CN201666469U

CN201666469U - LED module packaging structure

Info

Publication number: CN201666469U
Application number: CN2009201306019U
Authority: CN
Inventors: 肖从清; 郭伦春; 王飞
Original assignee: Shenzhen Jiuzhou Optoelectronics Technology Co Ltd
Current assignee: Shenzhen Jiuzhou Optoelectronics Technology Co Ltd
Priority date: 2009-04-10
Filing date: 2009-04-10
Publication date: 2010-12-08
Anticipated expiration: 2019-04-10

Abstract

The utility model relates to an LED module packaging technique, in particular to an LED multi-chip module packaging structure. The packaging structure comprises a base plate, a line layer, an LED chip and a lens assembly; an LED chip is fixed on the base plate of the line layer, the LED chip and the line layer form electrical connection, and fluorescence cement is coated and the lens assembly is sealed on the LED chip; wherein, the fluorescence cement and the lens assembly can be taken as a whole, and one or more LED chips can be packaged in each lens. The lens adopting the packaging mode can be designed into the lens assembly, and the heating area is large when in formation, and air bubbles will not be produced due to uneven partial heating; each lens can employ independent ray distribution design according to concrete application conditions, so as to increase the luminous efficiency and utilization rate of light.

Description

A kind of led module encapsulating structure

Technical field:

The utility model relates to a kind of led module encapsulation technology, specifically is a kind of LED multi-chip module encapsulating structure.

Background technology:

The led module of present most of enterprises, its PCB goes up every chips all has a bowl cup luminous intensity distribution, the independent silica-gel lens of each bowl cup.This bowl cup structure must be done two-layer line layer and bowl cup structure could being combined, and two interlayers need the glue of poor thermal conductivity bonding, and module size is also bigger.In addition, the packing forms of this structure is easy to generate bubble, and luminous efficiency is also lower, and yield is not high.Another modular structure in the market is that many chips are packaged together, and for each led chip carries out lens design and luminous intensity distribution design, the module light efficiency that encapsulates out like this is not lower, and the heating of module is too concentrated.The utility model has designed a kind of method for packing that every (or many) chip carries out lens design and luminous intensity distribution design separately that can be, and can improve the luminous efficiency and the encapsulation yield of module.

Summary of the invention:

The purpose of this utility model is to provide a kind of module encapsulation construction, is easy to generate bubble, problem that luminous efficiency is low to solve existing led module luminous intensity distribution difficulty, silica-gel lens.

For achieving the above object, the utility model mainly adopts following technical scheme:

A kind of led module encapsulating structure, described encapsulating structure contains substrate, line layer, led chip, set of lenses; Intrinsic led chip on the described substrate with line layer, led chip and line layer form and are electrically connected, and are coated with fluorescent glue on the led chip and envelope has set of lenses; Wherein said fluorescent glue and envelope set of lenses can be an integral body, can encapsulate one or plurality of LEDs chip in each lens.

Described substrate can be one or more combination in metal substrate, ceramic substrate, the cermet substrate.

Described led chip is chip and the chip portfolio that comprises shades of colours such as red, green, blue and wavelength.

Described lens can, make difformity according to illuminating light distribution design needs.

This encapsulating structure is made up of substrate, led chip, lens.The making flow process of this module is at first in the enterprising row wiring technology of substrate, but forms such as substrate metal substrate, ceramic substrate or cermet substrate, and line layer can be the Cu line layer, golden line layer, also Ag line layer; Then led chip is fixed on the solid brilliant dish of substrate, be electrically connected by bonding wire and line layer formation, on substrate, finish solid brilliant bonding wire craft operation to chip, chip can be Sapphire Substrate chip, Si substrate chip, SiC substrate chip, metal substrate chip, GaAs substrate chip etc. are Gu crystalline substance can adopt modes such as solid crystalline substance of elargol or the solid crystalline substance of eutectic; Apply fluorescent glue (powder) and make set of lenses at chip at last, this set of lenses bottom can be linked to be an integral body, only forms single lens on chip.Wherein apply the fluorescent glue step and also can unite two into one with making lens step, its method is that fluorescent material evenly is blended in the glue of making set of lenses.

Above-mentioned packaged type lens can be made a set of lenses, and heating surface area is big during moulding, can be because of local heating's inequality, and produce bubble; Each lens can carry out independent luminous intensity distribution design at concrete applicable cases, increases light extraction efficiency and light utilization rate.For example, each lens can be designed to oval or rectangular luminous intensity distribution, be applied to road lighting; Each lens can be made the low-angle lens, be applied to Projecting Lamp or shot-light light fixture or the like; Can carry out independent luminous intensity distribution design to each lens, various illumination occasions or general illumination are carried out general luminous intensity distribution design.

Description of drawings:

Fig. 1, Fig. 2, Fig. 3, Fig. 4, Fig. 5, Fig. 6 are the utility model example structure schematic diagram.

Identifier declaration among the figure: the power LED module encapsulation comprises: substrate 1, lens 2, led chip 3.

The specific embodiment:

For setting forth thought of the present utility model and purpose, the utility model is described further below in conjunction with the drawings and specific embodiments.

At first make in substrate 1 enterprising row wiring technology, substrate 1 can be metal substrate, ceramic substrate or cermet substrate etc., and line layer can be the Cu line layer of Cu, Ag or plating Ag.After having made line layer, led chip 3 solid crystalline substances can be wired on the pad of line layer, can consolidate several or tens of LEDs chip 3 on the general substrate 1, Gu crystalline substance can be undertaken by elargol or the solid brilliant mode of eutectic, after finishing solid brilliant step, chip is carried out bonding wire operation, line layer on chip and the substrate 1 is finished be electrically connected.At last, the chip on the module is applied fluorescent glue (powder) and sealing operation, adhesive material can be silica gel, epoxy resin etc.Wherein, also fluorescent material can be blended in the glue of sealing lens 2, to apply two technologies of fluorescent glue and sealing unites two into one, in the sealing design, every chips or multiple chips can be equipped with lens 2 separately, and these lens 2 can have unique luminous intensity distribution design, to satisfy the needs of different lighting conditions, for example, lens 2 can be designed to produce the shape of rectangle Illumination Distribution, to satisfy needs of road lighting or the like (as Fig. 3, Fig. 4, Fig. 5, shown in Figure 6).In addition, in this structure, also can encapsulate RGB three-primary color LED chip 3 in each lens 2, to reach the function of module color tunable.

More than be that a kind of power LED module encapsulating structure provided by the utility model is described in detail, used instantiation herein structural principle of the present utility model and embodiment are set forth, above embodiment just is used for helping to understand method of the present utility model and core concept thereof; Simultaneously, for one of ordinary skill in the art, according to thought of the present utility model, the part that all can change in specific embodiments and applications, in sum, this description should not be construed as restriction of the present utility model.

Claims

1. a led module encapsulating structure is characterized in that described encapsulating structure contains substrate, line layer, led chip, set of lenses; Intrinsic led chip on the described substrate with line layer, led chip and line layer form and are electrically connected, and are coated with fluorescent glue on the led chip and envelope has set of lenses; Wherein said fluorescent glue and envelope set of lenses can be an integral body, can encapsulate one or plurality of LEDs chip in each lens.

2. led module encapsulating structure according to claim 1 is characterized in that described substrate can be one or more combination in metal substrate, ceramic substrate, the cermet substrate.

3. led module encapsulating structure according to claim 1 is characterized in that described led chip is chip and the chip portfolio that comprises shades of colours such as red, green, blue and wavelength.

4. led module encapsulating structure according to claim 1 is characterized in that described lens can design needs according to illuminating light distribution and make difformity.