CN203650821U - EMC (Epoxy Molding Compound) packaging device for LED (Light Emitting Diode) bracket - Google Patents

EMC (Epoxy Molding Compound) packaging device for LED (Light Emitting Diode) bracket Download PDF

Info

Publication number
CN203650821U
CN203650821U CN201420002429.XU CN201420002429U CN203650821U CN 203650821 U CN203650821 U CN 203650821U CN 201420002429 U CN201420002429 U CN 201420002429U CN 203650821 U CN203650821 U CN 203650821U
Authority
CN
China
Prior art keywords
sprue
main body
emc
dozzle
height
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn - After Issue
Application number
CN201420002429.XU
Other languages
Chinese (zh)
Inventor
杨宇
曹杰
代迎桃
花富春
汪宗华
姚亮
黄银青
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TONGLING ZONFA TRINITY TECHNOLOGY Co Ltd
Original Assignee
TONGLING ZONFA TRINITY TECHNOLOGY Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TONGLING ZONFA TRINITY TECHNOLOGY Co Ltd filed Critical TONGLING ZONFA TRINITY TECHNOLOGY Co Ltd
Priority to CN201420002429.XU priority Critical patent/CN203650821U/en
Application granted granted Critical
Publication of CN203650821U publication Critical patent/CN203650821U/en
Anticipated expiration legal-status Critical
Withdrawn - After Issue legal-status Critical Current

Links

Images

Landscapes

  • Moulds For Moulding Plastics Or The Like (AREA)

Abstract

The utility model discloses an EMC (Epoxy Molding Compound) packaging device for an LED (Light Emitting Diode) bracket. The device comprises a central feeding body (1) and a packaging body (3), wherein two runners (2) are arranged at both ends of the central feeding body (1), a sprue (5) is formed in one end part of each of the runners (2), the packaging body (3) is connected with a widemouthed assistant sprue (4) relative to the sprue (5), the sprue (5) is connected with the packaging body (3) through the assistant sprue (4), the depth of the sprue (5) is greater than the height of the packaging main body (3), and the height of the packaging main body (3) is greater than that of the assistant sprue (4). Through a structural design of combining the packaging body, the sprue and the widemouthed assistant sprue, epoxy resin flowing through the assistant sprue can be uniformly and slowly filled to the packaging body with a large area, so that the problems of underfilling and loosening and the like in the EMC packaging process are reduced, and the yield of products is increased.

