CN204118116U - A kind of LED encapsulation structure - Google Patents
A kind of LED encapsulation structure Download PDFInfo
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- CN204118116U CN204118116U CN201420473014.0U CN201420473014U CN204118116U CN 204118116 U CN204118116 U CN 204118116U CN 201420473014 U CN201420473014 U CN 201420473014U CN 204118116 U CN204118116 U CN 204118116U
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Abstract
The utility model discloses a kind of LED encapsulation structure, comprise LED support and LED chip, described LED support comprises shell and the metal pins be connected on the housing; Described shell arranges bowl-shape inner chamber, described LED chip is arranged on described bowl-shape intracavity bottom, described LED chip is electrically connected with described metal pins, be wrapped with epoxy molding plastic with the equal filling bag in periphery in the bowl-shape inner chamber of described shell, described metal pins bending contacts with the epoxy molding plastic of described housing peripheral.LED encapsulation structure of the present utility model, is convenient to improve the LED encapsulation structure obtaining various shapes structure and sizes flexibly, electric leakage, dead lamp condition improved, and homogeneity of product is better.
Description
[technical field]
The utility model relates to light-emitting diode, particularly relates to a kind of LED encapsulation structure.
[background technology]
Existing LED encapsulation structure is adopting surface mounted LED (SMD-LED) mainly.The packaged type of adopting surface mounted LED has support embedding type.The LED encapsulation structure of support embedding type comprises support, and as shown in Figure 1, be the structural representation of support, support comprises shell 100 and copper sheet pin 200.Shell 100 material is PPA plastic cement material, is provided with plastic bowl cup cavity, and in bowl cup cavity, die bond installs LED chip, obtains LED encapsulation structure after some liquid-state epoxy resin curing molding.This kind of LED encapsulation structure, easily produces the fatal hidden danger such as electric leakage, dead lamp.In addition, in bowl cup cavity point glue plane can because of glue amount number and occur that " recessed cup " " convex cup " is bad, product lighting angle, brightness are affected, and cannot accomplish consistent.And this kind of LED encapsulation structure is when preparing, shaping by an adhesive curing, make the construction profile comparatively fixed single of product, multiple application scenarios cannot be applicable to flexibly.And during existing preparation LED encapsulation structure, as the LED encapsulation structure of sizes will be prepared, the support of sizes size can only be prepared, and the development cost of support is large especially, when causing the LED encapsulation structure of producing sizes structure, production cost is very high.
[utility model content]
Technical problem to be solved in the utility model is: make up above-mentioned the deficiencies in the prior art, a kind of LED encapsulation structure is proposed, be convenient to improve the LED encapsulation structure obtaining various shapes structure and sizes flexibly, and LED encapsulation structure electric leakage, extremely lamp condition improved, and homogeneity of product is better.
Technical problem of the present utility model is solved by following technical scheme:
A kind of LED encapsulation structure, comprise LED support and LED chip, described LED support comprises shell and the metal pins be connected on the housing; Described shell arranges bowl-shape inner chamber, described LED chip is arranged on described bowl-shape intracavity bottom, described LED chip is electrically connected with described metal pins, be wrapped with epoxy molding plastic with the equal filling bag in periphery in the bowl-shape inner chamber of described shell, described metal pins bending contacts with the epoxy molding plastic of described housing peripheral.
The beneficial effect that the utility model is compared with the prior art is:
LED encapsulation structure of the present utility model, mould injecting glue curing molding is adopted to obtain, control the packing space of injecting glue, make to be wrapped with epoxy molding plastic with the equal filling bag in periphery in the bowl-shape inner chamber of the housing parts of LED support, the metal pins bending of LED support contacts with the epoxy molding plastic of housing peripheral.Like this, the humidity resistance that experimental verification obtains LED encapsulation structure of the present utility model is better than existing LED encapsulation structure, moisture, moisture effectively can be stoped to infiltrate the work of LED chip in the internal influence shell 100 of LED encapsulation structure by assembly junction, thus effectively improve electric leakage, dead lamp situation.LED encapsulation structure of the present utility model, by mould injecting glue, product shape consistency is good, thus emission uniformity is better, and by adjustment mold cavity structure shape, the production of the LED encapsulation structure of various shapes can be realized flexibly, and bed die can share, economical flexibly.And LED encapsulation structure of the present utility model, share a kind of LED support, change the size of mould, the LED encapsulation structure of sizes structure can be obtained, although need the development cost of mould, but mould development cost is well below LED support development cost, the production cost of the LED encapsulation structure preparing sizes is reduced greatly.
[accompanying drawing explanation]
Fig. 1 is the structural representation of the support in prior art in embedding type LED encapsulation structure;
Fig. 2 to Fig. 8 is preparation technology's flow chart of the LED encapsulation structure of the utility model embodiment one;
Fig. 9 is the structural representation after the LED encapsulation structure of the utility model embodiment one a kind of improves profile;
Figure 10 is the structural representation after the another kind improvement profile of the LED encapsulation structure of the utility model embodiment one
Figure 11 is the view that when preparing LED encapsulation structure in the utility model embodiment two, LED support puts into mould;
Figure 12 is the structural representation of LED encapsulation structure obtained in the utility model embodiment two.
[embodiment]
Contrast accompanying drawing below in conjunction with embodiment the utility model is described in further details.
As shown in Fig. 2 ~ 8, be preparation technology's flow chart of the LED encapsulation structure of this embodiment, comprise the following steps:
1) prepare LED support, described LED support comprises shell and the metal pins be connected on the housing, and described shell is provided with bowl-shape inner chamber.
As shown in Figure 2, be the structural representation of the LED support of preparation, top figure a is plan structure schematic diagram, and below figure b is vertical direction cross-sectional schematic.The metal pins 2 that LED support comprises shell 1 and is connected on shell 1, shell 1 is provided with bowl-shape inner chamber 10.The material of shell 1 can be PPA plastic cement material.The material of metal pins 2 can be copper product.
2) LED chip is fixed on described bowl-shape intracavity bottom.As shown in Figure 3, top figure a is plan structure schematic diagram, and below figure b is vertical direction cross-sectional schematic.R, G, B tri-kinds of LED chips 3 being fixed on the bottom of the bowl-shape inner chamber 10 of LED support, thus in LED support 1 bowl of cup, completing the fixing of R, G, B tri-kinds of LED chips, is also die bond.
3) nation fixed (bonding) LED chip, makes LED chip be electrically connected with metal pins.As shown in Figure 4, top figure a is plan structure schematic diagram, and below figure b is vertical direction cross-sectional schematic.For LED chip 3 welding lead 4, complete the nation fixed (bonding) of LED chip 3, realize the electrical connection between LED chip 3 electrode and metal pins.
4) by step 3) LED support that obtains loads in the inner chamber of the mould of heating and thermal insulation, compresses described mould and realize sealing.
5) inject epoxy molding plastic by the hole for injecting glue of described mould, make to be wrapped with epoxy molding plastic with the equal filling bag in periphery in the bowl-shape inner chamber of described shell, solidify described epoxy molding plastic.
6) open mould, take out described LED support, process the metal pins of described LED support, the epoxy molding plastic of described metal pins and described housing peripheral is contacted, obtained LED encapsulation structure
In this embodiment, step 1) in the metal pins of LED support for preparing be level, carry out step 4) to step 6) time, as shown in Fig. 5 to 8.LED support that is solid, that weld is loaded in the molding dies cavity of insulation, when loading LED support, keeps metal pins 2 to be level.Molding mould comprises mold 5 and bed die 6, and mold 5 and bed die 6 clamp the end of the metal pins 2 being in level, makes shell 1 unsettled in the inner chamber of mould, and the upper/lower die that closes compresses and realizes sealing.Mould offers respectively 2 hole for injecting glue k1, k2, epoxy molding plastic 7 is injected by 2 hole for injecting glue, fill full dies cavity room, thus be wrapped with epoxy molding plastic 7 with the equal filling bag in periphery in the bowl-shape inner chamber of shell 1, be filled with epoxy molding plastic in the bowl cup inner chamber being stressed that not only shell 1 herein, and the periphery of shell 1 is also all enclosed with epoxy molding plastic.Epoxy molding plastic 7 (Epoxy Molding Compound is called for short EMC) is matrix resin by epoxy resin, and be curing agent with High Performance Phenolic Resins, adding silicon powder etc. is filler, and adds the powdery moulding compound of multiple additive mixture.Be in solid-state under epoxy molding plastic normal temperature, before injection, at 130-160 DEG C, the pre-heat treatment is heated to form liquid state, then injects mould, through overcuring process after injection, gets final product curing molding after general 3-5min.Open mould, take out semi-finished product support, complete external pin bending and threshing, metal pins 2 is contacted towards the epoxy molding plastic that direction bends and shell 1 bottom periphery is wrapped up at shell 1 place, the surface welded LED encapsulating structure of obtained single.If batch production plurality of LEDs encapsulating structure, then connected together by connecting portion between multiple LED support before injecting glue.During mould injecting glue, connecting portion clamped by mould.After injecting glue completes, cut off connecting portion, remove connecting portion, then bend metal pins, namely obtain the surface welded LED encapsulating structure of single.
Fig. 8 is the schematic diagram of LED encapsulation structure obtained in the utility model embodiment, comprises LED support and LED chip, the metal pins 2 that LED support comprises shell 1 and is connected on shell 1.The material of shell 1 can be polyphthalamide resin PPA.Metal pins 2 can be silver-plated copper sheet.Shell 1 arranges bowl-shape inner chamber, and LED chip is arranged on bowl-shape intracavity bottom, particularly, is fixed on bowl-shape intracavity bottom by conductive silver glue.LED chip is electrically connected with metal pins 2, is wrapped with epoxy molding plastic 7 in the bowl-shape inner chamber of shell 1 with the equal filling bag in periphery, and metal pins 2 bends and contacts with the epoxy molding plastic 7 of shell 1 periphery.In this embodiment, metal pins 2 contacts towards the epoxy molding plastic 7 that direction bends and shell 1 bottom periphery is wrapped up of shell 1.
The cyclic test of " pressure cook red ink+thermal shock " is set, verifies the humidity resistance of the LED encapsulation structure of this embodiment.Experiment condition is: use high pressure accelerated testing cabinet, red ink and water ratio 1:1, pressure is 1Kg/cm
2, time 60min; Cold shock testing condition: use low temperature impact test box,-40 DEG C ± 2 DEG C (30min) ← → 100 DEG C ± 2 DEG C (30min), the LED encapsulation structure recording this embodiment can tolerate the loop test of 35 ~ 40 bouts, and traditional LED encapsulation structure only can tolerate the loop test about 12 ~ 16 bouts, shows that the humidity resistance of the LED encapsulation structure of this embodiment is more excellent.
