CN110931625A - LED packaging method - Google Patents
LED packaging method Download PDFInfo
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- CN110931625A CN110931625A CN201911348734.8A CN201911348734A CN110931625A CN 110931625 A CN110931625 A CN 110931625A CN 201911348734 A CN201911348734 A CN 201911348734A CN 110931625 A CN110931625 A CN 110931625A
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- packaging
- support
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- glue
- peripheral
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/641—Heat extraction or cooling elements characterized by the materials
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/642—Heat extraction or cooling elements characterized by the shape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
Abstract
The invention provides an LED packaging method which comprises the steps of manufacturing a packaging support, packaging, dispensing, centrifuging and curing. Manufacturing a packaging support comprises manufacturing a peripheral support and an internal support, wherein the peripheral support is provided with a bowl cup inner cavity and comprises a peripheral dam and a bottom plate, and positive and negative electrodes are arranged on the bottom plate; the inner bracket is provided with an inner surrounding dam and is fixed at the center of the bottom plate of the peripheral bracket; packaging, namely fixing the LED chip in an internal support in a die bonding mode, and forming electric connection with the positive electrode and the negative electrode; dispensing, namely filling the first fluorescent glue serving as first packaging glue into the inner support; centrifuging, wherein the product obtained after dispensing is centrifuged to enable the fluorescent substance of the first packaging adhesive to sink so as to realize layering; and curing to cure the first packaging adhesive in the inner support. The invention effectively prevents the LED chip from heating seriously to cause the failure of the packaging colloid separated from the packaging bracket, thereby improving the packaging reliability.
Description
Technical Field
The invention relates to the field of LED chip packaging, in particular to an ultraviolet LED packaging method.
Background
A light Emitting diode (led), which is a solid semiconductor device capable of converting electrical energy into visible light, can directly convert electricity into light. In the process of manufacturing the LED lamp, the LED chip is first packaged into an LED package, i.e., a lamp bead structure, and then assembled into a finished lamp. Ultraviolet LEDs generally mean LEDs having an emission center wavelength of 400nm or less, but when the emission wavelength is more than 380nm, they are sometimes referred to as near ultraviolet. Referring to fig. 1 to 4, because the energy of the ultraviolet light is high and the temperature of the whole lamp is too high, the LED chip 200 and the encapsulant 105 are easily separated from the package support 102, and at this time, the chip is suspended and cannot radiate heat well, which causes the problems of disconnection of the bonding wire 103, high temperature failure of the LED chip 200, and the like. The reason why the following phenomenon of the lamp bead is caused is that the chip generates heat seriously, and the heat generation of the LED chip is mainly caused by that the packaging bracket 102 for fixing the LED chip takes charge of all heat conduction, so that the heat distribution is unbalanced, and one end of the packaging colloid 105 expands seriously and the other end expands slightly.
Disclosure of Invention
Therefore, the LED packaging method provided by the invention can effectively dissipate heat generated by the LED chip and prevent the failure caused by the separation of the packaging colloid from the packaging support due to the serious heating of the LED chip.
In order to achieve the purpose, the technical scheme provided by the invention is as follows:
the invention provides an LED packaging method, which comprises the following steps:
s1, manufacturing a packaging support, which comprises a peripheral support and an internal support, wherein the peripheral support is provided with a bowl cup inner cavity and comprises a peripheral dam and a bottom plate, and positive and negative electrodes are arranged on the bottom plate; the inner bracket is provided with an inner surrounding dam and is fixed at the center of the bottom plate of the peripheral bracket;
s2, packaging, namely fixing the LED chip in an internal support in a die and forming electric connection with the positive electrode and the negative electrode;
s3, dispensing, namely filling the first fluorescent glue serving as first packaging glue into the inner support;
s4, performing centrifugal treatment, namely performing centrifugal treatment on the product obtained in the step S3 to enable the fluorescent substance of the first packaging adhesive to sink so as to realize layering;
s5, curing to cure the first packaging adhesive in the inner support.
Further, in step S2, the LED chip is a front-mounted LED chip or a flip-chip LED chip.
Further, in step S1, the inner support is an inner dam made of a transparent material.
Further, the method also comprises the following steps:
s6, secondary dispensing is carried out, and second fluorescent glue is used as second packaging glue and filled in the peripheral support;
and S7, curing the second packaging adhesive in the peripheral support.