Description

A kind of EMC packaging system for LED support
Technical field
The utility model relates to a kind of EMC packaging system for LED support.
Background technology
At low-carbon economy, under the overall background of energy-conserving and environment-protective, China's LED industry development is rapid, and LED prospect of industrial development enjoys good, and EMC encapsulation is one of current high-end developing direction of LED industry.The capsulation material adopting while encapsulation due to EMC support is epoxy resin, this material has the advantages such as anti-UV, hot conditions stability inferior is good, the coefficient of expansion is low, in production capacity, EMC encapsulation is also greater than the LED product of traditional employing PPA Plastic Package from far away, and the equipment of EMC encapsulation takes up an area little, the availability of equipment is high, when exploitation new product, the second investment is little, encapsulate and developed a very long time at American-European and Japanese EMC, domestic many LED manufacturer is in recent years also at introduction EMC encapsulation technology and equipment gradually.EMC encapsulation has high density, highly integrated, the feature of packaged article thickness ultrathin, this feature of EMC encapsulation has determined the compact conformation of its mould, the rim of a cup that on mould, each fixing core is exactly a product, two adjacent core spacing are very little, existing single cast gate design is difficult to closely knit the position filling at the core back side in epoxy resin filling, in the process of encapsulation, often occur loose, filling is discontented, runner is residual large after separating, and affects the problems such as rear road cutting, has reduced the product percent of pass of EMC encapsulation.
Utility model content
The purpose of this utility model is to provide a kind of EMC packaging system for LED support, improves the product percent of pass of EMC encapsulation.
The technical solution adopted in the utility model is: a kind of EMC packaging system for LED support, comprise central feeding body and encapsulation main body, the two ends of described central feeding body are equipped with two runners, the end of described runner has cast gate, in described encapsulation main body, be connected with the dozzle of the wide degree of lip-rounding relative with cast gate, described cast gate is connected with encapsulation main body by dozzle, and the degree of depth of described cast gate is greater than the height of encapsulation main body, and the height of described encapsulation main body is greater than the height of dozzle.
As further improvement of the utility model, the face that described dozzle contacts with encapsulation main body is arc.
As further improvement of the utility model, the degree of depth of described cast gate is 0.25mm~0.3mm, and the height of described dozzle is 0.15mm, and the height of described encapsulation main body is 0.2mm.
The beneficial effect that the utility model adopts is: the structural design that the utility model combines by the dozzle of encapsulation main body, cast gate and the wide degree of lip-rounding, make epoxy resin can be evenly mild large-area to encapsulation main body filling when the dozzle, reduce the bad problems such as filling in EMC encapsulation process is discontented, loose, improved the qualification rate of product.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model;
Fig. 2 is the partial enlarged drawing of A portion in Fig. 1;
Shown in figure: 1, central feeding body, 2, runner, 3, encapsulation main body, 4, dozzle, 5, cast gate.
The specific embodiment
Below in conjunction with Fig. 1, Fig. 2, the utility model is described further.
As Fig. 1, shown in Fig. 2, a kind of EMC packaging system for LED support, comprise central feeding body 1 and encapsulation main body 3, the two ends of central feeding body 1 are equipped with two runners 2, runner 2 symmetries are distributed on the two ends of central feeding 1, the end of runner 2 has cast gate 5, in encapsulation main body 3, be connected with the dozzle 4 of the wide degree of lip-rounding relative with cast gate 5, the face that dozzle 4 contacts with encapsulation main body 3 is arc, cast gate 5 is connected with encapsulation main body 3 by dozzle 4, the degree of depth of cast gate 5 is greater than the height of encapsulation main body 3, the height of encapsulation main body 3 is greater than the height of dozzle 4.The degree of depth of cast gate 5 is 0.25mm~0.3mm, and the height of dozzle 4 is 0.15mm, and the height of encapsulation main body 3 is 0.2mm.
The utility model in use, cast gate, the dozzle of the wide degree of lip-rounding, encapsulation main body is connected successively, the outlet of dozzle is greater than the outlet of cast gate, epoxy resin changes into heavy in section by small bore when through dozzle, can epoxy resin is evenly mild large-area to encapsulation main body horizontal sliding, make as far as possible position, the dead angle filling at the core back side in encapsulation main body closely knit, because the cross section of cast gate is little, dozzle cross section is large, when epoxy resin flow to dozzle position from cast gate there is loss in pressure, the face that dozzle contacts with encapsulation main body adopts arc design, the degree of depth of cast gate is 0.25mm~0.3mm, the height of dozzle is 0.15mm, the height of encapsulation main body is 0.2mm, being used for equilibrium pours into pressure.Dozzle is stayed in LED support encapsulation main body in the time that runner separates, later process is directly excised together with the frame of encapsulation main body, therefore the height of encapsulation main body is greater than the height of dozzle, when preventing from cutting because putting the uneven cutting accuracy that affects, and while running into the higher epoxy resin of viscosity, runner separates damaged also only there will be on dozzle producing with encapsulation main body, can not have influence on outward appearance and the performance of product, effectively improves the qualification rate of product in EMC encapsulation process.