LED encapsulation structure in this embodiment, for existing LED encapsulation structure, existing LED encapsulation structure, resin glue is only potted in bowl cup inner chamber by a glue mode, metal pins contacts with the PPA plastic cement of shell and combines, and in this embodiment, housing peripheral wraps up the integrated epoxy molding plastic of one deck entirely, metal pins contacts with peripheral epoxy molding plastic, may be poor due to the combination stability of metal pins and plastic cement, and the combination stability of metal pins and peripheral epoxy molding plastic is higher, so humidity resistance is better than the LED encapsulation structure of existing structure, thus effectively can stop moisture, moisture infiltrates the inside of LED encapsulation structure by the junction of metal pins and shell, affect the work of LED chip in shell, thus effectively improve electric leakage, dead lamp situation.By the LED encapsulation structure that preparation method of the present utility model obtains, by mould injecting glue, product shape consistency is good, thus emission uniformity is better, and by adjustment mold cavity structure shape, can realize the production of the LED encapsulation structure of various shapes flexibly, and bed die can share, economical flexibly.In addition, when the preparation method of this embodiment prepares sizes structure, during 3.0 × 3.0,3.5 × 2.8,3.5 × 3.5 and 4.0 × 4.0 4 kinds of sizes of such as standard, only need the mould of a kind of LED support and four kinds of sizes to obtain.During relative to existing preparation four kinds of sizes, need exploitation four kinds of corresponding LED supports of size, and the development cost of support is far away higher than the development cost of mould, therefore, the preparation method of this embodiment is preparing in the LED encapsulation structure of sizes, cost effectively reduces, and is particularly suitable for actual applying.
Preferably, after the shape of adjustment mold cavity structure, two kinds of LED encapsulation structure improved as shown in Figure 9 and Figure 10 can be obtained.These the two kinds LED encapsulation structure improved, epoxy molding plastic top is protruding arc convex lens structures 9.Arc convex lens structures 9 shown in Fig. 9, can utilize concentrating light principles, realize optically focused, thus promotes the luminosity of LED encapsulation structure.And the contour structures of Figure 10, except the arc convex lens structures 9 at top make luminosity better except, whole contour structures is close to the profile of direct insertion LED encapsulation structure, and now LED outdoor display screen is the most widely used is exactly straight cutting LED profile, therefore product replaceable straight cutting LED outline packages structure, more easily promote the use of, be easier to be accepted by LED distributors.
Further preferably, as shown in Figure 2, bottom shell 1, the region of corresponding bowl-shape inner chamber 10 offers pod apertures 11, like this, step 5) after injecting glue, the epoxy molding plastic of filling in bowl-shape inner chamber 10 is communicated with by pod apertures 11 with the epoxy molding plastic that the periphery of shell 1 is wrapped up, such epoxy molding plastic is all connected inside and outside LED support, more effectively can protect the LED chip of LED encapsulation structure inside, and pod apertures 11 be arranged so that injecting glue time epoxy molding plastic packing space be communicated with, so also can effectively solve in injecting glue process interior lack, cavity, air bubble problem.
LED chip 3 comprises red LED chip, green LED chip and blue-light LED chip, and preferably, red LED chip, green LED chip and blue-light LED chip are arranged in a row at bowl cup intracavity bottom successively.Still more preferably, as shown in Figures 2 to 4, the metal pins 2 of LED support is arranged by five pin distributions, wherein, two pins are connected with the positive pole of red LED chip, negative electricity respectively, a pin is electrically connected with the positive pole of green LED chip and blue-light LED chip simultaneously, and two other pin is connected with the negative pole of green LED chip, the negative electricity of blue-light LED chip respectively.Also be, red, green, blue LED chip is set gradually from top to bottom in Fig. 4, the negative pole R-of upper left pin and the corresponding red LED chip of upper right pin difference, positive pole R+, the positive pole G+ of the corresponding green LED chip of left pin, the B+ of blue-light LED chip, the negative pole B-of the corresponding blue-light LED chip of lower-left pin, the negative pole G-of the corresponding green LED chip of bottom right pin.Like this, arrange relative to existing positive three negative four pins distributions, during power supply, positive pole all provides the voltage of 2.8 ~ 3.4V, and a resistance step-down of connecting in circuit corresponding to red light negative pole, make red light cathode voltage at 1.9 ~ 2.3V, thus red light normally work.But, although control conveniently, due to lossy on resistance, to cause the energy consumption of LED encapsulation structure higher.And during this preferably arranges, made a distinction by R+ positive pole, G+ and B+ still supplies the voltage of 2.8 ~ 3.4V, and R+ then controls separately, provides 1.9 ~ 2.3V voltage simultaneously, directly can meet application requirement without the need to arranging resistance step-down, the overall power consumption of LED can be reduced.
