CN101354123A - LED optical apparatus and preparation method thereof - Google Patents
LED optical apparatus and preparation method thereof Download PDFInfo
- Publication number
- CN101354123A CN101354123A CNA2007100753330A CN200710075333A CN101354123A CN 101354123 A CN101354123 A CN 101354123A CN A2007100753330 A CNA2007100753330 A CN A2007100753330A CN 200710075333 A CN200710075333 A CN 200710075333A CN 101354123 A CN101354123 A CN 101354123A
- Authority
- CN
- China
- Prior art keywords
- led
- optical lens
- optical devices
- led optical
- preparing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000003287 optical effect Effects 0.000 title claims abstract description 100
- 238000002360 preparation method Methods 0.000 title description 9
- 239000000463 material Substances 0.000 claims abstract description 52
- 238000000034 method Methods 0.000 claims abstract description 18
- 238000000465 moulding Methods 0.000 claims description 17
- 238000000748 compression moulding Methods 0.000 claims description 12
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- 229920000642 polymer Polymers 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000000741 silica gel Substances 0.000 claims description 3
- 229910002027 silica gel Inorganic materials 0.000 claims description 3
- 238000013007 heat curing Methods 0.000 claims description 2
- 238000013008 moisture curing Methods 0.000 claims description 2
- 238000012423 maintenance Methods 0.000 claims 1
- 238000002834 transmittance Methods 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 239000000047 product Substances 0.000 description 4
- 239000011345 viscous material Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 238000003475 lamination Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000001723 curing Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Images
Landscapes
- Led Device Packages (AREA)
Abstract
The invention provides an LED optical device which comprises a bracket, an LED chip and an optical lens, wherein, a light-emitting area is arranged on the bracket; the LED chip is arranged in the light-emitting area, the optical lens is arranged on the light-emitting area in a covering way, and the LED chip is embedded in the optical lens and connected with the electrode phase on the bracket through an electrode connecting wire; and the optical lens is integrated in structure. The method for manufacturing the LED optical device includes the following steps: the bracket is arranged in a mould, a forming material of the optical lens is shot to the cavity of the mould by high pressure, demoulding is carried out after the forming material is solidified. As the LED optical device is integrated in structure, the heat transferring performance of the LED optical device can be improved, overall heat resistance can be reduced and reliability of products can be increased; in addition, the LED optical device is easy to produce.
Description
[technical field]
The present invention relates to a kind of LED Optical devices and preparation method thereof.
[background technology]
LED (light emitting diode) is as a kind of luminescent device that directly electric energy is converted into visible light and radiant energy, extensively thought top quality light source of 21 century, it has series of advantages, low as operating voltage, power consumption is little, the luminous efficiency height, and LED itself and manufacturing process thereof are all pollution-free, stable and reliable for performance.
LED optical texture part commonly used at present mainly obtains corresponding optical results by add an optical lens in addition in the LED encapsulation, method commonly used is filled viscous material in the space between optical lens and LED electronic component then for to buckle an optical lens on the LED electronic component.
The heat radiation that this way can improve the integral LED optical texture by the viscous material of filling between adjustment optical lens and the LED electronic component, but such structure has its fatal defective: at first, optical lens itself is to use two kinds of different materials to do with inner viscous material of filling, in the follow-up failtests of LED optical texture, the combination of two kinds of unlike materials is not because own matching, layering can appear, both composition surfaces can form the state of hollow, this bright dipping light shape to LED produces fatal influence, has influence on the reliability of LED optical texture simultaneously; Secondly, the interpolation of optical lens and the filling work procedure of viscous material are loaded down with trivial details, thereby cause problems such as the operation yield is low; Once more, optical lens itself adopts PC material or other similar plastics material to make, material itself can not withstand high temperatures, in today of LED industry develop rapidly, non-refractory represents that this product can not use Reflow Soldering to do last assembling, is very tangible to the influence of the efficient of integral body assembling.
[summary of the invention]
Technical problem to be solved by this invention is to provide a kind of LED Optical devices, and its reliability is higher.
For solving the problems of the technologies described above, technical scheme of the present invention is: a kind of LED Optical devices are provided, comprise support, led chip and optical lens, described support is provided with the luminous zone, described led chip is located in the luminous zone, described optical lens is located on the luminous zone, and described led chip embeds in the optical lens, and it is connected with electrode on the support by electrode connecting line; Wherein, described optical lens is formed in one.
Compared with prior art, the optical lens of above-mentioned LED Optical devices is one-body molded, can promote the heat conductivility of LED Optical devices, reduces overall thermal resistance.
Another technical problem to be solved by this invention is to provide a kind of method for preparing above-mentioned LED Optical devices, can improve processing procedure efficient and yield.
For solving the problems of the technologies described above, technical scheme of the present invention is: a kind of method for preparing above-mentioned LED Optical devices is provided, comprise the steps: to prop up and be erected in the mould, the moulding material of optical lens is penetrated to the die cavity of described mould by high pressure, treat the demoulding after the material cured.
Compared with prior art, the method processing ease of the above-mentioned LED Optical devices of above-mentioned preparation can improve processing procedure efficient and yield.
[description of drawings]
Fig. 1 is the cross-sectional schematic of LED Optical devices first preferred embodiment of the present invention.
Fig. 2 is the cross-sectional schematic of LED Optical devices second preferred embodiment of the present invention.
[specific embodiment]
In order to make technical problem to be solved by this invention, technical scheme and beneficial effect clearer,, the present invention is further elaborated below in conjunction with drawings and Examples.Should be appreciated that specific embodiment described herein only in order to explanation the present invention, and be not used in qualification the present invention.
Seeing also Fig. 1, is first preferred embodiment of LED Optical devices of the present invention, and it comprises support 1, led chip 2 and optical lens 3.Wherein, the upper surface of support 1 forms a luminous zone (not indicating among the figure) to lower recess, and led chip 2 is located in the luminous zone, and optical lens 3 is located on the luminous zone, and led chip 2 is embedded in the optical lens 3.Described led chip 2 is connected with electrode 10 on the support 1 by electrode connecting line 20.Optical lens 3 also can be not same material composition.
The material option of described optical lens 3 silica gel, resin or other transparent polymer, and one-body molded by the mode of mold pressing, its same material that can be refractive index of the same race is formed.Because optical lens 3 is formed for same material, does not have the lamination problem between the interface, heat dispersion and heat conductivility promote, and can layering in the use of follow-up LED, thus the lifting reliability of products.
Please together consult Fig. 2, it is second preferred embodiment of LED Optical devices of the present invention, the difference of itself and the foregoing description is: described optical lens 3 is made up of inside and outside two layers of material, wherein, the refractive index of the material of internal layer 31 is the refractive index height of the material of skin 32, and the material of inside and outside layer 31,32 is a material of the same type.Because above-mentioned optical lens 3 refractive index from the inside to surface reduces, and can effectively photoconduction be gone out like this, reduce the light loss consumption that influences because of total reflection.
Other embodiment as LED Optical devices of the present invention, above-mentioned optical lens 3 can be made up of the multilayer material of arranging from the inside to surface, as long as layers of material has different refractive indexes, and be that material of the same type gets final product, wherein, preferred optical lens is from the innermost layer to the outermost layer, and the refractive index of layers of material reduces.In addition, each layer all can be selected different shapes, for example square, sphere etc.
The preparation method of LED Optical devices shown in Figure 1 comprises the steps:
1. be equipped with earlier mould, described mould is supporting according to employed support 1;
2. support 1 is put into mould, described mould keeps with the different temperature of room temperature to 300 ℃ of selecting of moulding material, and support 1 is put into before the mould, and the electrode connecting line 20 and the electrode 10 of led chip 2 have connected;
3. the moulding material with optical lens 3 penetrates to the die cavity of mould by high pressure, makes material cured according to actual needs and becomes optical lens 3, demoulding then.
Above-mentioned moulding material can be silica gel, resin or other transparent polymer, and it generally is by heat cure in mould that moulding material solidifies, and according to the difference of selecting material, also can select ultraviolet irradiation curing, moisture curing etc. certainly.Optical lens 3 shown in Figure 1 is once molding formed.
The preparation method of LED Optical devices shown in Figure 2 and above-mentioned preparation method's difference are: described optical lens 3 comes compression molding at twice, and it is the internal layer of first compression molding optical lens 3, and then the skin of compression molding optical lens 3.The die cavity shape difference of above-mentioned twice employed mould of compression molding.
Have the situation of multilayer for optical lens 3, can make by compression molding repeatedly.If will prepare the optical lens that each layer has different refractivity, the optional usefulness of moulding material that each time compression molding is adopted has the material of the same type of different refractivity.If the refractive index of the moulding material that compression molding is formerly adopted is greater than the refractive index of the moulding material that adopts in the back compression molding, then the optical lens of the LED Optical devices of preparation refractive index from the inside to surface reduces by this method, can effectively photoconduction be gone out like this, reduce the light loss consumption that influences because of total reflection.
Above-mentioned optical lens 3 employed glue material hardness are calculated with the shore A of unit, need be greater than 30, calculate less than 70 with the shore D of unit, select hardness good in optical property, electric property good reliability and overall mechanical strength in the above-mentioned scope to be fit to, and external force is difficult for having influence on reliability of products.Employed material in visible-range iuuminting rate greater than 85%.
The optical lens 3 of LED Optical devices of the present invention is one-body molded, can promote the heat conductivility of LED Optical devices, reduces overall thermal resistance, and does not have the lamination problem between the interface, can promote reliability of products like this; Optical lens 3 is made up of the material of the same type of different refractivity from the inside to surface, can effectively derive light.
The preparation method of above-mentioned LED Optical devices is one-body molded with optical lens 3 by the mode of mold pressing, and processing ease can improve processing procedure efficient and yield.
The above only is preferred embodiment of the present invention, not in order to restriction the present invention, all any modifications of being done within the spirit and principles in the present invention, is equal to and replaces and improvement etc., all should be included within protection scope of the present invention.
Claims (15)
1. LED Optical devices, comprise support, led chip and optical lens, described support is provided with the luminous zone, described led chip is located in the luminous zone, described optical lens is located on the luminous zone, described led chip embeds in the optical lens, and it is connected with electrode on the support by electrode connecting line; It is characterized in that: described optical lens is formed in one.
2. LED Optical devices as claimed in claim 1 is characterized in that: described optical lens is that material of the same type is one-body molded.
3. LED Optical devices as claimed in claim 1 is characterized in that: the material of described optical lens is a transparent polymer.
4. LED Optical devices as claimed in claim 3 is characterized in that: the material of described optical lens is silica gel or resin.
5. as any described LED Optical devices in the claim 1 to 4, it is characterized in that: described optical lens is made up of the multilayer material of arranging from inside to outside.
6. LED Optical devices as claimed in claim 5 is characterized in that: described layers of material is the material of the same type of different refractivity, and the refractive index of described optical lens from internal layer to outer field layers of material reduces.
7. LED Optical devices as claimed in claim 5 is characterized in that: each of described optical lens layer shape and structure difference.
8. method for preparing the described LED Optical devices of claim 1 comprises the steps: and will be erected in the mould, and the moulding material of optical lens is penetrated to the die cavity of described mould by high pressure, treats the demoulding after the material cured.
9. the method for preparing the LED Optical devices as claimed in claim 7 is characterized in that: described optical lens is by repeatedly compression molding.
10. the method for preparing the LED Optical devices as claimed in claim 8 is characterized in that: the moulding material that each time compression molding is adopted is a material of the same type.
11. the method for preparing the LED Optical devices as claimed in claim 10 is characterized in that: the refractive index difference of each moulding material that adopts.
12. the method for preparing the LED Optical devices as claimed in claim 11 is characterized in that: the refractive index of the moulding material that compression molding is formerly adopted is greater than the refractive index of the moulding material that adopts in the back compression molding.
13. as any described method for preparing the LED Optical devices in the claim 7 to 12, it is characterized in that: described mould is according to the different temperature maintenances of selecting room temperature to 300 ℃ of moulding material.
14. as any described method for preparing the LED Optical devices in the claim 7 to 12, it is characterized in that: described moulding material solidifies by heat cure in described mould, or solidifies or moisture curing by ultraviolet irradiation.
15. as any described method for preparing the LED Optical devices in the claim 7 to 12, it is characterized in that: the hardness of described moulding material is calculated greater than 30 with the shore A of unit, calculate less than 70 with the shore D of unit, its light transmittance is greater than 85% in visible-range.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007100753330A CN101354123A (en) | 2007-07-27 | 2007-07-27 | LED optical apparatus and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007100753330A CN101354123A (en) | 2007-07-27 | 2007-07-27 | LED optical apparatus and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101354123A true CN101354123A (en) | 2009-01-28 |
Family
ID=40307060
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2007100753330A Pending CN101354123A (en) | 2007-07-27 | 2007-07-27 | LED optical apparatus and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101354123A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102278647A (en) * | 2011-08-31 | 2011-12-14 | 杭州海康威视数字技术股份有限公司 | LED (light-emitting diode) lamp panel |
| CN103681991A (en) * | 2013-12-20 | 2014-03-26 | 纳晶科技股份有限公司 | Silicone lens for LED (Light Emitting Diode) packaging and manufacturing method thereof |
| CN104033842A (en) * | 2014-06-30 | 2014-09-10 | 长城汽车股份有限公司 | Car lamp lens component and car with same |
| CN108006491A (en) * | 2017-11-28 | 2018-05-08 | 西安科锐盛创新科技有限公司 | Led tunnel lamp |
-
2007
- 2007-07-27 CN CNA2007100753330A patent/CN101354123A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102278647A (en) * | 2011-08-31 | 2011-12-14 | 杭州海康威视数字技术股份有限公司 | LED (light-emitting diode) lamp panel |
| CN102278647B (en) * | 2011-08-31 | 2014-02-26 | 杭州海康威视数字技术股份有限公司 | LED (light-emitting diode) lamp panel |
| CN103681991A (en) * | 2013-12-20 | 2014-03-26 | 纳晶科技股份有限公司 | Silicone lens for LED (Light Emitting Diode) packaging and manufacturing method thereof |
| CN104033842A (en) * | 2014-06-30 | 2014-09-10 | 长城汽车股份有限公司 | Car lamp lens component and car with same |
| CN104033842B (en) * | 2014-06-30 | 2017-12-15 | 长城汽车股份有限公司 | Lens of car light component and there is its automobile |
| CN108006491A (en) * | 2017-11-28 | 2018-05-08 | 西安科锐盛创新科技有限公司 | Led tunnel lamp |
| CN108006491B (en) * | 2017-11-28 | 2020-10-30 | 吉安建伟纸塑制品包装有限公司 | LED tunnel lamp |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101030611B (en) | Large-power light-emitting diodes gluing process | |
| WO2007089380A3 (en) | METHOD OF MAKING OPTICAL LIGHT ENGINES WITH ELEVATED LEDs AND RESULTING PRODUCT | |
| CN103939754A (en) | LED lamp and making method thereof | |
| CN103700654A (en) | LED (Light-Emitting Diode) based on COB (Chip On Board) package and manufacturing method thereof | |
| CN101354123A (en) | LED optical apparatus and preparation method thereof | |
| CN101276866B (en) | High power LED bracket as well as high power LED made by the same | |
| CN103872227A (en) | Method for manufacturing LED lamp filament light source capable of illuminating by 360 degrees | |
| EP3300127B1 (en) | Process method using thermoplastic resin photoconverter to bond-package led by rolling | |
| CN102264198A (en) | Electronic product shell structure and processing technique thereof | |
| CN102916006A (en) | Integrated high-power LED (Light Emitting Diode) light source with more than two convex mirrors and manufacturing process thereof | |
| CN102610602A (en) | High-resolution LED (light emitting diode) light source made of single-package-based material and manufacturing process of high-resolution LED light source | |
| CN102856478A (en) | Power type light-emitting diode, light-emitting diode bracket and preparation method thereof | |
| CN104167483B (en) | A kind of LED encapsulation structure and preparation method thereof | |
| CN102054546A (en) | Preparation method for rubber cable connector | |
| CN101442093A (en) | Encapsulation method for LED | |
| CN202888243U (en) | Power-type light emitting diode and light emitting diode support | |
| CN200997405Y (en) | Light emitting diode assembly with molded glass lens | |
| CN101752465B (en) | Packaging method of high-power light-emitting diode | |
| CN203644775U (en) | LED filament and lighting apparatus | |
| CN201773837U (en) | Lead frame for high-power MOS device | |
| CN201302997Y (en) | LED encapsulation structure | |
| CN102709440A (en) | Paster LED (light-emitting diode) support, paster LED manufacturing method and paster LED | |
| CN204118116U (en) | A kind of LED encapsulation structure | |
| CN201081147Y (en) | LED optical device | |
| CN211504447U (en) | Modular heat conduction temperature measurement sensor |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C12 | Rejection of a patent application after its publication | ||
| RJ01 | Rejection of invention patent application after publication |
Open date: 20090128 |