CN203521467U - LED silica gel chip packaging structure - Google Patents

Abstract

Provided is an LED silica gel chip packaging structure which comprises a support and multiple base bodies. The base bodies are arranged on the support in a grouping way. A heat-radiating bench with a protrusion is wrapped by the base bodies. The protrusion of the heat-radiating bench is provided with an accommodation groove used for arranging an LED chip. The chip is wrapped by a semicircular silica gel layer. A semicircular cover plate is covered on the base bodies so that a semicircular molding space is formed above the base bodies. The periphery of the semicircular cover plate stretches out of a protruding edge arranged in the base bodies. One side of the protruding edge is provided with an injection hole, and the other side is provided with a ventilation hole. The semicircular cover plate is made of polycarbonate. The LED silica gel chip packaging structure also comprises a silica gel injection device. The silica gel injection device is provided with an extension tube which stretches into the injection hole to inject silica gel material. Therefore, the LED silica gel chip packaging structure is simple in structure, convenient to use, simple in operation and simplified in process, and thus cost is reduced.

Description

LED silicon core chip package

Technical field

The utility model relates to a kind of LED silicon core chip package.

Background technology

In LED silicon core chip package, the mould by ejection formation is by silica gel packaging in chip conventionally, and this structure exists the defect of packaging process complexity.

For this reason, designer of the present utility model is because above-mentioned defect, by concentrating on studies and designing, is comprehensively engaged in for a long time experience and the achievement of related industry for many years, and research and design goes out a kind of LED silicon core chip package, to overcome above-mentioned defect.

Utility model content

The technical problems to be solved in the utility model is: in LED silicon core chip package, the mould by ejection formation is by silica gel packaging in chip conventionally, and this structure exists the defect of packaging process complexity.

For addressing the above problem, the utility model discloses a kind of LED silicon core chip package, comprise support and a plurality of pedestal, it is characterized in that:

Described pedestal is mounted on described support, and described pedestal is coated with one and has protruding heat radiation platform, has the storage tank of inserting for a LED chip in the projection of described heat radiation platform, and described chip is coated by a semicircle layer of silica gel;

On described pedestal, be coated with semicircle cover plate to form the molding space of semicircle on pedestal, the periphery of described semicircle cover plate extends the flange that is positioned at pedestal, and a side of described flange has hand-hole, and opposite side is provided with air-vent;

Described semicircle cover plate is made by Merlon;

And a silica gel injection device, described silica gel injection device has and stretches into described hand-hole with the extension tube of Implanted Silicon sizing material.

Wherein: described support is that metal is made.

Wherein: described silica gel injection device has heater.

Known by said structure, LED silicon core chip package of the present utility model has following technique effect:

1, simple in structure, easy to use;

2, easy and simple to handle, operation is simplified, and reduces costs.

Detailed content of the present utility model can obtain by explanation described later and institute's accompanying drawing.

Accompanying drawing explanation

Fig. 1 has shown the schematic diagram of the utility model LED silicon core chip package.

Fig. 2 has shown the schematic diagram after the encapsulation of the utility model LED silicon core chip package.

Embodiment

Referring to Fig. 1 and Fig. 2, shown LED silicon core chip package of the present utility model.

Described LED silicon core chip package comprises support 10 and a plurality of pedestal 11, described pedestal 11 is mounted on described support 10, described pedestal 11 is coated with one and has protruding heat radiation platform 15, in the projection of described heat radiation platform 15, have the storage tank of inserting for a LED chip 12, described chip 12 is coated by a semicircle layer of silica gel.

Wherein, described support 10 is made for metal.

Wherein, be coated with semicircle cover plate 4 on described pedestal 11, to form the molding space of semicircle on pedestal 11, the periphery of described semicircle cover plate 4 extends the flange that is positioned at pedestal, and a side of described flange has hand-hole 40, and opposite side is provided with air-vent 41.

Wherein, described semicircle cover plate 4 is made by Merlon.

And a silica gel injection device 3, described silica gel injection device 3 has and stretches into described hand-hole 40 with the extension tube 31 of Implanted Silicon sizing material 131.

Wherein, silica gel injection device 3 has heater.

Known referring to Fig. 1, by being the silica gel of thickness liquid state after injection heating in the molding space of 3 pairs of semicircles of silica gel injection device, gas discharges to avoid bubble from air-vent, is full of rear wait silica gel and solidifies, after solidifying, directly form encapsulating structure, thereby avoided the complexity of operation.

Known by said structure, LED silicon core chip package tool of the present utility model has the following advantages:

1, simple in structure, easy to use;

2, easy and simple to handle, operation is simplified, and reduces costs.

It is evident that above description and to record be only for example rather than in order to limit disclosure of the present utility model, application or use.Although described in an embodiment and be described in the drawings embodiment, but the optimal mode that the utility model does not limit by accompanying drawing example and the conduct of describing is in an embodiment thought to be at present to implement the specific examples of instruction of the present utility model, scope of the present utility model will comprise any embodiment of the specification that falls into above and appended claim.

Claims (3)

1. a LED silicon core chip package, comprises support and a plurality of pedestal, it is characterized in that:

Described pedestal is mounted on described support, and described pedestal is coated with one and has protruding heat radiation platform, has the storage tank of inserting for a LED chip in the projection of described heat radiation platform, and described chip is coated by a semicircle layer of silica gel;

On described pedestal, be coated with semicircle cover plate to form the molding space of semicircle on pedestal, the periphery of described semicircle cover plate extends the flange that is positioned at pedestal, and a side of described flange has hand-hole, and opposite side is provided with air-vent;

Described semicircle cover plate is made by Merlon;

And a silica gel injection device, described silica gel injection device has and stretches into described hand-hole with the extension tube of Implanted Silicon sizing material.

2. LED silicon core chip package as claimed in claim 1, is characterized in that: described support is that metal is made.

3. LED silicon core chip package as claimed in claim 1, is characterized in that: described silica gel injection device has heater.

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