towards where away from shell 1
Direction bending, form the relative L-shaped structure in left and right.Molding moulds include mold 51 and lower mould 61, the He of mold 51
Lower mould 61 clamps the horizontal end of the bending of metal pins 21, makes shell 1 hanging in the inner chamber of mould, closes upper/lower die pressure
Consolidation is now sealed.During injecting glue, 2 hole for injecting glue similarly, on mould are offered respectively, and epoxy mold is injected by 2 hole for injecting glue
Material, the full dies cavity room of filling encloses filling and is enclosed with epoxy molding plastic so that the bowl-shape inner chamber of shell 1 is inner and outer.Injection
After epoxy molding plastic, curing process makes epoxy molding plastic curing molding.Mould is opened, semi-finished product support is taken out, metal is removed and draws
The part not contacted in pin 21 with epoxy molding plastic, threshing, obtained single SMD-LED encapsulating structures, such as Figure 12 institutes
Show, metal pins 21 are the epoxy wrapped up towards the direction bending away from shell 1 with the top peripheral of shell 1 in LED encapsulation structure
Moulding compound 7 contacts.
The LED encapsulation structure of present embodiment, is equally housing peripheral one layer of epoxy molding plastic of parcel entirely, and metal draws
Pin is contacted with peripheral epoxy molding plastic, and the combination stability of metal pins and peripheral epoxy molding plastic is higher, so humidity resistance
Better than the LED encapsulation structure of existing structure, so as to effectively prevent moisture, moisture from being oozed by the junction of metal pins and shell
Enter the work of LED chip in the inside of LED encapsulation structure, influence shell, so as to be effectively improved electric leakage, dead lamp situation.By this
LED encapsulation structure made from the preparation method of invention, by mould injecting glue, product shape uniformity is good, so that emission uniformity
Preferably, and by adjusting mold cavity structure shape, the production of the LED encapsulation structure of various shapes can flexibly be realized, and under
Mould can be shared, flexibly economical.And in terms of the LED encapsulation structure for preparing sizes, saved main LED support
Development cost, cost-effective reduction.
Above content is to combine specific preferred embodiment further description made for the present invention, it is impossible to assert
The specific implementation of the present invention is confined to these explanations.For general technical staff of the technical field of the invention,
Some replacements or substantially modification are made on the premise of not departing from present inventive concept, and performance or purposes are identical, should all be considered as
Belong to protection scope of the present invention.
Claims (9)
1. a kind of preparation method of LED encapsulation structure, it is characterised in that：Comprise the following steps：1) LED support, the LED are prepared
Support includes being provided with bowl-shape inner chamber on the metal pins of shell and connection on the housing, the shell；The shell bottom
The region of the portion correspondence bowl-shape inner chamber offers pod apertures；2) LED chip is fixed on the bowl-shape intracavity bottom；3) bonding
The LED chip, makes the LED chip be electrically connected with the metal pins；4) LED support is loaded to the mould of heating and thermal insulation
In the inner chamber of tool, compress the mould and realize sealing；5) epoxy molding plastic is injected by the hole for injecting glue of the mould, made described outer
The bowl-shape inner chamber of shell is inner and outer to enclose filling and is enclosed with epoxy molding plastic, and the epoxy molding plastic of the bowl-shape interior intracavitary filling with
The epoxy molding plastic of the periphery parcel of the shell is connected by the pod apertures, solidifies the epoxy molding plastic；6) mould is opened
Tool, takes out the LED support, handles the metal pins of the LED support, makes the ring of the metal pins and the housing peripheral
Oxygen moulding compound contacts, and LED encapsulation structure is made.
2. the preparation method of LED encapsulation structure according to claim 1, it is characterised in that：The step 4) in, the mould
Tool includes mold and lower mould, and the mold and lower mould clamp the metal pins, makes the shell hanging described
In the inner chamber of mould；The step 5) in, inject the epoxy molding plastic and fill the dies cavity room, so that described outer
The bowl-shape inner chamber of shell is inner and outer to enclose filling and is enclosed with epoxy molding plastic.
