CN206401317U - A kind of full-spectrum LED encapsulating structure of unstressed configuration powder - Google Patents
A kind of full-spectrum LED encapsulating structure of unstressed configuration powder Download PDFInfo
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- CN206401317U CN206401317U CN201621441475.5U CN201621441475U CN206401317U CN 206401317 U CN206401317 U CN 206401317U CN 201621441475 U CN201621441475 U CN 201621441475U CN 206401317 U CN206401317 U CN 206401317U
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Abstract
The utility model discloses a kind of full-spectrum LED encapsulating structure of unstressed configuration powder, the LED encapsulation structure directly synthesizes white light without using fluorescent material by multi-primary LED chip.LED chip includes specular removal vertical stratification yellow light LED chip, specular removal vertical stratification green LED chip, specular removal vertical stratification green light LED chip and specular removal vertical stratification blue-light LED chip prepared by AlInGaN material systems, specular removal vertical stratification red LED chip and specular removal vertical stratification orange light LED chip prepared by AlGaInP material systems.Full spectrum light extraction has more preferably color quality, it is to avoid the use of fluorescent material, simplifies packaging technology, while the reliability of package module is improved, while solving excessive conventional packaging method light extraction blue light, green light missing and the not enough defect of feux rouges.
Description
Technical field
The utility model belongs to LED encapsulation technologies, more particularly, to a kind of full-spectrum LED encapsulating structure of unstressed configuration powder.
Background technology
LED (Light Emitting Diode) is a kind of semiconductor light emitting being made based on P-N junction electroluminescent principle
Device, has the advantages that electro-optical efficiency height, service life length, environmental protection and energy saving, small volume, is described as 21 century green illumination
Light source, such as can apply to traditional lighting field will obtain very significant energy-saving effect, and what this was becoming tight in global energy day works as
It is modern significant.With the breakthrough of the third generation semiconductor material technology using nitride as representative, based on high-power and high-luminance hair
The semiconductor lighting industry of optical diode (LED) is rapidly growing in the whole world, just as the new economic increasing of semi-conductor photoelectronic industry
It is long, and triggered in traditional lighting field a revolution.LED is had begun in many fields due to its unique superiority
It is used widely, the main development direction of following lighting engineering is considered by industry, with huge market potential.
White light LEDs traditional at present are made up of blue-light LED chip combination yellow fluorescent powder, and it is excessive, blue or green that light extraction has blue light
Light is lacked and feux rouges is not enough.Increasing research shows that white-light LED encapsulation module in this way has serious indigo plant
Light endangers, and because blue power proportion is larger, will have a negative impact to the user biological rhythm and pace of moving things, and be embodied in suppression and take off
Melanocyte is secreted, and causes circadian rhythm disturbances, causes dyssomnias etc..Further, since the electric energy of input chip is partially converted to luminous energy,
Other are converted to heat energy, and fluorescent material absorbs chip outgoing blue light and is also partially converted into heat energy, and these will cause fluorescent material temperature
The rise of degree.During LED operation, with the rise of fluorescent material temperature, its decrease in efficiency causes LED module photosensitiveness
Can decay, and temperature is too high can also cause the carbonization of phosphor gel.Therefore, using blue-light LED chip combination fluorescent material
There is serious reliability defect in method for packing.Meanwhile, current fluorescent material paint-on technique is difficult in technique simplicity and bloom
Balance, the shortcoming of the simple free point coating Existential Space color homogeneity difference of low cost process are reached in terms of chromaticity matter, and is protected
Shape coating processes cost is too high, heavy dependence high-precision equipment.
Existing patent such as China Patent Publication No. CN105870303A, publication date is August in 2016 17, and it discloses one
The LED/light source of kind full spectrum, including substrate, the LED chip that is packaged on the substrate and for encapsulating the glimmering of the LED chip
Optical cement, the fluorescent glue is mixed by silica gel and fluorescent material.But, this method is only using the different fluorescence of emission peak
Powder realizes full spectrum, the various problems that do not avoid inherently fluorescent material from bringing.
Chinese patent Authorization Notice No. CN102543988B, the day for announcing is on June 25th, 2014, and it discloses a kind of metal
Vertical stratification unstressed configuration powder white light LEDs are supported, the LED and transmitting feux rouges, gold-tinted or reddish yellow mixed light that launch blue light LED are led to
Cross Direct Bonding together.But, this method is complicated, and bonding technology easily brings new integrity problem, and upper strata
Absorption of the chip material to lower layer chip light extraction will substantially reduce the light extraction efficiency of whole module.
China Patent Publication No. CN104157762A, publication date is on November 19th, 2014, and it discloses a kind of unstressed configuration
Powder white light LEDs and LED light module, including substrate, cushion, n-layer, active layer and p-type layer, active layer include long wave long hair
Light region and short-wave long light-emitting region, by setting the structure of LED active areas, make LED carriers under different Injection Levels
Main recombination region is different, and the luminous centre wavelength of correspondence is different, periodic variation drive signal, and utilizes the vision of human eye
Persistence effect, can visually obtain white light, further change the dutycycle of alternating current drive signal, regulation LED spectrum point
Cloth.But, this method chip structure and drive circuit are complicated, and light extraction is periodically variable, and necessarily human eye is caused not
Profit influence.
China Patent Publication No. CN104900771A, publication date is on 09 09th, 2015, discloses a kind of unstressed configuration powder
Efficient white light LED epitaxial structure and its growing method, the structure includes substrate, cushion, N-GaN layers, ultraviolet wavelength
Luminous multiple quantum well layer, P-GaN layers, yellowish leukorrhea and blue-band emission excitation layer and contact electrode layer；Using MOCVD techniques, in lining
Ultraviolet light multi-quantum pit structure, yellowish leukorrhea and blue-band emission excitation layer are grown on bottom, passes through bottom ultraviolet light MQW part
AlGaN/GaN superlattice layers after ultraviolet light P-GaN, so as to inspire its yellowish leukorrhea and blue-band emission, launch white light.But
It is that this method complex process, cost is higher, and the white light of full spectrum high-quality can not be obtained, still can't resolve green light and lack
The problem of feux rouges of becoming estranged is not enough, meanwhile, the outgoing of ultraviolet light can cause vision to injure lighting consumer.
The wretched insufficiency existed based on current white-light LED encapsulation technology, the utility model proposes a kind of unstressed configuration powder
Full-spectrum LED encapsulating structure.
The content of the invention
The purpose of this utility model is to provide a kind of full-spectrum LED encapsulating structure, multiple bases specular removal vertical structure LED
Chip directly synthesizes white light, improves package module color quality, for poor, the technique that solves conventional packaging method light extraction color quality
Complexity, the low problem of reliability.
What the purpose of this utility model was realized in：
A kind of full-spectrum LED encapsulating structure of unstressed configuration powder, including package substrate, some in the LED being spaced apart
Chip is mounted on package substrate respectively by die bond layer, in the two ends of lead Top electrode respectively with LED chip, package substrate
Circuit be fixedly connected, optical lens is installed on package substrate, in the gap between optical lens and LED chip fill
There is casting glue, be characterized in：Full-spectrum LED encapsulating structure directly synthesizes white light without using fluorescent material by some LEDs chips,
Some LEDs chips are specular removal vertical stratification yellow light LED chip, specular removal vertical stratification prepared by AlInGaN material systems
Green LED chip, specular removal vertical stratification green light LED chip and specular removal vertical stratification blue-light LED chip, AlGaInP materials
Specular removal vertical stratification red LED chip and specular removal vertical stratification orange light LED chip prepared by system.
Some LEDs chips are by 1 ~ 4 yellow light LED chip, 1 ~ 2 malachite blue-light LED chip and 1 ~ 2 blood orange light
LED chip is constituted, wherein：Yellow light LED chip peak wavelength scope is 560nm ~ 580nm；Malachite blue-light LED chip passes through extension
Growth has different In components MQWs, realizes single LED chip radiation green glow, blue light and green light, green light peak wavelength scope
For 510nm ~ 530nm, green light peak wavelength scope is 480nm ~ 500nm, and blue light peak wavelength scope is 445nm ~ 465nm；It is red
Orange light LED chip has different Al components MQWs by epitaxial growth, realizes single LED chip radiation feux rouges and orange light, red
Peak wavelength scope is 615nm ~ 635nm, and orange light peak wavelength scope is 590nm ~ 610nm；Some LEDs chips are series connection
Connection, single constant current driving.
Or, some LEDs chips are by 1 red LED chip, 1 orange light LED chip, 1 yellow light LED chip, 1
Green LED chip, 1 green light LED chip and 1 blue-light LED chip composition, wherein：Red LED chip peak wavelength scope
For 615nm ~ 635nm, orange light LED chip peak wavelength scope is 590nm ~ 610nm, and yellow light LED chip peak wavelength scope is
560nm ~ 580nm, green LED chip peak wavelength scope is 510nm ~ 530nm, and green light LED chip peak wavelength scope is
480nm ~ 500nm, blue-light LED chip peak wavelength scope is 445nm ~ 465nm；Some LEDs chips is are connected in parallel, multichannel
Electric current drives, and each color LED chip corresponds to driving respectively.
Or, some LEDs chips are by 1 ~ 2 red LED chip, 1 ~ 2 orange light LED chip, 1 ~ 6 yellow light LED
Chip, 1 ~ 2 green LED chip, 1 green light LED chip and 1 blue-light LED chip composition, wherein：Red LED chip peak value
Wave-length coverage is 615nm ~ 635nm, and orange light LED chip peak wavelength scope is 590nm ~ 610nm, yellow light LED chip peak value ripple
Long scope is 560nm ~ 580nm, and green LED chip peak wavelength scope is 510nm ~ 530nm, green light LED chip peak wavelength
Scope is 480nm ~ 500nm, and blue-light LED chip peak wavelength scope is 445nm ~ 465nm；Some LEDs chips connect for series connection
Connect, single constant current driving.
Or, some LEDs chips are by 1 ~ 2 red LED chip, 1 orange light LED chip, 1 ~ 4 yellow light LED core
Piece, 2 green LED chips, 1 green light LED chip and 1 blue-light LED chip, wherein：Red LED chip peak wavelength scope
For 615nm ~ 635nm, orange light LED chip peak wavelength scope is 590nm ~ 610nm, and yellow light LED chip peak wavelength scope is
560nm ~ 580nm, green LED chip peak wavelength scope is 510nm ~ 530nm, and green light LED chip peak wavelength scope is
480nm ~ 500nm, blue-light LED chip peak wavelength scope is 445nm ~ 465nm；Some LEDs chips are that connection in series-parallel combines company
Connect, selectively realize the parallel connection of LED modules with different colors chip chamber, driven using single constant current.
Further, some LEDs chips are arranged on package substrate with equidistant circular distribution or regular polygon
Row mode is distributed.
Further, there is the circuit for realizing LED chip electrical connection on described package substrate surface, and package substrate is printing electricity
Road plate（PCB）, metal core printed circuit board (PCB)（MCPCB）, Direct Bonding copper base（DBC）, low-temperature co-fired ceramic substrate（LTCC）、
Direct copper plating substrate（DPC）Or one kind in silicon substrate.
Further, described optical lens is ball cap lens, with surface micro-structure array lens, free-form surface lens
Or it is internal doped with one kind in the optical lens of micron/nano scattering particles, described optical lens material is silica gel, epoxy
One kind in resin, polymethyl methacrylate (PMMA), makrolon (PC) or glass.
Further, described casting glue is silica gel, epoxy resin, doped with micron/nano silica or titanium dioxide
The silica-gel mixture of scattering particles, doped with micron/nano silica or the epoxy resin composition of titanium dioxide scattering particles
In one kind；The doping of the micron/nano silica or titanium dioxide scattering particles of silica-gel mixture or epoxy resin composition
Concentration range is 0.01% ~ 0.1%.
In general, compared with prior art, advantage is to use many bases to the above technical scheme that the utility model is proposed
The directly encapsulation of color LED chip obtains white light, the method that the blue-light LED chip combination fluorescent material traditional for substituting synthesizes white light,
Simplify packaging technology, it is to avoid due to the integrity problem that fluorescent material is brought, meanwhile, directly closed using multi-primary LED chip
Into white light, full spectrum light extraction has more preferably color quality, truly realizes the LED illumination of green high-quality.
Brief description of the drawings
Fig. 1 is the full-spectrum LED encapsulating structure schematic diagram of the utility model embodiment 1；
Fig. 2 is the multi-primary LED chip distribution schematic diagram on package substrate of the utility model embodiment 1；
Fig. 3 is the spectrogram of the utility model embodiment 1；
Fig. 4 is the full-spectrum LED encapsulating structure schematic diagram of the utility model embodiment 2；
Fig. 5 is the multi-primary LED chip distribution schematic diagram on package substrate of the utility model embodiment 2；
Fig. 6 is the spectrogram of the utility model embodiment 2；
Fig. 7 is the full-spectrum LED encapsulating structure schematic diagram of the utility model embodiment 3；
Fig. 8 is the multi-primary LED chip distribution schematic diagram on package substrate of the utility model embodiment 3；
Fig. 9 is the spectrogram of the utility model embodiment 3；
Figure 10 is the full-spectrum LED encapsulating structure schematic diagram of the utility model embodiment 4；
Figure 11 is the multi-primary LED chip distribution schematic diagram on package substrate of the utility model embodiment 4；
Figure 12 is the spectrogram of the utility model embodiment 4.
Embodiment
The utility model is explained in more detail below by by embodiment, but following examples are merely illustrative,
Protection domain of the present utility model is not limited to these embodiments restrictions.
Embodiment 1：
As shown in figure 1, it is in be spaced apart that a kind of full-spectrum LED encapsulating structure of unstressed configuration powder, which includes ceramic substrate 12,4,
LED chip 11 be mounted on respectively on ceramic substrate 12 by conductive silver glue die bond layer 13, the two ends of lead 14 respectively with LED core
Circuit 15 in the Top electrode of piece 11, ceramic substrate 12 is fixedly connected, and directly being made on ceramic substrate 12 has ball cap lens 16.
As shown in Fig. 24 LEDs chips 11 are red by 1 malachite blue-light LED chip 21,2 yellow light LED chips 22 and 1
Orange light LED chip 23 is constituted.
Fig. 3 show the present embodiment according to malachite blue-light LED chip 21, yellow light LED chip 22 and blood orange light LED chip 23
Luminous power ratio be 3：3：The spectrogram of 4 synthesis, wherein：The light work(of green glow, green light and blue light in malachite blue-light LED chip 21
Rate ratio is 2：1：1, feux rouges and the luminous power ratio of orange light are 4 in blood orange light LED chip 23：1, the LED/light source finally given
Colour temperature is 2900K, and colour rendering index is 94.
Embodiment 2：
As shown in figure 4, a kind of full-spectrum LED encapsulating structure of unstressed configuration powder, including metal core printed circuit board (PCB) (MCPCB)
42,6 are mounted on MCPCB 42 respectively in the LED chip 41 being spaced apart by metal soldering paste die bond layer 43, lead 44
Circuit 45 in two ends Top electrode respectively with LED chip 41, MCPCB 42 is fixedly connected, and freedom is provided with MCPCB 42
Toroidal lens 46, is filled with silica gel 47 in LED chip 41 and MCPCB 42 gap.
As shown in figure 5,6 LEDs chips 41 are by 1 red LED chip 41,1 orange light LED chip 52,1 yellow light LED
Chip 53,1 green LED chip 54,1 green light LED chip 55 and 1 blue-light LED chip 56 are constituted.
Fig. 6 show the present embodiment according to red LED chip 51, orange light LED chip 52, yellow light LED chip 53, green glow
LED chip 54, green light LED chip 55 and the luminous power ratio of blue-light LED chip 56 are 10：4：10：6：3：The spectrogram of 3 synthesis,
The LED/light source colour temperature finally given is 3400K, and colour rendering index is 94.
Embodiment 3：
As shown in fig. 7, a kind of full-spectrum LED encapsulating structure of unstressed configuration powder, including ceramic copper-clad base plate (DBC) 72,9
It is mounted on respectively on DBC 72 by conductive silver glue die bond layer 74 in the LED chip 71 that is spaced apart, the two ends point of lead 73
The circuit 75 in Top electrode, DBC 72 not with LED chip 71 is fixedly connected, and diffuser plate 76 is provided with DBC 72, is being expanded
Fall apart 76 and LED chip 71 gap in be filled with silica gel 77.
As shown in figure 8,9 LEDs chips 71 are by 1 red LED chip 81,5 yellow light LED chips 82,1 green light LED
Chip 83,1 green light LED chip 84 and 1 blue-light LED chip 85 are constituted.
Fig. 9 show the present embodiment according to red LED chip 81, yellow light LED chip 82, green LED chip 83, green light
LED chip 84 and the luminous power ratio of blue-light LED chip 85 are 5：5：4：2：The spectrogram of 4 synthesis, the LED/light source color finally given
Temperature is 4900K, and colour rendering index is 96.
Embodiment 4：
As shown in Figure 10, a kind of full-spectrum LED encapsulating structure of unstressed configuration powder, including silicon substrate 102,10 are put in interval
The LED chip 101 put is mounted on silicon substrate 102 respectively by metal soldering paste die bond layer 104, the two ends of lead 103 respectively with
Circuit 105 in the Top electrode of LED chip 101, silicon substrate 102 is fixedly connected, and ball cap lens are provided with silicon substrate 102
106, silica gel and titanium dioxide nanoparticle mixture 107 are filled with the gap of lens 106 and LED chip 101.
As shown in figure 11,10 LEDs chips 101 by 1 red LED chip 111,5 yellow light LED chips 112,2 it is green
Light LED chip 113,1 green light LED chip 114 and 1 blue-light LED chip 115 are constituted.
Figure 12 show the present embodiment according to red LED chip 111, yellow light LED chip 112, green LED chip 113, green grass or young crops
Light LED chip 114 and the luminous power ratio of blue-light LED chip 115 are 5：4：2：1：The spectrogram of 1 synthesis, the LED light finally given
Source colour temperature is 3000K, and colour rendering index is 95.
Claims (8)
1. a kind of full-spectrum LED encapsulating structure of unstressed configuration powder, including package substrate, some in the LED chip being spaced apart
It is mounted on respectively on package substrate by die bond layer, the electricity in the two ends of lead Top electrode respectively with LED chip, package substrate
Road is fixedly connected, and optical lens is provided with package substrate and embedding is filled among optical lens and LED chip gap
Glue, it is characterised in that：Encapsulating structure directly synthesizes white light, some LEDs cores without using fluorescent material by some LEDs chips
Piece be AlInGaN material systems prepare specular removal vertical stratification yellow light LED chip, specular removal vertical stratification green LED chip,
Specular removal vertical stratification green light LED chip and specular removal vertical stratification blue-light LED chip, height prepared by AlGaInP material systems
Light efficiency vertical stratification red LED chip and specular removal vertical stratification orange light LED chip.
2. full-spectrum LED encapsulating structure according to claim 1, it is characterised in that：Described some LEDs chips by 1 ~
4 yellow light LED chips, 1 ~ 2 malachite blue-light LED chip and 1 ~ 2 blood orange light LED chip composition, yellow light LED chip peak value ripple
Long scope is 560nm ~ 580nm；Malachite blue-light LED chip has different In components MQWs by epitaxial growth, realizes single
LED chip radiation green glow, blue light and green light, green light peak wavelength scope is 510nm ~ 530nm, and green light peak wavelength scope is
480nm ~ 500nm, blue light peak wavelength scope is 445nm ~ 465nm；Blood orange light LED chip has different Al by epitaxial growth
Component MQW, realizes single LED chip radiation feux rouges and orange light, and red light peak wave-length coverage is 615nm ~ 635nm, orange light peak
Value wave-length coverage is 590nm ~ 610nm；Some LEDs chips is are connected in series, single constant current driving.
3. full-spectrum LED encapsulating structure according to claim 1, it is characterised in that：Described some LEDs chips are by 1
Red LED chip, 1 orange light LED chip, 1 yellow light LED chip, 1 green LED chip, 1 green light LED chip and 1
Blue-light LED chip composition, red LED chip peak wavelength scope is 615nm ~ 635nm, orange light LED chip peak wavelength model
Enclose for 590nm ~ 610nm, yellow light LED chip peak wavelength scope is 560nm ~ 580nm, green LED chip peak wavelength scope
For 510nm ~ 530nm, green light LED chip peak wavelength scope is 480nm ~ 500nm, and blue-light LED chip peak wavelength scope is
445nm~465nm；Some LEDs chips is are connected in parallel, and multichannel electric current driving, each color LED chip corresponds to driving respectively.
4. full-spectrum LED encapsulating structure according to claim 1, it is characterised in that：Described some LEDs chips by 1 ~
2 red LED chips, 1 ~ 2 orange light LED chip, 1 ~ 6 yellow light LED chip, 1 ~ 2 green LED chip, 1 green light LED
Chip and 1 blue-light LED chip composition, red LED chip peak wavelength scope is 615nm ~ 635nm, orange light LED chip peak value
Wave-length coverage is 590nm ~ 610nm, and yellow light LED chip peak wavelength scope is 560nm ~ 580nm, green LED chip peak value ripple
Long scope is 510nm ~ 530nm, and green light LED chip peak wavelength scope is 480nm ~ 500nm, blue-light LED chip peak wavelength
Scope is 445nm ~ 465nm；Some LEDs chips is are connected in series, single constant current driving.
5. full-spectrum LED encapsulating structure according to claim 1, it is characterised in that：Described some LEDs chips by 1 ~
2 red LED chips, 1 orange light LED chip, 1 ~ 4 yellow light LED chip, 2 green LED chips, 1 green light LED chip
With 1 blue-light LED chip composition, red LED chip peak wavelength scope is 615nm ~ 635nm, orange light LED chip peak wavelength
Scope is 590nm ~ 610nm, and yellow light LED chip peak wavelength scope is 560nm ~ 580nm, green LED chip peak wavelength model
Enclose for 510nm ~ 530nm, green light LED chip peak wavelength scope is 480nm ~ 500nm, blue-light LED chip peak wavelength scope
For 445nm ~ 465nm；Some LEDs chips are that connection in series-parallel combines connection, selectively realize LED modules with different colors chip chamber
Parallel connection, is driven using single constant current.
6. full-spectrum LED encapsulating structure according to claim 1, it is characterised in that：Described some LEDs chips are in envelope
Fill on substrate with equidistant circular distribution or the distribution of regular polygon arrangement mode.
7. full-spectrum LED encapsulating structure according to claim 1, it is characterised in that：Have on described package substrate surface
Realize LED chip electrical connection circuit, package substrate be printed circuit board (PCB), metal core printed circuit board (PCB), Direct Bonding copper base,
One kind in low-temperature co-fired ceramic substrate, direct copper plating substrate or silicon substrate.
8. full-spectrum LED encapsulating structure according to claim 1, it is characterised in that：Described optical lens is that ball cap is saturating
Mirror, with surface micro-structure array lens, free-form surface lens or the internal optical lens doped with micron/nano scattering particles
In one kind.
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106783821A (en) * | 2016-12-26 | 2017-05-31 | 南昌大学 | The full-spectrum LED encapsulating structure and its method for packing of a kind of unstressed configuration powder |
| CN108878624A (en) * | 2018-06-27 | 2018-11-23 | 朗昭创新控股（深圳）有限公司 | A kind of white LED light source and lighting device |
-
2016
- 2016-12-26 CN CN201621441475.5U patent/CN206401317U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106783821A (en) * | 2016-12-26 | 2017-05-31 | 南昌大学 | The full-spectrum LED encapsulating structure and its method for packing of a kind of unstressed configuration powder |
| CN106783821B (en) * | 2016-12-26 | 2020-11-20 | 南昌大学 | Full-spectrum LED packaging structure without fluorescent powder and packaging method thereof |
| CN108878624A (en) * | 2018-06-27 | 2018-11-23 | 朗昭创新控股（深圳）有限公司 | A kind of white LED light source and lighting device |
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