When arranging by five pin distributions, the described metal pins be connected with the negative electricity of described green LED chip, also namely the area of bottom right pin is greater than the area of other metal pins.In LED encapsulation structure embody rule, the luminosity ratio of R, G, B tri-LED chips is generally 3:6:1, and namely the luminosity of green LED chip requires the highest, and electric current is maximum, generates heat maximum.When five pin configuration arrange metal pins, the area of metal pins corresponding for green LED chip negative pole is arranged larger, can thermolysis be increased, thus make power consumption lower.
Embodiment two
This embodiment is with the difference of execution mode one: the metal pins of the LED support of preparation is bending state, and correspondingly, during preparation process, mould holding state is different.
In the preparation method of this embodiment LED encapsulation structure, preparation process is identical with embodiment one, just step 1) in the metal pins of LED support for preparing be bending state, correspondingly step 4) in the concrete state of LED support in mould cavity slightly different, step 6) in process slightly different.Only be described in detail for this difference part as follows.
In this embodiment, carry out step 4) time, as shown in figure 11.Load in the molding dies cavity of insulation by LED support that is solid, that weld, during loading LED support, metal pins 21 is bending state, and metal pins 2 bends towards the direction away from shell 1 place, forms the L shape structure that left and right is relative.Molding mould comprises mold 51 and bed die 61, and mold 51 and bed die 61 clamp the horizontal end that metal pins 21 bends, and make shell 1 unsettled in the inner chamber of mould, and the upper/lower die that closes compresses and realizes sealing.During injecting glue, similarly, mould offers respectively 2 hole for injecting glue, inject epoxy molding plastic by 2 hole for injecting glue, fill full dies cavity room, thus be wrapped with epoxy molding plastic with the equal filling bag in periphery in the bowl-shape inner chamber of shell 1.After injecting epoxy molding plastic, solidification process, makes epoxy molding plastic curing molding.Open mould, take out semi-finished product support, remove the part do not contacted with epoxy molding plastic in metal pins 21, threshing, the SMD-LED encapsulating structure of obtained single, as shown in figure 12, in LED encapsulation structure, namely metal pins 21 is that the epoxy molding plastic 7 wrapped up towards direction bending and shell 1 top peripheral away from shell 1 contacts.
The LED encapsulation structure of this embodiment, that housing peripheral wraps up one deck epoxy molding plastic entirely equally, metal pins contacts with peripheral epoxy molding plastic, the combination stability of metal pins and peripheral epoxy molding plastic is higher, so humidity resistance is better than the LED encapsulation structure of existing structure, thus can effectively stop moisture, moisture to infiltrate the inside of LED encapsulation structure by the junction of metal pins and shell, affect the work of LED chip in shell, thus effectively improve electric leakage, dead lamp situation.By the LED encapsulation structure that preparation method of the present utility model obtains, by mould injecting glue, product shape consistency is good, thus emission uniformity is better, and by adjustment mold cavity structure shape, can realize the production of the LED encapsulation structure of various shapes flexibly, and bed die can share, economical flexibly.And preparing in the LED encapsulation structure of sizes, saved main LED support development cost, cost effectively reduces.
Above content is in conjunction with concrete preferred implementation further detailed description of the utility model, can not assert that concrete enforcement of the present utility model is confined to these explanations.For the utility model person of an ordinary skill in the technical field, make some substituting or obvious modification without departing from the concept of the premise utility, and performance or purposes identical, all should be considered as belonging to protection range of the present utility model.
