CN204257595U - A kind of semiconductor packaging device mould - Google Patents
A kind of semiconductor packaging device mould Download PDFInfo
- Publication number
- CN204257595U CN204257595U CN201420794133.6U CN201420794133U CN204257595U CN 204257595 U CN204257595 U CN 204257595U CN 201420794133 U CN201420794133 U CN 201420794133U CN 204257595 U CN204257595 U CN 204257595U
- Authority
- CN
- China
- Prior art keywords
- location division
- mold
- packaging device
- semiconductor packaging
- bed die
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
The utility model provides a kind of semiconductor packaging device mould, comprising: upper die base; Mold, comprises patrix location division and is fixed on described upper die base bottom surface by described patrix location division; Bed die, is pressed on described mold bottom surface; Shunting guide part, be located at described bed die and be pressed on described patrix location division, epoxy resin for being flowed into outside imports the gap between upper and lower mould, be conducive to analyzing the rational degree of depth of air discharge duct by the characteristic of epoxy resin, while ensure that workability, add exhaust effect.
Description
Technical field
The utility model relates to technical field of manufacturing semiconductors, particularly relates to a kind of semiconductor packaging device mould.
Background technology
Due to existing defects in the semiconductor packaging mold Plastic packaging apparatus structure of current use, cause epoxy resin after high temperature melt enters Plastic packaging apparatus, gas in former Plastic packaging apparatus cannot be discharged in time, cause gas bubbles left in Plastic packaging apparatus, after hot setting, product exists the phenomenon of not injection moulding completely, defective products occurs in a large number.
Summary of the invention
The shortcoming of prior art in view of the above, the purpose of this utility model is to provide a kind of semiconductor packaging device mould, solves in above-mentioned prior art that cause because of mould inside structure problem cannot the problem of injection moulding completely.
For realizing above-mentioned target and other related objectives, the utility model provides a kind of semiconductor packaging device mould, comprising: upper die base; Mold, comprises patrix location division and is fixed on described upper die base bottom surface by described patrix location division; Bed die, is pressed on described mold bottom surface; Shunting guide part, be located at described bed die and be pressed on described patrix location division, the epoxy resin for being flowed into outside imports the gap between upper and lower mould.
Optionally, described upper die base, mold and bed die are square.
Optionally, described mold is provided with air discharge duct.
Optionally, described bed die is provided with air discharge duct.
As mentioned above, the utility model provides a kind of semiconductor packaging device mould, comprising: upper die base; Mold, comprises patrix location division and is fixed on described upper die base bottom surface by described patrix location division; Bed die, is pressed on described mold bottom surface; Shunting guide part, be located at described bed die and be pressed on described patrix location division, epoxy resin for being flowed into outside imports the gap between upper and lower mould, be conducive to analyzing the rational degree of depth of air discharge duct by the characteristic of epoxy resin, while ensure that workability, add exhaust effect.
Accompanying drawing explanation
Fig. 1 is shown as the structural representation of an embodiment of semiconductor packaging device mould of the present utility model.
Unit's portion's label declaration:
1-upper die base;
2-mold;
3-patrix location division;
4-bed die;
5-shunts guide part.
Embodiment
Below by way of specific instantiation, execution mode of the present utility model is described, those skilled in the art the content disclosed by this specification can understand other advantages of the present utility model and effect easily.The utility model can also be implemented or be applied by embodiments different in addition, and the every details in this specification also can based on different viewpoints and application, carries out various modification or change not deviating under spirit of the present utility model.It should be noted that, when not conflicting, the embodiment in the application and the feature in embodiment can combine mutually.
As shown in Figure 1, the utility model provides a kind of semiconductor packaging device mould, comprising: upper die base 1, mold 2, patrix location division 3, bed die 4 and shunting guide part 5.
Described upper die base 1, can be the plate body that has the fixed parts such as such as recessed or male structure, for for the described mold 2 of installing.
Described mold 2, comprises patrix location division 3 and is fixed on described upper die base 1 bottom surface by described patrix location division 3, described fixing can such as by being fitted together to, screw lock or bonding mode fix; Preferably, described mold 2 also can be provided with the air discharge duct for being vented.
It should be noted that, described mold 2 and patrix location division 3 can be provided with the hollow structure of connection, for importing epoxy resin etc.
Described bed die 4, is pressed on described mold 2 bottom surface; In one embodiment, the die pressing surface of described bed die 4 is provided with air discharge duct.
Described shunting guide part 5, be located at described bed die 4 and be pressed on described patrix location division 3, in one embodiment can be as shown in the figure, be located at the below of described patrix location division 3, also the mode that pressing is fixing can be adopted, for by such as incline structure etc. the epoxy resin that outside flows into being imported the gap between upper and lower mould 4, utilizing the flowing of structure guided rings epoxy resins thus extruding excessive gas, avoiding prior art epoxy resin to fix the problem of rear gas residue.
In one embodiment, described upper die base 1, mold 2 and bed die 4 is square.
As mentioned above, the utility model provides a kind of semiconductor packaging device mould, comprising: upper die base; Mold, comprises patrix location division and is fixed on described upper die base bottom surface by described patrix location division; Bed die, is pressed on described mold bottom surface; Shunting guide part, be located at described bed die and be pressed on described patrix location division, epoxy resin for being flowed into outside imports the gap between upper and lower mould, be conducive to analyzing the rational degree of depth of air discharge duct by the characteristic of epoxy resin, while ensure that workability, add exhaust effect.
Above-described embodiment is illustrative principle of the present utility model and effect thereof only, but not for limiting the utility model.Any person skilled in the art scholar all without prejudice under spirit of the present utility model and category, can modify above-described embodiment or changes.Therefore, such as have in art and usually know that the knowledgeable modifies or changes not departing from all equivalences completed under the spirit and technological thought that the utility model discloses, must be contained by claim of the present utility model.
Claims (4)
1. a semiconductor packaging device mould, is characterized in that, comprising:
Upper die base;
Mold, comprises patrix location division and is fixed on described upper die base bottom surface by described patrix location division;
Bed die, is pressed on described mold bottom surface;
Shunting guide part, be located at described bed die and be pressed on described patrix location division, the epoxy resin for being flowed into outside imports the gap between upper and lower mould.
2. semiconductor packaging device mould according to claim 1, is characterized in that, described upper die base, mold and bed die are square.
3. semiconductor packaging device mould according to claim 1, is characterized in that, described mold is provided with air discharge duct.
4. semiconductor packaging device mould according to claim 1, is characterized in that, described bed die is provided with air discharge duct.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420794133.6U CN204257595U (en) | 2014-12-16 | 2014-12-16 | A kind of semiconductor packaging device mould |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420794133.6U CN204257595U (en) | 2014-12-16 | 2014-12-16 | A kind of semiconductor packaging device mould |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204257595U true CN204257595U (en) | 2015-04-08 |
Family
ID=52961872
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420794133.6U Active CN204257595U (en) | 2014-12-16 | 2014-12-16 | A kind of semiconductor packaging device mould |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204257595U (en) |
-
2014
- 2014-12-16 CN CN201420794133.6U patent/CN204257595U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104339534A (en) | Injection molding method of superthick-wall transparent plastic parts | |
| CN204257595U (en) | A kind of semiconductor packaging device mould | |
| CN204773296U (en) | A injection mold for phenol -formaldehyde resin stereotypes | |
| CN204309198U (en) | A kind of high-light no-trace injection moulding apparatus | |
| CN203831731U (en) | Tunnel slide air discharging mold | |
| CN203472071U (en) | Runner mechanism | |
| CN204354412U (en) | A kind of thin-wall part improving injection defect | |
| CN207549316U (en) | A kind of gas assisted molding and handware injection mold simultaneously | |
| CN203739152U (en) | Liquid silicone rubber injection mold venting structure | |
| CN203567072U (en) | Injection mold for hole-breaking products | |
| CN102303393B (en) | Method for fixing flaky insert and plastic component with flaky insert | |
| CN204049391U (en) | Cure with sizing and extruding device | |
| CN204749233U (en) | Bimodulus head blowing forming device | |
| CN205044080U (en) | Injection mold is prevented blockking up in air guide | |
| CN204209913U (en) | Flash mould tool | |
| CN204340128U (en) | The mechanism that push rod ejects order can be controlled in a kind of mould | |
| CN202592668U (en) | Novel hot runner mold | |
| CN202163645U (en) | Aluminum-plastic packaging equipment | |
| CN202640661U (en) | Injection molding machine nozzle | |
| CN202528392U (en) | Injection mold of upper face cover of automobile front wall | |
| CN103448213A (en) | Rapid cooling die | |
| CN205984900U (en) | Semiconductor encapsulation mould | |
| CN203063075U (en) | Novel quick exhaust mold structure | |
| CN205601112U (en) | Injection moulding product stress trace improves equipment system | |
| CN205219610U (en) | Disposable tableware mould |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |