CN104369322B - A kind of paster rectifier bridge injection mold - Google Patents
A kind of paster rectifier bridge injection mold Download PDFInfo
- Publication number
- CN104369322B CN104369322B CN201410651156.6A CN201410651156A CN104369322B CN 104369322 B CN104369322 B CN 104369322B CN 201410651156 A CN201410651156 A CN 201410651156A CN 104369322 B CN104369322 B CN 104369322B
- Authority
- CN
- China
- Prior art keywords
- die
- chip
- rectangular recess
- mold
- running channel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000002347 injection Methods 0.000 title claims abstract description 21
- 239000007924 injection Substances 0.000 title claims abstract description 21
- 239000000463 material Substances 0.000 claims abstract description 8
- 239000000853 adhesive Substances 0.000 abstract description 3
- 230000001070 adhesive effect Effects 0.000 abstract description 3
- 239000003292 glue Substances 0.000 description 6
- 238000005476 soldering Methods 0.000 description 6
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 4
- 239000007788 liquid Substances 0.000 description 3
- 238000003466 welding Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/27—Sprue channels ; Runner channels or runner nozzles
- B29C45/2725—Manifolds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/32—Moulds having several axially spaced mould cavities, i.e. for making several separated articles
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
The present invention relates to a kind of paster rectifier bridge injection mold, including upper die and lower die, inside set cast gate and running channel, two moulds cooperatively form injection die cavity, material hole is offered at the top of upper mold, and the surrounding of described lower mold upper surface has four array distribution die group in lower mold, and this die group is made up of two dies being disposed adjacent, on described die, array distribution has some chip die cavities, and the both sides of this chip die cavity short-axis direction are all symmetrically distributed with two grooves accommodating pin；Described chip die cavity is a rectangular recess A, and the centre position of the bottom of this rectangular recess A also has a rectangular recess B extended along short-axis direction.It is an advantage of the current invention that: the injection mold of the present invention, enhance the structural compactness of mould, improve injection efficiency, in addition strengthen the adhesive structure of chip and pcb board.
Description
Technical field
The present invention relates to a kind of paster rectifier bridge, particularly to a kind of paster rectifier bridge injection mold.
Background technology
Paster rectifier bridge is by the pin of chip and pcb board welding process, generally use wave-soldering, wave-soldering is to allow the solder side of card directly contact with high-temperature liquid state stannum reach to weld purpose, its high-temperature liquid state stannum keeps an inclined-plane, and made liquid tin form a lot of by special device to be similar to the phenomenon of wave, so being " wave-soldering ", its main material is soldering tin bar.Before wave-soldering, need to fix chip body with pcb board, it is to avoid during wave-soldering, chip is thrown out of.
Planar chip is connected with pcb board at present, particularly as follows: be coated with red glue on PCB, is bondd with pcb board by red glue, and (temperature is the highest, and cohesive force is the highest), owing to planar chip is little with the contact surface of red glue, glue bond power is poor, and chip may be thrown out of；In order to avoid there is the situation that chip is thrown out of, during the injection of present paster rectifier bridge, molding groove in the bottom of chip, current injection mold cannot meet requirement.
Summary of the invention
The technical problem to be solved in the present invention is to provide a kind of paster rectifier bridge injection mold that can mold groove in chip bottom.
For solving above-mentioned technical problem, the technical scheme is that a kind of paster rectifier bridge injection mold, including upper die and lower die, inside set cast gate and running channel, two moulds cooperatively form injection die cavity, material hole is offered at the top of upper mold, its innovative point is: the surrounding of described lower mold upper surface has four array distribution die group in lower mold, this die group is made up of two dies being disposed adjacent, on described die, array distribution has some chip die cavities, and the both sides of this chip die cavity short-axis direction are all symmetrically distributed with two grooves accommodating pin；The total sprue that be interconnected is distributed in described lower mold, level props up running channel, vertically prop up running channel, horizontal ingate and the ingate of connection chip die cavity；Described vertical running channel extends distribution between two adjacent dies of each die group and along die long axis direction；Sharing a horizontal ingate extended along die short-axis direction on described each die between the chip of the most adjacent two rows, adjacent two chips being simultaneously positioned in the chip of same row accommodate chamber and share an ingate
；Described total sprue is positioned at the central area of four die groups, and its upper end connects with the material hole at upper mold top, and its both sides, lower end pass sequentially through level respectively and prop up running channel, vertically a running channel and horizontal ingate and connect with ingate.
Further, described chip die cavity is a rectangular recess A, and the centre position of the bottom of this rectangular recess A also has a rectangular recess B extended along short-axis direction.
Further, the half that width is rectangular recess A of described rectangular recess B, the degree of depth is 0.15-0.2mm.
It is an advantage of the current invention that: the injection mold of the present invention, once can be molded 8 paster rectifier bridge lead frames, 8 lead frames are divided into four groups and is molded simultaneously, its internal running channel distribution is simple, enhance the structural compactness of mould, improve injection efficiency；In addition, when welding with pcb board due to chip, bondd with pcb board by red glue, at chip cavity bottom, also there is a rectangular recess B, make to mold groove in chip bottom, thus utilize this groove to increase the contact surface of red glue, strengthen the adhesive structure of chip and pcb board；The present invention is by the half that width is rectangular recess A of rectangular recess B, and the degree of depth is arranged between 0.15-0.2mm, and through test of many times, now chip is firmly bonded with pcb board, and does not affect the performance of chip.
Accompanying drawing explanation
Fig. 1 is the top view of the present invention a kind of paster special injection mold of rectifier bridge.
Fig. 2 is the top view of the present invention a kind of paster rectifier bridge special injection mold concave module.
Detailed description of the invention
As it is shown in figure 1, the invention discloses a kind of paster rectifier bridge injection mold, including upper die and lower die 1, inside setting cast gate and running channel, two moulds cooperatively form injection die cavity, and material hole is offered at the top of upper mold；The surrounding of lower mold 1 upper surface has four array distribution die in lower mold 12 groups, this die 2 groups is made up of two dies being disposed adjacent 2, on die 2, array distribution has some chip die cavities 3, the both sides of chip die cavity 3 short-axis direction are all symmetrically distributed with two lead-in wire grooves 4 accommodating pin, chip die cavity 3 is a rectangular recess A, the centre position of the bottom of this rectangular recess A also has a rectangular recess B5 extended along short-axis direction, in order to strengthen the adhesive structure of chip and pcb board in the present embodiment, the width of rectangular recess B5 is the half of rectangular recess A, the degree of depth is 0.15-0.2mm.
The total sprue 6 that be interconnected is distributed in lower mold 1, level props up running channel 7, vertically a running channel 8, horizontal ingate 9 and connect the ingate 10 of chip die cavity 3；Vertically a running channel 8 is between two adjacent dies 2 of each die 2 groups and along the extension distribution of die 2 long axis direction；Sharing a horizontal ingate 9 extended along die 2 short-axis direction on each die 2 between the chip of the most adjacent two rows, adjacent two chips being simultaneously positioned in the chip of same row accommodate chamber and share an ingate 10；Total sprue 6 is positioned at the central area of four dies 2 groups, and its upper end connect with the material hole at upper mold top, and its both sides, lower end pass sequentially through level respectively and prop up running channel 7, vertical prop up running channel 8 and horizontal ingate 9 connects with ingate 10.
The ultimate principle of the present invention and principal character and advantages of the present invention have more than been shown and described.Skilled person will appreciate that of the industry; the present invention is not restricted to the described embodiments; the principle that the present invention is simply described described in above-described embodiment and description; without departing from the spirit and scope of the present invention; the present invention also has various changes and modifications, and these changes and improvements both fall within scope of the claimed invention.Claimed scope is defined by appending claims and equivalent thereof.
Claims (2)
1. a paster rectifier bridge injection mold, including upper die and lower die, inside set cast gate and running channel, two moulds cooperatively form injection die cavity, material hole is offered at the top of upper mold, it is characterised in that: the surrounding of described lower mold upper surface has four array distribution die group in lower mold, and this die group is made up of two dies being disposed adjacent, on described die, array distribution has some chip die cavities, and the both sides of this chip die cavity short-axis direction are all symmetrically distributed with two grooves accommodating pin；The total sprue that be interconnected is distributed in described lower mold, level props up running channel, vertically prop up running channel, horizontal ingate and the ingate of connection chip die cavity；Described vertical running channel extends distribution between two adjacent dies of each die group and along die long axis direction；Sharing a horizontal ingate extended along die short-axis direction on described each die between the chip of the most adjacent two rows, adjacent two chips being simultaneously positioned in the chip of same row accommodate chamber and share an ingate
；Described total sprue is positioned at the central area of four die groups, and its upper end connects with the material hole at upper mold top, and its both sides, lower end pass sequentially through level respectively and prop up running channel, vertically a running channel and horizontal ingate and connect with ingate；Described chip die cavity is a rectangular recess A, and the centre position of the bottom of this rectangular recess A also has a rectangular recess B extended along short-axis direction.
Paster rectifier bridge injection mold the most according to claim 1, it is characterised in that: the half that width is rectangular recess A of described rectangular recess B, the degree of depth is 0.15-0.2mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410651156.6A CN104369322B (en) | 2014-11-17 | 2014-11-17 | A kind of paster rectifier bridge injection mold |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410651156.6A CN104369322B (en) | 2014-11-17 | 2014-11-17 | A kind of paster rectifier bridge injection mold |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104369322A CN104369322A (en) | 2015-02-25 |
| CN104369322B true CN104369322B (en) | 2016-09-14 |
Family
ID=52548644
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410651156.6A Active CN104369322B (en) | 2014-11-17 | 2014-11-17 | A kind of paster rectifier bridge injection mold |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104369322B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105390407B (en) * | 2015-12-18 | 2018-02-23 | 浙江泰莱姆微电子科技有限公司 | The manufacture craft and particular manufacturing craft of a kind of rectifier bridge |
| CN109065523B (en) * | 2018-07-26 | 2024-04-26 | 苏州固锝电子股份有限公司 | Packaging structure of rectifying chip |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE202006018031U1 (en) * | 2006-11-24 | 2008-04-03 | Günther Heisskanaltechnik Gmbh | Arrangement for closing channel sections in a hot or cold runner distributor |
| CN201516680U (en) * | 2009-10-23 | 2010-06-30 | 深圳创维－Rgb电子有限公司 | Front housing injection mold structure of liquid crystal television |
| CN102267220A (en) * | 2011-08-04 | 2011-12-07 | 苏州腾行精密模具有限公司 | Runner structure for injection molding of rubber tube |
| CN102267219A (en) * | 2011-08-04 | 2011-12-07 | 苏州腾行精密模具有限公司 | Injection mold with X-shaped runner |
| CN204451058U (en) * | 2014-11-17 | 2015-07-08 | 如皋市易达电子有限责任公司 | A kind of paster rectifier bridge injection mold |
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2014
- 2014-11-17 CN CN201410651156.6A patent/CN104369322B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN104369322A (en) | 2015-02-25 |
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| TR01 | Transfer of patent right |
Effective date of registration: 20191125 Address after: 511458 No.106, Fengze East Road, Nansha District, Guangzhou City, Guangdong Province (self compiled Building 1) x1301-f8434 (cluster registration) (JM) Patentee after: Guangzhou dinghang Information Technology Service Co., Ltd Address before: 226500, Jiangsu Province, Nantong City, Rugao moved by the town group shore village 7 groups Patentee before: Rugao Eada Electronics Co., Ltd. |
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Effective date of registration: 20200103 Address after: 225300 No. 108 Mingzhu Avenue, Yonganzhou Town, Gaogang District, Taizhou City, Jiangsu Province Patentee after: Yang Jiawei Address before: 511458 No.106, Fengze East Road, Nansha District, Guangzhou City, Guangdong Province (self compiled Building 1) x1301-f8434 (cluster registration) (JM) Patentee before: Guangzhou dinghang Information Technology Service Co., Ltd |
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Address after: Room 501, Office Building of Market Supervision Bureau of Langchuan Avenue, Jianping Town, Langxi County, Xuancheng City, Anhui Province Patentee after: Yang Jiawei Address before: 225300 No. 108 Mingzhu Avenue, Yonganzhou Town, Gaogang District, Taizhou City, Jiangsu Province Patentee before: Yang Jiawei |
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Effective date of registration: 20200430 Address after: 523660 No.51, Keji Road, Qingxi Town, Dongguan City, Guangdong Province Patentee after: DONGGUAN DINGJUN PLASTIC MOULD Co.,Ltd. Address before: Room 501, Office Building of Market Supervision Bureau of Langchuan Avenue, Jianping Town, Langxi County, Xuancheng City, Anhui Province Patentee before: Yang Jiawei |
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