CN203038966U - LED preventing fluorescent glue from diffusing - Google Patents
LED preventing fluorescent glue from diffusing Download PDFInfo
- Publication number
- CN203038966U CN203038966U CN2011203874536U CN201120387453U CN203038966U CN 203038966 U CN203038966 U CN 203038966U CN 2011203874536 U CN2011203874536 U CN 2011203874536U CN 201120387453 U CN201120387453 U CN 201120387453U CN 203038966 U CN203038966 U CN 203038966U
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- CN
- China
- Prior art keywords
- fluorescent glue
- led
- wafer
- substrate
- barricade
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Abstract
The utility model provides a LED preventing fluorescent glue from diffusing, comprising a substrate, and a wafer and a lens fixed on the substrate. A retaining wall around the wafer is disposed on peripheral of the wafer. The retaining wall is disposed on the substrate. Fluorescent glue covering the wafer is filled in a holding space formed by the retaining wall. The lens packages the wafer, the fluorescent glue, and the retaining wall. Using the retaining wall disposed on the substrate and on the peripheral of the wafer, the LED preventing fluorescent glue from diffusing can effectively restrain the fluorescent glue in the retaining wall, so that problems that in an existing LED technology, the fluorescent glue on the substrate diffuses around because of fluidity of the fluorescent glue, resulting in overall thickness of the fluorescent glue in the LED is difficult to control can be solved. The LED preventing the fluorescent glue from diffusing ensures light rays generated by the LED are centralized. In addition, the LED with the structure is simple in manufacturing, special processing techniques are not needed, new devices are not needed, and processing cost is relatively low, thereby being beneficial for effective popularization and application of the LEDs.
Description
Technical field
The utility model relates to a kind of LED, relates in particular to a kind of LED that prevents the fluorescent glue diffusion.
Background technology
Along with strengthening gradually of energy-conserving and environment-protective consciousness and reaching its maturity of photoelectric technology, LED (Light Emitting Diode, light-emitting diode) has become the research focus of industry gradually.Existing LED is generally by directly making in the mode of substrate point fluorescent glue.Yet, with fluorescent glue point on substrate the time, fluorescent glue usually can since the flowability of himself and towards around diffusion.Thus, easily cause among the LED integral thickness of fluorescent glue restive, and the light that finally causes LED to produce do not concentrate, influence the total quality of LED.And if adopt special spraying coating process to make white light LEDs, then need increase new spraying equipment, and price is very expensive, cause the processing cost of LED too high, influence effective popularization of LED.
Summary of the invention
In view of this, be necessary to provide a kind of LED that can solve the prevented fluorescent glue diffusion of the problem that has LED now.
A kind of LED that prevents the fluorescent glue diffusion, it comprises substrate, is fixed on wafer and lens on the described substrate, the periphery of described wafer has the barricade around described wafer, described barricade is arranged on the described substrate, described barricade encloses and is filled with the fluorescent glue that covers described wafer, the described wafer of described lens packages, described fluorescent glue and described barricade in the receiving space of formation.
Preferably, described barricade is circular ring-type or polygon circulus.
Preferably, the height of described barricade be LED wafer thickness 1/3 to the thickness of the relative substrate of described lens, described wafer is connected with the pin of power supply by lead, described barricade center on described wafer and lead and pin around being of a size of.
Preferably, described barricade is white glues wall, silica gel wall, epoxy resin wall, Merlon wall, glass wall, metal wall or metal oxide wall.
Preferably, described barricade is arranged at described substrate by the mode of pressing, deposition, sintering or gluing.
Preferably, described substrate is metal substrate or ceramic substrate.
Preferably, the quantity of described wafer is 1～100.
Further, the described LED of fluorescent glue diffusion that prevents comprises that it is connected with negative pole with the positive pole of described wafer respectively by lead for the pin that connects feeder ear.
Compared to prior art, the LED of the prevented fluorescent glue diffusion that the utility model provides utilizes the barricade that is arranged at substrate and is positioned at the wafer periphery, can effectively fluorescent glue be limited in the barricade, solve the existing fluorescent glue of LED technology mid point on substrate because of himself flowability towards around spread, cause the restive problem of the integral thickness of fluorescent glue among the LED, guarantee concentrating of light that LED produces.In addition, the LED of this kind structure makes simple, need not special processing technology, also need not to increase new equipment, and processing cost is lower, is conducive to effective popularization and the application of LED.
Description of drawings
A kind of schematic diagram that prevents the LED of fluorescent glue diffusion that Fig. 1 provides for the utility model one execution mode.
Fig. 2 does not arrange the schematic diagram of fluorescent glue for the LED of fluorescent glue diffusion that prevents shown in Figure 1.
Fig. 3 does not arrange the schematic diagram of lens for the LED of fluorescent glue diffusion that prevents shown in Figure 2.
Embodiment
Below with reference to the drawings and the specific embodiments the utility model is elaborated.
See also Fig. 1, the utility model provides a kind of LED10 that prevents the fluorescent glue diffusion, and it comprises substrate 11, wafer 13, lead 14, barricade 15, fluorescent glue 17 and lens 19.
Described substrate 11 is made by Heat Conduction Material, and in the present embodiment, described substrate 11 is metal substrate, particularly, and the substrate that can make for copper-based material, alumina-base material or alloy material.Certainly, be not limited to present embodiment, described substrate 11 also can be ceramic base material.
Be understandable that the shape and structure of described substrate 11 can arrange according to reality is required, as circular, square or polygon.In the present embodiment, be that example describes with square substrate 11.
Described wafer 13 is fixed on the described substrate 11, and the positive pole of described wafer 13 is connected with the pin (figure does not indicate) of described LED10 by described lead 14 with negative pole (figure does not indicate).
Preferably, the quantity of described wafer is 1 ~ 100; Described lead is gold thread, silver-colored line or other leads.
Described barricade 15 is arranged on the described substrate 11, and is positioned at the periphery of described wafer 13.Described barricade 15 forms a receiving space 151 around described wafer 13, is used for accommodating described fluorescent glue 17 is set, as shown in Figures 2 and 3.In the present embodiment, described barricade 15 is continuous circle row circulus, and it is located in the periphery of described wafer 13 centered by described wafer 13.
Preferably, the height of described barricade 15 is that LED wafer thickness 1/3 is to the thickness (height of barricade 15 does not exceed the peak of lens in other words) of lens 19 relative substrates, for example can be 0.4～5mm, described barricade 15 around being of a size of around described wafer 13 and lead 14 and pin, when for example being rectangle or polygon, the length of side is specifically as follows 0.1 ~ 10mm, namely, the vertical height of described barricade 15 on described substrate 11 is 0.4～5mm, the length of side of described barricade 15 or be 0.1 ~ 10mm around diameter.
Preferably, the material of described barricade 15 is white glues, silica gel, epoxy resin, Merlon, glass, metal or metal oxide.
Be understandable that described barricade 15 can be arranged at by the mode of pressing, deposition, sintering or gluing on the described substrate 11, certainly, described barricade 15 also can be one-body molded with described substrate 11.
Described fluorescent glue 17 is filled in described barricade 15 and encloses in the receiving space 151 of formation, and covers described wafer 13 and described lead 14.Because be subjected to the barrier effect of described barricade 15, the flowability of described fluorescent glue 17 will be restricted, and thus, can avoid described fluorescent glue 17 further to spread effectively.
In the present embodiment, described fluorescent glue 17 is mixed by fluorescent material and transparent colloid.Wherein, fluorescent material plants composition for list or multiple composition mixes, and namely fluorescent glue 17 is single fluorescent material and transparent colloid colloid mixtures of planting composition or multiple composition; The material of transparent colloid is silica gel, epoxy resin, Merlon or glass.
Be understandable that, be filled in fluorescent glues 17 in the described receiving space 151 through behind the baking-curings, can be fixed on the described substrate 11, as shown in Figure 3.
Described lens 19 encapsulation described wafer 13, described fluorescent glue 17 and described barricades 15.In the present embodiment, described lens 19 through Mould Machining and substrate 11 as described in taking shape in, and cover described wafer 13, described fluorescent glue 17 and described barricade 15 by transparent material (as transparent colloid, plastics, glass).
When described fluorescent glue 17 covers described wafer 13, the described LED10 of fluorescent glue diffusion that prevents utilizes the barricade 15 that is arranged on the substrate 11 and is positioned at wafer 13 peripheries, can effectively fluorescent glue 17 be limited in the barricade 15, solve the existing fluorescent glue of LED technology mid point on substrate because of himself flowability towards around spread, cause the restive problem of the integral thickness of fluorescent glue among the LED, guarantee concentrating of light that LED produces.In addition, the described LED10 of fluorescent glue diffusion that prevents makes simply, need not special processing technology, also need not to increase new equipment, and processing cost is lower, is conducive to effective popularization and the application of LED.
In the present embodiment, barricade 15 is circular circulus, certainly, is not limited in the present embodiment, and described barricade 15 also can be Q-RING shape or polygon circulus, needs only the diffusion that can center on described wafer 13 and limit described fluorescent glue 17 effectively.
