CN104369322A - Injection molding mold of chip-sticking and rectifying bridge - Google Patents
Injection molding mold of chip-sticking and rectifying bridge Download PDFInfo
- Publication number
- CN104369322A CN104369322A CN201410651156.6A CN201410651156A CN104369322A CN 104369322 A CN104369322 A CN 104369322A CN 201410651156 A CN201410651156 A CN 201410651156A CN 104369322 A CN104369322 A CN 104369322A
- Authority
- CN
- China
- Prior art keywords
- die
- chip
- mold
- running channel
- ingate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000001746 injection moulding Methods 0.000 title claims abstract description 14
- 238000002347 injection Methods 0.000 claims description 12
- 239000007924 injection Substances 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 7
- 230000015572 biosynthetic process Effects 0.000 claims description 3
- 239000003292 glue Substances 0.000 description 6
- 238000005476 soldering Methods 0.000 description 6
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 4
- 239000007788 liquid Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/27—Sprue channels ; Runner channels or runner nozzles
- B29C45/2725—Manifolds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/32—Moulds having several axially spaced mould cavities, i.e. for making several separated articles
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
The invention relates to an injection molding mold of a chip-sticking and rectifying bridge. The injection molding mold comprises an upper mold and a lower mold. The injection molding mold is internally provided with a sprue and a runner; the two molds are matched to form an injection-molding mold cavity; an injecting hole is arranged at the top part of the upper mold; the periphery of the upper end surface of the lower mold is provided with four concave mold groups which are distributed on the lower mold in an array manner; each concave mold group consists of two adjacent concave molds; a plurality of chip cavities are distributed on the concave molds in an array manner, and two grooves for containing pins are respectively and symmetrically distributed at the two sides in the short-axis direction of the chip cavity; the chip cavity is a rectangular groove A; and the middle position of the bottom of the rectangular groove A is also provided with a rectangular groove B extending along the short-axis direction. The injection molding mold has the advantages that the structure compactness of the mold is enhanced, the injection molding efficiency is improved and the bonding structure of chips and PCBs (Printed Circuit Board) is also enhanced.
Description
Technical field
The present invention relates to a kind of paster rectifier bridge, particularly a kind of paster rectifier bridge injection mold.
Background technology
Paster rectifier bridge is by the pin of chip and pcb board welding process, usual employing wave-soldering, wave-soldering allows the solder side of card directly contact with high-temperature liquid state tin reach welding object, its high-temperature liquid state tin keeps an inclined-plane, and make liquid tin form the phenomenon of the similar wave of a lot of by special device, so cry " wave-soldering ", its main material is soldering tin bar.Before wave-soldering, need chip body and pcb board to fix, when avoiding wave-soldering, chip is thrown out of.
Current planar chip is connected with pcb board, is specially: the red glue of the upper painting of PCB, is bondd by red glue and pcb board, (temperature is higher, and cohesive force is higher), and because the contact surface of planar chip and red glue is little, glue bond power is poor, and chip may be thrown out of; In order to avoid there is the situation that chip is thrown out of, in the process of present paster rectifier bridge injection moulding, mold groove in the bottom of chip, current injection mold cannot meet the demands.
Summary of the invention
The technical problem to be solved in the present invention is to provide a kind of paster rectifier bridge injection mold that can mold groove in chip bottom.
For solving the problems of the technologies described above, technical scheme of the present invention is: a kind of paster rectifier bridge injection mold, comprise upper die and lower die, inside establish cast gate and running channel, two moulds coordinate formation injection moulding die cavity, material hole is offered at the top of patrix, its innovative point is: the surrounding of described counterdie upper surface has the die group of four array distribution on counterdie, this die group is made up of the die that two are disposed adjacent, on described die, array distribution has some chip die cavities, and the both sides of this chip die cavity short-axis direction are all symmetrically distributed with the groove that two are held pin; Described counterdie is distributed with the total sprue, the level that are interconnected to prop up running channel, vertically prop up the ingate of running channel, horizontal ingate and connection chip die cavity; Described vertical running channel between two adjacent dies of each die group and along die long axis direction extend distribution; Described each die often shares a horizontal ingate extended along die short-axis direction between adjacent two chips arranged, and the adjacent two chip container cavities being simultaneously arranged in the chip of same row share an ingate; Described total sprue is positioned at the central area of four die groups, and its upper end is communicated with the material hole at patrix top, and its both sides, lower end are propped up running channel, vertically a running channel and horizontal ingate by level successively respectively and are communicated with ingate.
Further, described chip die cavity is a rectangular recess A, and the centre position of the bottom of this rectangular recess A also has a rectangular recess B extended along short-axis direction.
Further, the width of described rectangular recess B is the half of rectangular recess A, and the degree of depth is 0.15-0.2mm.
The invention has the advantages that: injection mold of the present invention, once can carry out injection moulding to 8 paster rectifier bridge lead frames, 8 lead frames are divided into four groups and carry out injection moulding simultaneously, its inner running channel distribution is simple, enhance the structural compactness of mould, improve injection moulding efficiency; In addition, due to chip weld with pcb board time, bondd by red glue and pcb board, at chip cavity bottom, also there is a rectangular recess B, make to mold groove in chip bottom, thus utilize this groove to increase the contact surface of red glue, strengthen the adhesive structure of chip and pcb board; The width of rectangular recess B is the half of rectangular recess A by the present invention, and the degree of depth is arranged between 0.15-0.2mm, and through test of many times, now chip and pcb board bond firmly, and do not affect the performance of chip.
Accompanying drawing explanation
Fig. 1 is the top view of the special injection mold of a kind of paster of the present invention rectifier bridge.
Fig. 2 is the top view of a kind of paster of the present invention rectifier bridge special injection mold concave module.
Detailed description of the invention
As shown in Figure 1, the invention discloses a kind of paster rectifier bridge injection mold, comprise upper die and lower die 1, inside establish cast gate and running channel, two moulds coordinate formation injection moulding die cavity, and material hole is offered at the top of patrix, the surrounding of counterdie 1 upper surface has the die of four array distribution on counterdie 12 groups, this die 2 groups is made up of two dies be disposed adjacent 2, on die 2, array distribution has some chip die cavities 3, the both sides of chip die cavity 3 short-axis direction are all symmetrically distributed with the lead-in wire groove 4 that two are held pin, chip die cavity 3 is a rectangular recess A, the centre position of the bottom of this rectangular recess A also has a rectangular recess B5 extended along short-axis direction, in order to strengthen the adhesive structure of chip and pcb board in the present embodiment, the width of rectangular recess B5 is the half of rectangular recess A, the degree of depth is 0.15-0.2mm.
Counterdie 1 is distributed with the total sprue 6, the level that are interconnected to prop up running channel 7, vertically a running channel 8, horizontal ingate 9 and connect the ingate 10 of chip die cavity 3; Vertically a running channel 8 extends distribution along die 2 long axis direction between two adjacent dies 2 of each die 2 groups; Each die 2 often shares a horizontal ingate 9 extended along die 2 short-axis direction between adjacent two chips arranged, and the adjacent two chip container cavities being simultaneously arranged in the chip of same row share an ingate 10; Total sprue 6 is positioned at the central area of four dies 2 groups, and its upper end is communicated with the material hole at patrix top, and its both sides, lower end are propped up running channel 7, vertically a running channel 8 and horizontal ingate 9 by level successively respectively and are communicated with ingate 10.
More than show and describe general principle of the present invention and principal character and advantage of the present invention.The technical staff of the industry should understand; the present invention is not restricted to the described embodiments; what describe in above-described embodiment and description just illustrates principle of the present invention; without departing from the spirit and scope of the present invention; the present invention also has various changes and modifications, and these changes and improvements all fall in the claimed scope of the invention.Application claims protection domain is defined by appending claims and equivalent thereof.
Claims (3)
1. a paster rectifier bridge injection mold, comprise upper die and lower die, inside establish cast gate and running channel, two moulds coordinate formation injection moulding die cavity, material hole is offered at the top of patrix, it is characterized in that: the surrounding of described counterdie upper surface has the die group of four array distribution on counterdie, and this die group is made up of the die that two are disposed adjacent, on described die, array distribution has some chip die cavities, and the both sides of this chip die cavity short-axis direction are all symmetrically distributed with the groove that two are held pin;
Described counterdie is distributed with the total sprue, the level that are interconnected to prop up running channel, vertically prop up the ingate of running channel, horizontal ingate and connection chip die cavity; Described vertical running channel between two adjacent dies of each die group and along die long axis direction extend distribution; Described each die often shares a horizontal ingate extended along die short-axis direction between adjacent two chips arranged, and the adjacent two chip container cavities being simultaneously arranged in the chip of same row share an ingate; Described total sprue is positioned at the central area of four die groups, and its upper end is communicated with the material hole at patrix top, and its both sides, lower end are propped up running channel, vertically a running channel and horizontal ingate by level successively respectively and are communicated with ingate.
2. paster rectifier bridge injection mold according to claim 1, is characterized in that: described chip die cavity is a rectangular recess A, and the centre position of the bottom of this rectangular recess A also has a rectangular recess B extended along short-axis direction.
3. paster rectifier bridge injection mold according to claim 1, is characterized in that: the width of described rectangular recess B is the half of rectangular recess A, and the degree of depth is 0.15-0.2mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410651156.6A CN104369322B (en) | 2014-11-17 | 2014-11-17 | A kind of paster rectifier bridge injection mold |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410651156.6A CN104369322B (en) | 2014-11-17 | 2014-11-17 | A kind of paster rectifier bridge injection mold |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104369322A true CN104369322A (en) | 2015-02-25 |
| CN104369322B CN104369322B (en) | 2016-09-14 |
Family
ID=52548644
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410651156.6A Active CN104369322B (en) | 2014-11-17 | 2014-11-17 | A kind of paster rectifier bridge injection mold |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104369322B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105390407A (en) * | 2015-12-18 | 2016-03-09 | 浙江泰莱姆微电子科技有限公司 | Manufacturing process and special die of rectifier bridge |
| CN109065523A (en) * | 2018-07-26 | 2018-12-21 | 苏州固锝电子股份有限公司 | The encapsulating structure of rectification chip |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2086740A1 (en) * | 2006-11-24 | 2009-08-12 | Günther Heisskanaltechnik GmbH | Arrangement for the sealing of channel sections in a hot or cold runner |
| CN201516680U (en) * | 2009-10-23 | 2010-06-30 | 深圳创维－Rgb电子有限公司 | Front housing injection mold structure of liquid crystal television |
| CN102267219A (en) * | 2011-08-04 | 2011-12-07 | 苏州腾行精密模具有限公司 | Injection mold with X-shaped runner |
| CN102267220A (en) * | 2011-08-04 | 2011-12-07 | 苏州腾行精密模具有限公司 | Runner structure for injection molding of rubber tube |
| CN204451058U (en) * | 2014-11-17 | 2015-07-08 | 如皋市易达电子有限责任公司 | A kind of paster rectifier bridge injection mold |
-
2014
- 2014-11-17 CN CN201410651156.6A patent/CN104369322B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2086740A1 (en) * | 2006-11-24 | 2009-08-12 | Günther Heisskanaltechnik GmbH | Arrangement for the sealing of channel sections in a hot or cold runner |
| CN201516680U (en) * | 2009-10-23 | 2010-06-30 | 深圳创维－Rgb电子有限公司 | Front housing injection mold structure of liquid crystal television |
| CN102267219A (en) * | 2011-08-04 | 2011-12-07 | 苏州腾行精密模具有限公司 | Injection mold with X-shaped runner |
| CN102267220A (en) * | 2011-08-04 | 2011-12-07 | 苏州腾行精密模具有限公司 | Runner structure for injection molding of rubber tube |
| CN204451058U (en) * | 2014-11-17 | 2015-07-08 | 如皋市易达电子有限责任公司 | A kind of paster rectifier bridge injection mold |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105390407A (en) * | 2015-12-18 | 2016-03-09 | 浙江泰莱姆微电子科技有限公司 | Manufacturing process and special die of rectifier bridge |
| CN105390407B (en) * | 2015-12-18 | 2018-02-23 | 浙江泰莱姆微电子科技有限公司 | The manufacture craft and particular manufacturing craft of a kind of rectifier bridge |
| CN109065523A (en) * | 2018-07-26 | 2018-12-21 | 苏州固锝电子股份有限公司 | The encapsulating structure of rectification chip |
| CN109065523B (en) * | 2018-07-26 | 2024-04-26 | 苏州固锝电子股份有限公司 | Packaging structure of rectifying chip |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104369322B (en) | 2016-09-14 |
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| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20191125 Address after: 511458 No.106, Fengze East Road, Nansha District, Guangzhou City, Guangdong Province (self compiled Building 1) x1301-f8434 (cluster registration) (JM) Patentee after: Guangzhou dinghang Information Technology Service Co., Ltd Address before: 226500, Jiangsu Province, Nantong City, Rugao moved by the town group shore village 7 groups Patentee before: Rugao Eada Electronics Co., Ltd. |
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| TR01 | Transfer of patent right | ||
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| TR01 | Transfer of patent right |
Effective date of registration: 20200103 Address after: 225300 No. 108 Mingzhu Avenue, Yonganzhou Town, Gaogang District, Taizhou City, Jiangsu Province Patentee after: Yang Jiawei Address before: 511458 No.106, Fengze East Road, Nansha District, Guangzhou City, Guangdong Province (self compiled Building 1) x1301-f8434 (cluster registration) (JM) Patentee before: Guangzhou dinghang Information Technology Service Co., Ltd |
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| CP02 | Change in the address of a patent holder | ||
| CP02 | Change in the address of a patent holder |
Address after: Room 501, Office Building of Market Supervision Bureau of Langchuan Avenue, Jianping Town, Langxi County, Xuancheng City, Anhui Province Patentee after: Yang Jiawei Address before: 225300 No. 108 Mingzhu Avenue, Yonganzhou Town, Gaogang District, Taizhou City, Jiangsu Province Patentee before: Yang Jiawei |
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| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20200430 Address after: 523660 No.51, Keji Road, Qingxi Town, Dongguan City, Guangdong Province Patentee after: DONGGUAN DINGJUN PLASTIC MOULD Co.,Ltd. Address before: Room 501, Office Building of Market Supervision Bureau of Langchuan Avenue, Jianping Town, Langxi County, Xuancheng City, Anhui Province Patentee before: Yang Jiawei |