CN201956391U - LED (Light-Emitting Diode) packaging module - Google Patents
LED (Light-Emitting Diode) packaging module Download PDFInfo
- Publication number
- CN201956391U CN201956391U CN201020675182XU CN201020675182U CN201956391U CN 201956391 U CN201956391 U CN 201956391U CN 201020675182X U CN201020675182X U CN 201020675182XU CN 201020675182 U CN201020675182 U CN 201020675182U CN 201956391 U CN201956391 U CN 201956391U
- Authority
- CN
- China
- Prior art keywords
- led
- substrate
- coffer
- packaging module
- equipment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Landscapes
- Led Device Packages (AREA)
Abstract
The utility model relates to an LED (Light-Emitting Diode) packaging module. The utility model is characterized in that the LED packaging module comprises a substrate and at least one LED device arranged on the substrate; a coffer is arranged at one side of the substrate; at least one LED device is located inside the coffer; and a filler is arranged inside the coffer. In the LED packaging module, the coffer can be formed only by adopting glue-pouring equipment, glue is poured into the coffer, so as to package the LED device, therefore, professional Molding equipment is not needed; different dimensions of substrate type LEDs can be formed into any irregular shape without adopting a development mould, so that molding can be realized without relevant auxiliary tongs and professional equipment; therefore, the LED packaging module has the characteristics of low equipment investment cost, easy mastered manufacturing technology and highly one-time molding rate of the product.
Description
Technical field
The utility model relates to a kind of LED package module.
Background technology
LED package module of the prior art all is to use mould Molding technology to finish, and finishing of Molding technology needs the equipment of specialty to finish, and need need mold developing at the substrate-type LED of different size.Therefore, the prior art shortcoming that has that manufacturing cost height, product yield are low, can not revise after the typing.
Summary of the invention
The purpose of this utility model provides the LED package module that a kind of cost is low, the product yield is high.
For solving the problems of the technologies described above, the utility model is taked following technical scheme: a kind of LED package module, it is characterized in that: comprise substrate and at least one LED matrix that is arranged on the described substrate, side at described substrate also is provided with the cofferdam, described at least one LED matrix is positioned within the described cofferdam, also is provided with filler in described cofferdam.
Further, described filler is an encapsulation glue.
Further, described cofferdam is a glue cofferdam body.
Described LED package module in the utility model is owing to only need to adopt injecting glue equipment just can form the cofferdam, thereby and glue can be injected the encapsulation of described cofferdam formation to LED matrix, therefore the Molding equipment that does not need specialty, and at the substrate-type LED of different size, do not need mold developing, can form any irregular shape, therefore unwanted relevant shop helps anchor clamps and professional equipment can finish moulding, has the advantages that the equipment input cost is low, manufacturing technology is grasped easily, product one-shot forming rate is high.
Description of drawings
Fig. 1 is the structural representation of the described LED package module in the utility model.
Embodiment
Below in conjunction with accompanying drawing the technical solution of the utility model is elaborated.
Fig. 1 shows the structural representation of the described LED package module in the utility model.As shown in Figure 1, described LED package module comprises substrate 1 and at least one LED matrix 2 that is arranged on the described substrate 1, side at described substrate 1 also is provided with cofferdam 4, and described at least one LED matrix is positioned within the described cofferdam 4, also is filled with filler 3. in described cofferdam 4
Preferably, described filler 3 is an encapsulation glue.
Preferably, described cofferdam 4 is glue cofferdam bodies.
Preferably, described cofferdam 4 forms by injecting glue equipment.
Described LED package module in the utility model is owing to only need to adopt injecting glue equipment just can form the cofferdam, thereby and glue can be injected the encapsulation of described cofferdam formation to LED matrix, therefore the Molding equipment that does not need specialty, and at the substrate-type LED of different size, do not need mold developing, can form any irregular shape, therefore unwanted relevant shop helps anchor clamps and professional equipment can finish moulding, has the advantages that the equipment input cost is low, manufacturing technology is grasped easily, product one-shot forming rate is high.
Claims (3)
1. LED package module, it is characterized in that: comprise substrate and at least one LED matrix that is arranged on the described substrate, side at described substrate also is provided with the cofferdam, and described at least one LED matrix is positioned within the described cofferdam, also is provided with filler in described cofferdam.
2. LED package module as claimed in claim 1 is characterized in that: described filler is an encapsulation glue.
3. LED package module as claimed in claim 1 is characterized in that: described cofferdam is a glue cofferdam body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201020675182XU CN201956391U (en) | 2010-12-21 | 2010-12-21 | LED (Light-Emitting Diode) packaging module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201020675182XU CN201956391U (en) | 2010-12-21 | 2010-12-21 | LED (Light-Emitting Diode) packaging module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201956391U true CN201956391U (en) | 2011-08-31 |
Family
ID=44500493
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201020675182XU Expired - Lifetime CN201956391U (en) | 2010-12-21 | 2010-12-21 | LED (Light-Emitting Diode) packaging module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201956391U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20140353594A1 (en) * | 2013-05-29 | 2014-12-04 | Shenzhen China Star Optoelectronics Technology Co., Ltd. | OLED Panel, Manufacturing Method, and Related Testing Method |
| CN108538943A (en) * | 2018-06-15 | 2018-09-14 | 广东汉能薄膜太阳能有限公司 | The encapsulating method of solar cell module |
-
2010
- 2010-12-21 CN CN201020675182XU patent/CN201956391U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20140353594A1 (en) * | 2013-05-29 | 2014-12-04 | Shenzhen China Star Optoelectronics Technology Co., Ltd. | OLED Panel, Manufacturing Method, and Related Testing Method |
| CN108538943A (en) * | 2018-06-15 | 2018-09-14 | 广东汉能薄膜太阳能有限公司 | The encapsulating method of solar cell module |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| WO2009072786A3 (en) | Led package and method for fabricating the same | |
| WO2013102137A3 (en) | Fully molded fan-out | |
| EP2610925A3 (en) | Producing method of light emitting diode device | |
| CN201930901U (en) | Die used for flat bracket adhesive dispensing | |
| MY154178A (en) | Optoelectronic part producing method,optoelectronic part producing system,and optoelectronic part | |
| CN201956391U (en) | LED (Light-Emitting Diode) packaging module | |
| TW200626333A (en) | Resin casting mold and method of casting resin | |
| CN105643958A (en) | Forming tool and method for composite | |
| CN102514134A (en) | Die and machining process for glue pouring in packaging process of LED (Light-emitting Diode) | |
| CN204019874U (en) | For the jig structure of LED filament mold pressing encapsulation | |
| CN102189647A (en) | Injection molding mold positioning structure | |
| CN202344737U (en) | Glue potting mold during encapsulation of LED (Light Emitting Diode) | |
| CN202549798U (en) | Novel semiconductor packaging die | |
| CN203521467U (en) | LED silica gel chip packaging structure | |
| CN206999468U (en) | A kind of Mic USB terminal encapsulation dies | |
| CN207736675U (en) | A kind of plastic mould dish-style pulled core structure three times | |
| CN203650821U (en) | EMC (Epoxy Molding Compound) packaging device for LED (Light Emitting Diode) bracket | |
| CN202344742U (en) | Compression molding die | |
| CN202106505U (en) | Feeding point mechanism of double-color forming mold | |
| CN203553217U (en) | Simple LED silica gel chip packaging structure | |
| WO2014041470A3 (en) | Heat sink structure and method of manufacturing the same | |
| CN203371742U (en) | Filling nozzle of cold runner mold | |
| CN104626474A (en) | Female die slide block structure | |
| EP2471643A3 (en) | Method for manufacture of tray | |
| CN202394842U (en) | Semiconductor graphite die |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20110831 |