Further, the concentration of the second fluorescent glue is the same as or different from that of the first fluorescent glue.
Further, the method also comprises the following steps:
s8, manufacturing a lens;
and S9, bonding a lens, wherein the lens obtained in the step S8 is bonded on the top of the second packaging adhesive.
Further, the lens in step S8 is manufactured by using a mold.
Further, in the step S9, the lens is bonded after the adhesive glue is sprayed on the top of the second packaging glue.
Through the technical scheme provided by the invention, the method has the following beneficial effects: the LED chip heat dissipation device has the advantages that heat generated by the LED chip is effectively and quickly dissipated, thermal stress is reduced, the phenomenon that the packaging adhesive colloid seriously generated by the LED chip is separated from the packaging support to influence the service life or cause high-temperature failure of the chip is effectively prevented, and the stable connection and reliable packaging of the chip are guaranteed.
Drawings
Fig. 1 is a drawing showing a broken transmission diagram of a bonding wire for LED package in the prior art;
fig. 2 is a partially enlarged transmission diagram of a broken bonding wire of an LED package in the prior art;
FIG. 3 is a schematic diagram of a prior art LED package;
FIG. 4 is a schematic diagram of a prior art LED package failure;
FIG. 5 is a front cross-sectional view of a die bond wire of an LED packaging method according to an embodiment of the present invention;
FIG. 6 is a front view of an LED package after centrifugation in an embodiment of the present invention;
FIG. 7 is a front sectional view of an LED package after secondary dispensing in accordance with an embodiment of the present invention;
FIG. 8 is a front view of the mold lens in an embodiment of the invention;
FIG. 9 is a front sectional view of an LED package sprayed with high temperature glue according to an embodiment of the present invention;
FIG. 10 is a front cross-sectional view of an LED package in accordance with an embodiment of the present invention;
fig. 11 is a cross-sectional view of an inverted LED package according to an embodiment of the present invention.
Detailed Description
To further illustrate the various embodiments, the invention provides the accompanying drawings. The accompanying drawings, which are incorporated in and constitute a part of this disclosure, illustrate embodiments of the invention and, together with the description, serve to explain the principles of the embodiments. Those skilled in the art will appreciate still other possible embodiments and advantages of the present invention with reference to these figures. Elements in the figures are not drawn to scale and like reference numerals are generally used to indicate like elements.
The invention will now be further described with reference to the accompanying drawings and detailed description.
Example 1
Referring to fig. 5 to 10, the preferred method for packaging a front-mounted LED according to the present embodiment includes the following steps:
s1, manufacturing a packaging support 10, as shown in a figure 5, comprising a peripheral support 1 and an internal support 2, wherein the peripheral support 1 is provided with a bowl inner cavity and comprises a peripheral dam 12 and a bottom plate 4, and positive and negative electrodes 5 and 6 are arranged on the bottom plate 4; the inner bracket 1 is provided with an inner surrounding dam 3 and is fixed at the center of a bottom plate 4 of the outer bracket 1; the inner box dam 3 is used for heat insulation and heat dissipation, and thermal stress is reduced. The bottom plate 4 of the package support 10 is made of metal or ceramic, which is beneficial to improving the heat dissipation efficiency of the LED chip 20, and in this embodiment, in order to improve the heat dissipation efficiency and simultaneously reduce the difference between the thermal expansion coefficient of the LED chip 20 and the thermal expansion coefficient of the LED chip as much as possible, the bottom plate is made of ceramic. Of course, in other embodiments, a conventional package support may be used for the low-power LED chip, for example, a metal material with high thermal conductivity, such as copper, aluminum, etc.
S2, packaging, namely fixing the LED chip 20 in the inner support 2 in a die and forming electric connection with the positive and negative electrodes 5 and 6 through the welding wires 13; the internal dam 3 of inner support 2 has dispersed and has piled up originally in the inside heat of first packaging adhesive 40 colloid, conduct the heat on the internal dam 3, remaining heat is for reducing greatly also more balanced, quick radiating effect is good, can not produce the internal stress because of the temperature snap, avoided the packaging adhesive colloid to take place the inflation because of the heat distribution unbalance and the perk breaks away from the support (the heat can not pass through support conduction dispersion like this), further prevent to break away from 10 in-process bonding wire 13 of packaging support at the perk and be pulled apart and cause the encapsulation inefficacy, and the heat piles up and can't dispel fast and arouse that LED chip 20 high temperature influences life or even loses efficacy, the thermal stress reduces greatly, the stability of connection and the reliability of encapsulation have been improved.
S3, dispensing, namely filling the first fluorescent glue 9 (the concentration is recorded as A1) serving as first packaging glue into the inner support 2; the fluorescent glue is preferably a uniform mixture of transparent silica gel and fluorescent powder in the prior art, and has effective sealing protection. The proportion of the fluorescent powder is generally 15-30%, wherein the smaller the proportion of the fluorescent powder is, the higher the color temperature is, and conversely, the larger the proportion is, the lower the color temperature is. In this embodiment, 2538 transparent silica gel is used to achieve high temperature resistance and ultraviolet resistance. Of course, in other embodiments, other transparent colloids may be used and mixed with a certain proportion of phosphor powder, such as epoxy resin.
S4, performing centrifugal treatment, namely performing centrifugal treatment on the product obtained in the step S3 to enable the fluorescent substance of the first packaging adhesive 9 to sink to realize layering as shown in FIG. 6; specifically, the method comprises the following steps: the rotating speed of the centrifuge is 500rd/s, after 20 seconds of centrifugal treatment, the rotating speed of the centrifuge is set to 800rd/s, the treatment is carried out for 30 seconds, finally, the rotating speed of 1500rd/s is set to 120 seconds, and the centrifugal equipment adopted in the embodiment is conventional centrifugal equipment. The concentration of the fluorescent powder (marked as A2) of the transition layer 30 obtained after the fluorescent glue 9 is subjected to centrifugal treatment is higher than the concentration of the added fluorescent glue (namely A2 is larger than A1), and the concentration (marked as A3) of the packaging glue layer 40 left on the transition layer is lower than the concentration of the added fluorescent glue (namely A3 is smaller than A1), so that the shielding of the fluorescent powder on a chip is reduced, the external heat radiation is improved, the temperature of the LED chip 20 is favorably reduced, the deposited fluorescent glue of the high-concentration fluorescent powder can reduce the stress of a bottom colloid, and the expansion of the colloid is reduced.
S5, curing to cure the first packaging adhesive 9 in the inner support 2. In the embodiment, the curing mode is baking forming, the product after the centrifugal treatment is baked and cured, the forming is fast, the specific baking temperature and time are determined according to the specific fluorescent glue (different colloids and fluorescent powder are mixed according to different proportions), the product is baked at 100 ℃ for 1 hour, and then the product is baked at 150 ℃ for 2 hours to realize the curing forming of the fluorescent glue colloid. In other embodiments, the curing may also be performed by air drying, and different curing methods may be used according to the specific fluorescent glue.
The LED chip 20 is just being adorned (that is the electrode is up) and is placed on bottom plate 4, bottom plate 4 still is equipped with metal bonding pad 11, bonding pad 11 conducts away the heat that LED chip 20 produced in time, can not lead to on the fluorescent glue 9 excessively, has further optimized and just adorned LED chip 20 heat dissipation heat extraction.
The inner box dam 3 is a light-transmitting support to realize a large light-emitting area and improve the light-emitting efficiency. And adjusting the proportion of the fluorescent powder according to the parameter requirement to obtain secondary fluorescent glue 50, and filling the secondary fluorescent glue 50 in the peripheral bracket 1, namely, secondary dispensing. The fluorescent powder is added into the transparent colloid according to the light effect requirement, wherein the fluorescent powder is fluorescent powder with various excitation wavelengths, can form a continuous spectrum, and can be other wavelength change substances, so that the refractive index of light emitted from the LED chip 20 can be improved, and the luminous efficiency can be improved by improving the refractive index.
The LED packaging method further comprises the following steps:
s6, performing secondary dispensing, and filling a second fluorescent glue 50 serving as a second packaging glue in the peripheral bracket 1 as shown in figure 7; the concentration of the second fluorescent glue 50 is the same as or different from that of the first fluorescent glue 9. In this embodiment, the second fluorescent glue 50 has the same components as the fluorescent glue 9, but after the centrifugal treatment, since the fluorescent substance sinks, the concentration of the fluorescent glue of the package glue 40 becomes lower, so that the refractive index of the secondary fluorescent glue 50 in the peripheral bracket 1 is greater than that of the package glue 40 in the inner bracket 2, the light-emitting angle is wider, and the light-emitting efficiency is higher.
And S7, curing the second packaging adhesive 50 in the peripheral support. The curing manner of the second encapsulant 50 in this embodiment is the same as that of S5.
The LED packaging method further comprises the following steps:
s8, manufacturing a lens;
and S9, bonding a lens, wherein the lens obtained in the step S8 is bonded on the top of the second packaging adhesive 50.
In this embodiment, the model lens is manufactured, specifically:
s8, manufacturing a model lens 7, and as shown in figure 8, injecting a colloid with a high refractive index into a mold, baking, molding and demolding to obtain the model lens 7; specifically, the method comprises the following steps: preparing a mold, injecting a colloid with high refractive index and high hardness, in this embodiment, a transparent silica gel with high hardness into the mold, baking for molding, and demolding to obtain the model lens 7. In the embodiment, the regular arch-shaped body repeated array is selected to be fully distributed on the upper surface (the bowl rim) of the lamp bead, so that the lamp is attractive in appearance, multiple in light-emitting angle and good in refraction effect. Of course, in other embodiments, other types of molds for the molded lenses 7 may be used to perform mold release molding, such as petal-shaped regular arrays, or the like, or the lenses may be directly formed on the inner dam 3 by dispensing (such as hard silicone) to achieve the improvement of the light extraction efficiency.
And S9, bonding the model lens, as shown in the figure 9 and the figure 10, spraying high-temperature-resistant glue 8 with the thickness of 1-5 microns on the top of the second packaging glue, and bonding the model lens 7 obtained in the step S8. The high-temperature glue not only plays a role of an adhesive layer for adhering the model lens 7, but also effectively prevents the model lens 7 from being damaged due to overheating caused by the heating of the LED chip 20, and plays a role of heat insulation and protection of the model lens 7. And the model lens 7 is attached to improve the light-emitting efficiency of the lamp and increase the light-emitting angle, so that the light-emitting effect is better.
Example 2
Referring to fig. 11, in a preferred flip-chip LED packaging method provided in this embodiment, embodiment 2 is substantially the same as the LED packaging method described in embodiment 1, except that:
the LED is a flip LED, an LED chip 20 (with an electrode facing downwards) in S2 is fixed on the bottom plate 4 and is directly fixed with the positive and negative electrodes 5 and 6 to form electric connection without bonding wires;
the bottom plate 4 is provided with the electrodes 5 and 6, and no metal pad is additionally arranged, so that short circuit caused by contact between the electrodes 5 and 6 and the metal pad is avoided. The inverted LED structure of the embodiment 2 is the same as the forward LED structure of the embodiment 1, and due to the design of the inner support 2, the heat generated by the LED chip 20 is conducted out in time through the inner dam 3 and the electrodes 5 and 6, and is not conducted to the fluorescent glue 9 too much, so that the package glue is prevented from tilting and separating from the support. In addition, this implement 2's inside support 2's first encapsulation glue 9 has also adopted centrifugal treatment, reduces phosphor powder and shelters from the chip, improves external heat radiation, is favorable to reducing LED chip 20 temperature to the phosphor powder's that the high concentration phosphor powder that deposits down phosphor powder can reduce the stress of bottom colloid, reduces the colloid inflation.
In summary, it can be seen from embodiments 1 and 2 that the LED packaging methods of the above embodiments have the advantage of simple method and reliable LED package compared to the prior art. In addition, the LED packaging method is suitable for both a normally-mounted LED chip and a flip LED chip, and has better compatibility.
While the invention has been particularly shown and described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (8)
1. An LED packaging method, characterized in that: the method comprises the following steps:
s1, manufacturing a packaging support, which comprises a peripheral support and an internal support, wherein the peripheral support is provided with a bowl cup inner cavity and comprises a peripheral dam and a bottom plate, and positive and negative electrodes are arranged on the bottom plate; the inner bracket is provided with an inner surrounding dam and is fixed at the center of the bottom plate of the peripheral bracket;
s2, packaging, namely fixing the LED chip in an internal support in a die and forming electric connection with the positive electrode and the negative electrode;
s3, dispensing, namely filling the first fluorescent glue serving as first packaging glue into the inner support;
s4, performing centrifugal treatment, namely performing centrifugal treatment on the product obtained in the step S3 to enable the fluorescent substance of the first packaging adhesive to sink so as to realize layering;
s5, curing to cure the first packaging adhesive in the inner support.
2. The LED packaging method of claim 1, wherein: in step S2, the LED chip is a face-up LED chip or a flip LED chip.
3. The LED packaging method of claim 1, wherein: in step S1, the inner support is an inner dam made of a transparent material.
4. The LED packaging method of claim 1, wherein: further comprising the steps of:
s6, secondary dispensing is carried out, and second fluorescent glue is used as second packaging glue and filled in the peripheral support;
and S7, curing the second packaging adhesive in the peripheral support.
5. The LED packaging method of claim 4, wherein: the concentration of the second fluorescent glue is the same as or different from that of the first fluorescent glue.
6. The LED packaging method of claim 4, wherein: further comprising the steps of:
s8, manufacturing a lens;
and S9, bonding a lens, wherein the lens obtained in the step S8 is bonded on the top of the second packaging adhesive.
7. The LED packaging method of claim 6, wherein: the lens in step S8 is manufactured by using a mold.
8. The LED packaging method of claim 6, wherein: in step S9, the lens is bonded after the adhesive glue is sprayed on the top of the second packaging glue.
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| CN201911348734.8A CN110931625A (en) | 2019-12-24 | 2019-12-24 | LED packaging method |
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| CN201911348734.8A CN110931625A (en) | 2019-12-24 | 2019-12-24 | LED packaging method |
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Citations (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101713506A (en) * | 2009-09-25 | 2010-05-26 | 深圳莱特光电有限公司 | High-sealed SMD LED |
| CN201708188U (en) * | 2010-07-07 | 2011-01-12 | 四川九洲光电科技股份有限公司 | Ceramic high-power light emitting diode |
| CN102185087A (en) * | 2011-05-10 | 2011-09-14 | 深圳市光核光电科技有限公司 | High-power LED (Light Emitting Diode) encapsulating structure |
| CN202205806U (en) * | 2011-05-10 | 2012-04-25 | 深圳市光核光电科技有限公司 | High-power light-emitting diode (LED) packaging structure |
| CN102646779A (en) * | 2012-04-20 | 2012-08-22 | 华南师范大学 | Ceramic-based power type light-emitting diode and packaging method thereof |
| CN102646761A (en) * | 2011-02-21 | 2012-08-22 | 展晶科技(深圳)有限公司 | LED (light-emitting diode) packaging process |
| CN202405315U (en) * | 2012-01-10 | 2012-08-29 | 杭州杰乐光电有限公司 | High-power LED packaging structure |
| CN102956803A (en) * | 2011-08-19 | 2013-03-06 | 夏普株式会社 | Semiconductor light-emitting device |
| CN202817011U (en) * | 2011-12-30 | 2013-03-20 | 湘能华磊光电股份有限公司 | LED packaging structure |
| US20130221382A1 (en) * | 2010-11-02 | 2013-08-29 | Carsem (M) Sdn. Bhd. | Manufacturing light emitting diode (led) packages |
