CN109817797A - LED component and lamp group array - Google Patents
LED component and lamp group array Download PDFInfo
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- CN109817797A CN109817797A CN201910064156.9A CN201910064156A CN109817797A CN 109817797 A CN109817797 A CN 109817797A CN 201910064156 A CN201910064156 A CN 201910064156A CN 109817797 A CN109817797 A CN 109817797A
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- supporting structure
- light
- led component
- transmissive encapsulant
- silica gel
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Abstract
The present invention provides a kind of LED components and lamp group array, wherein LED component includes: supporting structure, for carrying chip；Light-transmissive encapsulant, light-transmissive encapsulant setting is in supporting structure and coating chip, and light-transmissive encapsulant is formed by being added dropwise after the high viscosity silica gel in the upper surface of supporting structure solidifies, and four apex angles of supporting structure expose to except light-transmissive encapsulant.The present invention solves the problems, such as that the at high cost and luminous efficiency of processing and manufacturing of ultraviolet LED and deep ultraviolet LED in the prior art is low.
Description
Technical field
The present invention relates to technical field of LED light illumination, in particular to a kind of LED component and lamp group array.
Background technique
As Minamata pact gradually comes into force, ultraviolet LED or deep ultraviolet LED using more and more extensive, be related to for example luring mosquito,
Manicure, the every field such as industry solidification and sterilizing.Therefore, in order to be conducive to the quick of ultraviolet LED or deep ultraviolet LED technology
How Popularization And Development reduces ultraviolet LED and the processing and manufacturing cost of deep ultraviolet LED, while can also promote ultraviolet LED and dark purple
The luminous efficiency of outer LED has become urgent problem to be solved in industry.
Summary of the invention
The main purpose of the present invention is to provide a kind of LED components and lamp group array, in the prior art ultraviolet to solve
The processing and manufacturing of LED and deep ultraviolet LED problem at high cost and low luminous efficiency.
To achieve the goals above, according to an aspect of the invention, there is provided a kind of LED component, comprising: bracket knot
Structure, for carrying chip；Light-transmissive encapsulant, light-transmissive encapsulant setting in supporting structure and coating chip, and light-transmissive encapsulant by
It is added dropwise and is formed after the high viscosity silica gel solidification of the upper surface of supporting structure, four apex angles of supporting structure expose to transparent encapsulant
Except portion.
Further, the viscosity number range of high viscosity silica gel is in 30000Pas between 40000Pas.
Further, the outer surface of the light-transmissive encapsulant formed after high viscosity silica gel is added dropwise in the upper surface of supporting structure is
The part of the surface of spherical surface or ellipsoid.
Further, supporting structure is rectangular panel body shape, and contacting with the upper surface of supporting structure for light-transmissive encapsulant is outer
Week extends loop curve along to be smooth.
Further, upper surface model of the bottom surface of light-transmissive encapsulant contacted with the upper surface of supporting structure in supporting structure
In enclosing.
Further, a part of the outer periphery of light-transmissive encapsulant protrudes from the second periphery of the upper surface of supporting structure
Edge.
Further, the upper surface of supporting structure is formed with the annular enclosing for the peripheral side that chip is arranged in, annular enclosing
For limiting the outer periphery of light-transmissive encapsulant in the regional scope that it is surrounded.
Further, the portion of upper surface of supporting structure, which is recessed downwards, forms cup chamber, and cup chamber is formed in annular enclosing and surrounds
Regional scope in, and chip setting it is intracavitary in cup.
Further, annular enclosing and supporting structure are integrated injection molding structure, or annular enclosing is with supporting structure
The separate structure being connected.
According to another aspect of the present invention, a kind of lamp group array, including support frame are provided, with the shape of array on support frame
Formula arrangement is provided with multiple supporting structures, by the way that high viscosity silica gel is added dropwise correspondingly in the upper surface of multiple supporting structures,
High viscosity silica gel forms the multiple light-transmissive encapsulants covered on multiple supporting structures correspondingly after solidifying, to be formed on multiple
The LED component stated.
It applies the technical scheme of the present invention, by optimizing the moulding process of LED component, high viscosity silica gel is added dropwise to bracket knot
Chip on structure carries out cladding encapsulation, not only ensure that the potting to chip, it is ensured that chip can be steadily in the long term
Shine operation, it is often more important that, this material of high viscosity silica gel is added dropwise, chip realization is encapsulated, simple process and low cost, ten
The processing and manufacturing cost for point being conducive to control LED component, has very high economy, can reliably LED component is in industry
The market competitiveness；Moreover, the light-transmissive encapsulant that high viscosity silica gel is formed after solidifying have excellent light transmission, and according to
By the high viscosity characteristic of high viscosity silica gel, it is made also just can to form curved surface appearance by the surface tension of itself in liquid
Face, the light-transmissive encapsulant formed after solidifying high viscosity silica gel have perfect curved outer surface, are advantageous to chip and issue light
The transmission and diverging of line, have greatly improved the luminous efficiency of LED component；And four apex angles of supporting structure expose to light transmission
Except encapsulation part, the overall volume of light-transmissive encapsulant has been accurately controlled, has advantageously reduced the high viscosity for generating light-transmissive encapsulant
The consumption of silica gel has greatly improved the economy of LED component.
Detailed description of the invention
The accompanying drawings constituting a part of this application is used to provide further understanding of the present invention, and of the invention shows
Examples and descriptions thereof are used to explain the present invention for meaning property, does not constitute improper limitations of the present invention.In the accompanying drawings:
Fig. 1 shows the main view perspective diagram of the LED component of embodiment according to the present invention one；
Fig. 2 shows a kind of signals of the top perspective of the light-transmissive encapsulant with alternative embodiment of the LED component in Fig. 1
Figure；
The top perspective with the light-transmissive encapsulant of another alternative embodiment that Fig. 3 shows the LED component in Fig. 1 is shown
It is intended to；
Fig. 4 shows the main view perspective diagram for eliminating light-transmissive encapsulant of the LED component in Fig. 1；
Fig. 5 shows the schematic top plan view for eliminating light-transmissive encapsulant of the LED component in Fig. 1；
Fig. 6 shows the main view perspective diagram of the LED component of embodiment according to the present invention two；
Fig. 7 shows the schematic diagram in top down perspective of the LED component in Fig. 6.
Wherein, the above drawings include the following reference numerals:
10, supporting structure；11, the second outer periphery；12, annular enclosing；13, cup chamber；14, apex angle；20, chip；30, light transmission
Encapsulation part；31, outer periphery.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that the described embodiment is only a part of the embodiment of the present invention, instead of all the embodiments.It is right below
The description only actually of at least one exemplary embodiment be it is illustrative, never as to the present invention and its application or use
Any restrictions.Based on the embodiments of the present invention, those of ordinary skill in the art are without creative efforts
Every other embodiment obtained, shall fall within the protection scope of the present invention.
Processing and manufacturing in order to solve ultraviolet LED and deep ultraviolet LED in the prior art is at high cost and luminous efficiency
Low problem, the present invention provides a kind of LED components and lamp group array, wherein lamp group array includes support frame, on support frame with
The form arrangement of array is provided with multiple supporting structures 10, by being added dropwise correspondingly in the upper surface of multiple supporting structures 10
High viscosity silica gel, high viscosity silica gel form the multiple light-transmissive encapsulants covered on multiple supporting structures 10 correspondingly after solidifying
30, to form multiple above-mentioned and following LED components.
Embodiment one
As shown in Figures 1 to 5, LED component includes: supporting structure 10 and light-transmissive encapsulant 30, and supporting structure 10 is for holding
Carry chip 20；The setting of light-transmissive encapsulant 30 is in supporting structure 10 and coating chip 20, and light-transmissive encapsulant 30 is by being added dropwise in bracket
It is formed after the high viscosity silica gel solidification of the upper surface of structure 10, four apex angles 14 of supporting structure 10 expose to light-transmissive encapsulant 30
Except.
By optimizing the moulding process of LED component, high viscosity silica gel is added dropwise, the chip 20 on supporting structure 10 is wrapped
Encapsulation is covered, not only ensure that the potting to chip 20, it is ensured that chip 20 can shine operation steadily in the long term, heavier
It wants, this material of high viscosity silica gel is added dropwise, encapsulation is realized to chip 20, simple process and low cost is advantageous to control
The processing and manufacturing cost of LED component processed has very high economy, being capable of the reliably market competition of LED component in industry
Power；Moreover, the light-transmissive encapsulant 30 that high viscosity silica gel is formed after solidifying has excellent light transmission, and relies on high viscosity
The high viscosity characteristic of silica gel makes it also just can form curved outer surface by the surface tension of itself in liquid, makes high viscous
The light-transmissive encapsulant 30 that is formed has perfection curved outer surface after degree silica gel solidify, be advantageous to chip 20 emit beam it is saturating
It crosses and dissipates, greatly improved the luminous efficiency of LED component；And four apex angles 14 of supporting structure 10 expose to light transmission envelope
Except dress portion 30, the overall volume of light-transmissive encapsulant 30 has been accurately controlled, has advantageously reduced the height for generating light-transmissive encapsulant 30
The consumption of viscosity silica gel has greatly improved the economy of LED component.
Preferably, the viscosity number range of high viscosity silica gel is in 30000Pas between 40000Pas.It needs to illustrate
It is in this application, to give the preferred scope of the viscosity number of high viscosity silica gel, the high viscosity silica gel within the scope of the viscosity number
The light-transmissive encapsulant 30 formed after solidification has perfect curved outer surface, and the light that can dramatically improve the sending of chip 20 exists
By the diverging performance of light-transmissive encapsulant 30, the luminous efficiency of LED component is reliably improved.
Optionally, the outer surface of the light-transmissive encapsulant 30 formed after high viscosity silica gel is added dropwise in the upper surface of supporting structure 10
For the part of the surface of spherical surface or ellipsoid.The outer surface of light-transmissive encapsulant 30 is more advantageous to for the part of the surface of spherical surface or ellipsoid
Light uniformly dissipates after passing through light-transmissive encapsulant 30 into space, so that the luminous intensity of LED component is uniform in its light-emitting area
Distribution, promotes the luminescent properties of LED component.
As shown in Figures 2 and 3, supporting structure 10 be rectangular panel body shape, light-transmissive encapsulant 30 it is upper with supporting structure 10
The outer periphery of surface contact is smooth extension loop curve.This is after high viscosity silica gel is added dropwise on supporting structure 10, to encounter branch
The upper surface backstop of frame structure 10, forms by its own fluid behaviour；In this application, by according to various sizes of bracket
Structure 10 is to be added dropwise suitable high viscosity silica gel drop, so that its light-transmissive encapsulant 30 formed after solidifying can either be covered reliably
Chip 20, and it can be stably formed curved outer surface, while the supporting structure 10 of larger area can also be covered as far as possible
Upper surface promotes the integrally-built stability of LED component to increase the adhesive force between light-transmissive encapsulant 30 and supporting structure 10.
It should be noted that in the present embodiment, the portion of upper surface of supporting structure 10 is recessed forms cup chamber 13, core downwards
Piece 20 is arranged in cup chamber 13,10 portion of upper surface of 30 cover cup chamber 13 of light-transmissive encapsulant and supporting structure, supporting structure
Four apex angles 14 of 10 upper surfaces expose to except light-transmissive encapsulant 30.Certainly, the upper surface of supporting structure 10 is also possible to put down
Face, chip 20 are located at the upper surface of supporting structure 10, and light-transmissive encapsulant 30 is arranged in supporting structure 10 and coating chip 20, and thoroughly
Light encapsulation part 30 is formed after the high viscosity silica gel solidification of the upper surface of supporting structure 10 by being added dropwise, 10 upper surface of supporting structure
Four apex angles 14 expose to except light-transmissive encapsulant 30.
As shown in Fig. 2, promoting its whole aesthetic appearance, while advantageous in order to enable the overall structure of LED component is regular
In the overall volume of control LED component, the bottom surface of light-transmissive encapsulant 30 contacted with the upper surface of supporting structure 10 is in bracket knot
Within the scope of the upper surface of structure 10.
Certainly, in another alternative embodiment of the application, as shown in figure 3, light-transmissive encapsulant 30 is in supporting structure 10
A part of the orthographic projection of upper surface protrudes from the second outer periphery 11 of the upper surface of supporting structure 10, can expand LED in this way
The light emitting angle of device.
Specifically, the first form is the upper with supporting structure 10 of light-transmissive encapsulant 30 in the alternative embodiment
For the outer periphery of surface contact as outer periphery 31, i.e. a part of the outer periphery 31 of light-transmissive encapsulant 30 protrudes from supporting structure 10
Upper surface the second outer periphery 11.In such manner, it is possible to effectively increase the upper surface of light-transmissive encapsulant 30 and supporting structure 10
Contact area reliably increases the adhesive force between light-transmissive encapsulant 30 and supporting structure 10, it is integrally-built to promote LED component
Stability.
Second of form is the part on the bottom surface of light-transmissive encapsulant 30 contacted with the upper surface of supporting structure 10
Outer periphery 31 is formed, i.e. a part of the outer periphery 31 of light-transmissive encapsulant 30 protrudes from outside the second of the upper surface of supporting structure 10
Week is along 11.It can equally expand the light emitting angle of LED component.
Embodiment two
As shown in Figure 6 and Figure 7, the main distinction of the embodiment and embodiment one is, the upper surface shape of supporting structure 10
At the annular enclosing 12 for having the peripheral side that chip 20 is arranged in, annular enclosing 12 is for limiting the outer periphery 31 of light-transmissive encapsulant 30
Position is in the regional scope that it is surrounded.Annular enclosing 12 plays the backstop action to light-transmissive encapsulant 30 before curing, stablizes
Ground limits the planform of the light-transmissive encapsulant 30 after solidifying, so that the first outer periphery 31 of light-transmissive encapsulant 30 is enclosed along annular
The inner wall of gear 12 extends, and chip 20 can not effectively be covered due to 30 outer periphery of light-transmissive encapsulant just deviates by avoiding, and also can
It avoids the outer periphery of light-transmissive encapsulant 30 excessive and consumptive material is caused to waste and influence the overall appearance aesthetic feeling of LED component.
Specifically, as shown in Figure 6 and Figure 7, the portion of upper surface of supporting structure 10, which is recessed downwards, forms cup chamber 13, cup chamber
13 are formed in the regional scope that annular enclosing 12 surrounds, and chip 20 is arranged in cup chamber 13.In this way, annular enclosing 12 will not
Backstop is to penetrating the light after light-transmissive encapsulant 30, it is ensured that LED component has stable luminescent properties.
Optionally, annular enclosing 12 is integrated injection molding structure with supporting structure 10.In this way, convenient for annular enclosing 12 with
The processing and manufacturing of supporting structure 10 advantageously reduces the processing and manufacturing cost of annular enclosing 12 and supporting structure 10, promotes LED device
The economy of part.
Certainly, the setting position for the ease of the annular enclosing 12 of adjustment relative to supporting structure 10, annular enclosing 12 and branch
Frame structure 10 is the separate structure being connected.
It should be noted that term used herein above is merely to describe specific embodiment, and be not intended to restricted root
According to the illustrative embodiments of the application.As used herein, unless the context clearly indicates otherwise, otherwise singular
Also it is intended to include plural form, additionally, it should be understood that, when in the present specification using term "comprising" and/or " packet
Include " when, indicate existing characteristics, step, operation, device, component and/or their combination.
Unless specifically stated otherwise, positioned opposite, the digital table of the component and step that otherwise illustrate in these embodiments
It is not limited the scope of the invention up to formula and numerical value.Simultaneously, it should be appreciated that for ease of description, each portion shown in attached drawing
The size divided not is to draw according to actual proportionate relationship.For technology, side known to person of ordinary skill in the relevant
Method and equipment may be not discussed in detail, but in the appropriate case, and the technology, method and apparatus should be considered as authorizing explanation
A part of book.In shown here and discussion all examples, any occurrence should be construed as merely illustratively, and
Not by way of limitation.Therefore, the other examples of exemplary embodiment can have different values.It should also be noted that similar label
Similar terms are indicated in following attached drawing with letter, therefore, once it is defined in a certain Xiang Yi attached drawing, then subsequent attached
It does not need that it is further discussed in figure.
For ease of description, spatially relative term can be used herein, as " ... on ", " ... top ",
" ... upper surface ", " above " etc., for describing such as a device shown in the figure or feature and other devices or spy
The spatial relation of sign.It should be understood that spatially relative term is intended to comprising the orientation in addition to device described in figure
Except different direction in use or operation.For example, being described as if the device in attached drawing is squeezed " in other devices
It will be positioned as " under other devices or construction after part or construction top " or the device of " on other devices or construction "
Side " or " under other devices or construction ".Thus, exemplary term " ... top " may include " ... top " and
" in ... lower section " two kinds of orientation.The device can also be positioned with other different modes and (is rotated by 90 ° or in other orientation), and
And respective explanations are made to the opposite description in space used herein above.