3. the preparation method of LED encapsulation structure according to claim 2, it is characterised in that：The step 1) described in LED
The metal pins of support are horizontality；The step 4) in, the mold and lower mould clamp the end of the metal pins
Portion；The step 6) in the processing metal pins to bend the metal pins, make the metal pins towards the shell
Direction bending with the outer casing bottom periphery wrap up epoxy molding plastic contact.
4. the preparation method of LED encapsulation structure according to claim 2, it is characterised in that：The step 1) described in LED
The metal pins of support are bending state；The step 4) in, the mold and lower mould clamp the metal pins bending
Horizontal end；The step 6) in the processing metal pins do not contacted to remove in the metal pins with epoxy molding plastic
Part together.
5. LED encapsulation structure made from a kind of preparation method according to any one of Claims 1 to 4, it is characterised in that：Including
LED support and LED chip, the LED support include the metal pins of shell and connection on the housing；Set on the shell
Bowl-shape inner chamber is put, the LED chip is arranged on the bowl-shape intracavity bottom, and the LED chip is electrically connected with the metal pins,
The bowl-shape inner chamber of the shell is inner and outer to enclose filling and is enclosed with epoxy molding plastic, the periphery of the shell one layer of one of parcel entirely
The epoxy molding plastic of shaping；The metal pins bending and the epoxy molding plastic of the housing peripheral contact；It is described outer
The region of the shell bottom correspondence bowl-shape inner chamber offers pod apertures, the epoxy molding plastic of the bowl-shape interior intracavitary filling with it is described
The epoxy molding plastic of the periphery parcel of shell is connected by the pod apertures.
6. LED encapsulation structure according to claim 5, it is characterised in that：The metal pins are towards the side of the shell
Contacted to bending and the epoxy molding plastic of outer casing bottom periphery parcel, or the metal pins are towards away from described
The direction bending of shell and the epoxy molding plastic of shell upper periphery parcel contact.
7. LED encapsulation structure according to claim 5, it is characterised in that：The epoxy molding plastic of the housing peripheral parcel
Top is raised arc convex lens structures.
8. LED encapsulation structure according to claim 5, it is characterised in that：The LED chip includes red LED chip, green
Light LED chip and blue-light LED chip；The metal pins by five pins be distributed set, two of which pin respectively with it is described red
Positive pole, the negative pole electrical connection, a pin of light LED chip while with the green LED chip and the blue-light LED chip just
Pole is electrically connected, and negative pole, the negative pole of the blue-light LED chip of two other pin respectively with the green LED chip are electrically connected.
9. LED encapsulation structure according to claim 8, it is characterised in that：Electrically connected with the negative pole of the green LED chip
The metal pins area be more than other metal pins area.
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| CN106252486A (en) * | 2016-08-03 | 2016-12-21 | 中山市雄纳五金照明科技有限公司 | A kind of manufacture method of Surface-mount LED lamp |
| CN107068835B (en) * | 2017-01-18 | 2019-08-23 | 中山市雄纳五金照明科技有限公司 | A kind of production method of bonded LED lamp |
| CN107275322A (en) * | 2017-06-27 | 2017-10-20 | 东莞市欧思科光电科技有限公司 | The luminous PLC technology LED in side with IC |
| CN109030159A (en) * | 2018-07-28 | 2018-12-18 | 中国石油天然气集团有限公司 | A kind of test button grind away clamping device and preparation method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2346075Y (en) * | 1998-11-09 | 1999-10-27 | 陈兴 | Light-emitting diode |
| CN102593115A (en) * | 2012-03-15 | 2012-07-18 | 深圳市丽晶光电科技股份有限公司 | LED surface-mounted device and manufacturing method thereof |
| CN204118116U (en) * | 2014-08-19 | 2015-01-21 | 深圳市丽晶光电科技股份有限公司 | A kind of LED encapsulation structure |
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2014
- 2014-08-19 CN CN201410413483.8A patent/CN104167483B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2346075Y (en) * | 1998-11-09 | 1999-10-27 | 陈兴 | Light-emitting diode |
| CN102593115A (en) * | 2012-03-15 | 2012-07-18 | 深圳市丽晶光电科技股份有限公司 | LED surface-mounted device and manufacturing method thereof |
| CN204118116U (en) * | 2014-08-19 | 2015-01-21 | 深圳市丽晶光电科技股份有限公司 | A kind of LED encapsulation structure |
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