Need to prove; the utility model is not limited to above-mentioned execution mode; according to creative spirit of the present utility model; those skilled in the art can also make other variations; these all should be included within the utility model scope required for protection according to the variation that creative spirit of the present utility model is done.
Claims (8)
1. LED that can prevent fluorescent glue diffusion, it comprises substrate, is fixed on wafer and lens on the described substrate, it is characterized in that: the periphery of described wafer has the barricade around described wafer, described barricade is arranged on the described substrate, described barricade encloses and is filled with the fluorescent glue that covers described wafer, the described wafer of described lens packages, described fluorescent glue and described barricade in the receiving space of formation.
2. the LED that prevents the fluorescent glue diffusion as claimed in claim 1 is characterized in that described barricade is circular ring-type or polygon circulus.
3. the LED that prevents fluorescent glue diffusion as claimed in claim 1, it is characterized in that, the height of described barricade is that LED wafer thickness 1/3 is to the thickness of the relative substrate of described lens, described wafer is connected with the pin of power supply by lead, described barricade around being of a size of around described wafer and lead and pin.
4. the LED that prevents the fluorescent glue diffusion as claimed in claim 1 is characterized in that described barricade is white glues wall, silica gel wall, epoxy resin wall, Merlon wall, glass wall, metal wall or metal oxide wall.
5. the LED that prevents the fluorescent glue diffusion as claimed in claim 1 is characterized in that described barricade is arranged at described substrate by the mode of pressing, deposition, sintering or gluing.
6. the LED that prevents the fluorescent glue diffusion as claimed in claim 1 is characterized in that described substrate is metal substrate or ceramic substrate.
7. the LED that prevents the fluorescent glue diffusion as claimed in claim 1 is characterized in that the quantity of described wafer is 1～100.
8. the LED that prevents the fluorescent glue diffusion as claimed in claim 1 is characterized in that, comprises that further it is connected with negative pole with the positive pole of described wafer respectively by lead for the pin that connects feeder ear.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011203874536U CN203038966U (en) | 2011-10-12 | 2011-10-12 | LED preventing fluorescent glue from diffusing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011203874536U CN203038966U (en) | 2011-10-12 | 2011-10-12 | LED preventing fluorescent glue from diffusing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203038966U true CN203038966U (en) | 2013-07-03 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011203874536U Expired - Fee Related CN203038966U (en) | 2011-10-12 | 2011-10-12 | LED preventing fluorescent glue from diffusing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203038966U (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103579456A (en) * | 2013-09-30 | 2014-02-12 | 深圳市瑞丰光电子股份有限公司 | COB area light source and glue blocking wall manufacturing method thereof |
| CN107994012A (en) * | 2017-11-09 | 2018-05-04 | 江苏稳润光电科技有限公司 | It is a kind of to be encapsulated for fluorescent glue and the closed SMD of stent |
| CN109817797A (en) * | 2019-01-23 | 2019-05-28 | 佛山市国星光电股份有限公司 | LED component and lamp group array |
| CN110021619A (en) * | 2019-05-17 | 2019-07-16 | 积高电子(无锡)有限公司 | Image sensor package structure and packaging method |
| CN110112163A (en) * | 2019-05-17 | 2019-08-09 | 积高电子(无锡)有限公司 | A kind of image sensor package structure and packaging method |
| CN112786759A (en) * | 2019-11-08 | 2021-05-11 | 宁波安芯美半导体有限公司 | Light-emitting diode substrate, preparation method and light-emitting diode bulb |
-
2011
- 2011-10-12 CN CN2011203874536U patent/CN203038966U/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103579456A (en) * | 2013-09-30 | 2014-02-12 | 深圳市瑞丰光电子股份有限公司 | COB area light source and glue blocking wall manufacturing method thereof |
| CN107994012A (en) * | 2017-11-09 | 2018-05-04 | 江苏稳润光电科技有限公司 | It is a kind of to be encapsulated for fluorescent glue and the closed SMD of stent |
| CN109817797A (en) * | 2019-01-23 | 2019-05-28 | 佛山市国星光电股份有限公司 | LED component and lamp group array |
| CN110021619A (en) * | 2019-05-17 | 2019-07-16 | 积高电子(无锡)有限公司 | Image sensor package structure and packaging method |
| CN110112163A (en) * | 2019-05-17 | 2019-08-09 | 积高电子(无锡)有限公司 | A kind of image sensor package structure and packaging method |
| CN112786759A (en) * | 2019-11-08 | 2021-05-11 | 宁波安芯美半导体有限公司 | Light-emitting diode substrate, preparation method and light-emitting diode bulb |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130703 Termination date: 20181012 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |