CN206116449U - White light LED wrapper spare - Google Patents
White light LED wrapper spare Download PDFInfo
- Publication number
- CN206116449U CN206116449U CN201621103108.4U CN201621103108U CN206116449U CN 206116449 U CN206116449 U CN 206116449U CN 201621103108 U CN201621103108 U CN 201621103108U CN 206116449 U CN206116449 U CN 206116449U
- Authority
- CN
- China
- Prior art keywords
- light led
- led chip
- reflector plate
- blue
- white light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
- H01L2224/48228—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item the bond pad being disposed in a recess of the surface of the item
Landscapes
- Led Device Packages (AREA)
Abstract
The utility model discloses a white light LED wrapper spare, including blue light LED chip, light conversion layer, copper sheet and at initial B under the stage state thermofixation coincide in reflector plate on the copper sheet, the reflector plate is made by white reflecting material, the reflector plate is a bowl cup, blue light LED chip is arranged in the bottom of cup of reflector plate, the light conversion layer cladding in on the blue light LED chip. White light LED wrapper spare, not only encapsulate the luminous efficiency height, prevent that vulcanizing effect is good, mechanical strength is high, its preparation method compares with the traditional handicraft moreover, the preparation technology step is few, processing reliable and simple is favorable to going up to reduce on the basis of improving product quality preparing the cost.
Description
Technical field
This utility model belongs to light emitting diode (LED) technical field, and in particular to a kind of white light LED packaging device.
Background technology
Light emitting diode (LED) because with specular removal, life-span length and it is nontoxic green many advantages, such as, step into main flow photograph
Bright market, in fields such as tunnel illumination, Landscape Lighting, greenhouse lighting and room lightings increasing application has been obtained.
Now, the market mainstream of LED encapsulation is encapsulated using PLCC stent-types, and its encapsulating structure includes copper sheet, plastic cement, its
In, plastic cement is processed into a bowl cup-shaped support, generally also does silver surface in the bottom of bowl and processes to strengthen reflection, improves encapsulation effect
Rate.But, there is following defect in the encapsulation of PLCC stent-types：
(1) mechanical strength is low；
(2) extraneous pollutant are easily penetrated in bowl organic silica gel and the gap of bottom, so as to easily cause silver-plated corrosion；
(3) silver coating also needs to take into account the anti-sulfuration of consideration, there are many difficult problems, such as, if silver coating adopts anti-sulfur protective layer,
Anti- sulfur effect is preferable, but high cost, spot printing technology difficulty are big；According to high rigidity silica gel, anti-sulfur effect is general, easily causes gold
Thread breakage；If silver coating adopts white silica gel, anti-sulfur effect is preferable, but processing technique difficulty is big.
It is many both at home and abroad in order to better adapt to the market demand of white light LED lamp based on the great potential in LED markets
Practitioner never stops carrying out LED product the research of correlation, such as：
(1) Chinese patent of Application No. 201110359944.4 discloses a kind of package structure for LED and its anti-
Cup is penetrated, it makes in side wall and bottom metallic reflective layer, but there is the existing many drawbacks of PLCC stent-types encapsulation in it；
(2) Chinese patent of Application No. 201410020728 discloses a kind of using low reflective black EMC plastic packaging materials
Material reaches the LED packaging technologies of high reflecting effect, i.e., directly increase by one layer of reflectorized material on black EMC timbering materials surface, should
Packaging technology can enable black EMC materials to realize higher light extraction efficiency, however, it will be apparent that its manufacturing process difficulty also compared with
Greatly；
(3) Chinese patent of Application No. 201310339703.2 discloses a kind of packaging technology of light emitting diode,
Reflective coating is coated on frame base plate, and as crystal-bonding adhesive, although this patent can improve anti-cure efficiency, light extraction efficiency, but
It is that its manufacturing process difficulty remains unchanged very greatly, packaging efficiency is not high；
(4) Chinese patent of Application No. 201020700819.6 discloses a kind of paster LED for preventing and vulcanizing, and it is glimmering
Optical cement surface increased anti-sulfuric horizon, so as to be effectively improved the anti-cure efficiency of product, but can reduce light extraction efficiency；
(5) United States Patent (USP) of Application No. US 2013/0285082 discloses and one is made around flip LED chips
Reflector, to realize higher light extraction efficiency and lower preparation cost, but the reflector described in it is plastic cement, and without base
, there are the problems such as mechanical strength is not high, anti-cure efficiency is not good in plate；
(6) United States Patent (USP) of Application No. US 2013/0029439 discloses a kind of preparation method of flip LED chips,
It is first placed on luminescence chip on one interim support plate, and surrounding arranges baffle plate, strikes off again after spot printing fluorescent glue, and cuts into list
, there is bottom land electrode and the problems such as easily pollute in the preparation technology described in this patent.
Utility model content
First, for the ease of understanding this utility model, corresponding explanation is first made to following noun：
B-stage：Refer to that resin and firming agent react, form a kind of solid of semi-solid preparation.
This utility model is to make up the deficiencies in the prior art, there is provided a kind of white light LED packaging device, it is not only encapsulated out
Light efficiency is high, and anti-cure efficiency is good, high mechanical strength, and, compared with traditional handicraft, its step of preparation process is few, processing letter
It is single easy, be conducive to reducing preparation cost on the basis of improve product quality.
This utility model is to reach its purpose, and the technical scheme of employing is as follows：
A kind of white light LED packaging device, it is characterised in that：
Include blue-light LED chip, light conversion layer, copper sheet and under initial B-stage states heat cure be superimposed on institute
State the reflector plate on copper sheet；The reflector plate is made up of white reflector material, and the reflector plate is in bowl shape；The blue-ray LED
Chip is placed in the cup bottom of the reflector plate, and the light conversion layer is coated on the blue-light LED chip.
Further, the white light LED packaging device also includes insulator, and the insulator is divided into the copper sheet just
Negative pole area.
Further, the bottom of the reflector plate offers two through holes.
Further, the blue-light LED chip is packed LED chip, and the blue-light LED chip is by extending through two
Two gold threads of the through hole are connected respectively with the positive and negative polar region of the copper sheet.
Further, the blue-light LED chip is flip LED chips, and the pad of the blue-light LED chip is directed at two institutes
State through hole to be directly connected with the positive and negative polar region of the copper sheet respectively.
Further, the light conversion layer is fluorescent adhesive layer.
Relative to prior art, this utility model has following Advantageous Effects：
(1) a kind of white light LED packaging device that this utility model is provided, by the reflector plate under B-stage states (by white
Reflectorized material is made) it is superimposed together with copper sheet heat cure, then directly blue-light LED chip is placed in the bowl of reflector plate,
Finally it is packaged into product, i.e. this utility model with light conversion layer and LED is manufactured using the reflector plate of B-stage states
Frame, so as to be effectively improved the anti-cure efficiency and encapsulation light extraction efficiency of LED encapsulation, it is ensured that with enough mechanical strengths,
And the electrode of blue-light LED chip is not exposed to extraneous foreign substance pollution, and then improve the quality of product.
(2) a kind of white light LED packaging device that this utility model is provided, belongs to a kind of new packing forms, itself and SMD
Compare, volume is less, weight is lighter, can be directly mounted on pcb board, be highly suitable for the assembling of low profile electronic product.
(3) relative to prior art, a kind of preparation method of white light LED packaging device that this utility model is provided is by LED
Designing and producing for support combines with LED packaging technologies, eliminates many processing steps of traditional PLCC stent-types encapsulation,
Preparation technology is simpler, it is easy to process, and is conducive to reducing preparation cost while improve product quality.
Description of the drawings
Fig. 1 is a kind of white light LED packaging device described in the utility model (blue-light LED chip is packed LED chip)
Preparation flow schematic diagram；
Fig. 2 is another kind of white light LED packaging device described in the utility model (blue-light LED chip is flip LED chips)
Preparation flow schematic diagram.
Reference：
100 (or 200), white light LED packaging device；101 (or 201), blue-light LED chip；102nd, light conversion layer；103rd, copper
Piece；104th, reflector plate；1041st, through hole；105th, insulator；106th, gold thread.
