CN204289510U - A kind of Novel diode encapsulating structure - Google Patents
A kind of Novel diode encapsulating structure Download PDFInfo
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- CN204289510U CN204289510U CN201420720536.6U CN201420720536U CN204289510U CN 204289510 U CN204289510 U CN 204289510U CN 201420720536 U CN201420720536 U CN 201420720536U CN 204289510 U CN204289510 U CN 204289510U
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- cap bag
- lens
- hat
- encapsulation
- encapsulating structure
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Abstract
The utility model belongs to diode production technical field, particularly relates to a kind of Novel diode encapsulating structure.Comprise metal cap bag, two contact conductors, chip and spun gold, metallic sheath crown portion is provided with lens, it is convex surface above lens, be plane or convex surface below, encapsulation is provided with in metal cap bag, the described formula structure that is packaged as a whole, be included in two contact conductors, encapsulate with the hat mated with cap bag internal diameter of translucent material injection moulding outside chip and spun gold, the top of this hat encapsulation is circular arc or plane, its top central point aligns with the focus of lens, the central point of its circular arc aligns with the focus of the lens on cap bag top, the bottom of hat encapsulation is provided with the flange on the base for holding cap bag simultaneously, two contact conductor ends are drawn from flange bottom and are formed both positive and negative polarity pin.The utility model structure is simple, easy for installation, can improve reliability, greatly reduces light decay loss, and sealing, good reliability, product quality is high.
Description
Technical field
The utility model belongs to diode production technical field, particularly relates to a kind of Novel diode encapsulating structure.
Background technology
China produce at present for photoelectric sensor, the remote-transmitter light source of the various instrument in the fields such as optical communication, paper money counter, photocopier, the signal transmitting/receiving diode series of products of watch-dog mostly adopt separate bottom holder structure, base generally adopts metal or ceramic material, its structure consists of: chip is placed in the electrode cavity of base upper surface, the pin for conducting electricity is connected with under base, pin and metab or ceramic base bonds by glass sealing or glue and fix, recycle silicon rubber seal dress base upper surface dew puts the position of chip, the additional metal cap bag be fixed with one with base, metal or ceramic base inherently complex structure, cost is high, production efficiency is low, and metab or ceramic base, lead-in wire and metal or ceramic segment and silica gel are all independently, its sealing, reliability are also poor.And according to application number for the metallic support infrared emission photosensitive described in the utility model patent of 200920115417.7 receives photoelectric device, although solve complex structure, the defect that cost is high, but its sealing and fastness poor, cap bag easily loosens and even comes off, and owing to being insert on circuit boards during diode product final utilization, the direct contact circuit plate of shade of the metal cap bag of this device, the normal diode component worked of tradition is lower relatively to make this overall device height, relative altitude between base and cap bag lens is also difficult to control, the undesirable condition that cannot normally work may be there is on the contrary in real work, Total Product is of low quality.
Chinese utility model patent 201420036276.0 discloses a kind of signal transmitting and receiving diode package structure of improvement, this encapsulating structure coordinates described flange plate to replace traditional base element by metal cap bag, simplify operation, reduce cost, and overall sealing performance is good, described cap bag difficult drop-off, useful life extends, device working depth is on circuit boards normal, and ensure the signal transmitting and receiving performance of product, Total Product is superior in quality.But this encapsulating structure adopts the fabricated structure of cap bag and flange plate, during assembling, flange plate passes through adhesive and the cap bag lower end glue company of high-low temperature resistant, and add on flange plate in man-hour and need to reserve the draw-in groove passed for both positive and negative polarity pin, so not only assemble trouble, processing cost is high, and when installation cap bag, easily produces crooked, make the focus of the lens on cap bag top not corresponding with the center of infrared emission tube and photosensitive receiving tube, thus produce substandard products.
Summary of the invention
The technical problems to be solved in the utility model overcomes above-mentioned the deficiencies in the prior art exactly, and provides a kind of structure simple, and processing cost is low, easy for installation, sealing, good reliability, the Novel diode encapsulating structure that product quality is high.
For solving the problems of the technologies described above, the technical solution of the utility model is:
A kind of Novel diode encapsulating structure, comprise metal cap bag, two contact conductors, chip and spun gold, metallic sheath crown portion is provided with lens, it is convex surface above lens, be plane or convex surface below, encapsulation is provided with in metal cap bag, the described formula structure that is packaged as a whole, be included in two contact conductors, encapsulate with the hat mated with cap bag internal diameter of translucent material injection moulding outside chip and spun gold, the top of this hat encapsulation is circular arc or plane, its top central point aligns with the focus of lens, the bottom of hat encapsulation is provided with the flange on the base for holding cap bag simultaneously, two contact conductor ends are drawn from flange bottom and are formed both positive and negative polarity pin.
Further, the projection for indicating both positive and negative polarity or groove is formed in the side of flange.
Further, the length of described both positive and negative polarity pin is different.
Further, described flange end face is choosing any one kind of them or the combining structure of wherein any two or three kinds in circular, oval, polygon.
Preferably, described flange end face be quadrangle in polygon, choosing any one kind of them in hexagon, octagon, cross, M shape.
Preferably, described translucent material is epoxy resin.
The beneficial effect of technical solutions of the utility model is:
1, structurally, package design contained by the utility model diode package structure is formed in one style, namely directly encapsulates with the hat that epoxy resin injection moulding one and cap bag internal diameter adapt outside two contact conductors, chip and spun gold, easy for installation; Owing to adopting translucent material to stop light, closed top end is circular arc, and the central point of its circular arc aligns with the focus of the lens on cap bag top, ensure that the accuracy of the transmitting and receiving of signal; The bottom of hat encapsulation is provided with flange, the base of holding cap bag that can be stable when bonding cap bag, ensures that cap bag can not be crooked and ensure that overall device height meets user demand, thus improves the quality of products.In addition, described encapsulating structure is simple, can single injection-molded, and processing cost is low, and production efficiency is high; If employing special die, this mould is arranged with multiple die cavity, also can the multiple encapsulation of single injection-molded, greatly reduce processing cost, enhance productivity further.
2, structurally, the utility model adopts integrative packaging, can improve reliability, greatly reduces light decay loss, and prevents external environment from polluting chip operation position, destroying; In addition, relative to existing packaged type, simplify technique, reduce production cost, improve production efficiency; And integral coating, unlike prior art metab or ceramic base, lead-in wire and metal or ceramic segment and silica gel are all independently, and sealing, reliability aspect improve all greatly.
3, structurally, permeability material described in the utility model is epoxy resin, and epoxy resin light transmission is good, ensure that the transmitting and receiving of signal, improves product reliability; Form the projection for indicating both positive and negative polarity or groove in the side of flange, or both positive and negative polarity pin arranging length difference, being easy to identify, easy to use; Described flange is circular, oval or choosing any one kind of them or the combining structure of wherein any two or three kinds in polygon, and be preferably choosing any one kind of them in quadrangle, hexagon, octagon, cross, M shape in polygon, embodiment is more, version is versatile and flexible, is easy to promotion and implementation.
4, to sum up, the utility model diode package structure is simple, easy for installation, can improve reliability, greatly reduces light decay loss, and sealing, good reliability, product quality is high; In addition, relative to existing packaged type, also simplify technique, reduce production cost, improve production efficiency, therefore, be very suitable for promotion and implementation.
Accompanying drawing explanation
Below in conjunction with accompanying drawing, embodiment of the present utility model is described in further detail, wherein:
Fig. 1 is the sectional structure schematic diagram of the utility model diode package structure;
Fig. 2 looks up one of structural representation for diode package structure shown in Fig. 1;
What Fig. 3 was diode package structure shown in Fig. 1 looks up structural representation two;
What Fig. 4 was diode package structure shown in Fig. 1 looks up structural representation three;
Sequence number in figure: 1, metal cap bag, 2, positive pole pin, 3, chip, 4, spun gold, 5, lens, 6, hat encapsulation, 7, flange, 8, protruding, 9, negative pole pin.
Embodiment
Embodiment one:
See Fig. 1-2, in figure, the utility model diode package structure, comprise metal cap bag 1, two contact conductors 2, 9, chip 3 and spun gold 4, metallic sheath crown portion is provided with lens 5, lens top and bottom are convex surface, encapsulation is provided with in metal cap bag, the described formula structure that is packaged as a whole, be included in two contact conductors, 6 are encapsulated with the hat mated with cap bag internal diameter of translucent material injection moulding outside chip and spun gold, the top of this hat encapsulation is circular arc, its top central point aligns with the focus of lens, the bottom of hat encapsulation is provided with the flange 7 on the base for holding cap bag simultaneously, two contact conductor ends are drawn from flange bottom and are formed both positive and negative polarity pin.The projection 8 for indicating both positive and negative polarity is formed in the side of flange.Described flange end face is circular.Described translucent material is epoxy resin.The length of described both positive and negative polarity pin 2,9 is different, and wherein positive pole pin is relatively long.
Embodiment two:
See in Fig. 1,3, figure, the present embodiment and embodiment two structural similarity, in its structure, same section no longer repeats at this, and its difference is: flange end face described in the present embodiment is cross and circular combining structure.
Embodiment three
See in Fig. 1,4 figure, the present embodiment and embodiment three structural similarity, in its structure, same section no longer repeats at this, and its difference is: flange end face described in the present embodiment is M shape and circular combining structure.
Embodiment four-six:
The present embodiment figure does not draw.The present embodiment four-six is respectively at embodiment one-three structural similarity, and its same section no longer repeats at this, and its difference is: form the groove for indicating both positive and negative polarity described in the present embodiment in the side of flange.
The foregoing is only the schematic embodiment of the utility model; and be not used to limit scope of the present utility model; the equivalent variations that any those skilled in the art makes under the prerequisite not departing from the utility model design and principle and amendment; for example: by adopting separately at the shaping projection in the side of flange or groove; or adopting separately both positive and negative polarity pin that length difference is set for identifying both positive and negative polarity, the scope of the utility model protection all should be belonged to.
Claims (6)
1. a Novel diode encapsulating structure, comprise metal cap bag, two contact conductors, chip and spun gold, metallic sheath crown portion is provided with lens, it is convex surface above lens, be plane or convex surface below, encapsulation is provided with in metal cap bag, it is characterized in that: described in be packaged as a whole formula structure, be included in two contact conductors, encapsulate with the hat mated with cap bag internal diameter of translucent material injection moulding outside chip and spun gold, the top of this hat encapsulation is circular arc or plane, its top central point aligns with the focus of lens, the bottom of hat encapsulation is provided with the flange on the base for holding cap bag simultaneously, two contact conductor ends are drawn from flange bottom and are formed both positive and negative polarity pin.
2. Novel diode encapsulating structure according to claim 1, is characterized in that: form the projection for indicating both positive and negative polarity or groove in the side of flange.
3. Novel diode encapsulating structure according to claim 1, is characterized in that: the length of described both positive and negative polarity pin is different.
4. Novel diode encapsulating structure according to claim 1, is characterized in that: described flange end face is choosing any one kind of them or the combining structure of wherein any two or three kinds in circular, oval, polygon.
5. Novel diode encapsulating structure according to claim 4, is characterized in that: described flange end face is quadrangle in polygon, choosing any one kind of them in hexagon, octagon, cross, M shape.
6. the Novel diode encapsulating structure according to any one of claim 1 to 5, is characterized in that: described translucent material is epoxy resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420720536.6U CN204289510U (en) | 2014-11-25 | 2014-11-25 | A kind of Novel diode encapsulating structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420720536.6U CN204289510U (en) | 2014-11-25 | 2014-11-25 | A kind of Novel diode encapsulating structure |
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| Publication Number | Publication Date |
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| CN204289510U true CN204289510U (en) | 2015-04-22 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201420720536.6U Active CN204289510U (en) | 2014-11-25 | 2014-11-25 | A kind of Novel diode encapsulating structure |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105870308A (en) * | 2016-04-30 | 2016-08-17 | 浙江单色电子科技有限公司 | Inorganic encapsulation direct-plug type violet LED and manufacturing method thereof |
| CN109790971A (en) * | 2016-09-12 | 2019-05-21 | 朗德万斯公司 | Compact LED light emitting device and its manufacturing method |
-
2014
- 2014-11-25 CN CN201420720536.6U patent/CN204289510U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105870308A (en) * | 2016-04-30 | 2016-08-17 | 浙江单色电子科技有限公司 | Inorganic encapsulation direct-plug type violet LED and manufacturing method thereof |
| CN105870308B (en) * | 2016-04-30 | 2019-11-05 | 浙江单色电子科技有限公司 | A kind of direct insertion purple LED of inorganic encapsulated and its manufacturing method |
| CN109790971A (en) * | 2016-09-12 | 2019-05-21 | 朗德万斯公司 | Compact LED light emitting device and its manufacturing method |
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