CN201715459U - LED support - Google Patents
LED support Download PDFInfo
- Publication number
- CN201715459U CN201715459U CN2010201854251U CN201020185425U CN201715459U CN 201715459 U CN201715459 U CN 201715459U CN 2010201854251 U CN2010201854251 U CN 2010201854251U CN 201020185425 U CN201020185425 U CN 201020185425U CN 201715459 U CN201715459 U CN 201715459U
- Authority
- CN
- China
- Prior art keywords
- led support
- conductive pin
- heat dissipation
- metal plate
- insulating base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000002184 metal Substances 0.000 claims abstract description 32
- 230000017525 heat dissipation Effects 0.000 claims description 30
- 238000000465 moulding Methods 0.000 claims description 5
- 238000000034 method Methods 0.000 abstract description 9
- 238000012545 processing Methods 0.000 abstract description 6
- 238000004904 shortening Methods 0.000 abstract 1
- 238000005516 engineering process Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 230000008595 infiltration Effects 0.000 description 2
- 238000001764 infiltration Methods 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000008034 disappearance Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000009931 harmful effect Effects 0.000 description 1
- 230000036632 reaction speed Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
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Abstract
The utility model discloses an LED support comprising an insulating base, and a plurality of conductive pins and a metal radiating sheet formed in the insulating base, wherein the metal radiating sheet is positioned among the conductive pins; and the metal radiating sheet is integrally connected with one conductive pin. The LED support solves the problems of high processing cost, complex processing process and the like of the existing LED support mould, and has the characteristics of saving cost, having simple mould forming process and shortening process flow.
Description
Technical field
The utility model relates to the LED art, refer in particular to a kind of have save that cost, mould-forming process are simple, the led support of shortened process.
Background technology
LED (Light Emitting Diode, light emitting diode) is a kind of solid-state semiconductor devices, and it can directly be converted into light to electricity.At present, development along with lighting engineering, shortcoming is replaced by the LED lamp traditional incandescent lamp just gradually because highly energy-consuming, photoelectric conversion rate be low etc., compare with traditional incandescent lamp, the LED light fixture has that power consumption is little, spotlight effect is good, reaction speed is fast, can bear advantages such as high impact forces, long service life, environmental protection, and led support is the indispensable assembly of LED lamp, and its importance is self-evident.
As everyone knows, led support comprises insulating base that the employing plastic cement is made and the conductive pin of being fixed by this insulating base, is to solve heat dissipation problem, and led support also is provided with heat dissipation metal plate.Yet, the conductive pin of the led support that habit has need be opened a mold moulding, heat dissipation metal plate need be opened the independent moulding of a mold again in addition, makes that the led support of this traditional structure has that Mould Machining cost costliness, mould processing technology are loaded down with trivial details, assembly problem and tolerance value be than problems such as complexity.And the insulating base of this led support and conductive pin relatively easily freely spur, and the quality to product produces harmful effect easily.
The utility model content
The utility model is at the disappearance of prior art existence, its main purpose provides a kind of led support, solve to practise problems such as the led support Mould Machining cost costliness, the processing technology that have are loaded down with trivial details, have and save that cost, mould-forming process are simple, the characteristics of shortened process.
Another purpose of the present utility model provides a kind of led support, and it has preferable product quality.
For achieving the above object, the utility model adopts following technical scheme:
A kind of led support includes insulating base and moulding and is coated on a plurality of conductive pins and a heat dissipation metal plate in this insulating base, and this heat dissipation metal plate is between this conductive pin, and this heat dissipation metal plate is connected with a conductive pin one wherein.
As a kind of preferred version, described insulating base is provided with a ccontaining cavity that is used to take in led chip, and this conductive pin and heat dissipation metal plate place this ccontaining cavity.
As a kind of preferred version, described heat dissipation metal plate places the middle part, bottom surface of this ccontaining cavity.
As a kind of preferred version, one is extended with a convex closure on the described heat dissipation metal plate.
As a kind of preferred version, described conductive pin includes connecting portion and the contact site that one connects, and this connecting portion is coated in the insulating base, and this contact site is exposed to outside this insulating base, is provided with pre-broken line between this connecting portion and contact site.
As a kind of preferred version, described conductive pin is provided with chamfering, and this chamfering is arranged on the contact site.
As a kind of preferred version, described conductive pin is provided with screens, and this screens is arranged on the connecting portion.
As a kind of preferred version, described screens is arranged on the outside of connecting portion.
As a kind of preferred version, structure is formed in one between described conductive pin and the heat dissipation metal plate.
The utility model compared with prior art has tangible advantage and beneficial effect, particularly, as shown from the above technical solution, the first, it is mainly by in wherein being connected with a heat dissipation metal plate on the conductive pin, replacing traditional heat dissipation metal plate needs to produce separately and assembling, reduce the structure mold processing charges, and mould-forming process is simple; The second, by being provided with screens in conductive pin, help installing of conductive pin and insulating base, prevent that freely spurring from appearring in conductive pin; Three, by further being provided with pre-broken line and chamfering on the conductive pin, also help installing of conductive pin and insulating base, prevent that freely spurring from appearring in conductive pin, avoid red ink test infiltration, occur the bad institute of sealing after the finished product encapsulation and cause a series of problems, thereby improve the quality of products; Four, be extended with a convex closure by one on this heat dissipation metal plate, further bite insulating base, prevent that once more this embodiment from occurring freely spurring phenomenon all around, improve the quality of products.
For more clearly setting forth architectural feature of the present utility model and effect, come the utility model is elaborated below in conjunction with accompanying drawing and specific embodiment:
Description of drawings
Fig. 1 is the three-dimensional diagrammatic sketch of the preferred embodiment of the utility model;
Fig. 2 is the local diagrammatic sketch of the preferred embodiment of the utility model;
Fig. 3 is the section diagrammatic sketch of the preferred embodiment of the utility model.
The accompanying drawing identifier declaration:
1, insulating base 23, pre-broken line
11, ccontaining cavity 24, screens
2, conductive pin 25, chamfering
21, connecting portion 3, heat dissipation metal plate
22, contact site 31, convex closure
The specific embodiment:
Referring to figs. 1 through shown in Figure 4, it has demonstrated the concrete structure of the preferred embodiment of the utility model, and this led support includes insulating base 1 and moulding and is coated on four conductive pins 2 and a heat dissipation metal plate 3 in this insulating base 1.Wherein, this conductive pin 2 includes connecting portion 21 and the contact site 22 that one connects, between this connecting portion 21 and contact site 22, be provided with pre-broken line 23, the contact site 22 of this conductive pin 2 is exposed to outside the insulating base 1, be used for being connected with the external circuitry plate, the arranged outside of this connecting portion 21 has a screens 24, and this contact site 22 is provided with chamfering 25.
In sum, design focal point of the present utility model is: the first, it is mainly by in wherein being connected with a heat dissipation metal plate on the conductive pin, replacing traditional heat dissipation metal plate needs to produce separately and assembling, reduce the structure mold processing charges, and mould-forming process is simple; The second, by being provided with screens in conductive pin, help installing of conductive pin and insulating base, prevent that freely spurring from appearring in conductive pin; Three, by further being provided with pre-broken line and chamfering on the conductive pin, also help installing of conductive pin and insulating base, prevent that freely spurring from appearring in conductive pin, avoid red ink test infiltration, occur the bad institute of sealing after the finished product encapsulation and cause a series of problems, thereby improve the quality of products; Four, be extended with a convex closure by one on this heat dissipation metal plate, further bite insulating base, prevent that once more this embodiment from occurring freely spurring phenomenon all around, improve the quality of products.
The above, it only is preferred embodiment of the present utility model, be not that technical scope of the present utility model is imposed any restrictions, so every foundation technical spirit of the present utility model all still belongs in the scope of technical solutions of the utility model any trickle modification, equivalent variations and modification that above embodiment did.
Claims (9)
1. led support, it is characterized in that: include insulating base and moulding and be coated on a plurality of conductive pins and a heat dissipation metal plate in this insulating base, this heat dissipation metal plate is between this conductive pin, and this heat dissipation metal plate is connected with a conductive pin one wherein.
2. led support according to claim 1 is characterized in that: described insulating base is provided with a ccontaining cavity that is used to take in led chip, and this conductive pin and heat dissipation metal plate place this ccontaining cavity.
3. led support according to claim 2 is characterized in that: described heat dissipation metal plate places the middle part, bottom surface of this ccontaining cavity.
4. led support according to claim 1 is characterized in that: one is extended with a convex closure on the described heat dissipation metal plate.
5. led support according to claim 1, it is characterized in that: described conductive pin includes connecting portion and the contact site that one connects, this connecting portion is coated in the insulating base, and this contact site is exposed to outside this insulating base, is provided with pre-broken line between this connecting portion and contact site.
6. led support according to claim 5 is characterized in that: described conductive pin is provided with chamfering, and this chamfering is arranged on the contact site.
7. led support according to claim 5 is characterized in that: described conductive pin is provided with screens, and this screens is arranged on the connecting portion.
8. led support according to claim 7 is characterized in that: described screens is arranged on the outside of connecting portion.
9. led support according to claim 1 is characterized in that: structure is formed in one between described conductive pin and the heat dissipation metal plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010201854251U CN201715459U (en) | 2010-05-01 | 2010-05-01 | LED support |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010201854251U CN201715459U (en) | 2010-05-01 | 2010-05-01 | LED support |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201715459U true CN201715459U (en) | 2011-01-19 |
Family
ID=43461462
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010201854251U Expired - Fee Related CN201715459U (en) | 2010-05-01 | 2010-05-01 | LED support |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201715459U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102221150A (en) * | 2011-05-30 | 2011-10-19 | 张志才 | LED (light emitting diode) lamp assembly |
| CN109786536A (en) * | 2011-08-12 | 2019-05-21 | 日亚化学工业株式会社 | Light emitting device |
-
2010
- 2010-05-01 CN CN2010201854251U patent/CN201715459U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102221150A (en) * | 2011-05-30 | 2011-10-19 | 张志才 | LED (light emitting diode) lamp assembly |
| CN109786536A (en) * | 2011-08-12 | 2019-05-21 | 日亚化学工业株式会社 | Light emitting device |
| CN109786536B (en) * | 2011-08-12 | 2021-09-28 | 日亚化学工业株式会社 | Light emitting device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: BOLUO CHENGCHUANG PRECISION INDUSTRY CO., LTD. Free format text: FORMER OWNER: CHONG-IA PRECISION INDUSTRY CO., LTD., BO LUO COUNTY Effective date: 20121011 Free format text: FORMER OWNER: STAMPING PRECISION INDUSTRY CO., LTD. BOLUO CHENGCHUANG PRECISION INDUSTRY CO., LTD. Effective date: 20121011 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 516000 HUIZHOU, GUANGDONG PROVINCE TO: 516123 HUIZHOU, GUANGDONG PROVINCE |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20121011 Address after: 516123 Boluo City, Huizhou Province, the town of Chau Chau Industrial Zone Patentee after: Boluo Chengchuang Precision Industry Co., Ltd. Address before: 516000 Boluo stamping precision Industrial Co., Ltd., Guangdong South Industrial Zone, Boluo Garden Town, Huizhou, China Patentee before: Boluo Chongia Precision Industry Co., Ltd. Patentee before: Chongia Precision Industry Co., Ltd. Patentee before: Boluo Chengchuang Precision Industry Co., Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110119 Termination date: 20190501 |