CN208368541U - Efficiently add lustre to type CSP LED - Google Patents

Abstract

The utility model relates to a kind of type CSP LED that efficiently adds lustre to.It is characterized in that a high light transmittance shell is arranged outside the CSP LED chip, which constitutes transparent resonant cavity, and CSP LED chip and transparent resonant cavity constitute the type CSP LED monomer that efficiently adds lustre to.The utility model constitutes the type CSP LED that efficiently adds lustre to by the external setting resonant cavity in existing CSP LED chip, makes that reflection and interference occurs by the light wave of transparent resonant cavity, and then generate the light wave of enhancing, realizes high photosynthetic efficiency；By the way that silica dioxide coating is arranged in the bottom of transparent resonant cavity, the light wave of lower layer is all reflected, enhances light efficiency by the silver layer effect of similar mirror bottom.

Description

Efficiently add lustre to type CSP LED

Technical field

The utility model relates to a kind of type CSP LED that efficiently adds lustre to.

Background technique

So far from utility model, oneself LED component constantly weed out the old and bring forth the new through as long as more than 30 years, it is lasting forward It expands in progress, among mature, price ceaselessly glides, and is received benefits using consumer.

LED region is divided into epitaxy and two kinds of component, and epitaxy is the single-chip after wafer division, and LED component is then By packaging technology process again, epitaxy is subjected to packaging protection appropriate, becomes LED component, it is more commonly used in straight cutting pattern With SMD patch pattern, occupation proportion is larger, and production technology comparative maturity, production yield is up to 99% or more.

The development of semi-conductor industry is paid attention to pushing with support energetically, LED is white in over the past thirty years by country The utility model of light, really enables the mankind enjoy the low energy consumption high-efficiency for partly leading device, and the maturation of LED illumination product is universal to cover Oneself lid rate substantially grown up, can substitution traditional lighting lamps and lanterns very, completely penetrate any required sky using illumination Between in.

Past LED component simply divides into two kinds:

1. direct insertion LED, also known as copper stent LED component, are mainly characterized by two metal pins, representative is The PN electrode of LED, it can be to complete being welded and fixed for device by wave-soldering, its luminous efficacy is opposite on straight cutting circuit board It is lower.This is the mature technology and lower-cost process flow of early stage.Its required precision is not high, compare be suitble to it is low On the product at end and the application range of signal lamp.

2.SMD LED component is the higher LED component of ratio of precision, is mainly required frivolous using surface mount process Short and small technique, is a kind of packaging support that metallic support is mixed with plastics, and structural strength surpasses the LED device of general copper stent Part.SMD LED component has different dimensional fits, is that LED epitaxial growth is packaged on bracket, welding lead electrode, then uses silicon Glue encapsulation is completed, and the luminous efficacy of SMD LED breaks through 100 lumens/watts, is a great breakthrough growth, in last decade, Stable growth is broken through upwards, target oneself be close to every watt of 180-200 lumen boundary.

The common ground of above two kinds of LED components is the semiconductor crystal growing technology for being all made of early stage, epitaxy be belong to it is rectilinear Mechanism, is exactly forward LED crystal growing technology, and the PN electrode of forward LED is in upper and lower, lower section N, top P.So of heap of stone The brilliant pole N is using the fixed epitaxy of silver paste in substrate surface, and the pole P of epitaxy is to be welded on bracket using gold thread, then use silicon Epitaxy is packed and is completed by glue.

It is the encapsulation basis of early stage using gold thread welding, oneself has been adopted 30 years as long as time, but the cause of LED component Life injury all occurs from the defective products of gold thread welding because there is a large amount of poor prognostic cause.In addition because the pole P occupies epitaxy The lighting area of top, and the light out for having gold thread masking a part of, cause the light efficiency of LED component to be difficult to grow up upwards.

Therefore it needs to develop a set of new technology, to improve the luminous efficacy of LED, and accomplishes height reliability.

