CN209729905U - A kind of high voltage optocoupler encapsulating structure - Google Patents
A kind of high voltage optocoupler encapsulating structure Download PDFInfo
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- CN209729905U CN209729905U CN201920843485.9U CN201920843485U CN209729905U CN 209729905 U CN209729905 U CN 209729905U CN 201920843485 U CN201920843485 U CN 201920843485U CN 209729905 U CN209729905 U CN 209729905U
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- packaging glue
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Abstract
The utility model provides a kind of high voltage optocoupler encapsulating structure, including first support and second support, infrared LEDs are provided at the top of the first support, layer of silica gel is wrapped with outside the infrared LEDs, receipts optical chip is provided at the top of the second support, it is also enclosed with one layer of interior plastic packaging glue-line with translucency outside the layer of silica gel and receipts optical chip, the outer plastic packaging glue-line of a black is also wrapped with outside the interior plastic packaging glue-line；The interior plastic packaging film surface is wrinkled surface；The section of the wrinkled surface is waveform.The utility model can effectively increase the conjugation of inside and outside plastic packaging colloid to avoid delamination generation.
Description
Technical field
The utility model relates to LED light production technical field, especially a kind of high voltage optocoupler encapsulating structure, the encapsulation knot
Structure can apply to power management: such as charger, transformer and new energy application: such as photovoltaic power generation, electric vehicle.
Background technique
Existing high voltage optocoupler encapsulating structure be mostly have pinned encapsulation design, at present mainstream be divided into up and down it is vertical with
Secondary plastic plane formula.And existing interior plastic packaging glue design surface is planar design, if inside and outside plastic packaging glue because production or other
Factor leads to the problem of delamination problems then and will lead to product insulation distance deficiency.And high pressure resistant insulation device, insulation effect with
Outer/inner insulation distance is positively correlated, and exterior insulation distance is because product appearance shape and size fixation can not optimize, but inside
In addition insulation size can optimize in design alteration；Therefore, this patent proposes a kind of high voltage optocoupler encapsulating structure.
Summary of the invention
In order to overcome the problems referred above, the purpose of the utility model is to provide a kind of high voltage optocoupler encapsulating structure, inside and outside increase
The conjugation of plastic packaging colloid is to avoid delamination generation.
The utility model is realized using following scheme: a kind of high voltage optocoupler encapsulating structure, including first support and second
Bracket, the first support top are provided with infrared LEDs, layer of silica gel, the second support are wrapped with outside the infrared LEDs
Top is provided with receipts optical chip, is also enclosed with one layer of interior plastic packaging glue-line with translucency outside the layer of silica gel and receipts optical chip,
The outer plastic packaging glue-line of a black is also wrapped with outside the interior plastic packaging glue-line；The interior plastic packaging film surface is wrinkled surface；The fold
The section in face is waveform.
Further, the first support and second support oppose setting up and down, and the infrared LEDs are set to first
Below top of the trellis, the layer of silica gel is located at below first support, and the receipts optical chip is set to second support over top；It is described
Surface is wrinkled surface above and below interior plastic packaging glue-line.
Further, the first support and second support are located at same level, and the infrared LEDs are set to first
Below cradle top, the layer of silica gel is located at below first support, and the receipts optical chip is set to lower section at the top of second support, makes
It obtains infrared LEDs and receives optical chip and be located at same level；One is provided with below the interior plastic packaging glue-line with translucency thoroughly
Mirror, the interior plastic packaging glue-line overhead surface are wrinkled surface；The interior plastic packaging glue-line and lens are wrapped in the outer plastic packaging of the black
In glue-line.
Further, the lens are shaped form lens.
Further, the lens are hemispherical.
The utility model has the beneficial effects that: the utility model is also enclosed with one layer of tool outside layer of silica gel and receipts optical chip
There is the interior plastic packaging glue-line of translucency, the outer plastic packaging glue-line of a black is also wrapped with outside the interior plastic packaging glue-line；The interior plastic packaging glue-line
Surface is wrinkled surface；The section of the wrinkled surface is waveform.Plastic packaging glue-line and the outer plastic packaging glue-line of black are due to fold in this way
Relation of plane conjugation will increase, to avoid the generation of delamination, improve the quality of product.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the first embodiment of the utility model.
Fig. 2 is the structural schematic diagram of the second embodiment of the utility model.
Specific embodiment
The utility model is described further with reference to the accompanying drawing.
Refering to Figure 1, a kind of high voltage optocoupler encapsulating structure of the first embodiment of the utility model, including first
Frame 1 and second support 2 are provided with infrared LEDs 3 at the top of the first support 1, are wrapped with layer of silica gel outside the infrared LEDs 3
4, be provided at the top of the second support 2 and receive optical chip 5, the layer of silica gel 4 and receiving also be enclosed with outside optical chip 5 one layer have it is saturating
The interior plastic packaging glue-line 6 of photosensitiveness, plastic packaging glue-line 6 dissipates outward in the light-transmissive that such infrared LEDs 3 issue；The interior plastic packaging
The outer plastic packaging glue-line 7 of a black is also wrapped with outside glue-line 6；The outer plastic packaging glue-line 7 of the black can avoid existing plastic packaging optocoupler encapsulation knot
Structure is that the white light transmission problem that is relatively also easy to produce causes optocoupler assembly can probability generation current leakage because of outer layer plastic packaging glue.The interior modeling
6 surface of adhesive layer is wrinkled surface 61；The section of the wrinkled surface is waveform.Plastic packaging glue-line and the outer plastic packaging glue-line of black in this way
Since fold relation of plane conjugation will increase, to avoid the generation of delamination, the quality of product is improved.This is practical new
Type can effectively increase distance between two endpoint S；As shown in Figure 1, the length that the wrinkled surface between two endpoint S is combined into is light
Coupling encapsulate built-in electrical insulation distance, distance it is longer to optocoupler high-voltage isulation effect all the more；This can be effectively increased by increasing fold design
Segment length.
In the present embodiment, the first support 1 and the opposition setting of about 2 second support, the infrared LEDs 3 are arranged
In 1 top lower section of first support, the layer of silica gel 4 is located at 1 lower section of first support, and the receipts optical chip 5 is set to second support 2
Over top；Surface is wrinkled surface 61 above and below the interior plastic packaging glue-line 6.
Please refer to be shown in Fig. 2 the utility model second embodiment, the difference of the second embodiment and first embodiment
Be: the first support 1 and second support 2 are located at same level, and the infrared LEDs 3 are set to 1 top of first support
Lower section, the layer of silica gel 4 are located at 1 lower section of first support, and the receipts optical chip 5 is set to 2 top lower section of second support, so that red
Outside line LED3 and receipts optical chip 5 are located at same level；Plane formula support Design be avoided that deformation of timbering cause built-in electrical insulation away from
From unstable and then cause optocoupler high pressure resistant property abnormal；One is provided with below the interior plastic packaging glue-line 6 with translucency thoroughly
Mirror 8, interior 6 overhead surface of plastic packaging glue-line are wrinkled surface 61；The interior plastic packaging glue-line 6 and lens 8 are wrapped in the black
In outer plastic packaging glue-line 7.The wrinkled surface will increase the conjugation between interior plastic packaging glue-line and the outer plastic packaging glue-line of black, to avoid taking off
The generation of layer phenomenon, improves the quality of product.
In this second embodiment, the lens 8 are shaped form lens.In addition, the lens are hemispherical.The lens 8
It can increase the light gathering of optocoupler encapsulating structure.
In short, the utility model is also enclosed with one layer of interior plastic packaging glue with translucency outside layer of silica gel and receipts optical chip
Layer, the interior plastic packaging glue-line are also wrapped with the outer plastic packaging glue-line of a black outside；The interior plastic packaging film surface is wrinkled surface；The wrinkle
The section of folding face is waveform.Plastic packaging glue-line is with the outer plastic packaging glue-line of black since fold relation of plane conjugation can increase in this way
Add, to avoid the generation of delamination, improves the quality of product.
The above is only the preferred embodiment of the present invention, it is all done according to present utility model application the scope of the patents it is equal
Deng variation and modification, it should all belong to the covering scope of the utility model.
Claims (5)
1. a kind of high voltage optocoupler encapsulating structure, it is characterised in that: including first support and second support, the first support top
Portion is provided with infrared LEDs, and layer of silica gel is wrapped with outside the infrared LEDs, is provided with receipts optical chip at the top of the second support,
It is also enclosed with one layer of interior plastic packaging glue-line with translucency outside the layer of silica gel and receipts optical chip, is also wrapped outside the interior plastic packaging glue-line
With plastic packaging glue-line outside a black；The interior plastic packaging film surface is wrinkled surface；The section of the wrinkled surface is waveform.
2. a kind of high voltage optocoupler encapsulating structure according to claim 1, it is characterised in that: the first support and second
Oppose setting above and below bracket, and the infrared LEDs are set to lower section, the layer of silica gel at the top of first support and are located under first support
Side, the receipts optical chip are set to second support over top；Surface is wrinkled surface above and below the interior plastic packaging glue-line.
3. a kind of high voltage optocoupler encapsulating structure according to claim 1, it is characterised in that: the first support and second
Bracket is located at same level, and the infrared LEDs are set to lower section, the layer of silica gel at the top of first support and are located at first support
Lower section, the receipts optical chip are set to lower section at the top of second support, so that infrared LEDs and receipts optical chip are located at same level
Face；A lens are provided with below the interior plastic packaging glue-line with translucency, the interior plastic packaging glue-line overhead surface is wrinkled surface；
The interior plastic packaging glue-line and lens are wrapped in the outer plastic packaging glue-line of the black.
4. a kind of high voltage optocoupler encapsulating structure according to claim 3, it is characterised in that: the lens are that shaped form is saturating
Mirror.
5. a kind of high voltage optocoupler encapsulating structure according to claim 4, it is characterised in that: the lens are hemispherical.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920843485.9U CN209729905U (en) | 2019-06-05 | 2019-06-05 | A kind of high voltage optocoupler encapsulating structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920843485.9U CN209729905U (en) | 2019-06-05 | 2019-06-05 | A kind of high voltage optocoupler encapsulating structure |
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| CN209729905U true CN209729905U (en) | 2019-12-03 |
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| CN201920843485.9U Active CN209729905U (en) | 2019-06-05 | 2019-06-05 | A kind of high voltage optocoupler encapsulating structure |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113540058A (en) * | 2021-06-03 | 2021-10-22 | 华润微集成电路(无锡)有限公司 | High-voltage-resistance optocoupler packaging product and manufacturing method thereof |
-
2019
- 2019-06-05 CN CN201920843485.9U patent/CN209729905U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113540058A (en) * | 2021-06-03 | 2021-10-22 | 华润微集成电路(无锡)有限公司 | High-voltage-resistance optocoupler packaging product and manufacturing method thereof |
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