Claims (10)
1. a LED encapsulation structure, is characterized in that: comprise LED support and LED chip, and described LED support comprises shell and the metal pins be connected on the housing; Described shell arranges bowl-shape inner chamber, described LED chip is arranged on described bowl-shape intracavity bottom, described LED chip is electrically connected with described metal pins, be wrapped with epoxy molding plastic with the equal filling bag in periphery in the bowl-shape inner chamber of described shell, described metal pins bending contacts with the epoxy molding plastic of described housing peripheral.
2. LED encapsulation structure according to claim 1, it is characterized in that: described metal pins contacts towards the epoxy molding plastic that direction bends and described outer casing bottom periphery is wrapped up of described shell, or described metal pins bends towards the direction away from described shell and the peripheral epoxy molding plastic wrapped up of described shell upper contacts.
3. LED encapsulation structure according to claim 1, it is characterized in that: the region of the corresponding described bowl-shape inner chamber of described outer casing bottom offers pod apertures, and the epoxy molding plastic of filling in described bowl-shape inner chamber is communicated with by described pod apertures with the epoxy molding plastic that the periphery of described shell is wrapped up.
4. LED encapsulation structure according to claim 1, is characterized in that: the epoxy molding plastic top of described housing peripheral parcel is protruding arc convex lens structures.
5. LED encapsulation structure according to claim 1, is characterized in that: described LED chip comprises red LED chip, green LED chip and blue-light LED chip; Described metal pins is arranged by five pin distributions, wherein two pins are connected with the positive pole of described red LED chip, negative electricity respectively, a pin is electrically connected with the positive pole of described green LED chip and described blue-light LED chip simultaneously, and two other pin is connected with the negative pole of described green LED chip, the negative electricity of described blue-light LED chip respectively.
6. LED encapsulation structure according to claim 5, is characterized in that: the area of the described metal pins be connected with the negative electricity of described green LED chip is greater than the area of other metal pins.
7. LED encapsulation structure according to claim 5, is characterized in that: described red LED chip, green LED chip and blue-light LED chip are arranged in a row at described bowl-shape intracavity bottom successively.
8. LED encapsulation structure according to claim 1, is characterized in that: described LED chip is fixed on described bowl-shape intracavity bottom by conductive silver glue.
9. LED encapsulation structure according to claim 1, is characterized in that: described metal pins is silver-plated copper sheet.
10. LED encapsulation structure according to claim 1, is characterized in that: the material of described shell is polyphthalamide resin.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420473014.0U CN204118116U (en) | 2014-08-19 | 2014-08-19 | A kind of LED encapsulation structure |
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| CN201420473014.0U CN204118116U (en) | 2014-08-19 | 2014-08-19 | A kind of LED encapsulation structure |
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| CN204118116U true CN204118116U (en) | 2015-01-21 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104167483B (en) * | 2014-08-19 | 2017-07-28 | 深圳市丽晶光电科技股份有限公司 | A kind of LED encapsulation structure and preparation method thereof |
| WO2018133189A1 (en) * | 2017-01-18 | 2018-07-26 | 中山市雄纳五金照明科技有限公司 | Surface-mounted led lamp and manufacturing method therefor |
-
2014
- 2014-08-19 CN CN201420473014.0U patent/CN204118116U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104167483B (en) * | 2014-08-19 | 2017-07-28 | 深圳市丽晶光电科技股份有限公司 | A kind of LED encapsulation structure and preparation method thereof |
| WO2018133189A1 (en) * | 2017-01-18 | 2018-07-26 | 中山市雄纳五金照明科技有限公司 | Surface-mounted led lamp and manufacturing method therefor |
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Address after: 518103 Guangdong, Shenzhen City, Guangdong Province, Baoan District Fuyong street oyyip road Xu Yuchang Industrial Park, B2 Patentee after: Shenzhen Lightking Technology Co., Ltd. Address before: 518103 Shenzhen, Guangdong, Fuyong street and the Far East Industrial Zone, the new building of the third Baoan District Patentee before: Shenzhen Lightking Technology Co., Ltd. |
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