| CN203521467U (en) * | 2013-11-08 | 2014-04-02 | 成都川联盛科技有限公司 | LED silica gel chip packaging structure |
| CN103762296A (en) * | 2014-01-08 | 2014-04-30 | 广东工业大学 | Light emitting diode encapsulating structure |
| WO2014080583A1 (en) * | 2012-11-21 | 2014-05-30 | 信越半導体株式会社 | Light-emitting apparatus and method for manufacturing same |
| CN204011471U (en) * | 2014-07-17 | 2014-12-10 | 陕西光电科技有限公司 | A kind of deep ultraviolet LED device encapsulation structure |
| CN104518067A (en) * | 2014-07-25 | 2015-04-15 | 吴鼎鼎 | Long-life LED light-emitting module and processing method thereof |
| CN205028919U (en) * | 2015-09-23 | 2016-02-10 | 厦门多彩光电子科技有限公司 | High -power LED lamp pearl and illumination lamps and lanterns |
| CN105810798A (en) * | 2016-05-26 | 2016-07-27 | 深圳市立洋光电子股份有限公司 | EMC (epoxy molding compound) inverted support and single-packaged lens structure and manufacture method thereof |
| CN205645864U (en) * | 2016-04-11 | 2016-10-12 | 厦门多彩光电子科技有限公司 | LED support and LED lamp pearl |
| CN106025037A (en) * | 2016-05-27 | 2016-10-12 | 厦门市三安光电科技有限公司 | Ultraviolet light emitting diode packaging structure and manufacturing method therefor |
| CN205790054U (en) * | 2016-05-26 | 2016-12-07 | 深圳市立洋光电子股份有限公司 | EMC upside-down mounting support adds a package lens structure |
| CN206947340U (en) * | 2017-04-11 | 2018-01-30 | 中山市腾阳光电科技有限公司 | A kind of LED lamp bead of high brightness |
| CN108258101A (en) * | 2018-01-26 | 2018-07-06 | 深圳市源磊科技有限公司 | A kind of LED lamp bead and its anti-glue knick point gluing method |
| CN108767096A (en) * | 2018-05-28 | 2018-11-06 | 木林森股份有限公司 | Preparation method of L ED lamp fluorescent powder layer |
| CN109065693A (en) * | 2018-08-08 | 2018-12-21 | 厦门多彩光电子科技有限公司 | A kind of LED encapsulation method |
| CN208690289U (en) * | 2018-08-08 | 2019-04-02 | 厦门多彩光电子科技有限公司 | A kind of LED lamp bead |
| CN109585630A (en) * | 2019-01-22 | 2019-04-05 | 佛山市顺德区蚬华多媒体制品有限公司 | LED encapsulation structure and preparation method thereof and LED light |
-
2019
- 2019-12-24 CN CN201911348734.8A patent/CN110931625A/en active Pending
Patent Citations (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101713506A (en) * | 2009-09-25 | 2010-05-26 | 深圳莱特光电有限公司 | High-sealed SMD LED |
| CN201708188U (en) * | 2010-07-07 | 2011-01-12 | 四川九洲光电科技股份有限公司 | Ceramic high-power light emitting diode |
| US20130221382A1 (en) * | 2010-11-02 | 2013-08-29 | Carsem (M) Sdn. Bhd. | Manufacturing light emitting diode (led) packages |
| CN102646761A (en) * | 2011-02-21 | 2012-08-22 | 展晶科技(深圳)有限公司 | LED (light-emitting diode) packaging process |
| CN102185087A (en) * | 2011-05-10 | 2011-09-14 | 深圳市光核光电科技有限公司 | High-power LED (Light Emitting Diode) encapsulating structure |
| CN202205806U (en) * | 2011-05-10 | 2012-04-25 | 深圳市光核光电科技有限公司 | High-power light-emitting diode (LED) packaging structure |
| CN102956803A (en) * | 2011-08-19 | 2013-03-06 | 夏普株式会社 | Semiconductor light-emitting device |
| CN202817011U (en) * | 2011-12-30 | 2013-03-20 | 湘能华磊光电股份有限公司 | LED packaging structure |
| CN202405315U (en) * | 2012-01-10 | 2012-08-29 | 杭州杰乐光电有限公司 | High-power LED packaging structure |
| CN102646779A (en) * | 2012-04-20 | 2012-08-22 | 华南师范大学 | Ceramic-based power type light-emitting diode and packaging method thereof |
| WO2014080583A1 (en) * | 2012-11-21 | 2014-05-30 | 信越半導体株式会社 | Light-emitting apparatus and method for manufacturing same |
| CN203521467U (en) * | 2013-11-08 | 2014-04-02 | 成都川联盛科技有限公司 | LED silica gel chip packaging structure |
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| CN106025037A (en) * | 2016-05-27 | 2016-10-12 | 厦门市三安光电科技有限公司 | Ultraviolet light emitting diode packaging structure and manufacturing method therefor |
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| CN109065693A (en) * | 2018-08-08 | 2018-12-21 | 厦门多彩光电子科技有限公司 | A kind of LED encapsulation method |
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