CN203210622U - Plastic packaging mold box - Google Patents

Plastic packaging mold box Download PDF

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Publication number
CN203210622U
CN203210622U CN 201320226492 CN201320226492U CN203210622U CN 203210622 U CN203210622 U CN 203210622U CN 201320226492 CN201320226492 CN 201320226492 CN 201320226492 U CN201320226492 U CN 201320226492U CN 203210622 U CN203210622 U CN 203210622U
Authority
CN
China
Prior art keywords
jiao dao
main
plastic packaging
diaphragm capsule
runner
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CN 201320226492
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Chinese (zh)
Inventor
王铁冶
郑渠江
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sichuan Mingtai Microelectronics Technology Co ltd
Original Assignee
Sichuan Ming Tai Electronic Science And Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sichuan Ming Tai Electronic Science And Technology Co Ltd filed Critical Sichuan Ming Tai Electronic Science And Technology Co Ltd
Priority to CN 201320226492 priority Critical patent/CN203210622U/en
Application granted granted Critical
Publication of CN203210622U publication Critical patent/CN203210622U/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Abstract

The utility model relates to a plastic packaging mold box which comprises forming cavities and a runner. The runner comprises a main runner and two branch runners, the two branch runners are communicated with the main runner and the forming cavities respectively, and the branch runners and the main runner are communicated with one another via arc-shaped channels. The plastic packaging mold box has the advantages that bending degrees of internal leads are reduced, so that the internal leads are straight, and the quality of products is high.

Description

A kind of plastic package die diaphragm capsule
Technical field
The utility model relates to the equipment that a kind of integrated circuit encapsulation field is used, and relates in particular to a kind of integrated circuit plastic package die diaphragm capsule.
Background technology
Current plastic packaging former has developed into MGP plastic package die (many injection heads plastic sealed mould) and automatic plastic package die, with respect to traditional plastic package die, MGP plastic sealed mould encapsulating products has product colloid density and encapsulation yield height and lead towards characteristics such as winding curvature are low.High and the lead flexibility of colloid density is low, and what bring is that product reliability is strong, the advantage that particularly the more low bonding wire quantity that it brings of lead flexibility can be more, bonding wire density is bigger.The MGP plastic package die comprises diaphragm capsule and following diaphragm capsule, as shown in Figure 1, the diaphragm capsule that runner is arranged is last diaphragm capsule, it comprises moulding bar, central bars, moulding die cavity and runner, runner comprises main Jiao Dao and divides Jiao Dao, main Jiao Dao and two fens Jiao Dao over against, during plastic packaging, diaphragm capsule is heated to about 175 ° up and down, lead frame is placed on down above the diaphragm capsule moulding bar, and diaphragm capsule closes up pressurization up and down, and the injection head pressurization moves upward, plastic packaging material melts under HTHP and pours into each moulding die cavity along main Jiao Dao and branch Jiao Dao, and then finishes plastic packaging.As shown in Figure 3, since the main Jiao Dao of the last diaphragm capsule of existing MGP plastic package die and two fens Jiao Dao over against, plastic packaging material is when main Jiao Dao pours into each moulding die cavity with branch Jiao Dao, the mobile meeting of the plastic packaging material in the main glue road impacts to chip and lead in the moulding die cavity, lead is subjected to its impulsive force can become curved, cause lead to uprise towards winding curvature, influence the package quality of product.
The utility model content
In order to overcome above-mentioned MGP plastic package die because main Jiao Dao and two fens Jiao Dao become curved defective over against the lead that causes, the utility model provides a kind of plastic package die diaphragm capsule, the product lead rate of curving that this diaphragm capsule plastic packaging comes out is extremely low, further reduce the flexibility of lead, further improved product quality.
In order to reach above-mentioned technical purpose, the technical solution adopted in the utility model is:
A kind of plastic package die diaphragm capsule, comprise moulding die cavity and runner, described runner comprises main Jiao Dao and two fens Jiao Dao, and Jiao Dao all was connected with main Jiao Dao in described two minutes, Jiao Dao was connected with the moulding die cavity in described minute, it is characterized in that: the passage that described minute Jiao Dao is connected with main Jiao Dao is curved channel.
The radian of described curved channel is π/6~π/3.
Described curved channel is fat pipe gradually, and an end that links to each other with main Jiao Dao is the narrowest.
The utlity model has following advantage:
Two minutes of the present utility model Jiao Dao no longer with main Jiao Dao over against setting, but the passage that will divide Jiao Dao to be connected with main Jiao Dao should be curved channel, because when curved channel has reduced plastic packaging greatly, lead is subjected to its impulsive force, lead-in wire also no longer stressed change is curved, so just reduced the flexibility of lead, made lead become more straight, product quality is higher.The radian of curved channel is π/6~π/3, does not also influence plastic packaging material and flow into the moulding die cavity when reducing impulsive force, moulding smoothly.Curved channel is made as gradually fat pipe, and an end that links to each other with main Jiao Dao is the narrowest, also is in order further to lower the impulsive force that lead is subjected to, to guarantee the glacing flatness of lead.
Description of drawings
Fig. 1 is the structural representation of diaphragm capsule on the existing MGP plastic package die;
Fig. 2 is structural representation of the present utility model;
Fig. 3 is the product structure schematic diagram behind the MGP plastic package die plastic packaging;
Fig. 4 is the product structure schematic diagram behind the utility model plastic packaging.
Mark 1, moulding bar among the figure, 2, divide Jiao Dao, 3, main Jiao Dao, 4, central bars, 5, the moulding die cavity, 6, lead.
The specific embodiment
As shown in Figure 2, the utility model comprises moulding bar 1, central bars 4, moulding die cavity 5 and runner, described runner comprises main glue road 3 and two fens glue roads 2, glue road 2 all was connected with main glue road 3 in described two minutes, glue road 2 was connected with moulding die cavity 5 in described minute, and the passage that described minute glue road 2 is connected with main glue road 3 is curved channel, and the radian of described curved channel is π/6~π/3, described curved channel is fat pipe gradually, and is the narrowest with the end that main glue road 3 links to each other.During plastic packaging, diaphragm capsule is heated to about 175 ° up and down, and lead frame is placed on down above the diaphragm capsule moulding bar 1, diaphragm capsule closes up pressurization up and down, injection head pressurization moves upward, plastic packaging material under HTHP, melt and along main glue road 3 and branch glue road 2 pour into each moulding die cavity 5, and then finish plastic packaging.
Contrast as can be known as Fig. 3 and Fig. 4, when curved channel had reduced plastic packaging greatly, lead 6 was subjected to its impulsive force, and lead-in wire also no longer stressed change is curved, had so just reduced the flexibility of lead, made lead 6 become more straight, and product quality is higher.

Claims (3)

1. plastic package die diaphragm capsule, comprise moulding die cavity (5) and runner, described runner comprises main Jiao Dao (3) and two fens Jiao Dao (2), described two minutes Jiao Dao (2) all be connected with main Jiao Dao (3), described minute Jiao Dao (2) be connected with moulding die cavity (5), it is characterized in that: the passage that is connected with main Jiao Dao (3) of Jiao Dao (2) was curved channel in described minute.
2. a kind of plastic package die diaphragm capsule according to claim 1, it is characterized in that: the radian of described curved channel is π/6~π/3.
3. a kind of plastic package die diaphragm capsule according to claim 1 and 2 is characterized in that: described curved channel is fat pipe gradually, and is the narrowest with the end that main Jiao Dao (3) links to each other.
CN 201320226492 2013-04-28 2013-04-28 Plastic packaging mold box Expired - Lifetime CN203210622U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 201320226492 CN203210622U (en) 2013-04-28 2013-04-28 Plastic packaging mold box

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 201320226492 CN203210622U (en) 2013-04-28 2013-04-28 Plastic packaging mold box

Publications (1)

Publication Number Publication Date
CN203210622U true CN203210622U (en) 2013-09-25

Family

ID=49200194

Family Applications (1)

Application Number Title Priority Date Filing Date
CN 201320226492 Expired - Lifetime CN203210622U (en) 2013-04-28 2013-04-28 Plastic packaging mold box

Country Status (1)

Country Link
CN (1) CN203210622U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104916549A (en) * 2014-10-31 2015-09-16 林梓梁 Packaging equipment possessing arc edge fingerprint identification chip and packaging and cutting method
CN111391243A (en) * 2020-03-24 2020-07-10 环维电子(上海)有限公司 Plastic packaging mold based on one-time double-sided plastic packaging technology and plastic packaging method thereof

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104916549A (en) * 2014-10-31 2015-09-16 林梓梁 Packaging equipment possessing arc edge fingerprint identification chip and packaging and cutting method
CN104916549B (en) * 2014-10-31 2018-08-14 深圳市东方聚成科技有限公司 A kind of sealed in unit of the fingerprint recognition chip with arc side and encapsulation and cutting method
CN111391243A (en) * 2020-03-24 2020-07-10 环维电子(上海)有限公司 Plastic packaging mold based on one-time double-sided plastic packaging technology and plastic packaging method thereof
CN111391243B (en) * 2020-03-24 2022-03-29 环维电子(上海)有限公司 Plastic packaging mold based on one-time double-sided plastic packaging technology and plastic packaging method thereof

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
PE01 Entry into force of the registration of the contract for pledge of patent right
PE01 Entry into force of the registration of the contract for pledge of patent right

Denomination of utility model: Plastic packaging mold box

Effective date of registration: 20190507

Granted publication date: 20130925

Pledgee: China Postal Savings Bank Limited by Share Ltd. Suining Sui branch

Pledgor: SICHUAN MOUNTEK ELECTRONIC TECHNOLOGY CO.,LTD.

Registration number: 2019510000053

CP01 Change in the name or title of a patent holder
CP01 Change in the name or title of a patent holder

Address after: 629000 No.11, Dequan road Microelectronics Industrial Park, Suining Economic Development Zone, Sichuan Province

Patentee after: Sichuan Mingtai Microelectronics Technology Co.,Ltd.

Address before: 629000 No.11, Dequan road Microelectronics Industrial Park, Suining Economic Development Zone, Sichuan Province

Patentee before: SICHUAN MOUNTEK ELECTRONIC TECHNOLOGY CO.,LTD.

PC01 Cancellation of the registration of the contract for pledge of patent right
PC01 Cancellation of the registration of the contract for pledge of patent right

Date of cancellation: 20220328

Granted publication date: 20130925

Pledgee: China Postal Savings Bank Limited by Share Ltd. Suining Sui branch

Pledgor: SICHUAN MOUNTEK ELECTRONIC TECHNOLOGY CO.,LTD.

Registration number: 2019510000053

CX01 Expiry of patent term
CX01 Expiry of patent term

Granted publication date: 20130925