CN203406328U - A LED support with high reliability and a LED device thereof - Google Patents
A LED support with high reliability and a LED device thereof Download PDFInfo
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- CN203406328U CN203406328U CN201320447838.6U CN201320447838U CN203406328U CN 203406328 U CN203406328 U CN 203406328U CN 201320447838 U CN201320447838 U CN 201320447838U CN 203406328 U CN203406328 U CN 203406328U
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- pad
- led
- high reliability
- bonding pad
- led support
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Abstract
The utility model discloses a LED support with high reliability and a LED device thereof. The LED support comprises a first bonding pad and a second bonding pad which are used as conductive pins. The first bonding pad and the second bonding pad are connected together through insulating connection colloid. An insulating seat integrally formed with the connection colloid is disposed on the top surfaces of the first bonding pad and the second bonding pad. A reflection cup for installing a LED chip and reflecting LED light is formed in the insulating seat. Multiple unit protruding structures arranged in a vertically and horizontally staggered manner are disposed on the top surfaces of the first bonding pad and the second bonding pad, wherein the top surfaces of the first bonding pad and the second bonding pad contact the insulating seat. The unit protruding structures in a back row are arranged behind gaps between every two adjacent unit protruding structures in a front row. Not only is the firmness of the LED support further reinforced, but also the air impermeability and the heat dissipating performance of the LED support are improved. Therefore, the reliability of the LED support is effectively increased.
Description
Technical field
The utility model belongs to LED technical field, is specifically related to a kind of high reliability LED support and LED device thereof.
Background technology
Along with LED application is increasingly extensive, application end has proposed more harsh requirement to LED reliability, how to manufacture a kind of high reliability LED support and packaging thereof and has challenge.LED support main flow manufacture method is that metab forms support conductive pin and crystal bonding area through punching press at present, then electroplates, and adopts jetting formation process to make support insulating base, finally by bending, forms LED support finished product.Between plastic cement and backbone metal base without adhesion, thereby poor air-tightness, steam infiltrates LED chip by combination interface gap, and plastic cement poor heat resistance, uses the phenomenon that occurs plastic cement jaundice, blackout for a long time, thereby LED device reliability is difficult to ensure.
As shown in Figure 1, Chinese patent CN201526917U discloses a kind of LED support 100 of high reliability, it is provided with the pit 103 to lower recess on the faying face of copper sheet 101 and plastic-sealed body 102, arranging of pit 103 increased the bonded area of copper sheet 101 with plastic-sealed body 102, makes both in conjunction with more firm.This kind of structural reinforcing copper sheet 101 adhesion with plastic-sealed body 102, the probability that comes off between the two reduces.
But because pit is to lower recess, can not effective obstacle be set for steam or red ink, air-tightness still can not meet production requirement, and this plastic-sealed body 102 is thermoplastic plastic, poor heat resistance, and reliability is waited to improve.
Utility model content
In order to address the above problem, the purpose of this utility model is to provide a kind of high reliability LED support and LED packaging thereof, makes LED air-tightness better, and then improve its unfailing performance when strengthening adhesion.
For achieving the above object, technical scheme that the utility model adopts is as follows:
A kind of high reliability LED support, this support comprises as the first pad of conductive pin and the second pad, described the first pad is connected colloid with the second pad by insulation and links together, upper surface at described the first pad and the second pad is also provided with and the described integrated insulating base of colloid that is connected, in described insulating base inside, be formed with the reflector that LED chip and reflection LED light are installed, the upper surface contacting with insulating base with the second pad at described the first pad is provided with a plurality of crisscross unit bulge-structures of arranging, the unit bulge-structure of wherein arranging is afterwards relatively arranged on the rear in the gap between front-seat adjacent two unit bulge-structures.
Further, described connection colloid and insulating base are made by thermosetting natural gum.
Further, the dual-side that described the first pad is relative with the second pad is non-straightsided shape structure.
Further, described reflector for a cup end be that square, rim of a cup is circular structure, or the cup end and rim of a cup are all square structure.
Further, described connection colloid presents inverted T shape structure.
Further, described unit bulge-structure is conical, prismatic or hemisphere, and the center distance of described adjacent cells bulge-structure is more than or equal to the bottom radius of twice unit bulge-structure, and is less than or equal to the bottom radius of four times of unit bulge-structures.
A high reliability LED device for high reliability LED support described in aforementioned six any one is provided with a LED chip in the reflector of described high reliability LED support.
Further, described LED chip is flip LED chips, and two electrodes of described flip LED chips are directly electrically connected to the first pad and the second pad respectively.
Further, described LED chip is packed LED chip, and two electrodes of described packed LED chip are electrically connected to by gold thread with the first pad and the second pad respectively.
Further, above described reflector, be also provided with lens.
The utility model by the first pad and the second pad by linking together with the integrated colloid that is connected of insulating base, make the fastness between insulating base and pad obtain reinforcement.Moreover, the upper surface that the utility model contacts with insulating base with the second pad at the first pad is provided with a plurality of crisscross unit bulge-structures of arranging, increased the contact area between insulating base and the first pad and the second pad, strengthen again adhesion to each other, and extended moisture permeation pathway; Simultaneously, unit bulge-structure is crisscross arranges, thereafter row's unit bulge-structure is relatively arranged on the rear in the gap between front-seat adjacent two unit bulge-structures, can effectively interrupt moisture infiltrates in order, for the invasion of moisture provides effective barrier, and then improved air-tightness of the present utility model.
Therefore, the utility model not only fastness has obtained further reinforcement, and its air-tightness is also improved, and then makes reliability of the present utility model obtain effective raising.
Accompanying drawing explanation
The picture that this accompanying drawing explanation provides is used for auxiliary to further understanding of the present utility model, forms the application's a part, does not form to improper restriction of the present utility model, in the accompanying drawings:
Fig. 1 is the structural representation of existing LED support 100;
Fig. 2 is the structural representation of the LED support 200 of the utility model embodiment 1;
Fig. 3 is on the first pad of the utility model embodiment 1 or the second pad and the structural representation of unit projection;
Fig. 4 is on the first pad of the utility model embodiment 2 or the second pad and the structural representation of unit projection;
Fig. 5 is on the first pad of the utility model embodiment 3 or the second pad and the structural representation of unit projection;
Fig. 6 is the structural representation of the LED support 200 of the utility model embodiment 4;
Fig. 7 is the structural representation of the LED support 200 of the utility model embodiment 5;
Fig. 8 is the structural representation of the LED device of the utility model embodiment 6;
Fig. 9 is the structural representation of the LED device of the utility model embodiment 7;
Figure 10 is the structural representation of the LED device of the utility model embodiment 8;
Reference numeral:
101, copper sheet 102, plastic-sealed body
103, pit
200, LED support
201, the first pad 202, the second pad
203, connect colloid 204, insulating base
205, reflector 206, unit bulge-structure
2061, front row
300, LED chip
400, gold thread
500, lens
Embodiment
In order to understand fully the purpose of this utility model, feature and effect, below with reference to accompanying drawing and specific embodiment, the technique effect of design of the present utility model, concrete structure and generation is described further.
Embodiment 1:
As shown in Figure 2, the present embodiment discloses a kind of high reliability LED support, this support comprises as the first pad 201 of conductive pin and the second pad 202, described the first pad 201 is connected colloid 203 with the second pad 202 by insulation and links together, upper surface at described the first pad 201 and the second pad 202 is also provided with and the described integrated insulating base 204 of colloid 203 that is connected, and is formed with the reflector 205 that LED chip and reflection LED light are installed in described insulating base 204 inside.Wherein, the first pad 201 and the second pad 202, by linking together with the integrated colloid 203 that is connected of insulating base 204, make the fastness between insulating base 204 and pad (201,202) obtain reinforcement.Moreover, the unit bulge-structure 206 that the upper surface that the present embodiment contacts with insulating base 204 with the second pad 202 at the first pad 201 is provided with, increased the contact area between insulating base 204 and the first pad and 201 second pads 202, strengthen again adhesion to each other, thereby made the connection reliability of this example obtain further raising.
As shown in Figure 3, in order to improve air-tightness, the upper surface that the present embodiment contacts with insulating base 204 with the second pad 202 at described the first pad 201 is provided with a plurality of crisscross unit bulge-structures 206 of arranging, the unit bulge-structure 206 of wherein arranging is afterwards relatively arranged on the rear in the gap between front-seat adjacent two unit bulge-structures 206, so-called front and back are comparatively speaking, do not have dividing of absolute front and back, can not be interpreted as restriction of the present utility model.So-called crisscross arranging, rear row's unit bulge-structure 206 is relatively arranged on the rear in the gap between front-seat adjacent two unit bulge-structures 206, adjacent two unit bulge-structures 2061 in figure for example, the rear of gap arranges staggered unit bulge-structure 2062 betwixt, hinder moisture from the gap invasion between adjacent two unit bulge-structures 2061, interrupt moisture and infiltrated in order, extended moisture permeation pathway, and then improved the air-tightness of the present embodiment.
Certainly, in order further to improve the heat resistance of the present embodiment, connection colloid 203 and the insulating base 204 of this example are made by thermosetting natural gum, concrete material can be epoxy resin (EMC), silicones, silica gel (SMC) and unsaturated-resin (UPC) etc., and selecting of thermosets has a distinct increment the heat resistance of this example.
As shown in Figure 3, the unit bulge-structure 206 of the present embodiment is conical, in order effectively to hinder moisture infiltration, the center distance of adjacent cells bulge-structure is more than or equal to the bottom radius of twice unit bulge-structure, and be less than or equal to the bottom radius of four times of unit bulge-structures, this spacing setting can more preferably make rear row's unit bulge-structure 2062 can stop the moisture of gap invasion between front-seat adjacent cells bulge-structure 2061.
As shown in Figure 2, in order further to increase the fastness between pad and insulating base, the connection colloid 203 of the present embodiment presents inverted T shape structure, as the contact area between the connection colloid 203 in figure and pad (201,202) is greater than gap between the two, by connecting colloid 203 and the integrated technique of insulating base 204, obviously can increase the fastness between pad and insulating base.
Embodiment 2:
As shown in Figure 4, the present embodiment is only from the different of embodiment 1: described unit bulge-structure has been changed into prismatic by taper shape, with respect to conical structure, prism structure makes both contacts area larger, thereby adhesion is stronger, the path that moisture is invaded further extends, and reliability is better.
Embodiment 3:
As shown in Figure 5, the present embodiment is only from the different of embodiment 1: described unit bulge-structure has changed hemisphere into by taper shape, the semiglobe outer surface of this embodiment protrusions presents smooth curve shape, significantly reduced the stress of insulating base 204 with metal pad faying face, generally, wedge angle is stress concentration point, be prone to by stress and concentrate the micro-crack and the glue that produce to split risk, thereby this embodiment medium-height trestle reliability is more excellent.
Embodiment 4:
As shown in Figure 6, the present embodiment is only from the different of embodiment 1-3: the dual-side that the first pad 201 is relative with the second pad 202 is non-straightsided shape structure, such as bending structure, zigzag structure etc., by lengthening, coordinate path lifting bracket intensity, especially promote the adhesion of the first pad 201 and the second pad 202.
Embodiment 5:
As shown in Figure 7, the present embodiment is only from the different of embodiment 1-4: reflector 205 for a cup end be that square, rim of a cup is circular structure, thereby make the sidewall area of this example larger, and then increased lighting area, make light extraction efficiency higher, light shape is larger.
In figure, only illustrated that a cup end is that square, rim of a cup is circular structure, same reflector 205 can also be glass at the bottom of and rim of a cup be all square structure, this also can increase sidewall area, and then raising light extraction efficiency.
Certainly, the utility model reflection board structure is not limited to said structure, and according to different use scenes, having difference can also be other structures, such as circle structure under the upper circle of example 1.
Embodiment 6:
As shown in Figure 8, the present embodiment discloses a kind of high reliability LED device, and it comprises the high reliability LED support 200 described in example 1-5 any one, and a LED chip 300 is installed in the reflector of described high reliability LED support 200.
The LED chip 300 of illustrating in the present embodiment figure is flip LED chips, so two electrodes of flip LED chips 200 are directly electrically connected to the first pad 201 and the second pad 202 respectively.
It should be noted that; although only illustrated the high reliability LED support 200 of example 1 structure in figure; this does not represent restriction of the present utility model, and the utility model can also be the high reliability LED support shown in embodiment 2-5, and these are all protection ranges of the present utility model.
Embodiment 7:
As shown in Figure 9, the present embodiment discloses a kind of high reliability LED device, the present embodiment is different from embodiment 6 to be: the LED chip 300 of illustrating in the present embodiment figure is packed LED chip, so two electrodes of packed LED chip are electrically connected to by gold thread 400 with the first pad 201 and the second pad 202 respectively.。
Embodiment 8:
As shown in figure 10, the present embodiment discloses a kind of high reliability LED device, and the present embodiment, on the basis of embodiment 6 and 7, is also provided with lens 500 above described reflector.
More than describe preferred embodiment of the present utility model in detail, should be appreciated that those of ordinary skill in the art just can make many modifications and variations according to design of the present utility model without creative work.Therefore, all technical staff in the art according to the utility model design on prior art basis by logic analysis, reasoning or according to the available technical scheme of limited experiment, all should be among the determined protection range by these claims.
Claims (10)
1. a high reliability LED support, is characterized in that:
This support comprises as the first pad of conductive pin and the second pad, described the first pad is connected colloid with the second pad by insulation and links together, upper surface at described the first pad and the second pad is also provided with and the described integrated insulating base of colloid that is connected, in described insulating base inside, be formed with the reflector that LED chip and reflection LED light are installed, the upper surface contacting with insulating base with the second pad at described the first pad is provided with a plurality of crisscross unit bulge-structures of arranging, the unit bulge-structure of wherein arranging is afterwards relatively arranged on the rear in the gap between front-seat adjacent two unit bulge-structures.
2. high reliability LED support according to claim 1, is characterized in that:
Described connection colloid and insulating base are made by thermosetting natural gum.
3. high reliability LED support according to claim 1 and 2, is characterized in that:
The dual-side that described the first pad is relative with the second pad is non-straightsided shape structure.
4. high reliability LED support according to claim 1 and 2, is characterized in that:
Described reflector for a cup end be that square, rim of a cup is circular structure, or the cup end and rim of a cup are all square structure.
5. high reliability LED support according to claim 1 and 2, is characterized in that:
Described connection colloid presents inverted T shape structure.
6. high reliability LED support according to claim 1 and 2, is characterized in that:
Described unit bulge-structure is conical, prismatic or hemisphere, and the center distance of described adjacent cells bulge-structure is more than or equal to the bottom radius of twice unit bulge-structure, and is less than or equal to the bottom radius of four times of unit bulge-structures.
7. a high reliability LED device that comprises the high reliability LED support described in claim 1-6 any one, is characterized in that:
One LED chip is installed in the reflector of described high reliability LED support.
8. high reliability LED device according to claim 7, is characterized in that:
Described LED chip is flip LED chips, and two electrodes of described flip LED chips are directly electrically connected to the first pad and the second pad respectively.
9. high reliability LED device according to claim 7, is characterized in that:
Described LED chip is packed LED chip, and two electrodes of described packed LED chip are electrically connected to by gold thread with the first pad and the second pad respectively.
10. according to the high reliability LED device described in claim 7-9 any one, it is characterized in that:
Above described reflector, be also provided with lens.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320447838.6U CN203406328U (en) | 2013-07-25 | 2013-07-25 | A LED support with high reliability and a LED device thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320447838.6U CN203406328U (en) | 2013-07-25 | 2013-07-25 | A LED support with high reliability and a LED device thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203406328U true CN203406328U (en) | 2014-01-22 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320447838.6U Expired - Lifetime CN203406328U (en) | 2013-07-25 | 2013-07-25 | A LED support with high reliability and a LED device thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203406328U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103400927A (en) * | 2013-07-25 | 2013-11-20 | 晶科电子（广州）有限公司 | High-reliability LED (light emitting diode) bracket and LED device thereof |
| CN105870292A (en) * | 2015-01-22 | 2016-08-17 | 深圳市斯迈得半导体有限公司 | High-sealing performance LED support |
| CN109817797A (en) * | 2019-01-23 | 2019-05-28 | 佛山市国星光电股份有限公司 | LED component and lamp group array |
-
2013
- 2013-07-25 CN CN201320447838.6U patent/CN203406328U/en not_active Expired - Lifetime
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103400927A (en) * | 2013-07-25 | 2013-11-20 | 晶科电子（广州）有限公司 | High-reliability LED (light emitting diode) bracket and LED device thereof |
| CN103400927B (en) * | 2013-07-25 | 2016-04-27 | 广东晶科电子股份有限公司 | A kind of high reliability LED support and LED component thereof |
| CN105870292A (en) * | 2015-01-22 | 2016-08-17 | 深圳市斯迈得半导体有限公司 | High-sealing performance LED support |
| CN105870292B (en) * | 2015-01-22 | 2018-11-13 | 深圳市斯迈得半导体有限公司 | A kind of high leakproofness LED support |
| CN109817797A (en) * | 2019-01-23 | 2019-05-28 | 佛山市国星光电股份有限公司 | LED component and lamp group array |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20140122 Effective date of abandoning: 20160427 |
|
| C25 | Abandonment of patent right or utility model to avoid double patenting |