CN101713506A - High-sealed SMD LED - Google Patents
High-sealed SMD LED Download PDFInfo
- Publication number
- CN101713506A CN101713506A CN200910190291A CN200910190291A CN101713506A CN 101713506 A CN101713506 A CN 101713506A CN 200910190291 A CN200910190291 A CN 200910190291A CN 200910190291 A CN200910190291 A CN 200910190291A CN 101713506 A CN101713506 A CN 101713506A
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- fluorescent glue
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Abstract
The invention discloses a high-sealed SMD LED, which comprises a bracket. The bracket is provided with a first bowl, the bottom of the first bowl is provided with a second bowl, and a groove is formed between the bowl mouth at the upper end of the second bowl and the first bowl; and fluorescent glue is filled in the second bowl, and epoxy resin is filled in the first bowl. Compared with the prior art, one bowl is increased in the other bowl, the whole forms a bowl-in-bowl structure, and the epoxy resin isolates the fluorescent glue with the outside air through layered encapsulation, so the purpose of preventing moisture in the air from entering the fluorescent glue is achieved, meanwhile a convex lens formed through the epoxy rein can better control the consistency and light spot effect of a product, and the brightness of the finished product can be improved at the same time.
Description
Technical field
The present invention relates to the LED encapsulation technology, particularly be a kind of high-sealed SMD LED.
Background technology
Present common SMD (surface mount assembly) LED, adopt silica gel to encapsulate in its production process mostly, this mainly is that especially the bigger led chip of caloric value in the reflow soldering process need encapsulate by silica gel because silica gel has good heat-conducting.
As shown in Figure 1, the structural representation of the existing surface mount component leds of Fig. 1.Here support 1 is provided with a bowl cup 101, and bowl cup 101 bottoms are fixed with led chip 102, and this led chip 102 is connected with the positive and negative electrode of support respectively by gold thread 103, when encapsulation silica gel, silica gel 104 is encapsulated in the bowl cup 101.The LED that adopts this mode to produce, because silica gel 104 combines bad with the inwall of bowl cup 101, then be easy to cause steam to enter from the junction between colloid and the bowl cup, and because silica gel absorbs airborne moisture easily, therefore in carrying out reflow soldering process, especially under the condition of high temperature, portion of water can be volatilized in the silica gel, the moisture of another part then can't volatilize, the strength of the strength of moisture vaporization generation greater than the combination of silica gel colloid will appear like this, thereby cause silica gel to produce " puffed rice " effect, cause the LED lamp not work.
For addressing this is that, the mode that adopts usually is to seal marine glue on packaged LED at present, but not only operation easier is big, inconvenient for this mode, and the processing cost height.
Summary of the invention
For addressing the above problem, the object of the present invention is to provide a kind of high-sealed SMD LED, this LED only need increase a little bowl cup in support bowl cup, can solve the problem that silica gel in the present LED encapsulation absorbs steam easily.
For achieving the above object, the present invention is mainly by the following technical solutions:
A kind of high-sealed SMD LED, comprise support (2), wherein said support (2) is provided with first bowl of cup (201), and the cup end of described first bowl of cup (201) is provided with second bowl of cup (202), is provided with groove (204) between second bowl of cup (202) upper end the rim of a bowl and the first bowl of cup (201); Be filled with fluorescent glue (207) in described second bowl of cup (202), be filled with epoxy resin (206) in first bowl of cup (201).
Wherein, described second bowl of cup (202) cup end, be fixed with led chip (203), and this led chip (203) is connected with the positive and negative electrode of support (2) by gold thread (205).
Wherein, the rim of a bowl edge, described second bowl of cup (202) upper end is than groove (204) height.
Wherein, described fluorescent glue (207) is mixed by fluorescent material and silica gel.
Compared with prior art, the present invention has following beneficial effect:
1, the present invention is by being provided with second bowl of cup in first bowl of cup, thereby form the structure of " cup in the cup ", and in second bowl of cup, fill fluorescent glue, filling epoxy resin in first bowl of cup, by epoxy resin with fluorescent glue and isolate from outer air, avoid because of silica gel suction in the fluorescent glue, and produce " puffed rice " effect, the phenomenon that causes the LED lamp not work.
2, be filled with fluorescent glue in second bowl of cup of the present invention, be filled with epoxy resin in first bowl of cup, and epoxy resin is positioned at the fluorescent glue upper strata, and the epoxy resin on upper strata is similar to convex lens, the white light that transmits from lower floor filter through the convex lens on upper strata and the secondary mixed light after, can improve the brightness and the lumen value of finished product, and can also control the LED product and go out light consistency, reach good hot spot effect.
Description of drawings
Fig. 1 is a SMD LED encapsulating structure schematic diagram in the prior art.
Fig. 2 is a SMD LED structural representation of the present invention.
Fig. 3 is a SMD LED encapsulating structure schematic diagram of the present invention.
Identifier declaration among the figure: support 2, first bowl of cup 201, second bowl of cup 202, led chip 203, groove 204, gold thread 205, epoxy resin 206, fluorescent glue 207.
The specific embodiment
Core concept of the present invention is: the present invention is by being provided with a little bowl cup in the bowl cup of support, form the structure of " cup in the cup ", and also be provided with groove between first bowl of cup and second bowl of cup, filling epoxy resin in first bowl of cup, fill fluorescent glue in second bowl of cup, thereby make fluorescent glue and air form good isolated effect, even there is steam to enter in the bowl cup, also only can remain in the groove, can not influence the whole structure of LED; In addition, the fluorescent glue of filling in the epoxy resin of filling in first bowl of cup and the second bowl of cup forms layering, and the epoxy resin that is positioned at the upper strata is hyaline layer, can form convex lens, the white light that transmits from lower floor filter through the convex lens on upper strata and the secondary mixed light after, can improve the brightness and the lumen value of finished product, and can also control the LED product and go out light consistency, reach good hot spot effect.
For setting forth thought of the present invention and purpose, the present invention is described further below in conjunction with the drawings and specific embodiments.
See also Fig. 2, shown in Figure 3, the present invention is to provide a kind of high-sealed SMD LED, be primarily aimed at existing SMD LED and directly adopt the easy problem that absorbs water in air vapour and cause LED not work of silica gel encapsulation.
The present invention includes support 2, wherein support 2 is provided with first bowl of cup 201, and is provided with second bowl of cup 202 in bowl bottom, the inside of first bowl of cup 201, first bowl of cup 201 and 202 formation of second bowl of cup here " cup in the cup " structure.And also being provided with a groove 204 at the rim of a bowl of second bowl of cup 202 and the inwall connecting place of first bowl of cup 201, the outer bowl wall of the edge of this groove 204 and second bowl of cup 202 is shared, or is lower than the rim of a bowl of second bowl of cup 202.
The cup end point of second bowl of cup 202 has insulating cement or elargol, so that fixed L ED chip 203,203 of described led chips are connected with the positive and negative electrode of support 2 respectively by two gold threads 205 respectively.
More than be explanation, will be further described concrete encapsulation process of the present invention below structure of the present invention.
At first led chip 203 is fixed on the cup end correct position of second bowl of cup 202, then fluorescent glue 207 evenly is filled in second bowl of cup 202, and make fluorescent glue 207 just second bowl of cup 202 be added full getting final product; Wherein must toast in fluorescent glue 207 2 hours after encapsulation, baking temperature is that segmented is solidified, and produces bubble to prevent the colloid vigorous reaction, and concrete baking temperature is: 90 ℃ of bakings 1 hour are warmed up to 110 ℃ of bakings 1 hour then; Be warmed up to 150 ℃ at last and toasted 2 hours, filling epoxy resin 206 in first bowl of cup 201 more then after baking finishes makes epoxy resin 206 that fluorescent glue 207 is covered, and fills full groove 204, thereby whole LED is encapsulated.
It is bad to the invention solves traditional SMD type LED lamp water resistance, and can only be applied in the problem of indoor lamp decoration and room lighting.Make the white lamp of SMD move towards outdoor lamp decoration and illumination, compare with traditional SMD LED lamp, SMD LED of the present invention adopts the support of two cup-shaped structure, form " cup in the cup ", two bowl cups of size promptly on the use support, have been designed, at first behind the full fluorescent glue of a little bowl cup mid point, and then at the big full epoxy resin of a bowl cup mid point, thereby better glue is closely linked to each other with support; The sealing property of epoxy resin is better than fluorescent glue in addition, can intercept at the groove part between two bowl cups even there is the small part aqueous vapor to enter also, thereby prevents soaking into of moisture.
In addition because the selection of chip and fluorescent material is depended in the brightness of LED lamp, therefore expire fluorescent glue at little bowl cup mid point among the present invention, and at the full epoxy resin of jorum cup mid point, the fluorescent glue of lower floor's point then can be suitable with conventional products brightness like this, the transparent glue of epoxy resin on upper strata then is similar to convex lens, behind the convex lens of the white light that transmits from the LED of lower floor through the upper strata, then play the effect of filtration and secondary mixed light, by filtering the brightness and the lumen value that can improve product, and the secondary mixed light by convex lens then can be eliminated out the bad problem of light consistency and mixed light.
More than a kind of high-sealed SMD LED of the present invention is described in detail, used specific case herein principle of the present invention and embodiment set forth, the explanation of above embodiment just is used for help understanding core concept of the present invention; Simultaneously, for one of ordinary skill in the art, according to thought of the present invention, the part that all can change in specific embodiments and applications, in sum, this description should not be construed as limitation of the present invention.
Claims (4)
1. high-sealed SMD LED, comprise support (2), it is characterized in that described support (2) is provided with first bowl of cup (201), the cup end of described first bowl of cup (201), be provided with second bowl of cup (202), is provided with groove (204) between second bowl of cup (202) upper end the rim of a bowl and the first bowl of cup (201); Be filled with fluorescent glue (207) in described second bowl of cup (202), be filled with epoxy resin (206) in first bowl of cup (201).
2. high-sealed SMD LED according to claim 1 is characterized in that described second bowl of cup (202) cup is fixed with led chip (203) in an end, and this led chip (203) is connected with the positive and negative electrode of support (2) by gold thread (205).
3. high-sealed SMD LED according to claim 1 is characterized in that the rim of a bowl edge, described second bowl of cup (202) upper end is than groove (204) height.
4. high-sealed SMD LED according to claim 1 is characterized in that described fluorescent glue (207) is mixed by fluorescent material and silica gel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910190291A CN101713506A (en) | 2009-09-25 | 2009-09-25 | High-sealed SMD LED |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910190291A CN101713506A (en) | 2009-09-25 | 2009-09-25 | High-sealed SMD LED |
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| Publication Number | Publication Date |
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| CN101713506A true CN101713506A (en) | 2010-05-26 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200910190291A Pending CN101713506A (en) | 2009-09-25 | 2009-09-25 | High-sealed SMD LED |
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Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101931041A (en) * | 2010-07-14 | 2010-12-29 | 四川九洲光电科技股份有限公司 | Silica-based packaging light-emitting diode |
| CN102194983A (en) * | 2011-04-26 | 2011-09-21 | 深圳市瑞丰光电子股份有限公司 | Surface mounting light-emitting diode (LED) with high sealing property and production method thereof |
| CN102263189A (en) * | 2010-05-31 | 2011-11-30 | 普罗科技有限公司 | Manufacturing method of LED device |
| CN102299247A (en) * | 2011-05-20 | 2011-12-28 | 浙江英特来光电科技有限公司 | Outdoor LED module group |
| CN102544319A (en) * | 2012-01-05 | 2012-07-04 | 深圳雷曼光电科技股份有限公司 | LED bracket, LED and LED packaging technology |
| CN103032745A (en) * | 2012-12-30 | 2013-04-10 | 中微光电子(潍坊)有限公司 | Light-emitting diode (LED) light source module and LED light source thereof |
| CN103688374A (en) * | 2011-07-14 | 2014-03-26 | 株式会社小糸制作所 | Light emitting module |
| CN104393149A (en) * | 2014-11-14 | 2015-03-04 | 无锡悟莘科技有限公司 | Baking system in LED (Light Emitting Diode) packaging |
| CN104393150A (en) * | 2014-11-14 | 2015-03-04 | 无锡悟莘科技有限公司 | Baking temperature control method in LED (Light Emitting Diode) encapsulation |
| CN106784238A (en) * | 2016-11-30 | 2017-05-31 | 芜湖聚飞光电科技有限公司 | The preparation method of quantum dot lens-type direct LED backlight |
| CN107002986A (en) * | 2014-12-19 | 2017-08-01 | 通用电气照明解决方案有限责任公司 | Optical mode block assembly and its manufacture method that moisture with reduction enters |
| CN107195754A (en) * | 2017-06-30 | 2017-09-22 | 深圳市宇亮光电技术有限公司 | A kind of LED encapsulation structure and method for packing for eliminating yellow hot spot |
| CN107255229A (en) * | 2017-07-24 | 2017-10-17 | 中山市华南理工大学现代产业技术研究院 | A kind of new integrated lamp just assembled and its manufacture method |
| CN107425096A (en) * | 2017-07-21 | 2017-12-01 | 中山市华南理工大学现代产业技术研究院 | A kind of long-range coating phosphor sheet and preparation method thereof |
| CN110416201A (en) * | 2019-08-28 | 2019-11-05 | 东莞市欧思科光电科技有限公司 | The LED structure of built-in IC |
| CN110931625A (en) * | 2019-12-24 | 2020-03-27 | 厦门多彩光电子科技有限公司 | LED packaging method |
-
2009
- 2009-09-25 CN CN200910190291A patent/CN101713506A/en active Pending
Cited By (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102263189A (en) * | 2010-05-31 | 2011-11-30 | 普罗科技有限公司 | Manufacturing method of LED device |
| CN101931041A (en) * | 2010-07-14 | 2010-12-29 | 四川九洲光电科技股份有限公司 | Silica-based packaging light-emitting diode |
| CN102194983A (en) * | 2011-04-26 | 2011-09-21 | 深圳市瑞丰光电子股份有限公司 | Surface mounting light-emitting diode (LED) with high sealing property and production method thereof |
| CN102299247A (en) * | 2011-05-20 | 2011-12-28 | 浙江英特来光电科技有限公司 | Outdoor LED module group |
| CN103688374A (en) * | 2011-07-14 | 2014-03-26 | 株式会社小糸制作所 | Light emitting module |
| CN103688374B (en) * | 2011-07-14 | 2016-12-21 | 株式会社小糸制作所 | Light emitting module |
| CN102544319A (en) * | 2012-01-05 | 2012-07-04 | 深圳雷曼光电科技股份有限公司 | LED bracket, LED and LED packaging technology |
| CN103032745A (en) * | 2012-12-30 | 2013-04-10 | 中微光电子(潍坊)有限公司 | Light-emitting diode (LED) light source module and LED light source thereof |
| CN104393150A (en) * | 2014-11-14 | 2015-03-04 | 无锡悟莘科技有限公司 | Baking temperature control method in LED (Light Emitting Diode) encapsulation |
| CN104393149A (en) * | 2014-11-14 | 2015-03-04 | 无锡悟莘科技有限公司 | Baking system in LED (Light Emitting Diode) packaging |
| CN107002986A (en) * | 2014-12-19 | 2017-08-01 | 通用电气照明解决方案有限责任公司 | Optical mode block assembly and its manufacture method that moisture with reduction enters |
| CN107002986B (en) * | 2014-12-19 | 2020-08-11 | 卡任特照明解决方案有限责任公司 | Optical module assembly with reduced moisture ingress and method of making same |
| CN106784238A (en) * | 2016-11-30 | 2017-05-31 | 芜湖聚飞光电科技有限公司 | The preparation method of quantum dot lens-type direct LED backlight |
| CN107195754A (en) * | 2017-06-30 | 2017-09-22 | 深圳市宇亮光电技术有限公司 | A kind of LED encapsulation structure and method for packing for eliminating yellow hot spot |
| CN107425096A (en) * | 2017-07-21 | 2017-12-01 | 中山市华南理工大学现代产业技术研究院 | A kind of long-range coating phosphor sheet and preparation method thereof |
| CN107255229A (en) * | 2017-07-24 | 2017-10-17 | 中山市华南理工大学现代产业技术研究院 | A kind of new integrated lamp just assembled and its manufacture method |
| CN110416201A (en) * | 2019-08-28 | 2019-11-05 | 东莞市欧思科光电科技有限公司 | The LED structure of built-in IC |
| CN110931625A (en) * | 2019-12-24 | 2020-03-27 | 厦门多彩光电子科技有限公司 | LED packaging method |
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Open date: 20100526 |