No matter direct insertion bracket LED and SMD stand type LED, use positive cartridge chip (VERTICAL CHIP) as luminous Core devices.It needs bonding wire processing procedure, and chip could be connected with bracket, this both is something in common, and also two The weakness of person, exactly work in can occur conducting wire be detached from or the dead lamp that breaks, and occur probability it is quite high, so high-end production Product will not select both product, be exactly that reliability is bad.

Insecure reason is caused, generally because the fabrication process condition of the two device, packs molding solidification temperature Condition is set at 150 degree, and the set temperature condition of reflow soldering is set to 240-260 degree, oneself is through being significantly larger than device Forming and hardening temperature condition.Actually say, be device is caused aging and destroy, when device complete by reflow soldering it Afterwards, it is equal to oneself through aging, it is the bad main cause for causing product that oneself is unstable unreliable through loosening for the solder joint of conducting wire.

Flip-chip (FLIP CHIP) is that a great break-through skill (see attached drawing one) is also known as horizontal LED chip, The weld pad of flip-chip is in the underface of chip, and level is presented in two weld pads, therefore has not needed bonding wire processing procedure, meeting in production Similar SMD technique is adopted, WU cream is printed on circuit, it can uses automatic chip mounting equipment, carries out patch processing, be fully achieved certainly Dynamic chemical industry skill.

Flip chip technology (fct) in fact appears in product on circuit module earliest, and highdensity product has close at circuit chip Degree is high, the advantage of more pin terminals, be product at the pin of circuit is all weld pad so need to take flip chip technology, directly with Circuit board docking, does not use bonding wire craft, such reliability is higher.Because the another item important breakthrough of LED epitaxial growth semiconductor goes out It is existing, it is exactly LED epitaxial growth and flip chip technology to connecting, the technique for equally eliminating bonding wire simplifies process flow, overcomes simultaneously Break bad problem in the past.

But LED illumination industry is being kept on improving, and under the requirement attained a yet higher goal, needs precision higher, light efficiency exports more High target, ceaselessly R & D design goes out new varieties, the preceding topic that cost is rationalized, and breaks through outlet pursuing, it is desirable to make LED device The light efficiency of part exports, another peak is presented.

Utility model content

Aiming at the problems existing in the prior art, the purpose of this utility model is to provide a kind of type CSP that efficiently adds lustre to The technical solution of LED.

The type CSP LED that efficiently adds lustre to, the LED bare crystalline including the pole P and the extremely ipsilateral setting of N, LED bare crystalline outside cladding Phosphor conversion layer is set and constitutes CSP LED chip, it is characterised in that is arranged outside a high light transmittance outside the CSP LED chip Shell, the high light transmittance shell constitute transparent resonant cavity, and CSP LED chip and transparent resonant cavity constitute the type CSP that efficiently adds lustre to LED monomer.

The type CSP LED that efficiently adds lustre to, it is characterised in that the high light transmittance shell uses high temperature resistant engineering shape Material passes through injection molded.

The type CSP LED that efficiently adds lustre to, it is characterised in that the section of the high light transmittance shell is configured to increase Add the convex of floor space, the groove of the lower part setting installation CSP LED chip of high light transmittance shell.

The type CSP LED that efficiently adds lustre to, it is characterised in that silica is arranged in the bottom of the high light transmittance shell Coating or coating of titanium dioxide.

The type CSP LED that efficiently adds lustre to, it is characterised in that the thickness of the silica dioxide coating or coating of titanium dioxide Degree is 50-100 microns.

The type CSP LED that efficiently adds lustre to, it is characterised in that the silica dioxide coating or coating of titanium dioxide can The light wave for reaching bottom is all reflected, reflecting light W4 is constituted, reflecting light W4 is to enhance light wave.

The type CSP LED that efficiently adds lustre to, it is characterised in that the light that the CSP LED chip issues is directional light W1, Reflected light W2, W1 and W2 can be generated when the transparent resonant cavity that directional light W1 is made up of high light transmittance shell can interfere effect It answers, when W1 is identical as the phase of light wave of W2, then the energy of W1 and W2 can generate the effect of superposition, and wave amplitude energy, which can mutually change, to be increased Greatly, outgoing light wave W3, the light efficiency energy of W3=W2+W1 are generated, which is to enhance light wave.

The utility model constitutes the type CSP LED that efficiently adds lustre to by the external setting resonant cavity in existing CSP LED chip, Make that reflection and interference occurs by the light wave of transparent resonant cavity, and then generate the light wave of enhancing, realizes high photosynthetic efficiency；By transparent Silica dioxide coating is arranged in the bottom of resonant cavity, and the silver layer effect of similar mirror bottom all reflects the light wave of lower layer, enhancing Light efficiency.

Detailed description of the invention

Fig. 1 is existing CSP LED structure schematic diagram；

Fig. 2 is that the utility model efficiently adds lustre to type CSP LED structure schematic diagram；

Fig. 3 is the waveform diagram of W1, W2 superposition；

Fig. 4 is the waveform diagram of W3, W4 superposition；

In figure: the pole 1-P, the pole 2-N, 3-LED bare crystalline, 4- Phosphor conversion layer, the transparent resonant cavity of 5-, 6- silica apply Layer.

Specific embodiment

The utility model is described in further detail with reference to the accompanying drawings of the specification:

Efficiently add lustre to type CSP LED, first has to the principle for mentioning laser diode, the structure of a laser diode, A PN junction is had, and has a resonant cavity, PN diode is placed in the central location of resonant cavity.Light wave resonance Alveolus is divided into internal resonance chamber and two kinds of structures of exterior resonance chamber, is this time using exterior resonance cavity configuration as the knot that efficiently adds lustre to Structure, simple and easy application.

The type CSP LED that efficiently adds lustre to of the utility model, the LED bare crystalline 3 including the pole P 1 and the ipsilateral setting in the pole N 2, LED is naked 3 outside cladding setting Phosphor conversion layer 4 of crystalline substance constitutes CSP LED chip, and in order to enhance the light efficiency of existing CSP LED, this is practical Novel that a high light transmittance shell is arranged outside existing CSP LED chip, which constitutes transparent resonant cavity 5, CSP LED chip may be implemented to reflect and be interfered by transparent resonant cavity, enhance light efficiency, and CSP LED chip and transparent resonant cavity are constituted One type CSP LED monomer that efficiently adds lustre to.

The high light transmittance shell of the utility model passes through injection molded, high light transmittance using high temperature resistant engineering plastic The section of shell is configured to increase the convex of floor space, the lower part setting installation CSP LED chip of high light transmittance shell Groove, for cooperating with CSP LED chip；The bottom setting silica dioxide coating 6 or titanium dioxide of high light transmittance shell apply Perhaps other homotype materials reflection silica dioxide coating or coating of titanium dioxide, will similar to the silver layer effect of mirror bottom for layer The light wave of lower layer all reflects, and the floor space of increase can increase the face of coating silicon dioxide coating or coating of titanium dioxide Product, enhances the effect of reflection, silica dioxide coating or coating of titanium dioxide with a thickness of 50-100 microns；Silica dioxide coating Or coating of titanium dioxide can all reflect the light wave for reaching bottom, constitute reflecting light W4, reflecting light W4 is Enhance light wave.

The light that existing CSP LED chip issues is directional light W1, and directional light W1 is made up of transparent high light transmittance shell Reflected light W2, W1 and W2 can be generated when resonant cavity can interfere effect, when W1 is identical as the phase of light wave of W2, then W1 and W2 Energy can generate the effect of superposition, wave amplitude energy, which can mutually change, to be increased, generate outgoing light wave W3, the light efficiency energy of W3=W2+W1, The outgoing light wave W3 is to enhance light wave.

All light waves are a kind of vibrational energies, and this energy can spread apart outward from starting point and, and contain visible light With black light, including including.

The utility model uses high temperature resistant engineering plastic, and after injection molded, referred to as transparent resonant cavity will Transparent resonant cavity and CSP LED, are merged by high pressure, become the type CSP LED monomer that efficiently adds lustre to.

One CSP LED is only capable of producing the parallel light wave of W1, when the energy of light wave enters space, i.e., can with away from From square be inversely proportional and to weaken energy.

How generation adds lustre to performance, carrys out self-induced transparency resonant cavity and is formed by light wave resonant cavity effect.

As in Fig. 2 to show W1 be the light efficiency that CSP LED is issued, be parallel lines light wave, this light wave can be imported into Bright resonance cavity wall, when the light wave of W1 proceeds to the position W2, it will reflection W2 light wave is generated, thus W1 and W2 can occur Interference effect, if W1 is identical as the phase of light wave of W2, the energy of W1 and W2 can generate the effect of superposition, wave amplitude energy Mutually can repeatedly it increase, the light wave for producing W3 goes out light, W3=W2+W1 light efficiency energy.

When the design for implementing transparent resonant cavity, especially increase area in bottom, while in bottom surface coating silicon dioxide coating, With a thickness of 50-100 microns, white film is formed, is located at transparent resonant cavity, the silver layer effect of similar mirror bottom, by lower layer Light wave all reflects.

W1 is the original light out of Phosphor conversion layer；

W2 be transparent resonant cavity reflecting light energy, 20%；

So that the light that goes out of W3 is reflected concentration upwards, may achieve effect below；

W3=W1+W2 (W2=W1+20%) same-phase；

Bottom reflection increases W4；

15%) W4=W1+15%(SiO2 reflects；

The total light efficiency of light=W3+W4 out.

Total light efficiency can increase by 35% light efficiency, therefore have the innovation effect efficiently added lustre to.

Light wave resonance effects explanation

As represented by Fig. 3,4, W1 is initial light-wave energy, and W2 is reflecting light energy, when the energy phase of W1 and W2 After position overlaps,

It is as follows mainly to generate efficiency of adding lustre to:

W3=W2+W1 energy.

Finally go out the total light efficiency of light=W3+W4.

The manufacturing process of the above-mentioned type CSP LED that efficiently adds lustre to, includes the following steps:

1) brilliant ring is expanded in flip-chip merging, previous operations:

Flip-chip is to be seated in one to be known as on the adhesive membrane of blue film first, it is necessary to is fixed on flip-chip low viscous On the blue film of degree, for sapphire towards viscose glue, PN electrode is upwardly-directed, to be first placed in inner ring and expand on brilliant machine platform, use indigo plant Film can be flat stretching indigo plant film so that heating dish is fixed on 50 degree by expanding the operation sequence of brilliant machine, blue film allowed to expand slowly Greatly, the spacing of flip-chip can be gradually increased at this time, and when chip chamber is when reaching certain distance, it is fixed blue that outer ring can be added Film is completed to expand brilliant program；

2) it will complete to expand brilliant expansion crystalline substance ring, the chip for being placed in automatic die bond board expands in brilliant ring fixing seat, waits transparent Resonant cavity frame；

3) injection molding of transparent resonant cavity:

Transparent resonant cavity is the machine-shaping on injection molding machine by plastics injection mould, can similar honeycomb type after molding Formula is netted, and for a large amount of transparent resonant cavity lattice on same frame, each transparent resonant cavity has a depression lattice, uses Engineering plastics resistant to high temperature, can withstand up to 200 degree of high temperature, and the injection molding under 260 degree of hot conditions is presented after cooling The crystal appearance of all-transparent, optics penetrance, up to 95% or more, this frame means are known as transparent resonant cavity lattice；

4) glue program is dripped:

Transparent resonant cavity frame is laid flat it is fixed on merging automatic dispensing machine platform, lattice it is opening up, input is all Transparent resonant cavity crystallographic coordinates start starting drop glue and enter among lattice, make to inject fluorescent powder glue in each lattice, reach 9 9% full position, advance for 1% be flip-chip area；

5) semi-solid preparation program is toasted

Transparent resonant cavity first instills after fluorescent glue, toasts under specific temperature conditions, is in using intracell glue Existing semi-solid preparation, similar jelly state, be not fully cured molding (general Phosphor conversion layer is to adopt one-part form to toast in place, Solidify fluorescent glue directly, coating chip)；

6) it will complete to drip glue and toast the transparent resonant cavity lattice of semi-solid preparation, and be placed on automatic die bond board, carry out certainly Dynamic die bond program, is one flip-chip of placement in each lattice, the PN electrode of chip be it is exposed upward, chip is The surface for being flattened on glue is put down gently, positioned at the central location of lattice；

7) transparent resonant cavity lattice and chip baking-curing program

Complete transparent resonant cavity lattice frame, is placed in after chip, will be fixed with flat plate mold, and be covered with steel plate It covers above chip and squeezes, there is guide post on mold, keep steel plate verticality；Chip, which is squeezed, will penetrate into the fluorescence of semi-solid preparation Reach full position in glue, with being integrally formed of fluorescent glue, is sent into oven, carries out two sections of heating baking-curing；

8) transparent resonant cavity is release

After being completed by baking-curing, flip-chip and transparent resonant cavity oneself through being integrated, flip-chip oneself passes through It penetrates into fixed in fluorescent glue；It is detached from after flat plate mold, it can be split monomer；

Because of the transparent resonant cavity frame of injection molding, transparent resonant cavity is connected by frame, so needing using punching Compression mould cuts off connected frame, and transparent resonant cavity is enable to become independent monolithic device；It so completes and efficiently adds lustre to Type CSP LED molding；

9) the type CSP LED that efficiently adds lustre to is packed

After punching press program, the type that efficiently adds lustre to CSP LED is completed, and becomes independent monomer, is being detached from flat plate mold Later, it can be placed on a clean blue film, the type CSP LED that makes efficiently to add lustre to is fixed on above the glue surface of blue film, then is covered One release paper protection, completes type CSP LED packaging of efficiently adding lustre to.

Claims (7)

1. efficiently add lustre to type CSP LED, the LED bare crystalline including the pole P and the extremely ipsilateral setting of N, cladding setting is glimmering outside LED bare crystalline Light powder conversion layer constitutes CSP LED chip, it is characterised in that a high light transmittance shell, the height are arranged outside the CSP LED chip Translucency shell constitutes transparent resonant cavity, and it is mono- that CSP LED chip and transparent resonant cavity constitute the type CSP LED that efficiently adds lustre to Body.

2. the type CSP LED according to claim 1 that efficiently adds lustre to, it is characterised in that the high light transmittance shell is using resistance to High temperature engineering plastic passes through injection molded.

3. the type CSP LED according to claim 1 that efficiently adds lustre to, it is characterised in that the section of the high light transmittance shell It is configured to increase the convex of floor space, the groove of the lower part setting installation CSP LED chip of high light transmittance shell.

4. the type CSP LED according to claim 3 that efficiently adds lustre to, it is characterised in that the bottom of the high light transmittance shell Silica dioxide coating or coating of titanium dioxide are set.

5. the type CSP LED according to claim 4 that efficiently adds lustre to, it is characterised in that the silica dioxide coating or dioxy Change titanium coating with a thickness of 50-100 microns.

6. the type CSP LED according to claim 4 that efficiently adds lustre to, it is characterised in that the silica dioxide coating or dioxy Changing titanium coating can all reflect the light wave for reaching bottom, constitute reflecting light W4, and reflecting light W4 is to enhance light wave.

7. the type CSP LED according to claim 1 that efficiently adds lustre to, it is characterised in that the light that the CSP LED chip issues For directional light W1, when transparent resonant cavity that directional light W1 is made up of high light transmittance shell, can generate reflected light W2, W1 and W2 meeting Effect is interfered, when W1 is identical as the phase of light wave of W2, then the energy of W1 and W2 can generate the effect of superposition, wave amplitude energy It mutually can repeatedly increase, generate outgoing light wave W3, the light efficiency energy of W3=W2+W1, which is to enhance light wave.