Specific embodiment
Elaborate many details in order to fully understand this utility model in the following description.But this practicality is new
Type can be implemented with the other modes for being much different from this description, and those skilled in the art can be without prejudice to this utility model
Similar popularization is done in the case of intension, therefore this utility model is not limited by following public specific embodiment.
Embodiment 1
As shown in figure 1, present embodiment discloses a kind of white light LED packaging device 100, include blue-light LED chip 101,
Light conversion layer 102, copper sheet 103 and under initial B-stage states heat cure be superimposed on the reflector plate 104 on copper sheet 103,
I.e. copper sheet 103 is superimposed together with the bottom of reflector plate 104 by heat cure effect.Reflector plate 104 is by white reflector material system
Into, wherein, white reflector material adds TiO mainly by organic siliconresin or epoxy resin as base material2(as reflecting material
Material), SiO2(as reinforcing material) and make so that there is reflector plate 104 bonding, reflection etc. to act on, its white light field it is anti-
The rate of penetrating can control up to more than 95%；Reflector plate 104 is in bowl shape, and blue-light LED chip 101 is fixed and is placed in reflector plate 104
Cup bottom；Light conversion layer 102 is coated on blue-light LED chip 101, to play a part of light conversion, wherein, blue-light LED chip 101
With the mutual bonding in the surface of both light conversion layers 102.
In the present embodiment, the white light LED packaging device also includes insulator 105, and insulator 105 is by 103 points of copper sheet
It is cut into positive and negative polar region.It is noted that copper sheet 103 needs to first pass through corrosiveness and is divided into both positive and negative polarity Liang Ge areas, then refill
Insulator 105, so that copper sheet 103 can be connected while positive and negative polar region is divided into again.
In the present embodiment, the bottom of reflector plate 104 offers two through holes 1041, for routing.
In the present embodiment, the selection of blue-light LED chip 101 is packed LED chip, by the wire soldering technology of formal dress so that
Blue-light LED chip 101 is connected respectively by extending through two gold threads 106 of two through holes 1041 with the positive and negative polar region of copper sheet 103
Connect.
In the present embodiment, light conversion layer 102 is fluorescent adhesive layer.But, this utility model is not limited to this, light conversion layer
102 can be equivalent protection scope of the present utility model to be made up of other light-converting materials.
The present embodiment also discloses a kind of preparation method of white light LED packaging device 100, the simple flow process of the preparation method
As shown in figure 1, it is comprised the following steps：
S1：Reflector plate 104 under the B-stage states by made by white reflector material is set as into bowl shape, then by indigo plant
Light LED chip 101 is placed in the cup bottom of reflector plate 104；
S2：Reflector plate 104 is superimposed on copper sheet 103, the two heat cure molding links into an integrated entity；
S3：Fluorescent glue is filled out and is overlying in the bowl of reflector plate 104, be heating and curing, make fluorescent glue be cured as light conversion layer
102；
S4：Cut into the white light LED packaging device of single.
Wherein, in step S1, reflector plate 104 is set as after bowl shape, and in the bottom of reflector plate 104 two use are offered
In the through hole 1041 of routing；In step S2, copper sheet 103 is separated into both positive and negative polarity beforehand through burn into filling insulator 105
Area, then reflector plate 104 is superimposed on copper sheet 103.
Wherein, in step S1, blue-light LED chip 101 selects to be packed LED chip；In step S2, two are used
Root gold thread 107 extends through two through holes 1041, and blue-light LED chip 101 is connected respectively with the positive and negative polar region of copper sheet 103.
Embodiment 2
Present embodiment discloses another kind of white light LED packaging device 200, as shown in Fig. 2 in structure, itself and embodiment 1
The difference of described white light LED packaging device 100 is：
In the present embodiment, blue-light LED chip 201 selects to be flip LED chips that the pad of blue-light LED chip 201 is aligned
Two through holes 1041 are directly connected with difference with the positive and negative polar region of copper sheet 103.
The present embodiment also discloses a kind of preparation method of white light LED packaging device 200, the simple flow process of the preparation method
As shown in Fig. 2 it is with the difference of the preparation method of the white light LED packaging device 100 described in embodiment 1：
In step S1, blue-light LED chip 201 selects to be flip LED chips；In step S2, blue-light LED chip
201 pad is directed at two through holes 1041, and is directly connected with the positive and negative polar region of copper sheet 103 respectively.
The other structures of the white light LED packaging device 200 described in the present embodiment, other preparation methoies and embodiment 1 are complete
It is identical, will not be described here.
The above, is only preferred embodiment of the present utility model, not does any formal to this utility model
Restriction, therefore all contents without departing from technical solutions of the utility model are implemented according to technical spirit of the present utility model to more than
Any simple modification, equivalent variations and modification that example is made, still fall within the range of technical solutions of the utility model.
Claims (6)
1. a kind of white light LED packaging device, it is characterised in that：
Include blue-light LED chip, light conversion layer, copper sheet and under initial B-stage states heat cure be superimposed on the copper
Reflector plate on piece；The reflector plate is made up of white reflector material, and the reflector plate is in bowl shape；The blue-light LED chip
The cup bottom of the reflector plate is placed in, the light conversion layer is coated on the blue-light LED chip.
2. white light LED packaging device according to claim 1, it is characterised in that：The white light LED packaging device is also included
The copper sheet is divided into positive and negative polar region by insulator, the insulator.
3. white light LED packaging device according to claim 2, it is characterised in that：The bottom of the reflector plate offers two
Individual through hole.
4. white light LED packaging device according to claim 3, it is characterised in that：The blue-light LED chip is forward LED
Chip, the blue-light LED chip by extend through two gold threads of two through holes respectively with the both positive and negative polarity of the copper sheet
Area connects.
5. white light LED packaging device according to claim 3, it is characterised in that：The blue-light LED chip is flip LED
Chip, the pad of the blue-light LED chip is directed at two through holes to be directly connected with the positive and negative polar region of the copper sheet respectively.
6. the white light LED packaging device according to any one of Claims 1 to 5, it is characterised in that：The light conversion layer is glimmering
Light glue-line.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621103108.4U CN206116449U (en) | 2016-09-30 | 2016-09-30 | White light LED wrapper spare |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621103108.4U CN206116449U (en) | 2016-09-30 | 2016-09-30 | White light LED wrapper spare |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206116449U true CN206116449U (en) | 2017-04-19 |
Family
ID=58530003
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621103108.4U Active CN206116449U (en) | 2016-09-30 | 2016-09-30 | White light LED wrapper spare |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206116449U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106356437A (en) * | 2016-09-30 | 2017-01-25 | 广东晶科电子股份有限公司 | White LED (light emitting diode) packaging device and preparation method thereof |
| CN108281537A (en) * | 2018-03-20 | 2018-07-13 | 木林森股份有限公司 | Packaging structure of L ED lamp pearl |
| CN111755581A (en) * | 2019-03-27 | 2020-10-09 | 隆达电子股份有限公司 | Light emitting diode carrier and light emitting diode package having the same |
-
2016
- 2016-09-30 CN CN201621103108.4U patent/CN206116449U/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106356437A (en) * | 2016-09-30 | 2017-01-25 | 广东晶科电子股份有限公司 | White LED (light emitting diode) packaging device and preparation method thereof |
| CN106356437B (en) * | 2016-09-30 | 2019-07-26 | 广东晶科电子股份有限公司 | A kind of white light LED packaging device and preparation method thereof |
| CN108281537A (en) * | 2018-03-20 | 2018-07-13 | 木林森股份有限公司 | Packaging structure of L ED lamp pearl |
| CN111755581A (en) * | 2019-03-27 | 2020-10-09 | 隆达电子股份有限公司 | Light emitting diode carrier and light emitting diode package having the same |
| CN111755581B (en) * | 2019-03-27 | 2022-03-15 | 隆达电子股份有限公司 | Light emitting diode carrier and light emitting diode package having the same |
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