CN203650821U - EMC (Epoxy Molding Compound) packaging device for LED (Light Emitting Diode) bracket - Google Patents
EMC (Epoxy Molding Compound) packaging device for LED (Light Emitting Diode) bracket Download PDFInfo
- Publication number
- CN203650821U CN203650821U CN201420002429.XU CN201420002429U CN203650821U CN 203650821 U CN203650821 U CN 203650821U CN 201420002429 U CN201420002429 U CN 201420002429U CN 203650821 U CN203650821 U CN 203650821U
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- sprue
- main body
- emc
- dozzle
- height
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Abstract
The utility model discloses an EMC (Epoxy Molding Compound) packaging device for an LED (Light Emitting Diode) bracket. The device comprises a central feeding body (1) and a packaging body (3), wherein two runners (2) are arranged at both ends of the central feeding body (1), a sprue (5) is formed in one end part of each of the runners (2), the packaging body (3) is connected with a widemouthed assistant sprue (4) relative to the sprue (5), the sprue (5) is connected with the packaging body (3) through the assistant sprue (4), the depth of the sprue (5) is greater than the height of the packaging main body (3), and the height of the packaging main body (3) is greater than that of the assistant sprue (4). Through a structural design of combining the packaging body, the sprue and the widemouthed assistant sprue, epoxy resin flowing through the assistant sprue can be uniformly and slowly filled to the packaging body with a large area, so that the problems of underfilling and loosening and the like in the EMC packaging process are reduced, and the yield of products is increased.
Description
Technical field
The utility model relates to a kind of EMC packaging system for LED support.
Background technology
At low-carbon economy, under the overall background of energy-conserving and environment-protective, China's LED industry development is rapid, and LED prospect of industrial development enjoys good, and EMC encapsulation is one of current high-end developing direction of LED industry.The capsulation material adopting while encapsulation due to EMC support is epoxy resin, this material has the advantages such as anti-UV, hot conditions stability inferior is good, the coefficient of expansion is low, in production capacity, EMC encapsulation is also greater than the LED product of traditional employing PPA Plastic Package from far away, and the equipment of EMC encapsulation takes up an area little, the availability of equipment is high, when exploitation new product, the second investment is little, encapsulate and developed a very long time at American-European and Japanese EMC, domestic many LED manufacturer is in recent years also at introduction EMC encapsulation technology and equipment gradually.EMC encapsulation has high density, highly integrated, the feature of packaged article thickness ultrathin, this feature of EMC encapsulation has determined the compact conformation of its mould, the rim of a cup that on mould, each fixing core is exactly a product, two adjacent core spacing are very little, existing single cast gate design is difficult to closely knit the position filling at the core back side in epoxy resin filling, in the process of encapsulation, often occur loose, filling is discontented, runner is residual large after separating, and affects the problems such as rear road cutting, has reduced the product percent of pass of EMC encapsulation.
Utility model content
The purpose of this utility model is to provide a kind of EMC packaging system for LED support, improves the product percent of pass of EMC encapsulation.
The technical solution adopted in the utility model is: a kind of EMC packaging system for LED support, comprise central feeding body and encapsulation main body, the two ends of described central feeding body are equipped with two runners, the end of described runner has cast gate, in described encapsulation main body, be connected with the dozzle of the wide degree of lip-rounding relative with cast gate, described cast gate is connected with encapsulation main body by dozzle, and the degree of depth of described cast gate is greater than the height of encapsulation main body, and the height of described encapsulation main body is greater than the height of dozzle.
As further improvement of the utility model, the face that described dozzle contacts with encapsulation main body is arc.
As further improvement of the utility model, the degree of depth of described cast gate is 0.25mm～0.3mm, and the height of described dozzle is 0.15mm, and the height of described encapsulation main body is 0.2mm.
The beneficial effect that the utility model adopts is: the structural design that the utility model combines by the dozzle of encapsulation main body, cast gate and the wide degree of lip-rounding, make epoxy resin can be evenly mild large-area to encapsulation main body filling when the dozzle, reduce the bad problems such as filling in EMC encapsulation process is discontented, loose, improved the qualification rate of product.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model;
Fig. 2 is the partial enlarged drawing of A portion in Fig. 1;
Shown in figure: 1, central feeding body, 2, runner, 3, encapsulation main body, 4, dozzle, 5, cast gate.
The specific embodiment
Below in conjunction with Fig. 1, Fig. 2, the utility model is described further.
As Fig. 1, shown in Fig. 2, a kind of EMC packaging system for LED support, comprise central feeding body 1 and encapsulation main body 3, the two ends of central feeding body 1 are equipped with two runners 2, runner 2 symmetries are distributed on the two ends of central feeding 1, the end of runner 2 has cast gate 5, in encapsulation main body 3, be connected with the dozzle 4 of the wide degree of lip-rounding relative with cast gate 5, the face that dozzle 4 contacts with encapsulation main body 3 is arc, cast gate 5 is connected with encapsulation main body 3 by dozzle 4, the degree of depth of cast gate 5 is greater than the height of encapsulation main body 3, the height of encapsulation main body 3 is greater than the height of dozzle 4.The degree of depth of cast gate 5 is 0.25mm～0.3mm, and the height of dozzle 4 is 0.15mm, and the height of encapsulation main body 3 is 0.2mm.
The utility model in use, cast gate, the dozzle of the wide degree of lip-rounding, encapsulation main body is connected successively, the outlet of dozzle is greater than the outlet of cast gate, epoxy resin changes into heavy in section by small bore when through dozzle, can epoxy resin is evenly mild large-area to encapsulation main body horizontal sliding, make as far as possible position, the dead angle filling at the core back side in encapsulation main body closely knit, because the cross section of cast gate is little, dozzle cross section is large, when epoxy resin flow to dozzle position from cast gate there is loss in pressure, the face that dozzle contacts with encapsulation main body adopts arc design, the degree of depth of cast gate is 0.25mm～0.3mm, the height of dozzle is 0.15mm, the height of encapsulation main body is 0.2mm, being used for equilibrium pours into pressure.Dozzle is stayed in LED support encapsulation main body in the time that runner separates, later process is directly excised together with the frame of encapsulation main body, therefore the height of encapsulation main body is greater than the height of dozzle, when preventing from cutting because putting the uneven cutting accuracy that affects, and while running into the higher epoxy resin of viscosity, runner separates damaged also only there will be on dozzle producing with encapsulation main body, can not have influence on outward appearance and the performance of product, effectively improves the qualification rate of product in EMC encapsulation process.
Claims (3)
1. the EMC packaging system for LED support, comprise central feeding body (1) and encapsulation main body (3), the two ends that it is characterized in that described central feeding body (1) are equipped with two runners (2), the end of described runner (2) has cast gate (5), in described encapsulation main body (3), be connected with the dozzle (4) of the wide degree of lip-rounding relative with cast gate (5), described cast gate (5) is connected with encapsulation main body (3) by dozzle (4), the degree of depth of described cast gate (5) is greater than the height of encapsulation main body (3), the height of described encapsulation main body (3) is greater than the height of dozzle (4).
2. a kind of EMC packaging system for LED support according to claim 1, is characterized in that the face that described dozzle (4) contacts with encapsulation main body (3) is arc.
3. a kind of EMC packaging system for LED support according to claim 1, the degree of depth that it is characterized in that described cast gate (5) is 0.25mm～0.3mm, and the height of described dozzle (4) is 0.15mm, and the height of described encapsulation main body (3) is 0.2mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420002429.XU CN203650821U (en) | 2014-01-03 | 2014-01-03 | EMC (Epoxy Molding Compound) packaging device for LED (Light Emitting Diode) bracket |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420002429.XU CN203650821U (en) | 2014-01-03 | 2014-01-03 | EMC (Epoxy Molding Compound) packaging device for LED (Light Emitting Diode) bracket |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203650821U true CN203650821U (en) | 2014-06-18 |
Family
ID=50917255
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420002429.XU Withdrawn - After Issue CN203650821U (en) | 2014-01-03 | 2014-01-03 | EMC (Epoxy Molding Compound) packaging device for LED (Light Emitting Diode) bracket |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203650821U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103753756A (en) * | 2014-01-03 | 2014-04-30 | 铜陵中发三佳科技股份有限公司 | EMC (Electro-Magnetic Compatibility) packaging device for LED (Light-Emitting Diode) support |
-
2014
- 2014-01-03 CN CN201420002429.XU patent/CN203650821U/en not_active Withdrawn - After Issue
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103753756A (en) * | 2014-01-03 | 2014-04-30 | 铜陵中发三佳科技股份有限公司 | EMC (Electro-Magnetic Compatibility) packaging device for LED (Light-Emitting Diode) support |
| CN103753756B (en) * | 2014-01-03 | 2016-08-17 | 铜陵中发三佳科技股份有限公司 | A kind of EMC packaging system for LED support |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20140618 Effective date of abandoning: 20160817 |
|
| C25 | Abandonment of patent right or utility model to avoid double patenting |