CN101442093A - Encapsulation method for LED - Google Patents
Encapsulation method for LED Download PDFInfo
- Publication number
- CN101442093A CN101442093A CNA2008101245320A CN200810124532A CN101442093A CN 101442093 A CN101442093 A CN 101442093A CN A2008101245320 A CNA2008101245320 A CN A2008101245320A CN 200810124532 A CN200810124532 A CN 200810124532A CN 101442093 A CN101442093 A CN 101442093A
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- substrate
- led chip
- led
- package support
- glue
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- Packaging Frangible Articles (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses an LED packaging method, which comprises the following steps: a, providing a packaging bracket or a substrate, wherein the packaging bracket or the substrate comprises a first electrode and a second electrode which are adjacent; b, fixing a chip, wherein an LED chip is fixed on the packaging bracket or the substrate; c, welding a wire, wherein the anode and the cathode of the LED chip are connected with the first electrode and the second electrode on the packaging bracket or the substrate respectively; and d, sealing with glue, wherein pointing glue in the places in which the LED chip is arranged on the surface of the packaging bracket or the substrate, and forming a packaging shell through bakeout. The method packages the LED chip through pointing gum, does not need to inject the glue in a reflection cavity of a mould, decreases the using amount of the glue, and saves the mould, so as to lower the cost of products and simplify the processing technique.
Description
Technical field
The present invention relates to a kind of LED method for packing.
Background technology
The LED light-emitting diode is a kind of solid-state semiconductor device, and it can directly be converted into light to electricity.Led light source have use low-tension supply, power consumption less, advantages such as strong, the stability height of applicability, response time weak point, environmentally safe, energy savings, though the existing illuminating equipment costliness of price, still be considered to it and will substitute existing illuminating device inevitably, at present, LED is widely used as new light source.
The conventional method for packing of existing LED: 1, provide package support or substrate, this package support or substrate comprise the first adjacent electrode and second electrode; 2, solid brilliant, led chip is fixed on package support or the substrate; 3, bonding wire links to each other the positive and negative electrode of led chip respectively with first, second electrode on package support or the substrate; 4, sealing, this sealing mode is improved emphasis, traditional its step of sealing mode is as follows: the package support or the substrate that will be connected with led chip are earlier put in the dies cavity with predetermined switch, and with die sealing; Then the hand-hole of encapsulating material from mould injected in the mould, carry out natural cooling at last, this method for packing need be made mould, thereby has increased cost.
Recently, new method has been appearred again in the sealing of the step 4 in the above-mentioned steps, its step is as follows: earlier with injection ring epoxy resins in the mould reflection cavity, vacuumizing and defoaming forms package casing, will weld the package support of line or the package casing combination back oven dry of substrate and formation then.The product that adopts this LED method for packing to make is easy to generate heat radiation and the not good shortcoming of luminous efficiency; And when module spliced is connected into LED display, since package casing be by in the mould reflection cavity, inject a large amount of epoxy resin again vacuumizing and defoaming form, its thickness and weight are all bigger, thereby the thickness and the weight of whole module have been increased, when a plurality of module spliced are connected together, the weight of entire display screen can reach 15 kilograms/square metre, thereby has increased the weight of whole LED display screen, and just product is installed inconvenient; Because the filler that injects in the mould reflection cavity all is made up of epoxy resin, has improved manufacturing cost greatly; Because, by a reflection cavity and whole package support or substrate is combined that led chip is carried out overall package, therefore in test or use, in case dead lamp of the LED of some points or reverse leakage on package support or the substrate, entire product will be removed, can't independently repair with regard to the place of damaging, thereby cause entire product to scrap, the waste resource.
Summary of the invention
Technical problem to be solved by this invention provides a kind of LED method for packing, the product weight of making by this method for packing light, cheap for manufacturing cost and use or test process in, if the dead lamp of LED or the reverse leakage of certain point all can be carried out independent reparation on package support or the substrate, saved the energy.
In order to overcome above-mentioned technical problem, a kind of LED method for packing of the present invention comprises the steps: a, package support or substrate is provided, and this package support or substrate comprise the first adjacent electrode and second electrode; B, solid brilliant is fixed in led chip on package support or the substrate; C, bonding wire link to each other the positive and negative electrode of led chip respectively with first, second electrode on package support or the substrate; D, sealing have the place point glue of led chip on package support or substrate surface, form package casing through overbaking.
Above-mentioned a kind of LED method for packing, wherein, sealing comprises the steps: d1, will encapsulate glue decanting point adhesive dispenser; D2, by point glue equipment with the packaging plastic water spot on led chip, d3, baking are put into apparatus for baking with the package support behind the glue or substrate and are toasted, and form in package casing is coated on led chip, stoving time is 5 hours, and baking temperature is 80 degrees centigrade to 100 degrees centigrade.
Above-mentioned a kind of LED method for packing, wherein, described baking temperature is preferably 90 degrees centigrade.
Above-mentioned a kind of LED method for packing, wherein, described package casing is hemisphere.
Above-mentioned a kind of LED method for packing, wherein, encapsulation glue is epoxy resin.
Compare with existing LED method for packing, the LED method for packing that the present invention adopts, by the place point glue of led chip is arranged on package support or substrate, the baking back forms package casing, just need not to fill with in the mould reflection cavity encapsulation glue, reduced the use amount of encapsulation glue, greatly reduce production cost of products, and also no longer need to have used mould, saved input mould, not only reduce production cost, and simplified production technology; In addition, when module is formed LED display, the weight of LED display can be reduced to 3 kilograms/square metre by original 15 kilograms/square metre, thereby reduce the weight of product greatly, make things convenient for the installation of product; Owing to be by forming package casing at the place point glue that led chip is arranged, all there is an independently package casing each led chip periphery like this, in use or test process, if dead lamp or leaky appear in the led chip of certain point on package support or the substrate, just certain can be put the corresponding package casing dismounting of led chip keeps in repair separately, thereby avoid causing scrapping of entire product, saved the energy; Moreover, can play the effect of good printing opacity and protection led chip because described package casing is hemisphere, improve luminous efficiency and the heat dispersion of LED, thereby prolonged the useful life of LED.
Description of drawings
Fig. 1 is a process chart of the present invention
Fig. 2 is a plan structure schematic diagram of the present invention
Fig. 3 is an end view of the present invention
Fig. 4 is the A-A profile of Fig. 3
Embodiment
The invention will be further described below in conjunction with accompanying drawing.
As Fig. 2, Fig. 3, shown in Figure 4, in order to overcome above-mentioned technical problem, a kind of LED method for packing of the present invention comprises the steps: a, package support or substrate 1 is provided, and this package support or substrate 1 comprise the first adjacent electrode and second electrode; B, solid brilliant is fixed in led chip 3 on package support or the substrate 1; C, bonding wire link to each other the positive and negative electrode of led chip 3 respectively with first, second electrode on package support or the substrate 1; D, sealing, package support or substrate 1 are toasted the back and are formed package casing 2 on led chip 3 surfaces at the place point glue that led chip 3 is arranged, led chip 3 is wrapped.In the above-mentioned steps, first three step is identical with the step of existing method for packing, and last step is that sealing then is the key step that the present invention is different from existing method for packing, below is that sealing is elaborated with regard to steps d.
In the encapsulation glue decanting point adhesive dispenser that among the present invention, the steps d sealing comprises the steps: d1, will modulate earlier; D2, the place that by point glue equipment the packaging plastic water spot is had led chip 3 then on package support or substrate 1 surface, d3, baking, package support behind the glue or substrate 1 are put into apparatus for baking to be toasted, in formation package casing 2 is coated on led chip 3, stoving time is 5 hours, baking temperature is 80 degrees centigrade to 100 degrees centigrade, in order to make the better effects if of encapsulation, can be set to 90 degrees centigrade by described baking temperature, wherein, encapsulation glue is unrestricted, can adopt that flowable normal transparent plastics are raw material after the heat fused, also prior glue through preparation, in the present embodiment, in order to improve the packaging effect of LED, packaging plastic hydromining epoxy resin, epoxy resin need not to heat or other processing when using, can use under the normal temperature state, it is unrestricted to put the used point glue equipment of glue, for easy to process, reduce cost, what the point glue equipment of present embodiment adopted is ordinary syringe; The place point glue of led chip 3 on package support or substrate 1, package casing 2 its shapes that baking forms can be dome, also can be concave crown, or other shapes, for convenient for production, improve the luminous efficiency and the heat dispersion of led chip 3, make package casing 2 have good light transmittance, in the present embodiment, package casing 2 is hemisphere.This LED method for packing that adopts, by the place point glue of led chip 3 is arranged on package support or substrate 1, the baking back forms package casing 2, just need not in the mould reflection cavity, to fill with encapsulation glue, reduced the use amount of encapsulation glue, greatly reduce production cost of products, reduced the weight of product greatly.
Contact fully with second electrode for fear of first electrode owing to package support or substrate 1, led chip 3 can not be worked by short circuit, can carry out before described step 1 provides package support or substrate 1, package support or the substrate 1 that connects led chip 3 carried out preliminary treatment, this pre-treatment step is as follows: at first package support or substrate 1 are soaked in a period of time in the epoxy resin solution, putting into baking oven then dries, make epoxy resin between first electrode of package support or substrate 1 and second electrode tip, form insulating barrier, above-mentioned immersion process required time is 1-2 second, and bake out temperature is when being 130 degrees centigrade, and drying time is 40-60 minute; When bake out temperature was 150 degrees centigrade, required drying time was 30 minutes, and bake out temperature suitably increases corresponding minimizing of the time that can make baking needed, but also can produce harmful effect to the insulation layer structure that forms, and therefore, baking temperature can not be too high.
First electrode in the above-mentioned method for packing on package support or the substrate 1 and second electrode are made of two socket pins 4 respectively, earlier contact pin 4 is inserted package support or substrate 1 two ends, and then by pressure apparatus contact pin 4 is crimped on described package support or the substrate 1, this two sockets pin 4 is used for transmitting signal.
In sum, the method for packing of a kind of LED of the present invention, the overall craft flow process is as shown in Figure 1.The present invention's main characteristics the most is to adopt the place that directly glue spots is had led chip 3 on package support or substrate 1 surface; utilize the surface tension baking back of glue to form package casing 2 on led chip 3 surfaces; LED core 3 is wrapped; reach the purpose of encapsulation; form the effect that hemisphere can play good printing opacity and protection led chip 3; these package casing 2 manufacturing process; saved the mould that is used for sealing for a long time; saved production cost greatly; simplified production technology; improved production efficiency; in addition; owing to be by forming package casing 1 at the place point glue that led chip 3 is arranged; all there is an independently package casing 2 each led chip 3 periphery like this; in use or test process; if dead lamp or leaky appear in the led chip 3 of certain point on package support or the substrate 1; just the led chip 3 pairing package casings 2 of corresponding certain point can be removed and keep in repair separately; specially it is repaired; thereby avoid causing scrapping of entire product, prolonged the useful life of product.
Here description of the invention and application is illustrative, is not to want that therefore, the present invention is not subjected to the restriction of present embodiment with scope restriction of the present invention in the above-described embodiments, and the technical scheme that any employing equivalence replacement obtains is all in the scope of protection of the invention.
Claims (5)
1, a kind of LED method for packing comprises the steps:
A, provide package support or substrate (1), this package support or substrate (1) comprise the first adjacent electrode and second electrode;
B, solid brilliant is fixed in led chip (3) on package support or the substrate (1);
C, bonding wire link to each other the positive and negative electrode of led chip (3) respectively with first, second electrode on package support or the substrate (1);
D, sealing are encapsulated in led chip (3) on package support or the substrate (1);
It is characterized in that described sealing is included in the place point glue that led chip (3) is arranged on package support or the substrate (1), form package casing (2) through overbaking.
2, a kind of according to claim 1 LED method for packing is characterized in that, described steps d sealing comprises the steps:
D1, will encapsulate glue decanting point adhesive dispenser;
D2, the packaging plastic water spot there is the place of led chip (3) on package support or substrate (1) surface by point glue equipment,
D3, baking are put into apparatus for baking with the package support behind the glue or substrate (1) and are toasted, and form package casing (2), and in led chip (3) was coated on, stoving time was 5 hours, and baking temperature is 80 degrees centigrade to 100 degrees centigrade.
3, as a kind of LED method for packing as described in the claim 2, it is characterized in that described baking temperature is preferably 90 degrees centigrade.
4, as a kind of LED method for packing as described in the claim 2, it is characterized in that described encapsulation glue is epoxy resin.
5, a kind of as claimed in claim 1 or 2 LED method for packing is characterized in that, described package casing (2) is hemisphere.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2008101245320A CN101442093A (en) | 2008-08-22 | 2008-08-22 | Encapsulation method for LED |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2008101245320A CN101442093A (en) | 2008-08-22 | 2008-08-22 | Encapsulation method for LED |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101442093A true CN101442093A (en) | 2009-05-27 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2008101245320A Pending CN101442093A (en) | 2008-08-22 | 2008-08-22 | Encapsulation method for LED |
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| CN (1) | CN101442093A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101807658A (en) * | 2010-03-25 | 2010-08-18 | 福建中科万邦光电股份有限公司 | High power LED encapsulating method |
| CN102632023A (en) * | 2011-02-14 | 2012-08-15 | 展晶科技(深圳)有限公司 | Dispensing process for LED (light-emitting diode) encapsulation |
| CN102732158A (en) * | 2012-06-26 | 2012-10-17 | 深圳市瑞丰光电子股份有限公司 | Solid crystal glue and LED packaging method |
| CN105118909A (en) * | 2015-07-31 | 2015-12-02 | 苏州南光电子科技有限公司 | Vacuum defoaming method during direct insert type LED lamp gluing packaging process |
| CN107331756A (en) * | 2017-07-21 | 2017-11-07 | 湖南粤港模科实业有限公司 | A kind of radiator and chip integrative packaging light-source structure |
| CN113206182A (en) * | 2021-04-29 | 2021-08-03 | 苏州东岩电子科技有限公司 | Method for replacing LED particles of LED light-emitting device |
-
2008
- 2008-08-22 CN CNA2008101245320A patent/CN101442093A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101807658A (en) * | 2010-03-25 | 2010-08-18 | 福建中科万邦光电股份有限公司 | High power LED encapsulating method |
| CN101807658B (en) * | 2010-03-25 | 2012-11-21 | 福建中科万邦光电股份有限公司 | High power LED encapsulating method |
| CN102632023A (en) * | 2011-02-14 | 2012-08-15 | 展晶科技(深圳)有限公司 | Dispensing process for LED (light-emitting diode) encapsulation |
| CN102632023B (en) * | 2011-02-14 | 2014-11-05 | 展晶科技(深圳)有限公司 | Dispensing process for LED (light-emitting diode) encapsulation |
| CN102732158A (en) * | 2012-06-26 | 2012-10-17 | 深圳市瑞丰光电子股份有限公司 | Solid crystal glue and LED packaging method |
| CN105118909A (en) * | 2015-07-31 | 2015-12-02 | 苏州南光电子科技有限公司 | Vacuum defoaming method during direct insert type LED lamp gluing packaging process |
| CN107331756A (en) * | 2017-07-21 | 2017-11-07 | 湖南粤港模科实业有限公司 | A kind of radiator and chip integrative packaging light-source structure |
| CN113206182A (en) * | 2021-04-29 | 2021-08-03 | 苏州东岩电子科技有限公司 | Method for replacing LED particles of LED light-emitting device |
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| PB01 | Publication | ||
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Open date: 20090527 |