Claims (3)

1. the EMC packaging system for LED support, comprise central feeding body (1) and encapsulation main body (3), the two ends that it is characterized in that described central feeding body (1) are equipped with two runners (2), the end of described runner (2) has cast gate (5), in described encapsulation main body (3), be connected with the dozzle (4) of the wide degree of lip-rounding relative with cast gate (5), described cast gate (5) is connected with encapsulation main body (3) by dozzle (4), the degree of depth of described cast gate (5) is greater than the height of encapsulation main body (3), the height of described encapsulation main body (3) is greater than the height of dozzle (4).
2. a kind of EMC packaging system for LED support according to claim 1, is characterized in that the face that described dozzle (4) contacts with encapsulation main body (3) is arc.
3. a kind of EMC packaging system for LED support according to claim 1, the degree of depth that it is characterized in that described cast gate (5) is 0.25mm~0.3mm, and the height of described dozzle (4) is 0.15mm, and the height of described encapsulation main body (3) is 0.2mm.
CN201420002429.XU 2014-01-03 2014-01-03 EMC (Epoxy Molding Compound) packaging device for LED (Light Emitting Diode) bracket Withdrawn - After Issue CN203650821U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201420002429.XU CN203650821U (en) 2014-01-03 2014-01-03 EMC (Epoxy Molding Compound) packaging device for LED (Light Emitting Diode) bracket

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201420002429.XU CN203650821U (en) 2014-01-03 2014-01-03 EMC (Epoxy Molding Compound) packaging device for LED (Light Emitting Diode) bracket

Publications (1)

Publication Number Publication Date
CN203650821U true CN203650821U (en) 2014-06-18

Family

ID=50917255

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201420002429.XU Withdrawn - After Issue CN203650821U (en) 2014-01-03 2014-01-03 EMC (Epoxy Molding Compound) packaging device for LED (Light Emitting Diode) bracket

Country Status (1)

Country Link
CN (1) CN203650821U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103753756A (en) * 2014-01-03 2014-04-30 铜陵中发三佳科技股份有限公司 EMC (Electro-Magnetic Compatibility) packaging device for LED (Light-Emitting Diode) support

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103753756A (en) * 2014-01-03 2014-04-30 铜陵中发三佳科技股份有限公司 EMC (Electro-Magnetic Compatibility) packaging device for LED (Light-Emitting Diode) support
CN103753756B (en) * 2014-01-03 2016-08-17 铜陵中发三佳科技股份有限公司 A kind of EMC packaging system for LED support

Similar Documents

Publication Publication Date Title
CN203650821U (en) EMC (Epoxy Molding Compound) packaging device for LED (Light Emitting Diode) bracket
CN103753756A (en) EMC (Electro-Magnetic Compatibility) packaging device for LED (Light-Emitting Diode) support
CN207503966U (en) Suitable for eight row lead frame of TO251 types of continuous filling technique
CN203210622U (en) Plastic packaging mold box
CN206568505U (en) A kind of integrated circuit plastic packaging mould injecting systems
CN203491253U (en) Plastic packaging structure for semiconductors
CN202378244U (en) Novel injection mould
CN207651475U (en) A kind of chip encapsulation assembly
CN202651073U (en) Integrated circuit plastic packaging mold for preventing horizontal material overflow at cored hole
CN205889740U (en) Can break switch shell mould of central runner waste material
CN207682806U (en) A kind of semiconductor packaging mold and packaging system
CN201838574U (en) DIP (dual in-line) package chip lead frame and packaging mold thereof
CN204936075U (en) A kind of Fast Filling equivalance constant voltage runner pouring gate structure
CN205219608U (en) Improved plastic injection mold
CN206579084U (en) A kind of submarine type glue feeding mould structure
CN203371742U (en) Filling nozzle of cold runner mold
CN202826275U (en) S-shaped runner plastic package body of four groups of metal gauze packing (MGP) moulds
CN203737953U (en) Casting mold for saddle of knitting machine
CN203260556U (en) Cavity plate for package moulds
CN202523761U (en) Led packaging structure
CN203077539U (en) Plastic packaging mold for plastic package body for packaging SOP8 chip
CN203637098U (en) LED (light emitting diode) lampshade hot-runner injection mold
CN202549798U (en) Novel semiconductor packaging die
CN207224471U (en) Stalking glue in a kind of line position
CN204658829U (en) Plaque injection mold under a kind of automobile B-column of flip-over type

Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
AV01 Patent right actively abandoned

Granted publication date: 20140618

Effective date of abandoning: 20160817

C25 Abandonment of patent right or utility model to avoid double patenting