It should be noted that term used herein above is merely to describe specific embodiment, and be not intended to restricted root
According to the illustrative embodiments of the application.As used herein, unless the context clearly indicates otherwise, otherwise singular
Also it is intended to include plural form, additionally, it should be understood that, when in the present specification using term "comprising" and/or " packet
Include " when, indicate existing characteristics, step, work, device, component and/or their combination.
It should be noted that the description and claims of this application and term " first " in above-mentioned attached drawing, "
Two " etc. be to be used to distinguish similar objects, without being used to describe a particular order or precedence order.It should be understood that using in this way
Data be interchangeable under appropriate circumstances, so that presently filed embodiment described herein can be in addition to illustrating herein
Or the sequence other than those of description is implemented.
The foregoing is only a preferred embodiment of the present invention, is not intended to restrict the invention, for the skill of this field
For art personnel, the invention may be variously modified and varied.All within the spirits and principles of the present invention, made any to repair
Change, equivalent replacement, improvement etc., should all be included in the protection scope of the present invention.
Claims (10)
1. a kind of LED component characterized by comprising
Supporting structure (10), for carrying chip (20)；
Light-transmissive encapsulant (30), the light-transmissive encapsulant (30) are arranged in the supporting structure (10) and coat the chip
(20), and the light-transmissive encapsulant (30) is by being added dropwise shape after the high viscosity silica gel in the upper surface of the supporting structure (10) solidifies
At four apex angles (14) of the supporting structure (10) expose to except the light-transmissive encapsulant (30).
2. LED component according to claim 1, which is characterized in that the viscosity number range of the high viscosity silica gel exists
30000Pas is between 40000Pas.
3. LED component according to claim 1, which is characterized in that be added dropwise in the upper surface of the supporting structure (10) high
The outer surface of the light-transmissive encapsulant (30) formed after viscosity silica gel is the part of the surface of spherical surface or ellipsoid.
4. LED component according to claim 1, which is characterized in that the supporting structure (10) is rectangular panel body shape, described
The outer periphery of light-transmissive encapsulant (30) contacted with the upper surface of the supporting structure (10) is smooth extension loop curve.
5. LED component according to claim 4, which is characterized in that the light-transmissive encapsulant (30) with the bracket knot
The bottom surface of the upper surface contact of structure (10) is within the scope of the upper surface of the supporting structure (10).
6. LED component according to claim 4, which is characterized in that the outer periphery (31) of the light-transmissive encapsulant (30)
A part protrudes from the second outer periphery (11) of the upper surface of the supporting structure (10).
7. LED component according to claim 1, which is characterized in that the upper surface of the supporting structure (10), which is formed with, to be set
The annular enclosing (12) in the peripheral side of the chip (20) is set, the annular enclosing (12) is used for the light-transmissive encapsulant
(30) outer periphery (31) limits in the regional scope that it is surrounded.
8. LED component according to claim 7, which is characterized in that the portion of upper surface of the supporting structure (10) is downward
Recess is formed cup chamber (13), and the cup chamber (13) is formed in the regional scope that the annular enclosing (12) surrounds, and the core
Piece (20) setting is in the cup chamber (13).
9. LED component according to claim 7, which is characterized in that
The annular enclosing (12) and the supporting structure (10) is integrated injection molding structure, or
The annular enclosing (12) is the separate structure being connected with the supporting structure (10).
10. a kind of lamp group array, which is characterized in that including support frame, arrangement is provided in an array manner on support frame as described above
Multiple supporting structures (10), by the way that high viscosity silica gel is added dropwise correspondingly in the upper surface of the multiple supporting structure (10),
High viscosity silica gel forms the multiple light-transmissive encapsulants (30) covered on the multiple supporting structure (10) correspondingly after solidifying,
To form LED component described in multiple any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910064156.9A CN109817797A (en) | 2019-01-23 | 2019-01-23 | LED component and lamp group array |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910064156.9A CN109817797A (en) | 2019-01-23 | 2019-01-23 | LED component and lamp group array |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109817797A true CN109817797A (en) | 2019-05-28 |
Family
ID=66604859
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910064156.9A Pending CN109817797A (en) | 2019-01-23 | 2019-01-23 | LED component and lamp group array |
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|---|---|
| CN (1) | CN109817797A (en) |
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