CN206595290U - A kind of LED lamp bead of moistureproof dust protection - Google Patents
A kind of LED lamp bead of moistureproof dust protection Download PDFInfo
- Publication number
- CN206595290U CN206595290U CN201720374851.1U CN201720374851U CN206595290U CN 206595290 U CN206595290 U CN 206595290U CN 201720374851 U CN201720374851 U CN 201720374851U CN 206595290 U CN206595290 U CN 206595290U
- Authority
- CN
- China
- Prior art keywords
- lamp bead
- led lamp
- heat sink
- sealing ring
- package body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000011324 bead Substances 0.000 title claims abstract description 43
- 239000000428 dust Substances 0.000 title claims abstract description 18
- 238000007789 sealing Methods 0.000 claims abstract description 30
- 239000003292 glue Substances 0.000 claims abstract description 16
- 239000000565 sealant Substances 0.000 claims abstract description 11
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 11
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 11
- 239000010703 silicon Substances 0.000 claims abstract description 11
- 239000000758 substrate Substances 0.000 claims description 13
- OAICVXFJPJFONN-UHFFFAOYSA-N phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 6
- 239000000843 powder Substances 0.000 claims description 6
- 210000000481 Breast Anatomy 0.000 claims description 3
- 229910002114 biscuit porcelain Inorganic materials 0.000 claims 1
- 101710031899 moon Proteins 0.000 claims 1
- 238000003466 welding Methods 0.000 abstract description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000005034 decoration Methods 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006011 modification reaction Methods 0.000 description 1
- 230000003287 optical Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Abstract
The utility model discloses a kind of LED lamp bead of moistureproof dust protection, including heat sink, the inner upper of the heat sink is provided with sealed plasthetic, the heat sink outer left side is provided with anode connection head, outside the heat sink cathode connection head is provided with the right positions of the first threaded securing bores, the lower inside of the outer package body is provided with the first sealing ring, and the inside of outer package body is provided with above heat-conducting glue, the outer package body at the top position of the first sealing ring and is provided with silicon sealant.This new structure is scientific and reasonable, it is safe and convenient to use, the first threaded securing bores and the second threaded securing bores are provided with the bottom of LED lamp bead, change the problem of conventional LED lamp bead causes less stable simply by connector lug with external welding, and with the addition of the first sealing ring and the second sealing ring, the sealing effectiveness of LED lamp bead is added, prevents outside moisture and dust from entering the inside of LED lamp bead, causes LED lamp bead to be damaged.
Description
Technical field
The utility model is related to field of photoelectric technology, specially a kind of LED lamp bead of moistureproof dust protection.
Background technology
LED lamp bead is exactly the english abbreviation abbreviation LED of light emitting diode, and this is a popular address, and LED full name are half
Conductor light emitting diode, is made of semi-conducting material, and directly to convert electrical energy into luminous energy, electricity number is converted into optical signal
Luminescent device；It is characterized in low in energy consumption, high brightness, beautiful in colour, anti-vibration, long lifespan（Normal luminous 8-10 ten thousand hours）, it is cold
The advantages of light source, be real " green illumination ".Lamp decoration product using LED as new light sources necessarily replaces in the future of 21 century
Incandescent lamp, the revolution again illuminated as the mankind.The LED lamp bead of new light sources semiconductor is widely used in lamp ornaments lighting, LED large-size screen monitors
Many lifes such as curtain display, traffic lights, decoration, computer, electronic toy gift, interchanger, telephone set, advertisement, the honorable engineering in city
Production field.
There are some defects in existing LED lamp bead, the sealing of such as LED lamp bead is poor in use, easily by
Tide and dust enter inside and cause to damage, and the radiating effect of LED lamp bead is poor, easily the service life of influence lamp bead.
Utility model content
The purpose of this utility model is to provide a kind of LED lamp bead of moistureproof dust protection, to solve in above-mentioned background technology
The sealing of the LED lamp bead of proposition is poor, easily make moist and dust enter inside cause damage, and LED lamp bead radiating
Effect is poor, easily the problem of the service life of influence lamp bead.
To achieve the above object, the utility model provides following technical scheme：A kind of LED lamp bead of moistureproof dust protection, bag
Include LED chip, plastic lens, die bond, chip mounting seat, speculum, heat-conducting glue, the first sealing ring, cathode connection head, the first spiral shell
Line fixing hole, heat sink, sealed plasthetic, the second threaded securing bores, anode connection head, outer package body, silicon sealant, the second sealing
Circle, thermally conductive sheet, substrate and phosphor powder layer, the inner upper of the heat sink are provided with sealed plasthetic, and the inside of heat sink is left
Side offers the second threaded securing bores, and the heat sink outer left side is provided with anode connection head, and the inner right side of heat sink
The first threaded securing bores are offered, the heat sink outside is provided with negative electrode at the right positions of the first threaded securing bores and connect
Outer package body is provided with above the end of a thread, and heat sink, the lower inside of the outer package body is provided with the first sealing ring, and outside
The inside of packaging body is provided with above heat-conducting glue, the outer package body at the top position of the first sealing ring and is provided with silicon
Speculum, the sealing ring of lower inside second of the speculum, and speculum are provided with above sealant, the silicon sealant
Internal symmetry be provided with thermally conductive sheet, the outside top of the speculum is provided with plastic lens.And the bosom of speculum
It is provided with above chip mounting seat, the chip mounting seat to be provided with above substrate, the substrate at position and is provided with admittedly
LED chip is provided with above crystalline substance, the die bond, the outside of the LED chip is provided with phosphor powder layer.
Further, the heat-conducting glue is provided with eight altogether, and eight heat-conducting glues are uniformly arranged on the inside of outer package body.
Further, the plastic lens is semicircular structure, and includes lens and lower lens, in upper lens with
Cavity is provided between lens.
Further, the thermally conductive sheet is provided with two altogether, and two thermally conductive sheets are separately positioned on the two of chip mounting seat
Side.
Further, the die bond is fixedly connected with chip mounting seat by substrate.
Compared with prior art, the beneficial effect that the utility model is reached is：This new structure is scientific and reasonable, uses peace
It is complete convenient, the first threaded securing bores and the second threaded securing bores are provided with the bottom of LED lamp bead, conventional LED lamp bead is changed
The problem of causing less stable with external welding simply by connector lug, and with the addition of the first sealing ring and the second sealing
Circle, adds the sealing effectiveness of LED lamp bead, prevents outside moisture and dust from entering the inside of LED lamp bead, cause LED lamp bead
Damage, and be provided with heat-conducting glue in the inside of LED lamp bead and thermally conductive sheet be connected with heat sink, can pass through internal heat scattered
Hot plate is timely dispersed into the air of outside.
Brief description of the drawings
Accompanying drawing is used for providing further understanding to of the present utility model, and constitutes a part for specification, with this practicality
New embodiment is used to explain the utility model together, does not constitute to limitation of the present utility model.In the accompanying drawings：
Fig. 1 is structural representation of the present utility model；
Fig. 2 is one of schematic appearance of the present utility model；
Fig. 3 is the two of schematic appearance of the present utility model；
In figure：1st, LED chip；2nd, plastic lens；3rd, die bond；4th, chip mounting seat；5th, speculum；6th, heat-conducting glue；7th,
One sealing ring；8th, cathode connection head；9th, the first threaded securing bores；10th, heat sink；11st, sealed plasthetic；12nd, second it is screwed
Hole；13rd, anode connection head；14th, outer package body；15th, silicon sealant；16th, the second sealing ring；17th, thermally conductive sheet；18th, substrate；19、
Phosphor powder layer.
Embodiment
Preferred embodiment of the present utility model is illustrated below in conjunction with accompanying drawing, it will be appreciated that described herein excellent
Select embodiment to be merely to illustrate and explain the utility model, be not used to limit the utility model.
Embodiment 1
Fig. 1-3 are referred to, the utility model provides a kind of technical scheme：A kind of LED lamp bead of moistureproof dust protection, including
LED chip 1, plastic lens 2, die bond 3, chip mounting seat 4, speculum 5, heat-conducting glue 6, the first sealing ring 7, cathode connection first 8,
First threaded securing bores 9, heat sink 10, sealed plasthetic 11, the second threaded securing bores 12, anode connection first 13, outer package body 14,
Silicon sealant 15, the second sealing ring 16, thermally conductive sheet 17, substrate 18 and phosphor powder layer 19, the inner upper of heat sink 10 are provided with
Sealed plasthetic 11, and the inside left of heat sink 10 offers the second threaded securing bores 12, the outer left side of heat sink 10 is provided with
Anode connection first 13, and the inner right side of heat sink 10 offers the first threaded securing bores 9, the outside of heat sink 10 is close to the first spiral shell
Cathode connection first 8 is provided with the right positions of line fixing hole 9, and the top of heat sink 10 is provided with outer package body 14, covering
The lower inside of dress body 14 is provided with the first sealing ring 7, and outer package body 14 inside close to the top position of the first sealing ring 7
Place is provided with heat-conducting glue 6, and the top of outer package body 14 is provided with silicon sealant 15, and the top of silicon sealant 15 is provided with speculum
5, the second sealing ring of lower inside 16 of speculum 5, and the internal symmetry of speculum 5 is provided with thermally conductive sheet 17, speculum 5 it is outer
Plastic lens 2 is provided with above portion.And chip mounting seat 4, chip mounting seat 4 are provided with the bosom position of speculum 5
Top be provided with substrate 18, the top of substrate 18 is provided with die bond 3, and the top of die bond 3 is provided with LED chip 1, LED chip 1
Outside be provided with phosphor powder layer 19.
In order that in the better heat-radiation effect of this LED lamp bead, the present embodiment, it is preferred that heat-conducting glue 6 is provided with eight altogether,
And eight heat-conducting glues 6 are uniformly arranged on the inside of outer package body 14.
In order that the illumination effect of this LED lamp bead is more preferably, in the present embodiment, it is preferred that plastic lens 2 is tied to be semicircle
Structure, and include lens and lower lens, it is provided with cavity between upper lens and lower lens.
In order that in the better heat-radiation effect of this LED lamp bead, the present embodiment, it is preferred that thermally conductive sheet 17 is provided with two altogether,
And two thermally conductive sheets 17 are separately positioned on the both sides of chip mounting seat 4.
In order that the structure of this LED lamp bead is more stablized, in the present embodiment, it is preferred that die bond 3 is led to chip mounting seat 4
Substrate 18 is crossed to be fixedly connected.
Operation principle：After the LED lamp bead of the moistureproof dust protection is installed, the first spiral shell is provided with the bottom of LED lamp bead
The threaded securing bores 12 of line fixing hole 9 and second, change conventional LED lamp bead simply by cathode connection first 8 and anode connection head
13 fix the problem of causing less stable with external welding, and with the addition of the first sealing ring 7 and the second sealing ring 16, add
The sealing effectiveness of LED lamp bead, prevents outside moisture and dust from entering the inside of LED lamp bead, causes LED lamp bead to be damaged, and
The inside of LED lamp bead is provided with heat-conducting glue 6 and thermally conductive sheet 17 is connected with heat sink 10, and the heat of inside can be made to pass through heat sink
10 are timely dispersed into the air of outside.
Finally it should be noted that：Preferred embodiment of the present utility model is the foregoing is only, this is not limited to
Utility model, although the utility model is described in detail with reference to the foregoing embodiments, for those skilled in the art
For, it can still modify to the technical scheme described in foregoing embodiments, or to which part technical characteristic
Carry out equivalent substitution.It is all it is of the present utility model spirit and principle within, any modification, equivalent substitution and improvements made etc.,
It should be included within protection domain of the present utility model.
Claims (5)
1. a kind of LED lamp bead of moistureproof dust protection, including LED chip（1）, plastic lens（2）, die bond（3）, chip mounting seat
（4）, speculum（5）, heat-conducting glue（6）, the first sealing ring（7）, cathode connection head（8）, the first threaded securing bores（9）, heat sink
（10）, sealed plasthetic（11）, the second threaded securing bores（12）, anode connection head（13）, outer package body（14）, silicon sealant
（15）, the second sealing ring（16）, thermally conductive sheet（17）, substrate（18）And phosphor powder layer（19）, it is characterised in that：The heat sink
（10）Inner upper be provided with sealed plasthetic（11）, and heat sink（10）Inside left offer the second threaded securing bores
（12）, the heat sink（10）Outer left side is provided with anode connection head（13）, and heat sink（10）Inner right side offer
First threaded securing bores（9）, the heat sink（10）Outside close first threaded securing bores（9）Right positions at be provided with the moon
Pole connector lug（8）, and heat sink（10）Top be provided with outer package body（14）, the outer package body（14）Lower inside set
It is equipped with the first sealing ring（7）, and outer package body（14）Inside close to the first sealing ring（7）Top position at be provided with heat conduction
Glue（6）, the outer package body（14）Top be provided with silicon sealant（15）, the silicon sealant（15）Top be provided with instead
Penetrate mirror（5）, the speculum（5）The sealing ring of lower inside second（16）, and speculum（5）Internal symmetry be provided with heat conduction
Piece（17）, the speculum（5）Outside top be provided with plastic lens（2）, and speculum（5）Bosom position at set
It is equipped with chip mounting seat（4）, the chip mounting seat（4）Top be provided with substrate（18）, the substrate（18）Top set
It is equipped with die bond（3）, the die bond（3）Top be provided with LED chip（1）, the LED chip（1）Outside be provided with fluorescence
Bisque（19）.
2. a kind of LED lamp bead of moistureproof dust protection according to claim 1, it is characterised in that：The heat-conducting glue（6）Set altogether
It is equipped with eight, and eight heat-conducting glues（6）It is uniformly arranged on outer package body（14）Inside.
3. a kind of LED lamp bead of moistureproof dust protection according to claim 1, it is characterised in that：The plastic lens（2）For
Semicircular structure, and include lens and lower lens, it is provided with cavity between upper lens and lower lens.
4. a kind of LED lamp bead of moistureproof dust protection according to claim 1, it is characterised in that：The thermally conductive sheet（17）Altogether
It is provided with two, and two thermally conductive sheets（17）It is separately positioned on chip mounting seat（4）Both sides.
5. a kind of LED lamp bead of moistureproof dust protection according to claim 1, it is characterised in that：The die bond（3）With chip
Mounting seat（4）Pass through substrate（18）It is fixedly connected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720374851.1U CN206595290U (en) | 2017-04-11 | 2017-04-11 | A kind of LED lamp bead of moistureproof dust protection |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720374851.1U CN206595290U (en) | 2017-04-11 | 2017-04-11 | A kind of LED lamp bead of moistureproof dust protection |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206595290U true CN206595290U (en) | 2017-10-27 |
Family
ID=60121179
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720374851.1U Expired - Fee Related CN206595290U (en) | 2017-04-11 | 2017-04-11 | A kind of LED lamp bead of moistureproof dust protection |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206595290U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110594604A (en) * | 2019-08-26 | 2019-12-20 | 高博(鞍山)半导体有限公司 | Small-size LED lamp bead capable of emitting light uniformly to all angles |
| CN110970328A (en) * | 2019-11-18 | 2020-04-07 | 长江存储科技有限责任公司 | Sealing ring installation jig and installation method |
| CN113793890A (en) * | 2021-11-17 | 2021-12-14 | 至芯半导体(杭州)有限公司 | Threaded deep ultraviolet device structure |
-
2017
- 2017-04-11 CN CN201720374851.1U patent/CN206595290U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110594604A (en) * | 2019-08-26 | 2019-12-20 | 高博(鞍山)半导体有限公司 | Small-size LED lamp bead capable of emitting light uniformly to all angles |
| CN110970328A (en) * | 2019-11-18 | 2020-04-07 | 长江存储科技有限责任公司 | Sealing ring installation jig and installation method |
| CN113793890A (en) * | 2021-11-17 | 2021-12-14 | 至芯半导体(杭州)有限公司 | Threaded deep ultraviolet device structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20171027 Termination date: 20200411 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |